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JPS56176589

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DESCRIPTION JPS56176589
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a characteristic diagram showing frequency
characteristics due to change of front cavity of diaphragm, FIG. 2 is a characteristic diagram
showing frequency characteristics due to change of back cavity of diaphragm, FIG. 3 FIG. 4 is a
cross-sectional view showing a conventional headphone speaker, FIG. 4 is a cross-sectional view
showing an embodiment of the headphone speaker according to the present invention, and FIG. 5
is a characteristic view showing the frequency characteristics of the same. 1 и и и и и и и и и и и и и и и и и и и
и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и guide, ring, 7 и и и и и и и и и и и 9 ииииии Voice coil, 11 и и и и и
и и и и и и и и и и и и и и и и и и и и и damping material.
[Detailed Description of the Invention] / '#! ???? The present invention relates to a speaker
for a headphone in which a back cavity of a diaphragm is formed large. Conventionally, in the
closed type headphone, the frequency characteristic is determined by the interrelation between
the iII surface cavity of the imaging station and the back cavity of the diaphragm. That is, as the
front cavity of the diaphragm is made larger, the lower sensitivity lowers and the constant loss
area becomes narrower as shown in FIG. 1, and conversely, the back cavity becomes larger as
shown in FIG. Low-pass sensitivity is increased, and constant loss range is broadened. However,
the front cavity needs a volume enough to contact the adherend's ear when wearing the
headphone, and is the height of the speaker from the direction of the headphone function? One
columnar layer and frequency characteristics are determined by 1III fJ lL and n. Conventional
Sukika! A magnetic circuit 2 'is formed in an injection-molded frame 1' as shown in FIG. 3, and a
bobbin 8 'is inserted together with a voice coil 9' in a gap 10 'of the magnetic circuit 2'. The outer
peripheral edge portion 7 'of the diaphragm 7' is bonded to the mounting step portion 1'b
formed at the upper portion of the inner periphery of the frame 1 '. However, when the
conventional headphone speaker is injection molded with the frame 1 ', the outer peripheral line
portion of the diaphragm 7' Since the mounting step 1'b for mounting 'a' is formed, the thickness
of the frame 1 'becomes thick, and the back cavity of the moving plate 1' is determined, and the
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desired frequency characteristics can be obtained. I could not The present invention is not
limited to the above-mentioned point, and its purpose is to accommodate the magnetic circuit
and widen the range of constant loss, and to be restricted from both the outer appearance and
the appearance. One embodiment of the present invention will be described in accordance with
FIGS. 4 to 5 in order to provide a speaker for a headphone capable of improving balance (a good
frequency characteristic can be improved). Reference numeral 1 denotes a frame, in which a
magnetic circuit 2 is formed. As the magnetic circuit 2, for example, an external magnet type
formed by the yoke 3, the magnet 4 and the plate 5 is formed. 6 is mounted on top of the inner
periphery of the frame 1 using high frequency welding, adhesives etc. Further, the outer
peripheral portion 7m of the fine movement 47 is attached to the guide ring 6 by an adhesive or
the like by means of a kite ring. The reference numeral 8 denotes a bobbin provided on the lower
surface of the diaphragm T, and 9 denotes a Heus coil which is turned to the bobbin 8; this voice
coil 9 is pushed into the cap 10 circle of the magnetic 7 path 2.
Reference numeral 1a denotes a communication hole which is drilled on the lower surface of the
frame 1 and which communicates with the back cavity 11 of the diaphragm 1. Reference
numeral 1 denotes a damping material such as mesh which is stretched over the communication
hole 1 &. Reference numeral 12 denotes a front panel fixed to the top of the frame 1 and having
a plurality of sound holes 12 and a front panel 13. A pad 13 is attached to the top of the front
panel 12. One embodiment of the present invention is constructed as described above, and a
guide ring 6 is attached to the upper inner periphery of the frame 1, and the outer peripheral
portion ya of the diaphragm 1 is attached to this guide ring 6 by high frequency welding or an
adhesive Since it is a structure to be fixed firmly, it is not necessary to directly fix the outer
periphery m portion of the @ moving plate to the mounting step portion of the frame 1 as in the
conventional speaker shown in FIG. Therefore, the rear cavity 11 of the tie ? T can be expanded
compared to the conventional headphone speaker, thereby raising the low-pass sensitivity, and
as shown in FIG. 5, the frequency characteristic becomes flat as shown in FIG. Become wider. For
this reason, even when the magnetic circuit 2 of the same output is housed in the frame 1,
slimming of the headphone speaker can be achieved. Further, the bottom portion of the frame 1
is provided with a compliance portion 1a communicating with the back cavity 11 of the sliding
plate T, and a damping material 12 such as mesh is stretched over the communication hole 1
When the diaphragm T vibrates due to the magnetic flux from the inside of the gap 10 of 2, even
if the air of the back cavity 11 of the diaphragm T passes from the communication hole + a to the
back of the frame 1, it is braked by a damping material such as mesh. -(Because it does not enter
into the back cavity 11 again from the communication hole 1 &, the piston moon of 'WIJIIll & I
can be made smooth. As described above, when considering the magnetic circuit, it is possible to
widen the fixed loss range, and the frequency characteristics restricted by the appearance and
the peripheral surface of the mounting are well balanced and flat frequency characteristics. it
can.
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