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JP2002261048

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JP2002261048
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an
element manufacturing method and apparatus, and in particular, an element is formed by
forming an arbitrary pattern on a substrate using a functional liquid applying apparatus such as
an ink jet recording apparatus. The improvement of the method and apparatus.
[0002]
2. Description of the Related Art Semiconductor devices and other circuit devices are
manufactured by forming circuit patterns and wiring patterns on silicon, glass, PET (polyethylene
terephthalate) and other substrates. Conventionally, for example, a lithography method is used to
manufacture such an element. In this lithography method, a photosensitive material called a
resist is applied onto a substrate, the circuit pattern is irradiated and developed, and a metal ion
or the like is implanted into this to form a circuit pattern. This lithography method requires a
large amount of equipment and complicated steps, and has a high manufacturing cost.
[0003]
Further, as a method of forming the wiring, for example, a method by etching is used. In this
method, a metal foil is attached to the surface of the substrate, a resist resin is further applied,
patterning is performed by photolithography or the like, and the metal foil in a portion from
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which the resist is removed is etched away. However, this etching method has a problem that the
manufacturing cost is high. Although a method of printing a wiring pattern has also been
proposed, there is a problem that one product is similar and quality stability is lacking.
[0004]
By the way, it is conceivable to form a wiring pattern by discharging a metal-containing liquid
onto a substrate instead of ink using an ink jet recording head. Since the resolution of this ink jet
recording head is as fine as 400 dpi, for example, if it is possible to discharge functional liquid
from each nozzle hole, equipment such as a semiconductor factory is not required, and an
arbitrary pattern is formed with a width on the order of μm. It is considered possible.
[0005]
However, when the droplets discharged by the ink jet method land on the substrate surface, the
droplets may spread widely on the substrate surface, or the shapes of the droplets may remain as
they are on the contour of the wiring pattern, resulting in unevenness.
[0006]
Also, there has not been a method and apparatus for efficiently forming a three-dimensional
wiring including a plurality of layers and connecting the electric circuits of the respective layers
to each other.
[0007]
An object of the present invention is to provide a device manufacturing method and a
manufacturing apparatus capable of forming fine wiring without causing droplets to wet
unnecessarily by using a low cost functional liquid application method. .
[0008]
Another object of the present invention is to provide a method and apparatus for efficiently
forming an element provided with three-dimensional wiring.
[0009]
In order to solve the above problems, the manufacturing method of the present invention is a
method of manufacturing a device by applying a functional liquid to a device forming substrate,
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and on the device forming substrate, Patterning a plurality of portions having mutually different
affinity to the functional liquid, and selectively applying the functional liquid to a portion having
high affinity to the functional liquid among the plurality of portions; have.
[0010]
In the above manufacturing method, preferably, the element forming substrate is a substrate of
an RFID tag, and the functional liquid is a liquid containing a metal forming an antenna of the
RFID tag.
[0011]
In the above manufacturing method, in the step of forming the plurality of portions having
different affinity to the functional liquid, a step of applying an organosiloxane film on the
substrate, and exposing the organosiloxane film through an optical mask It is preferable to have
a process.
[0012]
In the above manufacturing method, the step of forming the plurality of portions having different
affinities for the functional liquid may be a step of applying a fluoroalkylsilane film on a
substrate, and an optical mask on the fluoroalkylsilane film. And the step of exposing.
[0013]
Further, another manufacturing method of the present invention is a method of manufacturing a
device by applying a functional liquid to a device forming substrate, and patterning a bank for
preventing the overflow of the functional liquid on the device forming substrate. And the step of
selectively applying the functional liquid into the bank.
[0014]
The manufacturing apparatus of the present invention is an apparatus for manufacturing a
device by applying a functional liquid to a device forming substrate, and patterning a plurality of
portions having different affinities for the functional liquid on the device forming substrate. A
patterning processing apparatus and a functional liquid applying apparatus for selectively
applying the functional liquid to a part having high affinity to the functional liquid among the
plurality of parts are provided.
[0015]
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In the above manufacturing apparatus, the element formation substrate is preferably a substrate
of an RFID tag, and the functional liquid is preferably a liquid containing a metal forming an
antenna of the RFID tag.
[0016]
Further, in the above manufacturing apparatus, the patterning processing apparatus for forming
a plurality of portions having different affinities for the functional liquid includes a
photosensitive material application apparatus for applying an organosiloxane film on a substrate,
and an optical mask for the organosiloxane film. And an exposure apparatus for exposing
through the
[0017]
Further, in the above manufacturing method, the patterning processing apparatus for forming a
plurality of portions having different affinities for the functional liquid includes a photosensitive
material application apparatus for applying a fluoroalkylsilane film on a substrate, and the
fluoroalkylsilane film. It is preferable to provide an exposure apparatus that exposes through an
optical mask.
[0018]
Another manufacturing apparatus of the present invention is an apparatus for manufacturing a
device by applying a functional liquid to a device forming substrate, and patterning is performed
on the device forming substrate, by patterning a bank for preventing overflow of the functional
liquid. A processing apparatus and a functional liquid applying apparatus for selectively applying
the functional liquid into the bank are provided.
[0019]
Another manufacturing method of the present invention is a method of manufacturing a device
by applying a metal-containing liquid to a device forming substrate, wherein a step of forming a
hole in the device forming substrate, and applying the metal-containing liquid in the hole And a
process of
[0020]
In the above manufacturing method, it is preferable that the holes are formed at different
positions in the thickness direction of the substrate in the terminals of the plurality of electric
circuit elements.
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[0021]
In the above manufacturing method, the substrate has a multilayer structure including a plurality
of electric circuit layers and an insulating layer between the electric circuit layers, and the metalcontaining liquid applied to the holes causes the electric conduction between the electric circuits
of each layer. It is desirable to make it possible.
[0022]
In the above manufacturing method, it is desirable that a plurality of the holes are formed in a
long shape extending in a predetermined direction of the substrate surface and substantially in
parallel.
[0023]
Another manufacturing apparatus of the present invention is an apparatus for manufacturing a
device by applying a metal-containing liquid to a device forming substrate, and a processing
device for forming a hole in the device forming substrate, the metal-containing liquid in the hole
And a liquid applying device for applying.
[0024]
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be
described below with reference to the drawings.
[0025]
First Embodiment In the present embodiment, in particular, the case of forming an antenna of an
RFID (Radio Frequency Identification) tag will be described as an example.
[0026]
(Structure of RFID Tag) The RFID tag is an electronic circuit used in a so-called radio wave system
recognition system.
This system is composed of three parts: (1) a transponder (transmitter / receiver) called "tag", (2)
a tag reader, and (3) a data processing system such as a computer.
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[0027]
The tag reader includes an electronic device unit and an antenna, transmits a radio wave for
activating the tag, and receives a radio signal from the tag.
The received data is checked and decoded by the electronic device unit.
[0028]
The tag contains an IC and an antenna, in which there is a section of memory storing
identification codes and other data.
The contents of this memory are transmitted by radio (to the tag reader) when the chip is
activated.
[0029]
In many RFID systems, the tag reader emits radio waves to a certain zone determined by the
frequency of use of the system and the size of the antenna.
When one tag passes through this zone, the tag detects radio waves from the tag reader and
transmits data stored in the tag.
[0030]
When the tag reader receives data from the tag, it decodes the data and further determines
whether the data is valid.
If the data is valid, it is communicated to a data processing system such as a computer.
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[0031]
There are two types of tags: active and passive.
The active tag operates with the power of a battery connected or stored inside.
The active type has the advantage that the power supply of the tag reader can be reduced, and
generally a long reading distance is possible.
Passive tags do not require a separate external power source, and operating power is derived
from the energy emitted by the tag reader.
Passive tags are much smaller, lighter, cheaper than active tags, and have virtually no lifetime
limitations.
[0032]
(Structure of RFID Tag) FIG. 1 is a plan view (1) of an RFID tag manufactured by a manufacturing
method according to an embodiment of the present invention and a sectional view in the
direction of the arrow (2).
As shown in FIG. 1A, the RFID tag 10 includes an IC 12 provided on a PET substrate 11, a spiral
antenna 13 connected to the IC, and a solder resist 14 formed on a part of the antenna. And an
Ag wire 15 formed on the solder resist and connecting both ends of the antenna to form a loop.
[0033]
The antenna 13 is formed in a spiral shape on the substrate 11 at a predetermined distance from
each other, so that the respective spiral portions of the spiral do not short circuit with the
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adjacent circular portions.
In order to prevent short circuiting of each turn, it is necessary to accurately place the metal
forming the antenna at a predetermined position on the substrate.
When a liquid containing a metal that constitutes an antenna is discharged onto a substrate by
an ink jet method, it is necessary not to leave unevenness in the contour of the antenna.
[0034]
(Method of Manufacturing RFID Tag) In this embodiment, after a plurality of portions having
different affinities with respect to a liquid containing a metal constituting an antenna are formed,
the liquid is discharged by an ink jet method.
Here, the plurality of different affinity portions is preferably a combination of a high affinity
portion and a non-affinity portion.
Specifically, the portion to form an antenna is a portion with high affinity, and the portion not to
form an antenna is a non-affinity portion.
More specifically, since the liquid (a colloidal solution such as Au, Ag, Cu, etc. containing a metal)
that constitutes the antenna is an aqueous liquid, the portion where the antenna is to be formed
should be hydrophilic to form the antenna. The portion that should not be made should be
hydrophobic.
[0035]
FIG. 2 is a cross-sectional view of the manufacturing process for explaining the method of
manufacturing the RFID tag.
One of the methods of patterning a substrate into a plurality of portions with different affinity as
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described above is a method of using organosiloxane.
For example, an organosiloxane mixed with titanium oxide (TiO2) as a photocatalyst is coated on
a PET substrate shown in FIG. 2 (1) by spin coating or inkjet method, and exposed to ultraviolet
light by a high pressure mercury lamp with a wavelength of 254 nm through an optical mask. Let
As a result, the exposed portion of the hydrophobic organosiloxane becomes hydrophilized.
[0036]
Furthermore, wiring drawing of an Au colloid solution ("Perfect Gold" manufactured by vacuum
metallurgy Co., Ltd.) is performed by an inkjet method.
By baking this at 120 ° C. for 30 minutes in the atmosphere, the gold antenna wiring 13 shown
in FIG. 2 (2) can be obtained.
Furthermore, in order to obtain an RFID tag, IC mounting is performed as shown in FIG. 2 (3),
and a solder resist 14 is further applied by an inkjet method as shown in FIG. 2 (4).
Further, an Ag colloid solution ("Perfect Silver" manufactured by Vacuum Metallurgical Co., Ltd.)
is applied by an ink jet method to form an Ag wire 15 connecting both ends of the antenna 13 to
form a loop, and the RFID tag 10 shown in FIG. Manufacture.
[0037]
Although forming the IC 12 of the illustrated size by the ink jet method may be difficult with the
resolution of the current ink jet method, it may be realized by the ink jet method if it is a larger
IC. By thus performing all the processes by the inkjet method, the manufacturing efficiency and
the cycle time are dramatically improved. Further, by improving the manufacturing efficiency of
the RFID tag and reducing the cost, it is possible to manufacture an extremely inexpensive RFID
tag, and it becomes possible to put a disposable tag into practical use.
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[0038]
In the above example, although the organosiloxane is applied to the entire surface of the
substrate and the portion to be hydrophilized is exposed, it is not necessary to apply the
organosiloxane to the entire surface. That is, when the metal-containing liquid is ejected by the
inkjet method to the portion to form the antenna, the metal-containing liquid remains on the
portion to form the antenna and the metal-containing liquid does not stay to the portion not to
form the antenna. What is necessary is to hydrophilize the portion to form the antenna and to
hydrophobize the vicinity of the portion to form the antenna among the portions not to form the
antenna. Therefore, it is not necessary to apply organosiloxane at a position sufficiently away
from the boundary between the portion where the antenna should not be formed and the portion
where the antenna should be formed.
[0039]
As another method for performing hydrophilic and hydrophobic patterning of a substrate, there
is a method using fluoroalkylsilane (FAS). Fluoroalkylsilanes are also rendered hydrophilic by
irradiation with ultraviolet light. It is even more preferred to use a suitable photocatalyst.
[0040]
Moreover, the material which comprises antenna wiring 13 grade | etc., May use not only this
but the Cu-SOM liquid by a vacuum metallurgical company, the nano paste of Harima Chemicals,
etc., for example. The former is suitable for forming copper wiring, and the latter has the
property that fine metal wiring can be formed by low temperature baking at about 150 ° C. to
200 ° C. Not limited to metals, conductive polymers such as PEDT (polyethylenedioxythiophene) may also be used. In this case, a plurality of regions having different affinity to
the conductive polymer are patterned, and the melted conductive polymer is applied to the
region having affinity.
[0041]
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Another method of patterning the substrate to fix the functional liquid at a desired position on
the substrate is to form a bank on the substrate to prevent the functional liquid from spilling out.
In this method, the element thickness corresponding to the bank height is generated, and after
the discharge and baking of the functional liquid, the flattening process is required, but it is
advantageous when it is desired to thicken the wiring.
[0042]
Second Embodiment A microlens array (MLA) is formed by arranging a large number of fine
lenses on a substrate, and is used for a liquid crystal display panel, a projector, a scanner, and the
like. In order to form this microlens array, a method may be considered in which a transparent
epoxy resin or the like that is a material of the lens is discharged onto the substrate by an inkjet
method. The lens formation portion on the substrate is processed to have affinity with the resin,
and the non-formation portion of the lens is made non-affinity with the resin to make the shape
and arrangement of the lens more accurate. it can.
[0043]
The method of applying the functional liquid is not limited to the inkjet method, but may be a
method using a dispenser.
[0044]
Further, the substrate on which the element of the present embodiment is formed is not limited
to PET, glass, or silicon, and can be formed on, for example, paper and used as a seal.
[0045]
According to the manufacturing method of the present embodiment, since the functional liquid is
selectively applied only to the required part, there is no waste of material compared to the case
of applying and etching the entire surface, and the cost can be reduced. .
[0046]
Third Embodiment FIG. 3 is a schematic perspective view of a speaker manufactured by the
manufacturing method of this embodiment.
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As shown in FIG. 3, the coil 32 is formed by applying a liquid in which metal fine particles are
dispersed to the diaphragm 31 by ink jet, and the diaphragm 31 is disposed to face the magnetic
flux generating means 33 such as a magnet. .
Analog signal generation and current flow from the amplifier circuit 34 to the coil 32 on the
diaphragm 31 generate magnetic flux from the coil 32 and the diaphragm 31 vibrates by
interaction with the magnetic flux generating means 33, A sound is generated.
The diaphragm 31 may be flat as shown, or may be conical. Furthermore, by covering the coil
forming surface on the diaphragm 31 with a waterproof film or the like, it is possible to form a
thin and waterproof speaker.
[0047]
<Fourth Embodiment> FIG. 4 is a front transparent view in the case where electrical wiring is
formed on a wall surface by the device manufacturing method of the present embodiment. The
housing unit wall 41 shown in the figure is provided with a power supply terminal 42, a
telephone terminal 44, a terminal 46 of a cable television, and the like. The electric wire 43 is
connected to the power supply terminal 42, and the signal lines 45 and 47 are connected to the
terminals of the telephone and the cable television so that electric power and signals can be
output, respectively. For example, by attaching a wall-mounted television 48 to the unit wall 41
and connecting the electric wire 43 and the signal line 47 to the wall-mounted television 48, the
broadcast signal can be received and images and sounds can be received even without an
exposed portion such as an electric wire cord. It can be output.
[0048]
The electric wires 43 and the signal lines 45 and 47 can be formed by applying a liquid in which
metal fine particles are dispersed by inkjet to a predetermined position of the unit wall surface,
and drying and curing the liquid.
[0049]
Fifth Embodiment FIG. 5 is a cross-sectional view of a manufacturing process of a device
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provided with a three-dimensional wiring manufactured by the device manufacturing method of
the present embodiment.
Necessary surface treatment is applied to the same insulating substrate 51 as used in the first
embodiment (S1), and a plurality of layers of electric circuits 52 are formed on the substrate (S2).
Here, a liquid in which metal fine particles are dispersed by inkjet is applied to both sides of the
substrate in a predetermined pattern, and is dried and cured to form a total of two layers of
electric circuits 52. The method of forming the plurality of layers of the electric circuit 52 is not
limited to this, and an insulating layer may be formed on one layer of the electric circuit and an
electric circuit of the next layer may be formed thereon.
[0050]
Next, the holes 53 are formed in the substrate (S3). The holes 53 are for electrical conduction
between the plural layers of electric circuits 52, and the terminals of the plural layers of electric
circuits 52 are exposed on the wall surface of the holes 53 at different positions in the thickness
direction of the substrate. Be done. The holes 53 may penetrate from one surface of the substrate
to the other surface, or may not reach the other surface without penetrating. The holes 53 may
be formed, for example, by applying a photosensitive material, exposing it to a predetermined
pattern and developing it, or etching with a mask of a predetermined pattern. The diameter of the
hole 53 is, for example, 100 μm.
[0051]
Next, the metal-containing liquid 54 is applied by ink jet into the holes 53 (S4). At this time, it is
desirable to lyophilically process the wall surface of the hole 53 in advance according to the
nature of the metal-containing liquid. By drying and curing the applied liquid 54, the electric
circuits 52 in a plurality of layers can be conducted to each other, and a three-dimensional wiring
can be formed. It is sufficient that the conductivity of each layer be ensured, so that the metal
may be completely filled in the hole 53 after hardening, and the metal film 55 is formed only on
the wall surface of the hole 53. It is good also as (S5).
[0052]
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<Sixth Embodiment> FIG. 6 is a plan view (a) of an anisotropic conductive film 61 manufactured
by the device manufacturing method of this embodiment and a sectional view taken along the
line B-B. A plurality of elongated holes 62 extending in a predetermined direction on the film
surface, such as silicone rubber and polyester film, are formed substantially in parallel with each
other, subjected to necessary surface treatment, and then the liquid in which metal fine particles
are dispersed is formed by inkjet Apply within 62. By drying and curing this, it is possible to
produce an anisotropic conductive film 61 which can be electrically conducted in a certain
direction on the film surface and insulated in the direction perpendicular thereto. The holes 62
may penetrate in the thickness direction of the film as shown in FIG. 6 (b) or may be formed as
grooves which do not penetrate.
[0053]
<Manufacturing Apparatus> FIG. 7 is a schematic perspective view of an element manufacturing
apparatus used in the above-described manufacturing method. The element manufacturing
apparatus 100 includes an inkjet type functional liquid applying apparatus, and includes an
inkjet head group 1, an X direction drive shaft 4, a Y direction guide shaft 5, a control device 6, a
mounting table 7, a cleaning mechanism unit 8, and a base. A stand 9 is provided.
[0054]
The inkjet head group 1 includes an inkjet head that discharges a predetermined functional
liquid (a metal-containing liquid, a photosensitive material, and the like) from a nozzle (ejection
port) and applies it to a substrate.
[0055]
The mounting table 7 mounts the substrate 101 (PET, glass, silicon, paper, etc.) to which the
functional liquid is applied by the applying device, and includes a mechanism for fixing the
recording medium at a reference position.
[0056]
An X-direction drive motor 2 is connected to the X-direction drive shaft 4.
The X-direction drive motor 2 is a stepping motor or the like, and rotates the X-direction drive
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shaft 4 when a drive signal in the X-axis direction is supplied from the control device 6.
When the X-direction drive shaft 4 is rotated, the inkjet head group 1 moves in the X-axis
direction.
[0057]
The Y-direction guide shaft 5 is fixed so as not to move relative to the base 9. The mounting table
7 includes a Y-direction drive motor 3. The Y-direction drive motor 3 is a stepping motor or the
like and moves the mounting table 7 in the Y-axis direction when a drive signal in the Y-axis
direction is supplied from the control device 6.
[0058]
The control circuit 6 supplies each head of the inkjet head group 1 with a voltage for controlling
the discharge of droplets. The drive pulse signal for controlling the movement of the inkjet head
group 1 in the X axis direction is supplied to the X direction drive motor 2, and the drive pulse
signal for controlling the movement of the mounting table 7 in the Y axis direction is supplied to
the Y direction drive motor 3. .
[0059]
The cleaning mechanism unit 8 includes a mechanism for cleaning the inkjet head group 1. The
cleaning mechanism 8 is provided with a Y-direction drive motor (not shown). The cleaning
mechanism 8 moves along the Y direction guide shaft 5 by the drive of the drive motor in the Y
direction. The movement of the cleaning mechanism 8 is also controlled by the controller 6.
[0060]
Although an exposure apparatus for performing hydrophilic / hydrophobic patterning and the
like is not shown in FIG. 7, a known exposure apparatus using a mercury lamp or the like can be
applied to the manufacturing method of the present embodiment. According to the present
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invention, it is possible to provide an element manufacturing method and apparatus capable of
forming fine wiring without unnecessary wetting and spreading of droplets using a low cost
functional liquid application method. Can. Moreover, the method and apparatus which form
efficiently the element provided with three-dimensional wiring can be provided.
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