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JP2010161606

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JP2010161606
To provide a speaker device with high sound quality. A speaker device includes a diaphragm and
a magnetic circuit for converting an input audio signal into vibration of the diaphragm, and a first
speaker unit in which a back side of each sound radiation surface is connected by a rib A second
speaker unit; branching means for branching an input audio signal to a first audio signal for
sending to the first speaker unit; and a second audio signal for sending to the second speaker
unit; And adjusting means including at least one of filter means for attenuating high frequency
band components higher than a predetermined band, and delay means for delaying the first
audio signal. [Selected figure] Figure 3
Speaker device
[0001]
The present invention relates to an audio signal processing technique in a speaker device.
[0002]
The speaker device generally has a structure in which a speaker unit having a diaphragm (cone
or the like), a voice coil, a magnet, and the like is attached to a predetermined surface of the
speaker box.
In such a speaker device, the reaction force accompanying the drive of the speaker unit may
adversely affect the sound quality, such as vibrating the speaker box to generate unnecessary
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sound.
[0003]
In order to solve such a problem, for example, two speaker units face each other on the back side
(the back side when the radiation surface of the sound is the front side) and fix both ends of the
rib to the yoke on each back side. There exists a speaker apparatus which has the structure
couple | bonded by (refer the following patent document 1). According to this structure, since the
reaction caused by the vibration of the yoke of each speaker unit is offset through the ribs, the
unnecessary sound generated from the speaker box can be reduced.
[0004]
Japanese Patent Application Publication No. 2001-352592 Japanese Utility Model Application
Publication No. 5-60100
[0005]
However, when a stereo signal is input to the conventional speaker device having the above
structure, that is, when the left channel signal is input to one speaker unit and the right channel
signal is input to the other speaker unit, each speaker unit Because different voice signals are
input to each of the above, there are cases where the above-described vibration suppression
effect can not be obtained.
[0006]
On the other hand, even when a monaural signal is input to the above-described conventional
speaker device, when the listener (listener) is positioned on the front side of one of the speaker
units, the sound quality is degraded due to interference by the reflected wave or the like. There is
a case.
[0007]
An object of the present invention is to provide a speaker device with high sound quality in view
of such problems.
[0008]
Each aspect of the present invention adopts the following configurations in order to solve the
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problems described above.
[0009]
The first aspect includes a first speaker unit and a second speaker unit each having a diaphragm
and a magnetic circuit for converting an input audio signal into vibration of the diaphragm, and
the back side of each sound emitting surface is connected by a rib A speaker unit; branching
means for branching an input audio signal to a first audio signal for sending to a first speaker
unit; and a second audio signal for sending to a second speaker unit; A speaker device
comprising: adjustment means including at least one of filter means for attenuating high
frequency band components higher than a band and delay means for delaying a first audio
signal.
[0010]
In the first aspect, when the low frequency range component obtained by attenuating the high
frequency range component of the input audio signal is sent to the second speaker unit and the
audio signal is sent as it is to the first speaker unit (first (Case), when the audio signal is sent to
the first speaker unit in a delayed state and the audio signal is sent as it is to the second speaker
unit (second case), the audio signal is sent to the first speaker unit. May be sent in a delayed
state, and the high frequency range component of the sound signal may be attenuated and sent
to the second speaker unit (third case).
[0011]
According to the first case, the second speaker unit transmits an audio signal in which the high
frequency range component is attenuated. According to the second case, the first speaker unit
transmits the delayed audio signal. It is possible to reduce the interference that the sound
emitted from the first speaker unit receives from the sound emitted from the second speaker
unit.
According to the third case, since the sound signal in which the high frequency range component
is attenuated is sent to the second speaker unit, the interference can be reduced as in the first
case and the second case.
[0012]
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Here, when a predetermined band is attenuated by the filter means, the signal may be delayed.
In the third case, since the delayed audio signal is sent to the first speaker unit in such a case, the
bass components input to the first speaker unit and the second speaker unit have the same
phase. .
The meaning of this in-phase includes not only perfect coincidence but also slight deviation.
In the structure in which the first speaker unit and the second speaker unit included in the
present speaker device are fixed by ribs back to back, a phase shift to the extent that can cancel
the vibration generated from both units at the time of audio output by the ribs is allowed.
Therefore, according to the third case, it is possible to realize also the reduction of noise
accompanying the vibration of the diaphragm.
[0013]
As described above, according to the speaker device in the first aspect, high sound quality output
is enabled.
[0014]
The second aspect includes a first speaker unit and a second speaker unit, each having a
diaphragm and a magnetic circuit for converting an input audio signal into vibration of the
diaphragm, and the back side of each sound emitting surface is connected by a rib Speaker unit,
bass acquisition means for acquiring a composite bass signal in which each bass component of
the input right channel signal and left channel signal below the predetermined band is combined,
each of the right channel signal and left channel signal A filter means for extracting a right treble
band signal and a left treble band signal each of which a bass range component is attenuated,
and a right composite signal to be sent to the first speaker unit by combining the right treble
band signal and the composite bass range signal And a signal acquisition unit for acquiring a left
composite signal to be sent to the second speaker unit by combining the left high range signal
and the composite bass range signal. That.
[0015]
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In the second mode, the right channel signal and the left channel signal of the stereo signal are
respectively input, and the same sound and the same phase signal are sent to the speaker units
20 and 30 respectively for the bass component that influences the vibration among the
respective signals.
On the other hand, for the high frequency range component, the left channel signal and the right
channel signal are sent to the speaker units 20 and 30, respectively.
[0016]
Therefore, according to the second aspect, in the speaker structure as described above, even
when a stereo audio signal is input, it is possible to cancel the reaction accompanying the
vibration, and reduce the noise accompanying the vibration. In addition, stereo effects can be
provided to the user for treble components.
[0017]
Note that another aspect of the present invention may be a program that realizes any of the
above configurations, or a computer readable storage medium storing such a program.
[0018]
According to each of the above aspects, it is possible to provide a speaker device with high sound
quality.
[0019]
BRIEF DESCRIPTION OF THE DRAWINGS The upper surface schematic diagram which shows the
structure of the speaker apparatus of Example 1. FIG.
FIG. 2 shows a configuration of a signal processing circuit 60 in Embodiment 1.
The upper surface schematic diagram which shows the structure of the speaker apparatus of
Example 2. FIG.
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FIG. 7 is a diagram showing a configuration of a signal processing circuit 60 in Embodiment 2.
FIG. 7 is a diagram showing a configuration of a signal processing circuit 60 as a modified
example 1 of the second embodiment.
FIG. 7 is a diagram showing a configuration of a signal processing circuit 60 as a modified
example 2 of the second embodiment.
FIG. 7 is a diagram showing a configuration of a signal processing circuit 60 as a third
modification of the second embodiment. FIG. 16 is a diagram showing the configuration of a
signal processing circuit 60 according to a fourth modification of the second embodiment.
[0020]
Hereinafter, specific examples of the speaker device according to the embodiment will be
described. Each example mentioned below is an illustration, respectively, and this indication is
not limited to composition of each following example.
[0021]
Hereinafter, Example 1 of the speaker apparatus according to the embodiment will be described.
[0022]
FIG. 1 is a schematic top view showing the structure of the speaker device of the first
embodiment.
The speaker device 5 according to the first embodiment includes the hollow cylindrical speaker
box 10, the speaker unit 20 attached to the front opening of the speaker box 10, and the speaker
unit 30 attached to the back opening of the speaker box 10. Including. The speaker unit 20
includes a diaphragm 21, a frame 22 for fixing the outer periphery of the diaphragm 21, a voice
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coil 23 for vibrating the diaphragm 21, a magnetic circuit 24, and the like. The diaphragm 21 is
made of, for example, cone paper. The magnetic circuit 24 comprises a plate 25, a magnet 26, a
yoke 27 and the like. The speaker unit 30 has the same configuration as the speaker unit 20.
That is, the speaker unit 30 includes the diaphragm 31, a frame 32 for fixing the outer periphery
of the diaphragm 31, a voice coil 33 for vibrating the diaphragm 31, a magnetic circuit 34, and
the like. The magnetic circuit 34 includes a plate 35, a magnet 36, a yoke 37, and the like.
Although it is desirable that the speaker units 20 and 30 have exactly the same configuration and
shape, the present invention is not limited to this.
[0023]
The speaker units 20 and 30 are connected and fixed by the ribs 50 connected to the yokes 27
and 37 so that the diaphragm 21 faces in the front direction and the diaphragm 31 faces in the
back direction. The rib 50 is preferably formed of a cylindrical metal or the like, and is preferably
fixed to the same position of the yoke 27 of the speaker unit 20 and the yoke 37 of the speaker
unit 30 in contrast. Although the rib 50 is connected to the yokes 27 and 37 in the example of
FIG. 1, it may be connected to the magnetic circuits 24 and 34 and connected to the portion to
which the vibration of the diaphragms 21 and 31 is transmitted. It should be done. The rib 50 is
desirably formed so that its cross-sectional area is not constant in the longitudinal direction. For
example, the rib 50 is desirably formed in a barrel shape such that the cross-sectional area of the
central portion is the largest and the cross-sectional area gradually decreases toward both ends.
Thereby, resonance of rib 50 self is prevented.
[0024]
Guides 29 and 39 are provided on the back side of the outer peripheral part of the frames 22
and 32, and are configured such that the open end of the speaker box 10 can be engaged and
positioned via the shock absorbing material 42. There is. The buffer material 42 is disposed
between the speaker units 20 and 30 and the speaker box 10 to maintain the air tightness in the
speaker box 10, and the speaker units 20 and 30 are not fixed to the speaker box 10 but are
floated. Act to become a state. As a result, the vibrations of the speaker units 20 and 30 are less
likely to be transmitted to the speaker box 10. The shock absorbing material 42 is formed of a
material that maintains airtightness and can absorb the vibrations of the speaker units 20 and
30. Specifically, the buffer 42 is preferably formed of a material that can attenuate the signal by
6 dB (decibel) or more for the reproduction band in the speaker units 20 and 30. The shock
absorbing material 42 is formed of, for example, PEF (pef) material.
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[0025]
The frames 22 and 32 are provided with terminals 28 and 38. When an audio signal such as an
audio signal is supplied to the speaker units 20 and 30 through the terminals 28 and 38,
respectively, current flows through the voice coils 23 and 33, and the diaphragms 21 and 31
vibrate to generate audio. It is emitted. Therefore, the front and the back of the speaker device 5
become the sound emission surface, respectively, and the speaker device 5 emits the sound in the
reverse direction from the front and the back.
[0026]
On the other hand, when the diaphragms 21 and 31 vibrate, the reaction accompanying the
vibration affects the magnetic circuits 24 and 34 to vibrate the magnetic circuits 24 and 34. In
the first embodiment, since the speaker units 20 and 30 are connected back-to-back, the reaction
generated by the speaker unit 20 and the reaction generated by the speaker unit 30 have forces
of the same magnitude and in opposite directions. Therefore, when the same audio signal is input
to each of the speaker units 20 and 30 in the same phase, the respective reactions occurring in
the speaker units 20 and 30 are canceled through the ribs 50, so unnecessary noise caused by
vibration is generated. Can be reduced. Furthermore, the speaker device 5 has a structure in
which it is difficult for the vibration of the speaker units 20 and 30 to be transmitted to the
speaker box 10 by using the shock absorbing material 42 as described above, thereby further
reducing the sounding associated with the vibration. It has become possible.
[0027]
The noise accompanying such vibration is influenced by the frequency of the audio signal input
to each of the speaker units 20 and 30. The lower the voice signal, that is, the lower frequency
signal, the greater the influence. The frequency that affects the noise depends on the structure,
material, and the like of the speaker device 5, and is, for example, one hundred and several hertz
(Hz) or less.
[0028]
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The speaker apparatus 5 in the first embodiment includes the input terminals 40 and 41 in the
speaker box 10, and receives the left channel signal and the right channel signal of the stereo
audio signal from the input terminals 40 and 41, respectively. Generally, the left channel signal is
applied to the terminal 28 of the speaker unit 20, and the right channel signal is applied to the
terminal 38 of the speaker unit 30, so that different sounds are output from the respective
speaker units 20 and 30. Can provide the user with a stereo effect.
[0029]
However, when different audio signals are input to the speaker units 20 and 30, it is difficult to
cancel the vibration reaction as described above. Therefore, although the vibration generated in
each of the speaker units 20 and 30 is reduced by the shock absorbing material 42, it may be
transmitted to the speaker box 10 to generate noise.
[0030]
Therefore, the speaker device 5 according to the first embodiment includes the signal processing
circuit 60 that processes each audio signal supplied to the input terminals 40 and 41, and the
signal processing circuit 60 is configured to reduce the noise accompanying the vibration. Let
each audio signal be processed. FIG. 2 is a diagram showing the configuration of the signal
processing circuit 60 in the first embodiment. The signal processing circuit 60 includes mixers
61, 66 and 67, high pass filters 63 and 64, a low pass filter 68, and the like. Each part of the
signal processing circuit 60 is realized as a software component or a hardware component, or a
combination thereof (see [Others]).
[0031]
The mixer 61 combines the left channel signal input from the input terminal 40 and the right
channel signal input from the input terminal 41. The signal synthesized by the mixer 61 is sent
to the low pass filter 68.
[0032]
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The low pass filter 68 receives the signal synthesized by the mixer 61, attenuates frequency
components above a predetermined band of the synthesized signal, and passes frequency
components lower than the predetermined band. The low range signal passed through the low
pass filter 68 is sent to the mixers 66 and 67, respectively. The frequency components removed
by the low pass filter 68 are treble band components higher than a predetermined band, and are
other than the bass range components that affect the noise as described above. For example, one
hundred and several tens of hertz (Hz) is set in the low pass filter 68 as the predetermined band.
[0033]
The high pass filter 63 receives the left channel signal input from the input terminal 40,
attenuates frequency components below the predetermined band of the left channel signal, and
passes frequency components higher than the predetermined band. The left channel treble band
signal that has passed through the high pass filter 63 is sent to the mixer 66. The high pass filter
64 receives the right channel signal input from the input terminal 41, attenuates frequency
components below the predetermined band of the right channel signal, and passes frequency
components higher than the predetermined band. The right channel treble band signal that has
passed through the high pass filter 64 is sent to the mixer 67. The frequency components
removed by the high pass filters 63 and 64 are bass components that affect noise as described
above. Therefore, in the high pass filters 63 and 64, for example, one hundred and several tens of
hertz (Hz) is set as the predetermined band.
[0034]
The mixer 66 combines the left channel treble band signal passed through the high pass filter 63
and the bass band signal passed through the low pass filter 68. The signal synthesized by the
mixer 66 is sent to the terminal 28. The mixer 67 combines the right channel treble band signal
passed through the high pass filter 64 and the bass band signal passed through the low pass
filter 68. The signal synthesized by the mixer 67 is sent to the terminal 38. Therefore, the bass
component of the audio signal sent to the terminal 28 and the bass component of the audio
signal sent to the terminal 38 basically have the same sound and the same phase. On the other
hand, the high range component of each audio signal is the left channel signal and the right
channel signal.
[0035]
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[Operation and Effect of First Embodiment] In the speaker device 5 of the first embodiment, the
speaker units 20 and 30 are connected by ribs 50 back to back with the sound emitting surface
as the front. Thus, the reaction caused by the vibration of the diaphragms 21 and 31 caused by
the drive of the speaker units 20 and 30 is offset by the ribs 50.
[0036]
In the first embodiment, when the left channel signal and the right channel signal of the stereo
audio signal are input, each signal is input to the signal processing circuit 60. The signal
processing circuit 60 combines the left channel signal and the right channel signal in the mixer
61 for the bass component affecting the vibration, and acquires the synthesized signal by passing
it through the low pass filter 68, and the influence on the vibration is The low treble band
component is obtained by passing the left channel signal and the right channel signal through
the high pass filters 63 and 64, respectively. The signal processing circuit 60 sends, to the
speaker units 20 and 30, signals obtained by combining the bass component and the treble
component thus acquired by the mixers 66 and 67, respectively.
[0037]
Therefore, in the first embodiment, even when the stereo audio signal is input to the speaker
device 5 having the above-described structure, the same sound is generated in the speaker units
20 and 30 for the low frequency range component affecting the vibration. Since the phase signal
is sent, the reaction accompanying the vibration can be offset, and the noise accompanying the
vibration can be reduced. On the other hand, for the high-frequency band component, the left
channel signal and the right channel signal are respectively sent to the speaker units 20 and 30,
so that the stereo effect of the high-frequency band component can be provided to the user. The
speaker device 5 can realize high sound quality.
[0038]
The speaker structure other than the signal processing circuit 60 of the first embodiment is not
limited to this, and the speaker units 20 and 30 are arranged back to back and connected to each
other by the ribs 50. It should just be. As shown in FIG. 1, it is preferable for the stereo effect of
the high sound range to listen to the user 1 who is a listener at the same distance from the front
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and back of the speaker device 5 of the first embodiment.
[0039]
Next, a second example of the speaker device according to the embodiment will be described.
[0040]
FIG. 3 is a schematic top view showing the structure of the speaker device of the second
embodiment.
The speaker apparatus 5 of the first embodiment is provided with the input terminals 40 and 41
in the speaker box 10, and the right channel signal and the left channel signal of the stereo audio
signal are given to these terminals. The speaker apparatus 5 according to the second
embodiment includes the input terminal 40 in the speaker box 10, and a right channel signal, a
left channel signal, or a monaural signal is input from the input terminal 40. The speaker device
5 of the second embodiment has the same configuration as that of the first embodiment except
for the number of input terminals and the configuration of the signal processing circuit 60.
[0041]
The speaker device 5 according to the second embodiment is installed so that the user 1
(listener) is located in the front direction, that is, in the direction of the sound emission surface of
the speaker unit 20, as shown in FIG. As a result, the sound radiated from the back surface of the
speaker device 5, that is, the sound generated by the vibration of the diaphragm 31 of the
speaker unit 30, often reaches the user 1 as a reflected wave rather than directly reaching the
user 1. Therefore, the sound radiated from the front of the speaker device 5 may interfere with
the sound radiated from the back. Note that such interference is greatly affected by the highfrequency range component. This is because the high range signal is more directional (narrower)
than the low range signal. The signal processing circuit 60 in the second embodiment performs
signal processing so as to reduce the noise accompanying the vibration described in the first
embodiment and to reduce this interference as well. Hereinafter, the signal processing circuit 60
different from that of the first embodiment will be described, and the description of the other
parts similar to those of the first embodiment will be omitted.
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[0042]
FIG. 4 is a diagram showing the configuration of the signal processing circuit 60 in the second
embodiment. The signal processing circuit 60 of the second embodiment includes a delay circuit
71, a low pass filter 72, and the like. Each part of the signal processing circuit 60 is realized as a
software component or a hardware component, or a combination thereof (see [Others]).
[0043]
The low pass filter 72 receives an audio signal input and branched from the input terminal 40,
attenuates frequency components above a predetermined band of the audio signal, and passes
frequency components lower than the predetermined band. The low range signal passed through
the low pass filter 72 is sent to the terminal 38. Filters such as the low pass filter 72 generally
have delay characteristics. That is, a delay time occurs between the signal input to the low pass
filter 72 and the signal output.
[0044]
The delay circuit 71 delays the input signal for a predetermined time corresponding to the delay
characteristic of the low pass filter 72 and sends the delayed signal to the terminal 28. As a
result, the bass component included in the audio signal input to the terminal 28 and the bass
signal sent to the terminal 38 basically have the same sound and the same phase. On the other
hand, the high range component is sent only to the terminal 28, and only the low range
component of the input audio signal is sent to the terminal 38.
[0045]
[Operation and Effect of Second Embodiment] Similar to the first embodiment, the speaker device
5 of the second embodiment has a reaction caused by the vibration of the diaphragms 21 and 31
caused by driving the speaker units 20 and 30. , Is offset via the ribs 50.
[0046]
In the second embodiment, a left channel signal or a right channel signal of a stereo audio signal,
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or a monaural signal is input from the input terminal 40 and sent to the signal processing circuit
60.
The signal processing circuit 60 acquires only the bass component affecting the vibration from
the input audio signal by passing through the low pass filter 72 and sends it to the speaker unit
30 located at the back of the speaker device 5. On the other hand, the signal processing circuit
60 delays the input audio signal in the same manner as the signal delay in the low pass filter 72
and sends it to the speaker unit 20 located in front of the speaker device 5.
[0047]
Therefore, in the second embodiment, even when the speaker units 20 and 30 have a back-toback structure and the user is placed in the direction of the sound emission surface of one of the
speaker units 20 and 30, the influence on interference is high. Since the range component is sent
only to the speaker unit 20, interference due to the sound emitted from the rear speaker unit 30
can be reduced.
[0048]
Furthermore, in the second embodiment, the same sound and the same phase signal are sent to
the speaker units 20 and 30, respectively, for the bass component affecting the vibration, so that
the reaction accompanied by the vibration can be canceled out. Noise can be reduced.
[0049]
If a plurality of speaker devices 5 in the second embodiment are installed to face each other via
the user, and the left channel signal and the right channel signal of the stereo audio signal are
input to the respective speaker devices 5, a stereo effect is provided to the user. It is also
possible.
[0050]
Therefore, according to the speaker device 5 of the second embodiment, high-quality sound can
be realized because interference can be reduced and noise accompanying vibration can also be
reduced even under the above-described conditions.
[0051]
First Modification of Second Embodiment In the second embodiment described above, the signal
processing circuit 60 includes the delay circuit 71 and the low pass filter 72, and the signal is
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delayed by the delay circuit 71 in accordance with the delay in the low pass filter 72. However,
the delay circuit 71 may be omitted.
[0052]
FIG. 5 is a diagram showing the configuration of a signal processing circuit 60 as a first
modification of the second embodiment.
The signal processing circuit 60 of the first modification does not include the delay circuit 71,
and has a low pass filter 72.
The operation of the low pass filter 72 is similar to that of the second embodiment described
above.
[0053]
In the first modification, the audio signal input to the input terminal 40 is sent as it is to the
terminal 28 provided in the speaker unit 20 located in front of the speaker device 5.
On the other hand, to the terminal 38 provided in the speaker unit 30 located on the back of the
speaker device 5, only the low frequency band component that affects the vibration acquired by
passing the low pass filter 72 among the sound signals is sent.
[0054]
Therefore, according to the first modification, as in the second embodiment described above, the
high frequency range component that affects interference is sent only to the speaker unit 20, so
the interference due to the sound emitted from the speaker unit 30 on the back surface is
reduced. It can be done.
[0055]
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In addition, even when the delay circuit is not provided as in the first modification, even if signals
with phases slightly different with respect to the bass component are respectively input to the
speaker units 20 and 30, there is a reaction associated with the vibration. The degree can be
offset.
Therefore, also in the first modification, it is possible to reduce the noise accompanying the
vibration.
[0056]
According to the first modification, since the number of parts can be reduced compared to the
configuration of the second embodiment while realizing high sound quality as described above,
cost reduction can be achieved.
When the influence of the delay characteristic of the low pass filter 72 does not greatly
contribute to the increase of the noise due to the vibration, or when the influence of the noise
due to the vibration is not large due to the material, the structure, etc. Configuration 1 is suitable.
[0057]
Second Modification of Second Embodiment In the second embodiment described above, the
signal processing circuit 60 includes the delay circuit 71 and the low pass filter 72, and the
signal is delayed by the delay circuit 71 in accordance with the delay in the low pass filter 72.
However, the low pass filter 72 may be omitted.
[0058]
FIG. 6 is a diagram showing the configuration of a signal processing circuit 60 as a second
modification of the second embodiment.
The signal processing circuit 60 of the second modification has a delay circuit 71 and does not
include the low pass filter 72.
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The operation of the delay circuit 71 is the same as that of the second embodiment described
above.
[0059]
In the second modification, the audio signal input to the input terminal 40 is sent to the terminal
28 provided on the speaker unit 20 located in front of the speaker device 5 in a delayed state for
a predetermined time. On the other hand, the audio signal is sent as it is to the terminal 38
provided in the speaker unit 30 located on the back of the speaker device 5.
[0060]
Thereby, since the sound radiated from the front speaker unit 20 is delayed by the delay circuit
71, the sound emitted from the rear speaker unit 30 is reflected and the like, so that the
interference with the sound which is delayed and reaches the user is generated. Reduced. That is,
according to the second modification, as in the second embodiment described above, the
interference due to the sound radiated from the speaker unit 30 on the back surface can be
reduced.
[0061]
However, since the signal sent to the terminal 28 is delayed by the delay circuit 71 than the
signal sent to the terminal 38, signals with different phases are input to the speaker units 20 and
30 respectively for the bass component affecting the vibration. Be done. Thus, the counteracting
effect of the reaction accompanying the vibration is reduced, and the noise reducing effect of the
vibration is also reduced.
[0062]
However, according to the second modification, since the number of parts can be reduced as
compared with the configuration of the second embodiment, cost reduction can be achieved. The
configuration of the modified example 2 is particularly suitable in the case where the influence of
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the noise accompanying the vibration is not large due to the material, the structure and the like
of the speaker device 5.
[0063]
Third Modification of Second Embodiment In the second embodiment and the first and second
modifications of the second embodiment described above, the audio signal sent to the terminal
38 provided in the speaker unit 30 located on the back of the speaker device 5 Sound effects
may be added to the
[0064]
FIG. 7 is a diagram showing the configuration of a signal processing circuit 60 as a third
modification of the second embodiment.
The signal processing circuit 60 of the modification 3 further includes a sound effect signal
processing unit 75 and a mixer 76 in addition to the configuration of the second embodiment.
The sound effect signal processing unit 75 and the mixer 76 are realized as software components
or hardware components, or a combination thereof (see [Others]). The other parts are the same
as in the second embodiment, and thus the description thereof is omitted here.
[0065]
The sound effect signal processing unit 75 receives the sound signal input from the input
terminal 40, and processes the sound signal using an existing sound effect algorithm to acquire a
sound effect signal. Here, the sound effects are reverberant sounds, echoes and the like, and are
sounds that impart effects such as thickness and depth to the original sound. The sound effect
algorithm is used, for example, in delay echo and reverb. The sound effect signal output from the
sound effect signal processing unit 75 is sent to the mixer 76.
[0066]
The mixer 76 synthesizes the sound effect signal with the bass region signal that has passed
through the low pass filter 72. The synthesized voice signal is sent to the terminal 38.
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[0067]
In the third modification, the audio signal input to the input terminal 40 is sent to the terminal
28 provided on the speaker unit 20 located in front of the speaker device 5 in a delayed state for
a predetermined time. On the other hand, to the terminal 38 provided on the speaker unit 30
located on the back of the speaker device 5, the sound effect signal is applied to the bass range
signal that affects the vibration obtained by passing the low pass filter 72 among the audio
signals. The signal to which is added is sent.
[0068]
As a result, according to the third modification, as in the second embodiment, it is possible to
realize the reduction of interference and the reduction of noise associated with vibration, and
further having a sound field control function by providing sound effects. You can Since this
sound effect is emitted only from the back of the speaker device 5, it arrives to the user later
than the sound emitted from the front. Therefore, a more effective reverberation etc. can be
provided to a user.
[0069]
Since the sound effect signal is sent only to the terminal 38, each signal sent to the speaker units
20 and 30 does not have the same sound. Therefore, it is desirable that the sound effect signal
generated by the sound effect signal processing unit 75 does not include a bass component that
affects the vibration. In this way, it is possible to prevent noise from increasing with the addition
of sound effects.
[0070]
Further, although an example in which the sound effect signal processing unit 75 is included in
the signal processing circuit 60 is shown in FIG. 7, the sound effect signal processing unit 75
may be disposed outside the speaker device 5. In this case, a new input terminal may be
provided, and the sound effect signal may be taken in from this input terminal. Further, although
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the example of FIG. 7 is an example in which the signal processing circuit 60 of the second
embodiment shown in FIG. 4 is modified, it is also applicable to the first and second
modifications shown in FIGS. Furthermore, the signal processing circuit 60 of the second
embodiment may be configured to include only the sound effect signal processing unit 75 and
the mixer 76 except for the delay circuit 71 and the low pass filter 72 respectively. In this way, it
is possible to obtain only the effects relating to sound effects.
[0071]
Fourth Modification of Second Embodiment In the signal processing circuit 60 of the second
embodiment described above, a switch for switching the passage of the delay circuit 71 and the
low pass filter 72 is provided, and the second embodiment, the first modification of the second
embodiment, and It may be configured to be switchable to any of the two configurations.
[0072]
FIG. 8 is a diagram showing a configuration of the signal processing circuit 60 in the fourth
modification of the second embodiment.
In addition to the configuration of the second embodiment, the signal processing circuit 60 in the
fourth modification switches the signal line for bypassing without passing through the delay
circuit 71 and the signal line passing through the delay circuit 71; And a switch 82 for switching
the signal line passing through the low-pass filter 72.
[0073]
In the fourth modification, an interface (for example, a control knob or the like) for controlling
the operation of the switches 81 and 82 may be provided at a predetermined position of the
speaker box 10 of the speaker device 5. In this way, the necessary configuration can be switched
according to the installation place of the speaker device 5 or the like. Further, the delay time of
the delay circuit 71 and the information of the predetermined band to be band-limited of the low
pass filter 72 may be configured to be changeable according to the interface.
[0074]
[Others] <Hardware Component and Software Component> The hardware component is a
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hardware circuit, for example, a field programmable gate array (FPGA), a specific application
These include integrated circuits (ASICs), gate arrays, combinations of logic gates, signal
processing circuits, analog circuits, and so on.
[0075]
Software components are components (fragments) that implement the above-described
processing as software, and are not concepts that limit the language that implements the
software, development environment, and the like.
Examples of software components include tasks, processes, threads, drivers, firmware, databases,
tables, functions, procedures, subroutines, predetermined portions of program code, data
structures, arrays, variables, parameters, and the like. These software components are realized on
one or more memories (one or more processors (for example, a central processing unit (CPU), a
digital signal processor (DSP), etc.)).
[0076]
In addition, the above-mentioned each embodiment does not limit the implementation method of
said each process part. Each of the processing units may be configured as a component of the
hardware or a component of software or a combination thereof in a method that can be realized
by a person skilled in the art.
[0077]
Reference Signs List 5 speaker device 10 speaker box 20, 30 speaker unit 21, 31 diaphragm 22,
32 frame 24, 34 magnetic circuit 25, 35 plate 26, 36 magnet 27, 37 yoke 28, 38 terminal 40, 41
input terminal 42 buffer member 50 Rib 60 signal processing circuit 61, 66, 67, 76 mixer 63, 64
high pass filter 68, 72 low pass filter 71 delay circuit 75 sound effect signal processing unit 81,
82 switch
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