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Патент USA US3059330

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Oct. 23, 1962
Filed June 23, 1958
FIG. 1.
FIG. 5.
United States Patent 0 ’
Patented Oct. 23, 1962
the ?nished product with holes punched in the lands and
insulating plate for mounting electrical components
William A. Seabury IH, Ulster Park, and Robert D. Me
Nutt, Kingston, N.Y., assignors to International BUSI
ness Machines Corporation, New York, N.Y., a corpo
ration of New York
Filed June 23, 1958, Ser. No. 743,682
11 Claims. (Cl. 29-155.5)
This invention relates to the manufacture of an insulat
ing panel carrying an electrically conductive circuit, and
pertains more speci?cally to a wholly mechanical method
of manufacture for such panels which is readily adapted
to automatic control.
In carrying out the process of the present invention,
the ?rst step is to design a wiring arrangement for the
desired circuit so that the wiring connections all lie. on
straight lines, which are either parallel or perpendicular
to each other, forming a grid pattern. The termination
points for the wiring paths, hereinafter referred to as
“lands,” are the points at which the various electrical
components are to be connected to the circuit, and these
also must be arranged so as to lie along straight lines
which are either parallel or perpendicular to each other
and are intercalated in and connected to the ?rst grid
Although it has hitherto been proposed to manufac 15 pattern de?ning the wiring connections.
The wiring pattern having been thus determined, it may
ture insulating panels carrying electrically conductive
be transferred to a sheet of conductive metal foil such
circuits, none of the methods previously known is readily
as copper foil Iby punches, the operation of which is
subjected to automatic control directly from raw data
controlled by means of punched cards to provide the
which is supplied, for example, in the form of punched‘
cards, or in any other conventional manner. Further 20 desired pattern.
The copper or other conductive metal foil employed
more, many prior art processes have involved photography
to form the conductive circuit may be ?rst coated, pref
and/or electroplating steps which require expensive art
Work and are di?icult to carry out so as to obtain the
necessary uniformity of quality of product. Further,
erably on its rough or matte surface, with a thermosetting
adhesive composition of conventional composition such
many of the prior processes have involved subjecting the 25 as a
entire face of the insulating panel to the action of an
to a
electrolytic solution or have involved coating the entire
face of the insulating panel with an adhesive composi
phenol-aldehyde, urea-aldehyde, or melamine-alde
adhesive. The adhesive-coated foil is then subjected
first punching operation, these punches being actu
to remove aligned rectangular areas from the foil
and leave a grid pattern or reticulated sheet 10 of inter
requirements have made it di?icult to maintain the desired 30 connected narrow ‘bands of foil 14 as shown in FIG. 1.
tion in order to secure the conductive circuit to it. These
insulating properties on the face of the panel which has
been thus treated.
One object of the present invention is to provide a
method of manufacturing insulating panels carrying elec
trically conductive circuits, which is readily subjected
to automatic control directly from the raw data and
which is free from electroplating and photographic steps.
Another object is to provide a method of manufac
turing panels of the type described in which the adhesive
composition employed to bond the circuit to the face
of the panel is con?ned to that area of the panel which
immediately underlies the circuit itself, thus making it
Certain of the rectangular areas, as determined by the
automatic control are left unpunched to provide residual
webs of foil 12 from which the desired lands or circuit
terminal points may subsequently be formed. ‘The grid
of metal foil thus formed contains both the desired circuit
and in addition a number of temporary bridges consisting
of narrow bands of foil which serve to hold the grid to
gether and locate its parts during this and certain subse
quent steps of its manufacture.
The grid containing residual webs 12 is then subjected
to a second punching operation to remove portions of the
residual webs and leave the ‘desired lands 15 in certain
selected openings of the ?rst grid pattern, which lands
unnecessary to control the electrical properties of the ad
are connected to each other and to the ?rst grid pattern
hesive in order to maintain the desired insulating prop
45 by a second grid pattern consisting of narrow bands of
erties across the face of the panel.
foil 16, 18 intermediate between those formed during the
Still another object is to provide a method of manufac
?rst operation and parallel thereto. Consequently each
turing panels of the type described in which automatic
of the lands is connected to the midpoint of each side of
testing of the circuit may be carried out prior to bonding
its respective opening by a narrow band 16, 18 of foil;
of the circuit to the insulating panel.
Other and further objects will be apparent from the 50 The punches employed during this step need not be con
trolled by punch cards or the like, since they will have no
drawing and the description which follows.
effect on those areas which have been removed during
In the drawing:
the ?rst punching operation.
FIG. 1 is a plan ‘view showing a sheet of metal foil
There is then applied to the uncoated face of the grid
which has been punched to form a grid or reticulate
65 shown in FIG. 2 an adhesive composition which is thermo
releasing, that is, which loses its'ibonding strength when
subjected to elevated temperatures suf?ciently high to
cure the thermosetting adhesive previously applied to the
residual webs, left during the ?rst punching operation,
‘opposite face of the grid. The thermo—releasing adhee
are trimmed to form the desired lands;
FIG. 3 shows the step of applying to the grid of FIG. 60 sive is selectively applied to the remaining lands by
FIG. 2 is a view corresponding to FIG. 1, on an en
larged scale, showing the next step in the process in which
2 a temporary support;
means of a die similar in construction to a rubber stamp
having a protuberance at each possible land location,
FIG. 4 shows the assembly after the next punching
so that the remainder of the uncoated face of the grid re
step which seve'rs the desired portions of the circuit from
mains free from any adhesive. Among suitable thermo
the undesired portions;
FIG. 5 shows the bottom plan view of the assembly 65 releasing ‘adhesive compositions are gum arabic, poly
vinyl alcohol, and gelatin, all of which may be applied
of FIG. 4 after removal of the undesired portions of the
vFlEG. 6 is a view in cross-section showing the step of
to the lands in the form of an aqueous solution or dis-'
A temporary supporting member 19 is then bonded to
FIG. 7 shows the step of removing the temporary 70 the raised portions of the lands by means of the thermo-'
releasing cement, as shown in FIG. 3 of the drawing.‘
support; and
bonding the circuit to the insulating panel;
P16. 8 is a plan view on an enlarged scale showing
The temporary supporting member maybe either electroL
conductive or electrically insulating and is preferably ?ex
ible. For example, aluminum foil, copper foil, or other
member to the opposite face of the circuit. Consequently
the temporary supporting member may now readily be
metal foil may be used, or if desired, paper or other
?brous sheet material may be used impregnated with re
inforcing resins if desired. In one embodiment of the
stripped off from the face of the panel and circuit as
shown in FIG. 7.
present invention, electrically insulating temporary sup
present on the exposed face of the circuit may then be
Any residual thermo-releasing adhesive ‘which maybe
porting sheet members such as paper sheets are pre
ferred so that the continuity of the desired electrical cir~
cuit may be tested prior to its bonding to the insulating
The grid, having been bonded to a temporary sup
removed, as by brushing, burnishing or the like, and
the holes 26 in the lands required for mounting the com
ponents of the circuit are punched through both the lands
10 and the insulating panel in another automatically con
trolled punching operation to produce the product shown
porting member, is then subjected to another punching
operation which is automatically controlled as by
in FIG. 8.
It will 1be understood that the mounting of the com
punched cards or the like. This punching operation, in
ponents on the circuit and the soldering of these com
which the punches penetrate both the electrically conduc 15 ponents may be carried out in any conventional manner,
tive sheet and the temporary supporting member, serves
the soldering preferably being a single dip soldering step.
to sever the desired circuit or circuits from the undesired
It will ‘be appreciated that the coating of the grid or
portion of the grid which has, as pointed out above,
foil with thermosetting adhesive may take place at any
served to provide temporary bridges or temporary sup
time prior to bonding the grid to the insulating panel,
ports to locate all of the elements of the desired circuit 20 either before or after any of the several punching oper
in the proper positions with respect to each other.
ations and before or after bonding of the grid to the
The undesired or temporary bridge portions 20, 20 of
temporary supporting member. It is usually most con~
the grid are now readily removed from the face of the
venient, however, to apply the thermosetting adhesive
temporary support 19 since they are not bonded to the
to- the foil prior to the ?rst punching operation.
support and are now free from connection with the lands 25
It will also be appreciated that the sequence of the
15 which are bonded to the support. This operation may
?rst two punching operations may be reversed, with the
be carried out manually or automatically, and in some
step of ‘delineating the lands 15 being carried out ?rst.
cases suction devices may ‘be found helpful in removing
In this case this punching operation may be automatically
the unwanted portions of the grid. The resulting struc
controlled to delineate lands only in the desired locations,
ture, as shown in FIG. 5, contains the desired lines and 30 leaving the remainder of the sheet unpunched, so that it
terminal points connected in the desired manner by nar
may be subjected to a second automatically controlled
row bands of foil, which represent the residue of the
punching operation to form a second grid pattern, the re
grids formed in the several punching steps. Inasmuch as
each of the lands is bonded to the temporary support, the
connecting lines or circuits are held in place solely by
their connection to the lands. In the case where the tem
porary supporting member 19, or at least the face
thereof in contact with the grid, is electrically insulating,
sulting structure being identical with that shown in FIG.
2 of the drawing. It is also possible in this case to de
lineate lands throughout the full extent of the foil during
the ?rst punching ‘operation, then remove only the un
desired lands by the second, automatically controlled
punching step; when this procedure is followed, the lands
the circuit may now be tested ‘by an electroconductivity
test through appropriately located electrodes. While the
and both grid patterns are formed simultaneously in the
?rst punching operation.
test may be carried out manually, it will be appreciated
that it lends itself to automatic control from punched
The automatically controlled punching operation or op
erations may be carried out by a single roving punch
cards or the like.
directed to specific locations and actuated by the data on
The temporary support bearing the desire-d circuit on
punched cards. For most large-scale production opera
its face is then placed in contact with the desired insulat 45 tions, however, an array of punches is preferred, consist
ing panel 22 as shown in FIG. 6, with the thermosetting
ing either of a small number of rows (even a single row)
adhesive-coated face of the circuit itself in direct con
of punches which are moved as a unit with respect to the
tact with the panel, and with the temporary support con
foil to successive locations which are automatically con
tinuing to maintain the desired circuits in their proper
trolled, or a complete array coextensive in area with the
relationship with respect to each other. This assembly
desired circuit, selected punches of the array being actu
is then placed between the heated platens 24, 24 of a
ated by punched card control.
conventional hydraulic press and subjected to the heat
Although speci?c embodiments of the invention have
and pressure required to cure the insulating panel and
‘been described herein, it is not intended to limit the in
bond the circuit ?rmly to it by means of the thermoset
vention solely thereto, but to include all of the obvious
ting adhesive coating on the face of the circuit. Tem 55 variations and modi?cations within the spirit and scope
peratures of the order of 310°—340° F. for 15 to 25
of the appended claims.
minutes at a pressure of the order of 9001 to 1100 lb./ sq.
What is claimed is:
in. vare satisfactory for most conventional thermosetting
1. The method of making an insulating panel carrying
adhesive compositions. During this step the circuit is em
an electrically conductive circuit which comprises provid
bedded in the face of the insulating panel. Any of the 60 ing a sheet of metal foil having one face coated with
conventional materials may be employed for the insulat
thermosetting adhesive, providing an array of punches
ing panel itself, among the more common of which are
adapted to punch a grid pattern from said sheet of metal
paper or other ?brous sheet material impregnated with
foil, actuating selected punches of said array to form a
a thermosetting resinous composition such as phenol
foil grid having residual lands in a desired pattern
aldehyde, urea-aldehyde, melamine-aldehyde, or'other 65 metal
and including both the desired circuit and temporary con
thermosetting resinous composition. The resinous com
necting bridges in said grid pattern, temporarily adhering
position may be previously cured, although it is prefer
ably either uncured or only partially cured, as is the
the uncoated face of said residual lands to a temporary
supporting member while leaving the remainder of said
resin of the thermosetting adhesive composition, in order
grid free from adhesion thereto, separating from the de
to provide a strong permanent bond between thev circuit 70 sired circuit and residual lands the undesired portion of
and the panel, and to permit embedding of the circuit into
said grid, bonding the coated face of said desired circuit
the face of the panel. The same heating operation
and residual lands to an insulating panel, and releasing the
which serves to cure the thermosetting adhesive on the
temporary supporting member from said residual lands.
insulating panel serves to degrade the thermo-releasing
2. The method of making an insulating panel carrying
adhesive which has securedthe temporary supporting 75 an electrically conductive circuit which comprises provid
7. The method according to claim 6 in which said ?rst
ing a sheet of metal foil having one face coated with
thermosetting adhesive, punching from said sheet a grid
pattern having residual lands in a desired array and in
cluding both the desired circuit and temporary connecting
bridges in said grid pattern, applying to the residual land
punching is performed by mechanism adapted to punch
said sheet in uniformly spaced and sized areas to remove
said areas leaving intervening portions of said sheet as
portions of certain of said strips, said machine being con
trollable to omit said punches in those said areas forming
portions only of the uncoated face of said grid pattern
lands in the electrically conductive circuit.
an adhesive which is releasable upon heating, and bond
ing to said residual land portions with said adhesive a
8. The method according to claim 7 wherein adhesive
is applied to said punched sheet for temporarily securing
sheet to said support member by an applicator adapted
on said supporting member to separate the undesired por 10 the
said adhesive only in said areas so that said ad
tion of the grid pattern from the desired circuit and from
hesive is applied only to said areas forming lands.
the residual lands, heating and pressing the desired circuit
9. The method according to claim 7 wherein said sheet,
and residual lands against an insulating panel while said '
said ?rst punching, is subjected to the action of
circuit and lands are still adhered to said temporary sup
acting only in said areas and effective to form
porting member, said heat and pressure serving to bond
said previously unpunched areas into reduced lands and
said circuit and lands to said insulating panel and to re
strips connecting said lands to contiguous strips.
lease the lands from said temporary supporting member,
10. The method according to claim 6 wherein said
and removing said temporary supporting member from
punching of said assembly of said sheet and said tempo
said lands.
3. The method as de?ned in claim 2 including in 20 rary base is performed by mechanism controllable to
punch said assembly to sever only certain of said strips at
addition the step of cleaning the exposed face of said
juncture with said portions forming the conductive
lands and circuit after removal of said temporary support
elements of said circuit.
to remove any residual adhesive.
11. The method according to claim 6 which includes
4. The method as de?ned in claim 2 in which said insu
step of applying to one face of said sheet preliminary
lating panel comprises a thermosetting resin.
to punching a thermo-setting adhesive which is utilized to
temporary supporting member, punching said grid pattern
5. The method as de?ned in claim 4 in which said resin
secure to said panel said face of the portions thereof form
is thermoset at least in part during the step of bonding
the conductive elements of said circuit, and wherein
the circuit and lands to said insulating panel.
opposite face of some of said portions is adhesively
6. The method of making an insulating panel carrying
to said temporary supporting member by an ad
an electrically conductive circuit which comprises punch 30 united
hesive which is thermo-releasing at a temperature at which
ing a sheet of electrically conducting material in a pre
said ?rst adhesive is thermo-setting.
determined pattern to form lands and relatively narrow
strips of said material connecting said lands to the mar
References Cited in the ?le of this patent
gins of said sheet, said lands and said strips comprising
the conductive elements of said circuit and additional
temporary connecting bridges, temporarily securing a sup
porting member to one face of said punched sheet only
in portions which are comprised in the conductive ele
ments of said circuit, punching said assembly to sever
said elements from the remainder of said strips so that 4.0
said remainder is freely removable from said support
while said elements remain adhered thereto, securing the
opposite face of said portions to a face of said insulating
panel and removing said temporary support from said
Caruso ____ _._.______...,.__ Mar. 3, 1931
Copeman _______....__,__ June 14, 1938
Heibel ______ 9-.‘ ______ __ Oct. 7, 1952
Knutsen _____________ __ Dec. 30, 1952
Kapp _______________ __ Nov. 16, 1954
Pritikin _____________ __ Nov. 22, 1955
Oden _______________ -_ ‘Mar. 22, 1960
Greenman et a1 ______ .._,.... Feb, 14, 1961
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