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2005
Nanotechnology
V 1505
Boring Deep Cylindrical Nanoholes in Silicon Using Silver Nanoparticles as a Cat— Cylindrical nanoholes in Si are generated by immersing Si wafers loaded with
26- 165 alyst.
Ag nanoparticles in a solution containing HF and H2O2. The depth of the holes reaches
500 µm after etching for 10 h. The position of the holes can be controlled by the loading
position of the Ag particles. The method is expected to be useful for making new electronic and optical devices. — (TSUJINO, K.; MATSUMURA*, M.; Adv. Mater.
(Weinheim, Ger.) 17 (2005) 8, 1045-1047; Res. Cent. Solar Eng. Chem., Osaka Univ.,
Toyonaka, Osaka 560, Japan; Eng.) — W. Pewestorf
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