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JP2008187416

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JP2008187416
An object of the present invention is to provide a condenser microphone capable of avoiding
generation of hum noise. A capacitor microphone 11 in which a microphone unit 32 and a circuit
board 62 carrying necessary members including a filter and an output circuit are integrated to
ensure continuity and then housed in a protective case 22. The case 43 is formed of a solderable
metal material, and the circuit board 62 is provided with a ground pattern 63 at a position facing
the caulking portion 47 of the unit case 43, and the caulking portion 47 is a ground pattern on
the circuit board 62 side. Solder to 63. Thereby, in the condenser microphone 11, even if the
caulking force of the caulking portion 47 is relieved, the ground side conductive path formed by
electrically connecting the caulking portion 47 and the ground pattern 63 on the circuit board
62 side ensures strong conduction. Since it can be done, generation of hum can be avoided.
[Selected figure] Figure 2
コンデンサマイクロホン
[0001]
The present invention relates to a condenser microphone in which the microphone unit side is
soldered and integrally connected on the circuit board side on which the necessary members
including the filter and the output circuit are mounted and then the whole is housed in a
protective case. It is a technology.
[0002]
As one of the condenser microphones, there is a gooseneck microphone widely used for
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conferences and the like.
As disclosed in FIG. 3 of Patent Document 1 below, the gooseneck microphone is normally
disposed in a state in which a protective case housing the microphone unit and a circuit board on
which a filter and an output circuit are mounted are separated. And the microphone cords are
electrically connected to each other. JP 2005-323222 A
[0003]
In addition, usually, in the above-mentioned condenser microphone, a part of the microphone
cord is embedded in a shield case for housing a circuit board, so when a strong electromagnetic
wave is added to the microphone cord when a mobile phone is used at a close distance, It is said
that noise caused by the electromagnetic waves is generated.
[0004]
For this reason, as a method for avoiding the generation of noise due to an electromagnetic wave
entering through a microphone cord, a necessary member including a filter and an output circuit
as shown in the following non-patent document 1 in a condenser microphone, for example A
capacitor microphone has also been proposed in which the microphone unit side is soldered to
the circuit board side on which the is mounted and integrally connected in a conductive manner,
and the whole is housed in a protective case.
Audio-Technica Co., Ltd. product catalog (See "For Sound Contractor" page 16 published in 2003)
[0005]
FIG. 3 is an explanatory view showing an example of the entire configuration of a conventional
condenser microphone including the non-patent document 1 and a cross-sectional structure
thereof. FIG. 4 is an enlarged view of the condenser microphone portion in FIG.
[0006]
As shown in these figures, the condenser microphone 1 comprises at least a protective case 2
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and a microphone unit 3 and a circuit board 6 which are housed integrally while securing
conductive connection in the protective case 2. ing.
[0007]
In this case, in the condenser microphone 1, the flexible pipe 7 is integrally connected to the base
end side of the protective case 2, and the whole thereof is configured as a gooseneck
microphone.
[0008]
Further, as is apparent from FIG. 4, the condenser microphone 1 has a unit case 4 of cylindrical
aluminum with a bottom and an inner bottom surface 4 a located on the end side, and an
opening side of the unit case 4 crimped and sealed. It is formed by the built-in member 5
comprised with several components arrange | positioned in the predetermined position in unit
case 4 via the unit board | substrate 5b.
In this case, necessary conduction between the diaphragm ring 5a and the unit substrate 5b
which constitute the built-in member 5 and are accommodated on the inner bottom surface 4a
side, the crimped portion 4b formed on the opening side of the unit case 4 is a unit It secures by
contacting a conductive pattern (not shown) provided on the peripheral side of the substrate 5b.
[0009]
On the other hand, the circuit board 6 on which the necessary members including the filter and
the output circuit are mounted is disposed in a positional relationship orthogonal to the surface
direction of the unit board 5b, and is formed with a lateral width substantially equal to the inner
diameter of the unit case 4 ing.
[0010]
Further, on the predetermined conductive pattern on the circuit board 6 side, the output terminal
5d of the FET (impedance converter) 5c projecting in pairs from the substantially central portion
of the unit substrate 5b is separately soldered.
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Although only one output terminal 5d is shown in the illustrated example, the other output
terminal 5d is similarly soldered on the back surface side.
Thereby, the circuit board 6 side secures necessary conduction between the microphone unit 3
side.
[0011]
On the other hand, the protective case 2 has a case body portion 2a for housing the circuit board
6, and a cap portion having an opening for sound collection which houses the microphone unit 3
and is detachably covered with the tip end side of the case body portion 2a. It is comprised by 2
d and the nozzle | cap | die 2c which hold | maintained the flexible pipe 7 and was connected
with the base end side of the case main-body part 2a.
[0012]
As described above, the condenser microphone 1 is formed by being integrated with the
microphone unit 3 and the circuit board 6 while securing necessary conduction between each
other and then housed in the protective case 2.
[0013]
By the way, in the condenser microphone 1 of the illustrated example, the unit case 4 is
electrically connected to the ground pattern (not shown) of the unit substrate 5b via the caulking
portion 4b, and the unit substrate 5b is electrically connected to the ground pattern (not shown)
on the circuit substrate 6 side. Ground side conductive path is secured.
[0014]
As a result, the condenser microphone 1 can obtain a shielding effect against electromagnetic
waves generated when a mobile phone is used at a close distance, etc., and can avoid generation
of hum noise caused by the penetration of the electromagnetic waves. .
[0015]
However, in the condenser microphone 1 of the illustrated example, after the microphone unit 3
and the circuit board 6 are integrated, they are housed in the case body 2a to which the inner
diameter substantially equal to the width of the circuit board 6 is given. The Rukoto.
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For this reason, the circuit board 6 is semi-forcefully stored while the edge side along the length
direction is in sliding contact with the inner peripheral surface of the case body 2a.
[0016]
For this reason, the circuit board 6 having a thin plate shape is screwed in to the microphone
unit 2 side to a certain extent at the time of storing the circuit board 6, so that the circuit board 6
which is swung in a direction perpendicular to the surface direction is pushed.
As a result, the unit substrate 5b soldered to the circuit board 6 side receives stress generated at
the time when the circuit board 6 side swings intensively at the soldering portion S.
[0017]
In particular, since the unit substrate 5b is soldered to the circuit substrate 6 at a substantially
central portion thereof, a ladder action with the soldering portion S as a fulcrum acts and the
pressing force in the direction of loosening the caulking portion 4b is received. become.
As a result, the surface direction of the unit substrate 5b is inclined from the horizontal position,
and the conductive contact between the caulking portion 4b and the ground pattern on the side
of the unit substrate 5b (not shown) becomes uncertain.
[0018]
On the other hand, such loosening of the caulking force once generated does not return to its
original state even when the stress applied to the unit substrate 5b is released.
For this reason, the microphone unit 3 and the circuit board 6 are accommodated in the
protective case 2 in a state where only insufficient ground side conductive paths are formed
between each other. As a result, the condenser microphone 1 tends to generate a problem of
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generating hum noise under the condition that a sufficient ground can not be obtained.
[0019]
Moreover, as shown in FIG. 3, when the flexible pipe 7 is connected to the base end side of the
protective case 2, bending in the flexible pipe 7 side accompanying the position movement on
the condenser microphone 1 side causes the same as above. The loosening of the caulking force
causes the condenser microphone 1 to generate the same hum noise as described above.
[0020]
SUMMARY OF THE INVENTION In view of the above problems of the prior art, the present
invention provides stable ground-side conduction between the microphone unit side and the
circuit board side even when stored in the protective case with the caulking force of the caulking
portion of the unit case loosened. It is an object of the present invention to provide a condenser
microphone capable of securing a path and avoiding the generation of hum noise.
[0021]
The present invention has been made to achieve the above object, and includes a plurality of unit
cases having a bottomed cylindrical shape and a unit substrate which is sealed by caulking
through a caulking portion formed on the opening surface side of the unit case. At least a
microphone unit comprising the internal components and a circuit board mounted in a positional
relationship in which the necessary members including a filter, an output circuit, and the like are
mounted and orthogonal to the surface direction of the unit substrate; A circuit board is a
condenser microphone in which at least a ground-side conductive path is secured by soldering
mutually via the unit board, and the unit case can be soldered. The circuit board has a width
substantially equal to the outer diameter of the caulking portion of the unit case A ground
pattern is provided at a position facing the caulking portion at the time of storage thereof and is
formed, and the unit case and the circuit board are secured by soldering between the caulking
portion and the grand pattern. The most important feature is that it is connected conductively.
[0022]
In this case, it is desirable to connect a flexible pipe integrally to the base end side of the
protective case.
[0023]
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According to the invention of claim 1, in the condenser microphone, the unit case of the
microphone unit is formed of a metal material which can be soldered, and a ground pattern is
provided on the circuit board at a position facing the caulking portion when stored in the
protective case. Since it is provided, the crimped portion on the unit case side and the ground
pattern on the circuit board side can be soldered to stably secure the ground-side conductive
path.
As a result, even if the caulking force of the caulking portion is relaxed, the condenser
microphone has a ground-side conductive path formed by direct conduction connection between
the caulking portion and the ground pattern on the circuit board side. Generation of hum can be
avoided.
[0024]
Moreover, according to the invention of claim 2, the condenser microphone is entirely as a
gooseneck microphone in which the flexible pipe is connected to the base end side of the
protective case and the flexible pipe is repeatedly bent to move the condenser microphone. Even
if configured, the ground-side conductive path can be secured, so that it can be suitably used for
a long time in a stable manner.
[0025]
FIG. 1 is an explanatory view showing a cross-sectional structure of an example of the present
invention, and FIG. 2 is an enlarged view showing a main part of the example shown in FIG.
According to these figures, a plurality of condenser microphones 11 includes a cylindrical unit
case 43 with a bottom and a plurality of unit substrates 58 caulked by caulking portions 47
formed on the opening surface 45 side of the unit case 43. The microphone unit 32 composed of
the built-in member 53 composed of the following components and the circuit board 62 on
which the necessary members including the filter and the output circuit are mounted are housed
and formed in the protective case 22 in a state of conducting connection integrally. It is done.
[0026]
Among them, the protective case 22 is provided with a case main body 23 in which the circuit
board 62 and the microphone unit 32 are accommodated, and a sound collecting opening 25 and
is detachably covered with the tip end side of the case main body 23. A cap portion 24 and a cap
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26 disposed on the base end side of the case main body portion 23 and connected to the lexible
pipe 72 are configured.
[0027]
On the other hand, the circuit board 62 is disposed in a positional relationship orthogonal to the
surface direction of the unit board 58, and is formed with a lateral width substantially equal to
the outer diameter of the caulking portion 47 of the unit case 43.
[0028]
That is, the circuit board 62 has a thin plate-like long quadrilateral whose longitudinal width
direction is elongated compared to the length in the lateral width direction, and the position
where the lateral width direction is made along the diameter direction of the unit substrate 58
Arranged in a relationship.
[0029]
In this case, the necessary members on the circuit board 62 side include a ground pattern 63 for
grounding.
The ground pattern 63 is at a position on the circuit board 62 side facing the caulking portion 47
on the microphone unit 32 side when the microphone unit 32 and the circuit board 63 are
stored in the protective case 22 under the above positional relationship. It is provided.
[0030]
The positional relationship between the microphone unit 32 and the circuit board 62 will be
described in more detail based on FIG. 2. The microphone unit 32 has a unit case 43 with the
inner bottom surface 44 facing the sound collection opening 25 and the unit case The individual
components constituting the internal member 53 are fixed at a predetermined position in the
unit case 43 via the crimped portion 47 which is formed by bending so that the open end edge
on the opening surface 45 side of the 43 is curled inward. There is.
[0031]
In this case, the diaphragm ring 54 is disposed on the inner bottom surface 44 side by the
diaphragm 54a and the fixed pole 55 is provided opposite to the diaphragm 54a, and the fixing
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is performed on the components constituting the built-in member 53. An insulating seat 56 for
supporting the pole 55, an FET (impedance converter) 57 housed in a space provided in the
insulating seat 56 and conducted to the fixed pole 55 side, the FET 57 is mounted, and the
opening face 45 is formed. At least the unit substrate 58 to be sealed is included.
[0032]
Further, the unit case 43 is provided with the large diameter portion 46 on the opening surface
45 side so as to hold the unit substrate 58 in the horizontal direction in the plane direction when
the caulking portion 47 is formed on the open end edge side. .
That is, in the unit case 43, a step portion 46a derived from the difference in diameter and size
between the large diameter portion 46 and the adjacent portion in the length direction is formed.
The step portion 46a and the caulking portion 47 are formed. The opposite peripheral edge
portion of the unit substrate 58 held via the lower substrate is supported by the large diameter
portion 46 to fix the unit substrate 58 in position.
[0033]
In addition, unit case 43 should be excellent in resistance to chlorine-based organic solvents used
for degreasing oils and fats and for acidic liquids used for removal of oxide films, and should be
suitably used as a base material because of its good solderability. Can be formed, for example,
using a conductive metal such as C7521.
[0034]
On the other hand, the output terminal 57a of the FET 57 projecting in a pair from the unit
substrate 58 toward the circuit substrate 62 is soldered to a predetermined conductive pattern
on the circuit substrate 62 side.
In the illustrated example, only one of the exposed output terminals 57 a is shown, and the other
is soldered to a predetermined conductive pattern on the back surface side of the circuit board
62.
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[0035]
Furthermore, the caulking portion 47 of the unit case 43 is soldered to a ground pattern 63
provided under the positional relationship facing the caulking portion 47 on both end sides in
the lateral width direction of the circuit board 62. .
[0036]
Thereby, the circuit board 62 has separate soldering sites S2 for the soldering site S1 with the
unit board 58 through the output terminal 57a at the substantially central site along the width
direction and the soldering sites S2 for the caulking sections 47 on both ends. , And S2 are
integrally connected to the microphone unit 32 side.
[0037]
The microphone unit 32 and the circuit board 62 are conductive paths for audio signals from the
fixed pole 55 on the microphone unit 32 side to the output circuit on the circuit board 62 side
via the soldering site S, through the FET 57, The capacitor microphone 11 is formed by being
accommodated in the protective case 22 after at least securing a ground side conductive path for
grounding from the unit case 43 side to the ground pattern 63 on the circuit board 62 side.
[0038]
Moreover, in the ground side conductive path between the microphone unit 32 and the circuit
board 62, the caulking portion 47 of the unit case 43 is conducted to the ground pattern (not
shown) of the unit board 58, and the circuit board 62 side is Two paths are secured: one
conducted to the ground pattern 63 and the one conducted directly to the ground pattern 63 on
the circuit board 62 side through the caulking portion 47.
[0039]
Next, the operation and effects of the present invention will be described with reference to FIGS.
1 and 2. The microphone unit 32 is mounted on the circuit board 62 disposed in a positional
relationship orthogonal to the surface direction of the unit board 58. The unit substrate 58 is
soldered through the output terminal 57a of the FET 57 projected from the unit substrate 58
toward the circuit substrate 62, and the unit case 43 is further soldered through the caulking
portion 47. can do.
[0040]
Under such positional relationship, on the circuit board 62 side, the soldering portion S1 with the
unit substrate 58 via the output terminal 57a at the substantially central portion along the
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surface direction of the unit substrate 58, and both end portions Each separate soldering portion
S2, S2 with the unit case 43 and 35 via the caulking portion 47 is formed.
[0041]
On the other hand, the microphone unit 32 and the circuit board 52 are for audio signals from
the fixed pole 55 on the microphone unit 32 side to the output circuit on the circuit board 62
side via the FET 57 via the soldering portion S1 on the output terminal 57a side. A conductive
path (not shown) is integrated in a state where at least a ground side conductive path (not
shown) extending from the unit case 43 side to the circuit board 52 side via the soldering portion
S2 on the caulking portion 47 side is secured. It becomes.
[0042]
Next, the integrated microphone unit 32 and the circuit board 62 are accommodated in the case
main body 23 to which an inner diameter dimension substantially equal to the lateral width
dimension of the circuit board 62 is given.
That is, since the circuit board 62 is fed while the end edge on the long side along the length
direction is in sliding contact with the inner peripheral surface of the case main body portion 23,
the case is forced to a certain extent It will be stored in the main body part 23.
[0043]
Then, the case body 23 containing the microphone unit 32 and the circuit board 62 is covered
with the cap 24 and assembled into the protective case 22 to form the condenser microphone
11.
[0044]
In this case, the circuit board 62 in the form of a thin plate is swung in a direction perpendicular
to the surface direction by forced pressing at the time of storage thereof, and the swinging
pressure is transmitted through the soldering portion S1 at a substantially central portion. Thus,
the unit substrate 58 is supported.
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For this reason, the unit substrate 58 tends to act as a ladder with the soldering portion S1 as a
fulcrum to concentrate stress on the caulking portion 47 and to cause a phenomenon of
loosening the caulking force of the caulking portion 47.
[0045]
If such a phenomenon occurs temporarily, the unit substrate 58 is inclined in the surface
direction, and the caulking portion 47 causes the conductive contact with the ground pattern
(not shown) of the unit substrate 58 to be unreliable. It will be.
[0046]
In this case, in the unit case 43 according to the preferred embodiment shown in FIG. 2, the large
diameter portion 46 is formed on the side of the opening surface 45. The position of the unit
substrate 58 is fixed by holding the horizontal position of the unit substrate 58, and the function
of the unit substrate 58 as a fulcrum with the soldering portion S1 as a fulcrum when the stress
is applied to the unit substrate 58 can be suppressed. ing.
[0047]
That is, at the boundary between the large diameter portion 46 and the adjacent portion in the
length direction, the step portion 46a is generated from the difference in diameter dimension
between the two, and the step portion 46a is the soldering portion S1 of the unit substrate 58.
Will stop the seesaw-like movement around the fulcrum and prevent it from acting as a ladder.
However, in the unit case 43 which does not have a structure such as the large diameter portion
46, the unit substrate 58 acts on the caulking portion 47 as a ladder so as to concentrate stress,
and hence the caulking force is relaxed.
[0048]
In the present invention, the circuit board 62 side is also soldered to the caulking portion 47 in
addition to the soldering with the printed circuit board 58, thereby being conductively connected
and integrated with the microphone unit 32 side.
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In particular, the caulking portion 47 is directly conductively connected to the ground pattern 63
on the circuit board 62 side via the soldering portion S2.
[0049]
Thus, the ground-side conductive path via the caulking portion 47 between the microphone unit
32 side and the circuit board 62 side passes through the ground pattern (not shown) on the unit
board 58 side to the ground pattern 63 on the circuit board 62 side. Two paths, that is, the one
directly to the ground pattern 63 on the circuit board 62 side, are secured.
[0050]
Among these, since the ground side conductive path, which is the latter path, is formed by
soldering the caulking portion 47 and the ground pattern 63 on the circuit board 62 side, the
caulking portion is formed by interposing the soldering portion S2. The surface contact between
47 and the ground pattern 63 makes it possible to ensure the electrical connection more
securely.
[0051]
From this, a loosening of the caulking force occurs between the microphone unit 32 and the
circuit board 62, and the ground-side conductive path from the caulking portion 47 to the unit
board 58 side becomes unstable and in a conductive state. Also, another ground conductive path
from the caulking portion 47 to the ground pattern 63 on the circuit board 62 side can be stably
secured.
[0052]
As a result, the condenser microphone 11 can ensure a reliable shielding effect on
electromagnetic waves and can avoid the generation of hum noise.
Moreover, in the condenser microphone 11, since the diaphragm ring 54 electrically connected
to the unit case 43 is electrically connected to the circuit board 62 side through the conductive
connection between the caulking portion 47 and the ground pattern 63 on the circuit board 62
side, Noise generation due to contact failure can also be avoided.
[0053]
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Furthermore, in the condenser microphone 11, the flexible pipe 72 is integrally connected to the
base end side of the protective case 22 via the base 26, and the circuit board 62 swings
according to the frequent bending of the flexible pipe 72. Thus, even if the caulking force is
reduced, the generation of the hum noise can be effectively avoided since the ground side
conductive path is secured, and the gooseneck microphone can be suitably used for a long time.
[0054]
The above has described the present invention based on the illustrated examples, and the specific
configuration thereof is not limited to this.
For example, although the unit case 43 has been exemplified by using the conductive metal
C7521, the invention is not limited to this, and the unit case 43 has conductivity, is excellent in
resistance to solvents and acidic liquids, and is wetted with solder. A metal material having good
properties can be used as the material of the unit case 43.
Furthermore, the shape of the unit case may be of the conventional type shown in FIG.
[0055]
Explanatory drawing which shows the cross-section according to an example of this invention.
The enlarged view which shows the principal part according to the example shown in FIG.
Explanatory drawing shown including a cross-sectional structure per the example of whole
structure of the condenser microphone which exists conventionally.
Explanatory drawing which expands the part of the capacitor microphone of FIG. 3, and shows an
example of an internal structure.
Explanation of sign
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[0056]
11 Condenser Microphone 22 Protective Case 23 Case Body 24 Cap 25 Sound Collection
Opening 26 Base 32 Microphone Unit 43 Unit Case 44 Inner Bottom 45 Opening 46 Large
Diameter 46a Stepped Part 47 Crimping Part 53 Internal Member 54 Diaphragm Ring 54a
Diaphragm 55 Fixed pole 56 Insulating seat 57 FET (impedance converter) 57a Output terminal
58 Unit board 62 Circuit board 63 Ground pattern 72 Flexible pipe S, S1, S2 soldered part
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