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JP2013005403

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JP2013005403
Abstract: The present invention provides an ultrasonic unit 30 that is easy to manufacture. An
ultrasonic unit (30) comprises an ultrasonic array (40) comprising a plurality of connected
ultrasonic elements (20), and the ultrasonic element (20) comprises a silicon substrate (11) and a
plurality of ultrasonic cells (10). The transmission / reception unit 60 disposed on the first main
surface 20SA of the silicon substrate 11, the flexible lower electrode wiring 42, the lower
electrode terminal 52, the flexible upper electrode wiring 41, and the upper electrode terminal
51, and a flexible third insulating layer 17 covers the surface of the transmitting / receiving unit
60 and is bent in the direction of the second main surface 20SB by the bending portions 46 and
47. The wire 42 and the upper electrode wire 41 are covered. [Selected figure] Figure 6
ULTRASONIC UNIT, ULTRASONIC ENDOSCOPE AND METHOD OF MANUFACTURING
ULTRASONIC UNIT
[0001]
The present invention relates to a capacitive ultrasonic unit, an ultrasonic endoscope having the
ultrasonic unit, and a method of manufacturing the ultrasonic unit.
[0002]
The ultrasound endoscope clearly delineates the digestive tract wall or deep organs with good
image quality that is not affected by gas or bone in the body.
04-05-2019
1
The electronically scanned ultrasonic endoscope is provided with an ultrasonic unit having an
ultrasonic array at its tip. The ultrasound array is configured by connecting a plurality of
ultrasound elements.
[0003]
Each of the ultrasonic elements is provided with a plurality of capacitive ultrasonic vibration cells
consisting of a lower electrode portion and an upper electrode portion facing each other through
a cavity. The capacitive ultrasonic element is formed on the substrate by so-called MEMS
technology. For this reason, the electrode terminal for an electrical connection and the ultrasonic
wave transmission surface are arrange | positioned by the same main surface of a board |
substrate.
[0004]
Patent No. 3924466 specification discloses an ultrasonic transducer in which an electrode
terminal is disposed on the second main surface by a through wiring extending from the first
main surface on which the ultrasonic wave transmitting surface is disposed. ing.
[0005]
However, since the through wiring needs to be formed at the beginning of the manufacturing
process, the manufacturing may be difficult.
In addition, depending on the heat resistance of the conductive material disposed inside the
through hole, there is a possibility that the maximum temperature that can be used in the
process may decrease. Although the factor of the operating speed of the capacitive ultrasonic
transducer is the product of the electrical resistance and the capacitance, the through wiring
using polysilicon as the conductive material does not have a low electrical resistance. For this
reason, there existed a possibility that operating speed might fall.
[0006]
Patent No. 3924466 specification
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2
[0007]
Embodiments of the present invention aim to provide an ultrasonic unit that is easy to
manufacture, an ultrasonic endoscope that is easy to manufacture, and a method of
manufacturing an easy ultrasonic unit.
[0008]
An ultrasonic unit according to an embodiment of the present invention comprises an ultrasonic
array consisting of a plurality of connected ultrasonic elements, and the ultrasonic element has a
rectangular first main surface and a second main surface. A plurality of ultrasonic cells each
having a base, and a lower electrode portion and an upper electrode portion disposed opposite to
each other through a cavity are disposed, and the lower electrode portions are connected to each
other. A plurality of transmitting / receiving units each having a rectangular shape in a plan view
that transmits and receives ultrasonic waves disposed on the first main surface, the upper
electrode units being connected to each other; and a plurality of extending from the end of the
transmitting and receiving units A flexible lower electrode wire connected to the lower electrode
portion, a lower electrode terminal connected to the lower electrode wire, and a plurality of
upper electrodes extended from the other end of the transmitting and receiving unit Flexible
connected to the unit An upper electrode wire; and an upper electrode terminal connected to the
upper electrode wire, wherein a flexible resin layer covers the surface of the transmitting and
receiving unit, and the second bent portion is formed by the respective bent portions. Covering
the lower electrode wiring and the upper electrode wiring bent in the direction of the main
surface of
[0009]
Another embodiment of the ultrasonic endoscope includes a distal end rigid portion having the
above-described ultrasonic unit.
[0010]
In a method of manufacturing an ultrasonic unit according to another embodiment, a plurality of
ultrasonic cells each having a lower electrode portion and an upper electrode portion disposed
opposite to each other on a first main surface of a base via a cavity are provided. Manufacturing
a plurality of ultrasonic elements, a lower electrode wire connected to the lower electrode
portion, a lower electrode terminal extended from the lower electrode wire, an upper electrode
wire connected to the upper electrode portion, And manufacturing an upper electrode terminal
extended from the upper electrode wiring on the first main surface, covering a surface of the first
main surface with a flexible resin layer, and the lower electrode. Removing at least a part of the
wiring, the lower electrode terminal, the upper electrode wiring, and the substrate under the
upper electrode terminal; and removing the lower electrode wiring and the upper electrode
04-05-2019
3
wiring from the second main surface. Worker bending in the direction And it comprises a.
[0011]
According to an embodiment of the present invention, an ultrasonic unit that is easy to
manufacture, an ultrasonic endoscope that is easy to manufacture, and a method of
manufacturing an easy ultrasonic unit are provided.
[0012]
BRIEF DESCRIPTION OF THE DRAWINGS It is an external view for demonstrating the endoscope
system which comprises the ultrasound endoscope of 1st Embodiment.
It is a perspective view for demonstrating the front-end | tip rigid part of the ultrasound
endoscope of 1st Embodiment.
It is a perspective view for demonstrating the structure of the ultrasound unit of 1st Embodiment.
It is cell structure sectional drawing of the ultrasound array of 1st Embodiment.
It is a top view of the ultrasound array of a 1st embodiment.
It is sectional drawing along the VI-VI line of FIG. 5 of the ultrasonic array of 1st Embodiment.
It is a flowchart for demonstrating the manufacturing method of the ultrasound unit of 1st
Embodiment. It is sectional drawing for demonstrating the manufacturing method of the
ultrasound unit of 1st Embodiment. It is sectional drawing for demonstrating the structure of the
ultrasonic unit of the modification 1 of 1st Embodiment. It is sectional drawing for demonstrating
the structure of the ultrasonic unit of the modification 2 of 1st Embodiment. It is a top view for
demonstrating the structure of the ultrasound array of 2nd Embodiment. FIG. 12 is a crosssectional view taken along the line XII-XII of FIG. 11 for describing the structure of the
ultrasound array of the second embodiment.
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[0013]
Hereinafter, with reference to the drawings, an ultrasound unit (hereinafter referred to as "US
unit") 30 according to the first embodiment, an ultrasound endoscope (hereinafter referred to as
"US endoscope") 2 having a US unit 30, and The method of manufacturing the US unit 30 will be
described.
[0014]
<Configuration of Ultrasonic Endoscope> As shown in FIG. 1, the US endoscope 2 constitutes the
ultrasonic endoscope system 1 together with the ultrasonic observation device 3 and the monitor
4.
The US endoscope 2 includes an elongated insertion portion 21 inserted into the body, an
operation portion 22 disposed at a proximal end of the insertion portion 21, and a universal cord
23 extending from the side portion of the operation portion 22. Prepare.
[0015]
At the proximal end of the universal cord 23, a connector 24A connected to a light source device
(not shown) is disposed. From the connector 24A, a cable 25 detachably connected to the camera
control unit (not shown) via the connector 25A, and a cable 26 detachably connected to the
ultrasonic observation apparatus 3 via the connector 26A It is extended. A monitor 4 is
connected to the ultrasonic observation apparatus 3.
[0016]
The insertion portion 21 is positioned and operated from the distal end side to the distal end
rigid portion (hereinafter referred to as “the distal end”) 37, the curved portion 38 located at
the rear end of the distal end 37, and the rear end of the curved portion 38 A flexible tube
portion 39 having a small diameter, a long length and flexibility up to the portion 22 is
continuously provided. The ultrasonic unit 30 is disposed on the distal end side of the distal end
portion 37.
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[0017]
The operation unit 22 includes an angle knob 22A that performs bending control of the bending
unit 38 in a desired direction, an air / water supply button 22B that performs air supply and
water supply operations, a suction button 22C that performs suction operation, and a treatment
that is introduced into the body A treatment tool insertion port 22D or the like which is an
entrance of the tool is disposed.
[0018]
Then, as shown in FIG. 2, the tip portion 37 provided with the US unit 30 has an illumination lens
cover 31 constituting an illumination optical system, an observation lens cover 32 of an
observation optical system, and a suction port. A forceps port 33 which doubles as well as an air
/ water nozzle (not shown) are disposed.
[0019]
As shown in FIG. 3, the US array 40 of the US unit 30 has a plurality of rectangular ultrasonic
elements (hereinafter referred to as “US elements”) having a rectangular shape in plan view,
which are connected in a long side and curved in a cylindrical shape. Type oscillator group.
That is, in the US array 40, for example, 200 US elements 20 each having a short side of 0.1 mm
or less are provided in the direction of 360 degrees on the side surface of a cylinder having a
diameter of 2 mm.
Each US element 20 is provided with a transmitter / receiver 60 (see FIGS. 4 to 6) which is an
active area for transmitting and receiving ultrasonic waves.
[0020]
Although the US array 40 is a radial type transducer group, the US array may be a convex type
transducer group bent in a convex shape.
[0021]
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At the end of the inner surface of the cylindrical ultrasonic array 40, a plurality of lower
electrode terminals 52 are arranged, and each is connected to the respective signal lines 62 of
the coaxial cable bundle 35.
Further, although not shown in FIG. 3, a plurality of upper electrode terminals 51 (see FIG. 5) are
arranged at the other end of the inner surface of the ultrasonic array 40, and each of the upper
electrode terminals 51 is It is connected to the shield wire 61 (see FIG. 5). That is, the coaxial
cable bundle 35 is formed of a coaxial cable having the same number of core wires as the
plurality of signal wires 62.
[0022]
The transmitting and receiving unit 60 generates an ultrasonic wave based on a drive signal
applied via the lower electrode terminal 52 and the upper electrode terminal 51. Further, when
the transmitting and receiving unit 60 receives an ultrasonic wave, the transmitting and receiving
unit 60 generates an electrical signal between the lower electrode terminal 52 and the upper
electrode terminal 51.
[0023]
The coaxial cable bundle 35 is inserted into the distal end portion 37, the bending portion 38,
the flexible tube portion 39, the operation portion 22, the universal cord 23, and the ultrasonic
cable 26, and the ultrasonic connector 26a is used. , And the ultrasound observation apparatus 3.
[0024]
<Structure of Transmitting / Receiving Unit> Next, the structure of the transmitting / receiving
unit 60 of the US element 20 will be described with reference to FIGS. 4 and 5.
The figures are all schematic diagrams for explanation, and the ratio of the number of patterns,
thickness, size, size and the like is different from the actual one.
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[0025]
As shown in FIG. 5, in the transmission / reception unit 60 of the ultrasonic unit 30, a plurality of
capacitive ultrasonic transducer cells (hereinafter, "US cells") 10 are arranged in a matrix. The
arrangement of the US cells 10 may be a regular lattice arrangement, a staggered arrangement, a
triangular mesh arrangement or the like, or may be a random arrangement.
[0026]
As shown in FIG. 4, the US cell 10 includes a lower electrode 12 connected to a lower electrode
terminal 52, a first insulating layer (lower insulating layer) 13, and a lower electrode terminal 52
sequentially stacked on a silicon substrate 11 as a base. The second insulating layer (upper
insulating layer) 15 in which the cylindrical cavity 14 is formed, the upper electrode 16
connected to the upper electrode terminal 51, and the third insulating layer (resin layer) 17 are
provided. The silicon substrate 11 is a substrate in which silicon thermal oxide films 11B and
11C are formed on the surface of silicon 11A.
[0027]
Each US cell 10 has a lower electrode portion 12A which is a signal electrode portion disposed
opposite to each other via a cavity 14 and an upper electrode portion 16A which is a ground
electrode portion. The plurality of lower electrode portions 12A constitute a lower electrode 12
which is a signal electrode, and the plurality of upper electrode portions 16A constitute an upper
electrode 16 which is a ground electrode.
[0028]
The lower electrode 12 includes a circular lower electrode portion 12A and a conductive portion
12B extending from the edge of the lower electrode 12. The lower electrode portion 12A is
connected to the lower electrode portion of another US cell of the same US element 20 by the
conductive portion 12B. The lower electrode 12 is extended from the end of the transmitting /
receiving unit 60 to the lower electrode wire 42, and the lower electrode wire 42 is further
extended to the lower electrode terminal 52.
04-05-2019
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[0029]
The upper electrode 16 includes a circular upper electrode portion 16A and a conductive portion
16B extending from the edge of the upper electrode 16. The upper electrode portion 16A is
connected to the upper electrode portion of another US cell of the same US element 20 by the
conductive portion 16B. The upper electrode 16 is extended from the end of the transmission /
reception unit 60 to the upper electrode wire 41, and the upper electrode wire 41 is further
extended to the upper electrode terminal 51.
[0030]
すなわち。 All lower electrode parts 12A of a plurality of US cells 10 arranged in the same US
element 20 are connected to each other, and all upper electrode parts 16A are also connected to
each other.
[0031]
The upper electrode wiring 41 and the lower electrode wiring 42 (hereinafter referred to as
“wiring 41 etc.”) are made of a metal material having a lower electrical resistance than
conductive silicon or the like, such as copper, gold or aluminum.
[0032]
The third insulating layer 17 is a flexible resin layer covering the surface of the transmitting and
receiving unit 60.
Furthermore, the third insulating layer 17 also covers the wiring 41 and the like, but does not
cover the electrode terminal 51 and the like. The third insulating layer 17 has not only a
protective layer function but also an acoustic matching layer function and further a function to
connect the US element 20.
[0033]
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9
The third insulating layer 17 is made of a flexible resin such as polyimide, epoxy, acrylic or
polyparaxylene, has high chemical resistance, has flexibility, and is easy to process, particularly
preferably polyimide. It is. The third insulating layer 17 may have a two-layer structure in which
a biocompatible upper insulating layer is further formed on the lower insulating layer.
[0034]
In the US cell 10 having the above structure shown in FIG. 4, the second insulating layer 15, the
upper electrode 16, and the third insulating layer 17 in the region directly above the cavity 14
constitute a membrane 18 which is a vibrating portion.
[0035]
<Configuration of Ultrasonic Array> As shown in FIGS. 5 and 6, from the end of the transmitting /
receiving unit 60 of the US element 20 to the lower electrode terminal 52 which is an external
connection terminal located on the second main surface 20SB side A flexible lower electrode
wiring 42 is extended.
In addition, a flexible upper electrode wire 41 extends from the other end of the transmission /
reception unit 60 of the US element 20 to the upper electrode terminal 51 which is an external
connection terminal located on the second main surface 20SB side. It is done.
[0036]
As described above, the lower electrode terminal 52 is connected to the signal line 62, and the
upper electrode terminal 51 is connected to the shield line 61.
[0037]
Then, the third insulating layer 17 which is a flexible resin layer covers the surface of the
transmission / reception unit 60 and also covers the wiring 41 and the like.
The third insulating layer 17 not only covers the upper side of the wiring 41 and the like, but
also covers the lower side of the wiring 41 and the like, and preferably seals the wiring 41 and
04-05-2019
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the like.
[0038]
Hereinafter, the flexible wiring 41 and the like sealed by the flexible third insulating layer 17 will
be referred to as "flexible wiring". The flexible wiring includes bent portions 46 and 47 bent at a
bending angle θ of 180 degrees from the first main surface 20SB.
[0039]
The US unit 30 is easy to manufacture because the external connection terminals are disposed on
the second main surface 20SB by the bent flexible wiring. The US endoscope 2 equipped with the
US unit 30 is easy to manufacture. Furthermore, since the wires 41 and the like have low electric
resistance, there is no possibility that the operation speed of the US unit 30 decreases.
[0040]
<Method of Manufacturing Ultrasonic Array> Next, a method of manufacturing the ultrasonic
array 40 will be described with reference to FIGS. 7 and 8.
[0041]
<Step S11> Formation of Lower Electrode As shown in FIG. 8A, a lower electrode layer made of a
conductive material is formed on the silicon thermal oxide film 11B of the silicon substrate 11.
The conductive material is deposited on the entire surface of the silicon substrate 11 by
sputtering or the like. Then, after the mask pattern by photolithography is formed, the lower
electrode 12 is formed by partially removing it by etching.
[0042]
<Step S12> Formation of First Insulating Layer The first insulating layer 13 made of an insulating
material such as SiN is formed, for example, by CVD (chemical vapor deposition) to cover the first
major surface 20SA including the lower electrode 12. The film is formed by
04-05-2019
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[0043]
<Step S13> Cavity / Second Insulating Layer Forming Step After forming a sacrificial layer
material on the first insulating layer 13, the sacrificial layer having the shape (cylindrical shape)
of the cavity 14 is formed by partially removing the sacrificial layer material. Is formed.
[0044]
The thickness of the sacrificial layer is, for example, 0.05 to 0.3 μm, preferably 0.05 to 0.15
μm, in order to be the height of the cavity 14.
As a sacrificial layer material, for example, phosphorus glass (PSG: phospho-containing silicon
oxide), silicon dioxide, polysilicon, metal or the like is used.
[0045]
On the upper surface of the first insulating layer 13 on which the sacrificial layer is formed, the
second insulating layer 15 is formed by, for example, the same method and the same material as
the first insulating layer 13.
[0046]
Then, in order to remove the sacrificial layer, an opening (not shown) into which an etchant flows
is formed at a predetermined position of the second insulating layer 15.
[0047]
Next, the cavity 14 is formed by etching the sacrificial layer.
For example, when phosphorus glass is used as a sacrificial layer and SiN is used as the first
insulating layer 13 and the second insulating layer 15, a hydrofluoric acid solution (buffered HF
solution) is used as an etching agent.
04-05-2019
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[0048]
The cavity 14 is not limited to a cylindrical shape, and may be a polygonal pillar shape or the
like.
When the cavity 14 has a polygonal prism shape, the shapes of the upper electrode portion 16A
and the lower electrode portion 12A are also preferably polygonal.
[0049]
<Step S <b> 14> Upper Electrode Layer Formation As shown in FIG. 8B, the upper electrode 16 is
formed by the same method as the lower electrode 12.
[0050]
<Step S15> Wiring Layer Formation As shown in FIG. 8C, after forming holes for bonding with
the lower electrode wiring 42 in the first insulating layer 13 and the second insulating layer 15,
the wiring layer, ie, the wiring layer, is formed. Lower electrode wire 42, lower electrode terminal
52, upper electrode wire 41, and upper electrode terminal 51 are formed.
The wiring layer is formed by a sputtering method, an evaporation method, a plating method or
the like, and for example, a gold plating film of 2 μm is preferably used.
[0051]
<Step S16> Formation of Third Insulating Layer As shown in FIG. 8D, the surface of the US
element 20 (US array 40) excluding the electrode terminals 51 and the like is covered with the
third insulating layer 17.
In addition, in order to seal the wiring 41 and the like, it is preferable to form a resin layer
similar to the third insulating layer before the wiring layer forming step. That is, the third
insulating layer is preferably performed before and after the wiring layer forming step. For
example, the wiring layer is sealed by forming the 5 μm third insulating layer 1 before the
04-05-2019
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wiring layer forming process and forming the 5 μm third insulating layer 2 after the wiring
layer forming process.
[0052]
In addition, part of the first insulating layer 13 and the second insulating layer 15 may be used
as a lower layer of the third insulating layer, or the lower layer of the wiring layer is formed
when the lower electrode 12 and the upper electrode 16 are formed. May be In addition, as
described above, the insulating layer formed after the wiring layer forming step may have a twolayer structure.
[0053]
<Step S17> Substrate Etching As shown in FIG. 8E, a part of the substrate 11, that is, both ends
and the space between the US elements 20 are removed from the second main surface 20SB side
by, for example, etching. The wiring 41 and the like can be bent by the substrate etching. As an
etching method, a DRIE (Deep Reactive Ion Etching) method or the like is used.
[0054]
<Step S18> Bending As shown in FIG. 8F, the flexible wires at both ends are bent by 90 degrees
along the side surface of the silicon substrate 11, and further 90 degrees along the second main
surface 20SB. It is bent. That is, the bending angle θ of the bending portions 46 and 47 is 180
degrees. For this reason, the electrode terminal 51 etc. which were in 1st main surface 20SA
come to be located in the 2nd main surface 20SB side.
[0055]
Although not shown, the flexible wiring is joined to the silicon substrate 11 in a bent state with
an epoxy adhesive or the like.
[0056]
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<Step S19> External Wiring Connection The signal wire 62 and the shield wire 61 of the coaxial
cable bundle 35, which are external connection wiring, are connected to the electrode terminals
51 on the second main surface 20SB side by solder, for example, respectively. .
For example, the coaxial cable bundle 35 may be connected via a relay wiring board (cable
connection board) formed of a printed wiring board having a plurality of wirings.
[0057]
Although omitted in the above description, the plurality of rectangular planar-view rectangular
US elements 20 constituting the US array 40 are simultaneously manufactured using one silicon
substrate 11. Then, for example, in the substrate etching step, each of the US elements 20 is
divided. That is, as shown in FIG. 5, the US array 40 has a structure in which the long sides of the
plurality of ultrasonic elements 20 are connected by the third insulating layer 17. As already
described, although the third insulating layer 17 may have a multilayer structure, any layer is
made of a flexible resin.
[0058]
Furthermore, in the US array 40, a plurality of ultrasonic elements 20 are curvedly arranged in a
radial direction of a predetermined diameter in the connecting direction. That is, the US array 40
is joined to, for example, the outer periphery of a cylinder having a predetermined diameter.
[0059]
As described above, the method of manufacturing the ultrasonic unit 30 is easy.
[0060]
Modified Example of First Embodiment Next, an ultrasonic endoscope 2A including an ultrasonic
unit 30A and an ultrasonic unit 30A of a modified example 1 of the first embodiment, and an
ultrasonic wave of a modified example 2 of the first embodiment An ultrasonic endoscope 2B
having a unit 30B and an ultrasonic unit 30B will be described.
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Since the modification is similar to the first embodiment, the same components are denoted by
the same reference numerals and the description thereof will be omitted.
[0061]
As shown in FIG. 9, in the ultrasonic unit 30A, a backing layer 70 that absorbs unnecessary
ultrasonic waves is formed on the second main surface 20SB of the silicon substrate 11. The
backing layer 70 regulates the free vibration of the membrane when emitting ultrasonic waves,
and improves the resolution in the traveling direction of the ultrasonic waves. For the backing
layer 70, various materials capable of absorbing vibration can be used, and both inorganic
materials and organic materials can be applied. In particular, epoxy resins and rubber materials
are preferable because they have small acoustic impedance and can absorb vibrations without
lowering sensitivity.
[0062]
The silicon substrate 11 of the US element 20 of the US unit 30A is etched so as to leave the
silicon substrate 11 in a part of the lower part of the flexible wiring. In particular, by performing
anisotropic etching with an aqueous alkali solution using a (100) plane single crystal silicon
substrate, the end face has a tapered shape having a slope of 54.7 degrees with respect to the
main surface. Of course, a dry etching method capable of forming a non-vertical cross-sectional
shape may be used.
[0063]
As shown in FIG. 9, the flexible wiring is bent at bending portions 46 and 47 so as to cover the
backing layer 70. The bending angle θ is 180 degrees, and the electrode terminals 51 and the
like are located on the second main surface side of the silicon substrate 11.
[0064]
The US unit 30A has a silicon substrate 11 with a tapered side surface at a part under the flexible
wiring, so the bending process is easy.
04-05-2019
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[0065]
On the other hand, as shown in FIG. 10, in the ultrasonic unit 30B, the bending angle θ of the
bending portions 46 and 47 is 90 degrees.
The electrode terminal 51 is located on the inner surface side of the side surface of the silicon
substrate 11, and the electrode terminal 52 is located on the side surface of the silicon substrate
11.
[0066]
That is, the arrangement state of the electrode terminal 51 and the electrode terminal 52 does
not need to be the same state, for example, one electrode terminal may be on the second main
surface 20SB side of the silicon substrate 11 and the other may be located on the side surface . In
addition, one electrode terminal may be located on the first main surface 20SA side of the silicon
substrate 11.
[0067]
The ultrasonic unit 30A and the ultrasonic unit 30B both have the same effect as the ultrasonic
unit 30 of the first embodiment. That is, although the external connection electrode terminal is
disposed on a surface different from the ultrasonic transmission / reception surface, it is easy to
manufacture.
[0068]
Second Embodiment Next, an ultrasonic endoscope 2C including an ultrasonic unit 30C and an
ultrasonic unit 30C according to a second embodiment will be described.
[0069]
In the ultrasonic unit 30A and the like, in order to deform the ultrasonic array 40 into a radial
04-05-2019
17
shape, it is joined to the outer periphery of a cylindrical member of a predetermined diameter.
However, the arrangement of the cylindrical members increases the diameter of the ultrasonic
array 40.
[0070]
On the other hand, as shown in FIGS. 11 and 12, in the US unit 30C, the plurality of ultrasonic
elements 20 are curved along the shape of the backing layer 70 disposed on the second main
surface 20SB. There is.
[0071]
The silicon substrate 11 of the US element 20 of the US unit 30C is etched so as to leave the
silicon substrate 11 also on a part of the lower part of the flexible wiring.
[0072]
Furthermore, the side surface of the silicon substrate 11 after etching is not perpendicular to the
main surface but inclined.
In order to make the side surface into a tapered shape, anisotropic etching with an aqueous alkali
solution is performed using a single crystal of (100) surface as the silicon substrate 11.
Then, the side surface formed by etching has a slope of 54.7 degrees with respect to the main
surface. Of course, a dry etching method capable of forming a non-vertical cross-sectional shape
may be used.
[0073]
The backing layer 70 has an outer peripheral surface having a concave portion with a side
surface having a predetermined inclination angle, that is, a shape fitted to the inclined side
surface of the silicon substrate 11. For this reason, by joining the US elements 20 of the US array
40 so as to fit in the irregularities of the outer peripheral surface of the cylindrical backing layer
04-05-2019
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70, it is possible to obtain the US unit 30C of a predetermined radial shape without a gap. .
[0074]
The US unit 30C has an effect of the US unit 30B, and further has a small diameter because a
cylinder or the like for deforming the ultrasonic array 40 to a predetermined bending angle is
unnecessary. Further, the tip of the US endoscope 2C has a small diameter.
[0075]
The present invention is not limited to the above-described embodiment or modification, and
various changes, modifications, and the like can be made without departing from the scope of the
present invention.
[0076]
DESCRIPTION OF SYMBOLS 1 ... ultrasound endoscope system, 2, 2A-2C ... ultrasound endoscope,
3 ... ultrasound observation apparatus, 10 ... ultrasound cell, 11 ... silicon substrate, 12 ... lower
electrode, 12A ... lower electrode part, DESCRIPTION OF SYMBOLS 13 ... 1st insulating layer, 14
... Cavity, 15 ... 2nd insulating layer, 16 ... Upper electrode, 16A ... Upper electrode part, 17 ... 3rd
insulating layer, 18 ... Membrane, 20 ... Ultrasonic element, 20SA ... 1st Second main surface 30,
30A to 30C ultrasonic wave unit 40 ultrasonic array 41 upper electrode wiring 42 lower
electrode wiring 46 47 bent portion 51 upper portion Electrode terminal, 52: lower electrode
terminal, 60: transmission / reception unit, 61: shield line, 62: signal line, 70: backing layer
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