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Bonding
Applicable
Die Attach on Applicable
Metalization Metalization
Code on Top
Dielectric
Bottom Pad Case Size
System
Thickness
Pad
Material
Conductive
1010 to
NPQ,
99.99% Au
H Au Wire
Epoxy or AuSn 5050
NPO, BX
Al and Au Conductive
1010 to
NPQ,
99% Au
J
wire
Epoxy or AuSn 5050
NPO, BX
Alloy
100
99.99% Au Microinches
Conductive
1717 to
minimum
X7R
over
G Au Wire
Epoxy or AuSn 5050
Pt/Pd/Au
Consult
Consult
1010 to
Pt/Pd/Au
X7R
P
Factory
Factory
1515
alloy
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Presidio Components' quality system is ISO 9001 compliant and
approved to Mil-I-45208 and Mil-Std-790.
Code Industrial Parts
X
Electrical: 100% capacitance and dissipation factor (DF), 1%
Level II AQL for insulation resistance (IR) and dielectric
withstanding voltage (DWV).
Visual: 100%, as per Mil-Std-883, Method 2032.
Bond Strength: Sample basis per lot (see mechanical parameters).
High Reliability Testing as per Mil-C-49464A (modified)
A
B
C
Group A Testing: 100%, 100 hours voltage conditioning, 100%
electrical screening, 100% visual screening.
Group B Testing: Includes Group A testing plus bond and die
shear strength, temperature coefficient limits.
Group C Testing: Includes Group A and B testing plus thermal
shock and immersion, resistance to soldering heat, moisture
resistance, low voltage humidity, 2000 hour life test.
MIL-PRF-38534, Appendix C, Table C-III
H
Class H Element Evaluation.
K
Class K Element Evaluation.
D
Special Testing as per Customer Source Control Drawing
Examples:
10 (0 failure) destructive bond pull test as per Mil-Std-883,
Method 2011.
10 (0 failure) die shear test as per Mil-Std-883, Method 2019.
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