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JP2009254572

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JP2009254572
The present invention provides an ultrasonic transducer and electronic device having sufficient
output power and sensitivity while enabling reduction of a DC bias voltage by providing an
electret film. An ultrasonic transducer according to the present invention is disposed on one
surface of a substrate, and includes a lower electrode, a first gap disposed above the lower
electrode, and an upper portion disposed above the first gap. An ultrasonic transducer cell having
an electrode; a first conductive layer disposed on the other surface of the substrate and
electrically connected to any one of the lower electrode and the upper electrode; An electret film
disposed on the first conductive layer, an insulating layer disposed on the electret film, and the
first conductive layer of the lower electrode and the upper electrode disposed on the insulating
layer; And a second conductive layer electrically connected to the electrode not connected to the
electrode. [Selected figure] Figure 3
Ultrasonic transducer and electronic device
[0001]
The present invention relates to a capacitive ultrasonic transducer and electronic device
configured to include an electret.
[0002]
Conventionally, a piezoelectric element such as ceramic piezoelectric material PZT (lead zirconate
titanate) has been mainly used as an ultrasonic transducer, but in recent years, a capacitive
ultrasonic wave as disclosed in Patent Document 1 has been used. Transducers are attracting
attention.
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1
[0003]
A capacitive ultrasonic transducer comprises a pair of electrodes consisting of an upper electrode
and a lower electrode facing each other across a gap, and includes a film-like portion (a
membrane or a diaphragm including the upper electrode). Transmission and reception of
ultrasonic waves by the vibration of
[0004]
A capacitive ultrasonic transducer converts an ultrasonic signal into an electrical signal based on
a change in capacitance between the upper electrode and the lower electrode at the time of
receiving ultrasonic waves. In the above, it was necessary to apply a DC bias voltage between the
upper electrode and the lower electrode.
[0005]
In order to realize low power consumption and miniaturization of the ultrasonic transducer, it is
preferable to reduce or zero the DC bias voltage.
Therefore, by arranging an electret film holding electric charge between the upper electrode and
the lower electrode of the capacitive ultrasonic transducer, a potential difference is generated
between the upper electrode and the lower electrode, and a DC bias voltage is generated.
Techniques for reducing
Japanese Patent Application Publication No. 2005-510264
[0006]
However, in a capacitive ultrasonic transducer, an electret film having a thickness capable of
stably holding a sufficient amount of charge to reduce the DC bias voltage is placed between the
upper electrode and the lower electrode. In the case of being disposed in the above, the distance
between the upper electrode and the lower electrode is increased, so that the capacitance is
reduced, and the output and the sensitivity of the capacitive ultrasonic transducer are reduced.
[0007]
The present invention was made in view of the above problems, and provides an ultrasonic
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transducer and an electronic device having sufficient output power and sensitivity while making
it possible to reduce a DC bias voltage by providing an electret film. With the goal.
[0008]
The ultrasonic transducer according to the present invention comprises a substrate, a lower
electrode disposed on one surface of the substrate, a first air gap disposed on the lower
electrode, and an upper surface disposed on the first air gap. An ultrasonic transducer cell having
an electrode; a first conductive layer disposed on the other surface of the substrate and
electrically connected to any one of the lower electrode and the upper electrode; An electret film
disposed on the first conductive layer, an insulating layer disposed on the electret film, and the
first conductive layer of the lower electrode and the upper electrode disposed on the insulating
layer; And a second conductive layer electrically connected to the electrode not connected to the
electrode.
[0009]
Further, the ultrasonic transducer according to the present invention is provided on a substrate, a
lower electrode disposed on one surface of the substrate, a first gap disposed on the lower
electrode, and a first gap disposed on the first gap. An ultrasonic transducer cell having an upper
electrode, and a first conductive layer disposed on the other surface of the substrate and
electrically connected to any one of the lower electrode and the upper electrode; An insulating
layer disposed on the first conductive layer, an electret film disposed on the insulating layer, and
the first conductive layer of the lower electrode and the upper electrode disposed on the electret
film And a second conductive layer electrically connected to the electrode which is not
electrically connected.
[0010]
Hereinafter, preferred embodiments of the ultrasonic transducer of the present invention will be
described with reference to the drawings.
In the drawings used in the following description, in order to make each component a size that
can be recognized in the drawing, the scale is different for each component, and the present
invention It is not limited only to the number of components described in the drawings, the
shape of the components, the ratio of the size of the components, and the relative positional
relationship between the components.
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[0011]
FIG. 1 is a plan view of an ultrasonic transducer as seen from the direction of ultrasonic
transmission.
FIG. 2 is a perspective view showing a schematic configuration of the ultrasonic transducer.
FIG. 3 is a cross-sectional view taken along the line III-III of FIG.
FIG. 4 is a cross-sectional view showing a modification of the ultrasonic transducer.
[0012]
The ultrasonic transducer 1 has an ultrasonic transducer cell 10 disposed on one surface 2 a of
the substrate 2 and an electret film 20 disposed on the other surface 2 b of the substrate 2.
[0013]
Hereinafter, with regard to the vertical relationship of the components disposed on one surface 2
a or the other surface 2 b of the substrate 2, the direction of moving away from each surface in
the normal direction is referred to as the upper side.
For example, in the cross-sectional view of FIG. 3, the upper electrode 12 is referred to as being
disposed above the lower electrode 11 on one surface 2 a of the substrate 2, and on the other
surface 2 b of the substrate 2 The two conductive layers 22 are referred to as being disposed
above the first conductive layer 21.
[0014]
The material which comprises the board | substrate 2 is not specifically limited, You may be
comprised by the material which has electroconductivity, and you may be comprised by the
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material which has electrical insulation.
In the present embodiment, the substrate 2 is made of a known insulating material such as
silicon oxide, silicon nitride, quartz, sapphire, quartz, alumina, zirconia, glass, or resin.
[0015]
The ultrasonic transducer cell 10 is disposed opposite to a flat lower electrode 11 disposed on
one surface 2 a of the substrate 2 and on the lower electrode 11 with the first gap portion 13
interposed therebetween. And an upper electrode 12 in the form of a flat plate.
[0016]
The upper electrode 12 is supported by the insulating layer 14 made of an electrically insulating
material disposed on the lower electrode 11 so as to be substantially parallel to the lower
electrode 11.
In the ultrasonic transducer cell 10, the film-like portion 15 including the insulating layer 14 and
the upper electrode 12 located above the first gap portion 13 vibrates when transmitting and
receiving the ultrasonic waves.
[0017]
The shape of the film-like portion 15 when the substrate 2 is viewed in a plan view is preferably
an oval shape, an oval shape, or a polygon shape, as shown in FIG. It is also good.
When a plurality of ultrasonic transducer cells 10 are disposed in one ultrasonic transducer 1,
the plurality of ultrasonic transducer cells 10 are provided with the film-like portion 15 having a
plurality of different shapes. May be
[0018]
The insulating layer 14 is disposed to cover at least one of the surface of the lower electrode 11
on the side of the first gap 13 and the surface of the upper electrode 12 on the side of the first
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gap 13. It is preferable to have a function to prevent short circuit and contact with 13.
[0019]
In the present embodiment, as shown in FIG. 3, the lower electrode 11 is electrically connected to
the signal electrode pad 31 formed on one surface 2 a of the substrate 2.
The upper electrode 12 is electrically connected to a ground electrode pad 32 formed on one
surface 2 a of the substrate 2 by a wire not shown.
[0020]
The signal electrode pad 31 and the ground electrode pad 32 are electrodes disposed exposed at
a position not overlapping the ultrasonic transducer cell 10 when one surface 2 a of the
substrate 2 is viewed in plan view, A drive circuit for driving the ultrasonic transducer 1 is
electrically connected through the signal electrode pad 31 and the ground electrode pad 32.
[0021]
For example, as shown in FIG. 3, a protective film 16 made of resin may be provided on the
ultrasonic transducer cell 10 for the purpose of preventing oxidation, preventing damage,
improving moisture resistance, and the like.
[0022]
On the other hand, between the lower electrode 11 and the upper electrode 12 of the ultrasonic
transducer cell 10, on the other surface 2b opposite to the surface on which the ultrasonic
transducer cell 10 of the substrate 2 is disposed. An electret film 20 for providing a potential
difference is disposed.
[0023]
The configuration on the other surface 2 b of the substrate 2 will be described in detail.
First, a flat plate-shaped first conductive layer 21 made of a conductive material is disposed on
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the other surface of the substrate 2.
The first conductive layer 21 is electrically connected to the lower electrode 11 through the
through electrode 3 in the via hole provided through the substrate 2.
[0024]
An electret film 20 is disposed on the first conductive layer 21 with an insulating layer having
electrical insulation interposed therebetween.
The electret film 20 is a known one having a function of permanently holding positive or
negative charges, and the configuration and formation method thereof are not particularly
limited.
[0025]
For example, when the electret film 20 is formed of an inorganic film, the electret film 20 is
formed by injecting a charge into the inorganic film made of a silicon compound, a hafnium
compound or the like by ion beam or corona discharge. Further, the electret 20 may have a
laminated structure made of a plurality of types of materials. For example, it is preferable to form
the electret film 20 of SiO 2 and cover the electret film 20 with an insulating film made of SiN
because the loss of the charge held even under high temperature is suppressed.
[0026]
Further, for example, when the electret film 20 is formed of an organic film, the electret film 20
is formed by injecting a charge into a resin film made of fluorine resin, polyimide, polypropylene,
polymethylpentene or the like by corona discharge.
[0027]
In the present embodiment, the insulating layer interposed between the first conductive layer 21
and the electret film 20 is composed of the second void portion 23 and the insulating film 24
made of a material having electrical insulation.
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[0028]
The insulating layer interposed between the first conductive layer 21 and the electret film 20 is
not limited to this form. For example, the electret film 20 and the first conductive layer 21 may
be formed only by the second air gap 23. It may be in the form of being electrically isolated or
may be in the form of being electrically isolated only by the insulating film 24.
[0029]
As in the present embodiment, covering the surface of the electret film 20 with the insulating
film 24 is more preferable because the loss of the charge held by the electret film 20 can be
suppressed.
[0030]
On the electret film 20, that is, on the side opposite to the first conductive layer 21 side of the
electret film 20, a flat plate-like second material made of a conductive material disposed
substantially in parallel to the first conductive layer 21 is provided. A conductive layer 22 is
provided.
The electret film 20 and the second conductive layer 22 may be disposed to be in contact with
each other, or a conductive or electrically insulating film for preventing oxidation of the surface
of the second conductive layer 22 is interposed therebetween. It may be done.
[0031]
The second conductive layer 22 is electrically connected to the ground electrode pad 32 through
the through electrode 4 in the via hole provided through the substrate 2.
That is, the second conductive layer 22 is electrically connected to the upper electrode 12.
[0032]
The configuration for electrically connecting the first conductive layer 21 and the second
conductive layer 22 to the lower electrode 11 and the upper electrode 12 is not limited to this
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embodiment, and, for example, the first conductive layer 21 and the second conductive layer 22
may be The second conductive layer 22 and the lower electrode 11 and the upper electrode 12
may be electrically connected to each other through a wiring provided so as to extend around the
outer peripheral portion of the substrate 2.
[0033]
The electret film 20 and the second conductive layer 22 are supported by the insulating film 24.
In other words, in the insulating film 24, the second void 23 is formed between the electret film
20 and the first conductive layer 21, and the first conductive layer 21 and the second conductive
layer 22 are substantially parallel. , And supports the electret film 20 and the second conductive
layer 22.
[0034]
As shown in FIG. 3, in the case where the space where the second air gap portion 23 is closed is
formed airtight, and the surface of the first conductive layer 21 is exposed in the second air gap
portion 23, the first conductive layer For the purpose of preventing oxidation of the layer 21, the
second void 23 is preferably vacuum or filled with a dry inert gas.
Moreover, when the 2nd space | gap part 23 is not comprised airtightly, it is preferable that the
surface of the 1st conductive layer 21 is coat | covered with the protective film which prevents
oxidation.
[0035]
As shown in FIG. 4, the electret film 20 is disposed in contact with the first conductive layer 21,
and an insulating layer including the second void 23 and the insulating film 24 is disposed on the
electret film 20. Furthermore, the second conductive layer 22 may be disposed on the insulating
layer.
[0036]
The effects of the ultrasonic transducer 1 having the above-described configuration will be
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described below.
[0037]
In the ultrasonic transducer 1 having the above-described configuration, the electret film 20 for
generating a potential difference between the lower electrode 11 and the upper electrode 12 of
the ultrasonic transducer cell 10 is provided with the ultrasonic transducer cell 10 of the
substrate 2. It is arrange | positioned on the surface (other surface 2b) on the opposite side to a
surface (one surface 2a).
[0038]
For this reason, in the ultrasonic transducer 1 of the present embodiment, the thickness of the
electret film 20 and the distance between the lower electrode 11 and the upper electrode 12 can
be set independently.
[0039]
That is, according to the present embodiment, the distance between the lower electrode 11 and
the upper electrode 12 is smaller as compared with the capacitance type ultrasonic transducer in
which the electret film is disposed between the conventional upper electrode and the lower
electrode. The electrostatic capacitance between both electrodes is increased to improve the
sound pressure of the transmitting ultrasonic wave and the sensitivity of the receiving ultrasonic
wave, and the thickness of the electret film 20 is permanently stabilized by the electret film 20.
Can be as thick as possible.
[0040]
Therefore, the ultrasonic transducer 1 of the present embodiment has the electret film 20, which
reduces the DC bias voltage applied between the lower electrode 11 and the upper electrode 12
or eliminates the need to apply the DC bias voltage. Higher power and sensitivity.
[0041]
In addition, since the ultrasonic transducer of this embodiment can make the electret film 20
thicker than in the conventional case, the charge retention performance of the electret film 20 is
stabilized, and the performance can be maintained for a longer period of time. It is.
[0042]
Further, in the present embodiment, since the electret film 20 is disposed at a position
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overlapping with the ultrasonic transducer cell 10 when the substrate 2 is viewed in plan, the
ultrasonic transducer 1 of the present embodiment is a conventional one. It can be realized in the
same size as an ultrasonic transducer in which an electret film is disposed between the upper
electrode and the lower electrode.
[0043]
Also, in general, an ultrasonic transducer may be used in a state in which the surface transmitting
/ receiving the ultrasonic wave is in contact with the liquid in order to propagate the ultrasonic
wave without attenuating the ultrasonic wave.
On the other hand, the electret film 20 may lose its held charge by being in contact with
moisture.
In the present embodiment, since the electret film 20 is disposed on the opposite side to the
surface that transmits and receives the ultrasonic waves, it is possible to prevent water from
entering the electret film 20, and the durability of the ultrasonic transducer 1 is obtained.
Improve.
[0044]
By the way, in the conventional ultrasonic transducer in which the electret film is disposed
between the upper electrode and the lower electrode, the electret film is affected by the
component of the atmosphere, humidity, and temperature in the manufacturing process
performed after injecting the charge into the electret film. There is a problem that the charge
held by is lost.
Therefore, conventionally, there have been limited materials which constitute the electret film
and methods which can be carried out after the charge is injected into the electret film.
[0045]
On the other hand, in the case of manufacturing the ultrasonic transducer 1 described above, the
ultrasonic transducer cell 10 disposed on one surface 2a of the substrate 2 and the electret film
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20 disposed on the other surface 2b are It is possible to combine after being manufactured
separately.
[0046]
Therefore, after the charge is injected into the electret film 20, it can be provided in the
ultrasonic transducer 1 without being placed in an environment where the charge holding the
electret film 20 disappears.
That is, in the ultrasonic transducer 1 having the above-described configuration, since the degree
of freedom in design such as selection of constituent materials and selection of a construction
method is improved, higher performance can be realized at lower cost than in the prior art.
Further, since the degree of freedom in selection of the constituent material is improved, the
ultrasonic transducer 1 can be made of a material with less environmental load, such as using a
material not containing lead.
[0047]
In addition, the ultrasonic transducer 1 mentioned above can be manufactured using various
manufacturing techniques, such as a semiconductor manufacturing technique and a fine
machining technique.
Therefore, the method of forming the ultrasonic transducer 1 is not particularly limited, and for
example, a MEMS (Micro Electro Mechanical Systems) process can be used.
An ultrasonic transducer created by a MEMS process is generally called a c-MUT (Capacitive
Micromachined Ultrasonic Transducer).
[0048]
Next, examples of electronic devices to which the ultrasonic transducer of the present invention
can be applied will be described with reference to FIGS. 5 to 9.
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[0049]
The form which applied the ultrasonic transducer 1 of this invention to the ultrasonic endoscope
as an example of an ultrasonic diagnostic apparatus is demonstrated with reference to FIGS. 5-7.
FIG. 5 is an explanatory view showing a schematic configuration of the ultrasound endoscope.
FIG. 6 is a perspective view showing the structure of the distal end portion of the ultrasonic
endoscope.
FIG. 7 is a perspective view of the ultrasonic wave transmitting / receiving unit.
[0050]
As shown in FIG. 5, the ultrasonic endoscope 101 of this embodiment includes an elongated
insertion portion 102 introduced into the body of a subject, an operation portion 103 positioned
at the proximal end of the insertion portion 102, and this operation. It mainly comprises the
universal cord 104 extending from the side of the portion 103.
[0051]
At the proximal end of the universal cord 104, an endoscope connector 104a connected to a light
source device (not shown) is provided.
The endoscope connector 104a is detachably connected to the electric cable 105 detachably
connected to the camera control unit (not shown) via the electric connector 105a and the
ultrasonic observation apparatus (not shown) via the ultrasonic connector 106a. The ultrasonic
cable 106 is extended.
[0052]
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The insertion portion 102 is positioned at a distal end rigid portion 120 formed of a rigid
member in order from the distal end side, a bendable curved portion 108 positioned at the rear
end of the distal end rigid portion 120, and a rear end of the curved portion 108 A flexible tube
portion 109 having a small diameter and a long length up to the tip end portion of the operation
portion 103 is continuously provided.
Further, an ultrasonic wave transmitting / receiving unit 130 for transmitting / receiving
ultrasonic waves described later is provided on the distal end side of the distal end rigid portion
120.
[0053]
The operation unit 103 has an angle knob 111 for controlling the bending of the bending unit
108 in a desired direction, an air supply / water supply button 112 for performing air supply and
water supply operations, a suction button 113 for performing a suction operation, an cavity The
treatment tool insertion port 114 etc. which become an entrance of the treatment tool to be
introduced are provided.
[0054]
As shown in FIG. 6, in the distal end rigid portion 120, an illumination lens (not shown)
constituting an illumination optical unit for irradiating illumination light to an observation site,
and an objective optical system constituting an observation optical unit capturing an optical
image of the observation site A lens 121, a suction and forceps port 122, which is an opening
through which a portion to be removed is suctioned or a treatment tool protrudes, and a gas
supply port (not shown) for supplying air and water are provided.
[0055]
As shown in FIG. 7, the ultrasonic transmitting / receiving unit 130 provided at the tip of the
distal end rigid portion 120 is arranged in a cylindrical shape with the ultrasonic transducer cells
1 directed in the outer peripheral direction. It is configured.
[0056]
The substrate 2 is made of a flexible material such as polyimide and is cylindrically wound.
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On the outer peripheral surface of the cylindrically wound substrate 2, an ultrasonic transducer
element 34, which is a minimum drive unit comprising a plurality of ultrasonic transducer cells
10, is arranged in the circumferential direction. Electrets 20 corresponding to the plurality of
ultrasonic transducer elements 34 are disposed on the circumferential surface.
[0057]
Further, on the outer peripheral surface of the substrate 2, signal electrode pads 31 and ground
electrode pads 32 corresponding to the plurality of ultrasonic transducer elements 34 are
formed, and the signal electrode pads 31 and the ground electrode pads 32 are formed by The
other end of the coaxial cable 33, which is inserted through the ultrasonic cable 6 and whose one
end is electrically connected to the ultrasonic connector 6a, is electrically connected.
[0058]
The ultrasonic transducer 1 of the present invention is not limited to the above-described
ultrasonic endoscope, and may be applied to a conventionally known ultrasonic diagnostic
apparatus.
For example, the present invention may be applied to an ultrasound probe type ultrasound
endoscope, a capsule type ultrasound endoscope, or an ultrasound diagnostic apparatus in which
ultrasound is transmitted and received from outside the subject into the subject.
[0059]
The form which applied the ultrasonic transducer 1 of this invention to the ultrasonic flaw
detector as an example of a nondestructive inspection apparatus is demonstrated with reference
to FIG.
FIG. 8 is an explanatory view showing a schematic configuration of the ultrasonic flaw detector.
[0060]
The ultrasonic flaw detection apparatus 200 includes a probe 202 for transmitting and receiving
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ultrasonic waves, and an apparatus main body 203 for controlling the probe 202.
[0061]
A display device 206 for displaying an image for flaw detection is provided at the center of the
front surface of the device body 203, and a switch 207 having various roles is provided in the
vicinity of the display device 206.
[0062]
Also, the probe 202 is connected to the apparatus main body 203 by the composite coaxial cable
208.
One or more ultrasonic transducers 1 are disposed on the contact surface 202 a of the probe
202 that is to be in contact with the subject.
[0063]
The ultrasonic flaw detection apparatus 201 emits ultrasonic waves in a state where the contact
surface 202a of the probe 202 is in contact with the subject, and changes in the reflection of the
ultrasonic waves cause flaws in the subject without destroying the subject. It is possible to detect.
[0064]
In addition, the ultrasonic transducer 1 of this invention can be applied not only to the ultrasonic
flaw detector mentioned above but to the conventionally well-known nondestructive inspection
apparatus.
For example, the present invention may be applied to a thickness measuring device that
measures the thickness of a subject by transmitting and receiving ultrasonic waves.
[0065]
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An example in which the ultrasonic transducer 1 of the present invention is applied to an
acoustic microscope will be described with reference to FIG.
FIG. 9 is a view for explaining the configuration of the ultrasonic microscope of the present
embodiment.
[0066]
The ultrasound microscope 300 applies a high frequency signal generated by the high frequency
oscillator 301 to the ultrasound transducer 1 according to the present invention via the
circulator 302 to convert it into ultrasound.
The ultrasonic waves are converged by the acoustic lens 304, and the sample 305 is placed at
the convergence point. The sample 305 is held by a sample holder 306, and a coupler 307 such
as water is filled between the sample 305 and the lens surface of the acoustic lens 304. The
reflected wave from the sample 305 is received by the transducer 1 via the acoustic lens 304 and
converted into an electrical reflected signal. An electrical signal corresponding to the received
ultrasound output from the ultrasound transducer 1 is input to the display device 308 via the
circulator 302. The sample holder 306 is driven by the scanning device 310 controlled by the
scanning circuit 309 in two horizontal directions of XY in the horizontal plane.
[0067]
The ultrasonic microscope 300 configured as described above quantifies the elastic property of
the sample 305 or evaluates the structure of the thin film by irradiating the sample 305 with
ultrasonic waves to evaluate the acoustic characteristics of the sample 305. It is possible.
[0068]
The following configuration can be proposed based on the embodiment described above.
That is, (Supplementary Note 1) a substrate, an ultrasonic wave including: a lower electrode
disposed on one surface of the substrate; a first gap disposed on the lower electrode; and an
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upper electrode disposed on the first gap. A vibrator cell, a first conductive layer disposed on the
other surface of the substrate and electrically connected to any one of the lower electrode and
the upper electrode, and disposed below the first conductive layer An electret film, an insulating
layer disposed under the electret film, and an electrode disposed under the insulating layer and
not electrically connected to the first conductive layer of the lower electrode and the upper
electrode And a second conductive layer electrically connected to the at least one ultrasonic
transducer.
[0069]
(Supplementary Note 2) An ultrasonic transducer including: a substrate; a lower electrode
disposed on one surface of the substrate; a first gap disposed on the lower electrode; and an
upper electrode disposed on the first gap. A cell, a first conductive layer disposed on the other
surface of the substrate and electrically connected to any one of the lower electrode and the
upper electrode, and an insulating layer disposed under the first conductive layer An electret film
disposed under the insulating layer, and an electrode disposed under the electret film, which is
not electrically connected to the first conductive layer, of the lower electrode and the upper
electrode. An ultrasonic transducer comprising at least a second conductive layer connected in a
coupled manner.
[0070]
(Supplementary Note 3) The ultrasonic transducer according to Supplementary note 1 or 2,
wherein the insulating layer includes a pair of insulating films and a second void portion
sandwiched by the pair of insulating films.
[0071]
(Supplementary note 4) The ultrasonic transducer according to any one of supplementary notes
1 to 3, wherein the substrate is a flexible substrate.
[0072]
The present invention is not limited to the above-described embodiment, and can be
appropriately modified without departing from the scope or spirit of the invention as can be read
from the claims and the entire specification, and an ultrasonic wave accompanied by such a
modification. Transducers and electronics are also within the scope of the present invention.
[0073]
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It is the top view which looked at the ultrasonic transducer from the ultrasonic wave
transmission direction.
It is a perspective view showing a schematic structure of an ultrasonic transducer.
FIG. 3 is a cross-sectional view taken along the line III-III in FIG.
It is sectional drawing which shows the modification of an ultrasonic transducer.
It is a figure explaining schematic structure of an ultrasonic endoscope. It is a perspective view
which shows the structure of the front-end | tip part of an ultrasonic endoscope. It is a
perspective view of an ultrasonic transmission and reception part. It is a figure explaining
schematic structure of an ultrasonic flaw detector. It is a figure explaining schematic structure of
an ultrasonic microscope.
Explanation of sign
[0074]
DESCRIPTION OF SYMBOLS 1 ultrasonic transducer, 2 board | substrates, 2a one side, 2b other
side, 3 penetration electrode, 4 penetration electrode, 10 ultrasonic transducer cell, 11 lower
electrode, 12 upper electrode, 13 1st space | gap part, 14 insulating layer 15 film-like portions,
16 protective films, 20 electret films, 21 first conductive layers, 22 second conductive layers, 23
second air gaps, 24 insulating films, 31 signal electrode pads, 32 ground electrode pads, 33
coaxial cables, 34 transducer element, 101 ultrasonic endoscope, 102 insertion unit, 103
operation unit, 104 universal cord, 104a endoscopic connector, 105 electrical cable, 105a
electrical connector, 106 ultrasonic cable, 106a ultrasonic connector, 108 curved Part, 109
flexible tube part, 111 angle knob, 112 air / water supply button, 113 suction Button, 114
treatment tool insertion port, 120 tip rigid part, 121 objective lens, 122 suction and forceps port,
130 ultrasonic transmitter and receiver, 200 ultrasonic flaw detector, 202 probe, 202a contact
surface, 203 device body, 206 display Apparatus, 207 switches, 208 compound coaxial cables,
300 acoustic microscopes, 301 high frequency oscillators, 302 circulators, 304 acoustic lenses,
305 samples, 306 sample holders, 307 couplers, 308 display devices, 309 scanning circuits, 310
scanning devices.
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