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JP2014127843

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DESCRIPTION JP2014127843
Abstract: To obtain good sound pressure frequency characteristics. SOLUTION: An exciter 5,
which is an acoustic generator and vibrates when an electric signal is input, and a vibrator 3
which is attached with the exciter 5 and vibrates together with the exciter 5 by the vibration of
the exciter 5. The frame 2 is provided on the outer peripheral portion of the vibrating body 3a
and supports the vibrating body 3a substantially flatly, and the frame 2 has a hole H1 and has a
hole 2aa corresponding to the hole H1. The substrate 2a is fixed to the main surface by a pin 8
or a screw 9 inserted into the hole 2aa and the hole H1. [Selected figure] Figure 3A.
Acoustic generator, acoustic generator and electronic device
[0001]
Embodiments of the disclosure relate to a sound generator, a sound generator and an electronic
device.
[0002]
Conventionally, an acoustic generator using a piezoelectric element is known (see, for example,
Patent Document 1).
Such a sound generator vibrates the vibration plate by applying a voltage to the piezoelectric
element attached to the vibration plate to vibrate the vibration plate, and outputs the sound by
actively utilizing the resonance of the vibration.
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1
[0003]
Moreover, since such a sound generator can use thin films, such as a resin film, for a diaphragm,
it can be comprised thinly and lightweight compared with a general electromagnetic speaker etc.
[0004]
In the case where a thin film is used as the diaphragm, the thin film is supported in a uniformly
tensioned state by being sandwiched from a thickness direction, for example, by a pair of frame
members so as to obtain excellent acoustic conversion efficiency. Is required.
[0005]
JP 2004-023436
[0006]
However, since the above-mentioned conventional sound generator actively utilizes the
resonance of the uniformly tensioned diaphragm, a peak (a portion where the sound pressure is
higher than that of the surroundings) and a dip in the frequency characteristic of the sound
pressure There is a problem that (the part where the sound pressure is lower than the
surrounding area) is likely to occur, and it is difficult to obtain good sound quality.
[0007]
One aspect of the embodiments is made in view of the above, and it is an object of the present
invention to provide an acoustic generator, an acoustic generator and an electronic device
capable of obtaining good frequency characteristics of sound pressure.
[0008]
The sound generator according to one aspect of the embodiment includes an exciter, a vibrator,
and a frame.
The exciter vibrates when an electrical signal is input.
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The vibrator is attached with the exciter, and vibrates together with the exciter due to the
vibration of the exciter.
The frame is provided on an outer peripheral portion of the vibrator and supports the vibrator in
a substantially flat manner.
Further, the frame has a hole, and a substrate having a hole corresponding to the hole is fixed to
the main surface by a pin or a screw inserted into the hole and the hole.
[0009]
According to one aspect of the embodiment, good sound pressure frequency characteristics can
be obtained.
[0010]
It is a schematic plan view which shows schematic structure of a basic sound generator.
It is the sectional view on the AA line of the sound generator shown to FIG. 1A (the 1).
It is the sectional view on the AA line of the sound generator shown to FIG. 1A (the 2). It is a
figure which shows an example of the frequency characteristic of sound pressure. It is an
acoustic generator which concerns on embodiment, and (a) is a typical top view (the 1) which
shows an example of composition, (b) is a frame of an acoustic generator shown to (a), a
substrate, and (C) and (d) are typical perspective views which show the other example of a pin. It
is a BB sectional view in the case of fixing a substrate to a sound generator shown in Drawing 3A
(a) with a screw, and (a) is a typical figure showing the state before fixing a substrate to a frame
with a screw. FIG. 7B is a schematic cross-sectional view showing a state after the substrate is
fixed to the frame with a screw. It is an acoustic generator which concerns on embodiment, and
(a) is a typical top view (the 2) which shows an example of composition, (b) is a frame of an
acoustic generator shown to (a), a substrate, and It is a typical perspective view showing a screw.
It is CC sectional view in the case of fixing a substrate to a sound generator shown in Drawing 3C
(a) with a screw, and (a) is a typical figure showing the state before fixing a substrate to a frame
with a screw FIG. 7B is a schematic cross-sectional view showing a state after the substrate is
fixed to the frame with a screw. (a) and (b) are modifications of the screw, and are schematic
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cross-sectional views showing the state after fixing the substrate with the screw, and (c) is a
schematic showing the other modification of the screw It is a perspective view. (A), (b) and (c) are
typical top views which show the notch | incision of the head of a screw. It is a figure showing
composition of a sound generator concerning an embodiment. It is a figure which shows the
structure of the electronic device which concerns on embodiment. It is a typical top view showing
an example of the composition of the sound generator concerning an embodiment. (Part 1) It is a
typical top view showing an example of the composition of the sound generator concerning an
embodiment. (2) It is a typical top view which shows an example of a structure of the sound
generator which concerns on embodiment. (3) It is a typical top view which shows an example of
a structure of the sound generator which concerns on embodiment. (その4)
[0011]
Hereinafter, embodiments of a sound generator, a sound generator and an electronic device
disclosed in the present application will be described in detail with reference to the attached
drawings. Note that the present invention is not limited by the embodiments described below.
[0012]
First, prior to the description of the sound generator 1 according to the embodiment, a schematic
configuration of a basic sound generator 1B will be described with reference to FIGS. 1A to 1C.
1A is a schematic plan view showing a schematic configuration of the sound generator 1B, FIG.
1B is a cross-sectional view taken along the line AA 'of FIG. 1A (part 1), and FIG. It is a -A 'line
sectional view (the 2).
[0013]
In order to make the description easy to understand, FIGS. 1A to 1C illustrate a three-dimensional
orthogonal coordinate system including a Z axis in which the vertically upward direction is a
positive direction and the vertically downward direction is a negative direction. Such an
orthogonal coordinate system may also be shown in other drawings used in the following
description.
[0014]
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Further, in FIG. 1A, illustration of the resin layer 7 (described later) is omitted. In order to make
the description easy to understand, FIGS. 1B and 1C show the sound generator 1B in a greatly
exaggerated manner in the thickness direction (Z-axis direction).
[0015]
As shown in FIG. 1A, the sound generator 1B includes a frame 2, a diaphragm 3, a piezoelectric
element 5, and lead wires 6a and 6b. As shown in FIG. 1A, the following description exemplifies
the case where one piezoelectric element 5 is provided, but the number of piezoelectric elements
5 is not limited.
[0016]
Further, as shown as an example in FIG. 1B, the frame 2 functions as a support for supporting the
diaphragm 3 at the peripheral portion of the diaphragm 3. The diaphragm 3 has a plate-like or
film-like shape, and the peripheral edge portion thereof is fixed to the frame 2 and supported
substantially flat in a state in which tension is uniformly applied within the frame 2 Ru.
[0017]
Further, in the example shown in FIG. 1C, the frame 2 is constituted by two frame members
having a rectangular frame shape and the same shape, and supports the diaphragm 3 by
sandwiching the peripheral portion of the diaphragm 3 Act as a body. The diaphragm 3 has a
plate-like or film-like shape, and the peripheral edge portion thereof is sandwiched and fixed to
the frame 2 and is substantially flat in a state where tension is uniformly applied within the
frame 2 Supported by
[0018]
In this case, since the tension of the diaphragm 3 can be stabilized by sandwiching the
diaphragm 3 between the two frame members, the frequency characteristic of the acoustic
generator 1 'is not changed for a long period of time. Better because you can.
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[0019]
A portion of the diaphragm 3 inside the inner periphery of the frame 2, that is, a portion of the
diaphragm 3 which is not sandwiched by the frame 2 and can freely vibrate is referred to as a
vibrator 3a.
That is, the vibrating body 3 a is a portion having a substantially rectangular shape in the frame
of the frame 2.
[0020]
Moreover, the diaphragm 3 can be formed using various materials, such as resin and a metal. For
example, the diaphragm 3 can be made of a resin film of polyethylene, polyimide or the like
having a thickness of about 10 to 200 μm.
[0021]
Also, the thickness, material, and the like of the frame 2 are not particularly limited, and the
frame 2 can be formed using various materials such as metal and resin. For example, a stainless
steel or the like having a thickness of about 100 to 1000 μm can be suitably used as the frame
2 because of its excellent mechanical strength and corrosion resistance.
[0022]
Although FIG. 1A shows the frame 2 in which the shape of the inner region is substantially
rectangular, it may be a polygon such as parallelogram, trapezoid, and regular n-gon or oval It
may be. In the present embodiment, as shown in FIG. 1A, it is assumed to be substantially
rectangular.
[0023]
The piezoelectric element 5 is provided by being attached to the surface of the vibrating body 3a
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or the like, and is an exciter that excites the vibrating body 3a by vibrating upon receiving an
applied voltage.
[0024]
As shown in FIG. 1B or 1C, the piezoelectric element 5 is, for example, a laminate in which
piezoelectric layers 5a, 5b, 5c, 5d made of four layers of ceramic and three layers of internal
electrode layers 5e are alternately stacked. A body, surface electrode layers 5f and 5g formed on
the upper and lower surfaces of the laminate, and external electrodes 5h and 5j formed on the
exposed side surfaces of the internal electrode layer 5e.
In addition, lead wires 6a and 6b are connected to the external electrodes 5h and 5j. The lead
wires 6a and 6b are conductors for inputting an electrical signal from the outside.
[0025]
The piezoelectric element 5 has a plate shape, and the main surfaces on the upper surface side
and the lower surface side have a polygonal shape such as a rectangular shape or a square shape.
The piezoelectric layers 5a, 5b, 5c and 5d are polarized as shown by arrows in FIG. 1B or 1C.
That is, the direction of polarization with respect to the direction of the electric field applied at a
certain moment is polarized such that one side and the other side in the thickness direction (Zaxis direction in the drawing) are reversed.
[0026]
Then, when a voltage is applied to the piezoelectric element 5 through the lead wires 6a, 6b, for
example, at a certain moment, the piezoelectric layers 5c, 5d on the side adhered to the vibrating
body 3a shrink and the upper surface of the piezoelectric element 5 The piezoelectric layers 5a
and 5b on the side deform so as to extend. Therefore, by applying an alternating current signal to
the piezoelectric element 5, the piezoelectric element 5 can be bent and vibrated, and the
bending vibration can be applied to the vibrator 3a.
[0027]
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Further, the main surface of the piezoelectric element 5 is bonded to the main surface of the
vibrating body 3a by an adhesive such as an epoxy resin.
[0028]
As materials constituting the piezoelectric layers 5a, 5b, 5c and 5d, lead-free piezoelectric
materials such as PZT (lead zirconate titanate), Bi layer compounds, tungsten bronze structure
compounds, etc. are conventionally used. Piezoelectric ceramics can be used.
[0029]
Moreover, various metal materials can be used as a material of the internal electrode layer 5e.
For example, in the case of containing a metal component composed of silver and palladium, and
a ceramic component forming piezoelectric layers 5a, 5b, 5c, 5d, between piezoelectric layers 5a,
5b, 5c, 5d and internal electrode layer 5e. Since the stress due to the thermal expansion
difference can be reduced, it is possible to obtain the piezoelectric element 5 having no stacking
fault.
[0030]
Also, the lead wires 6a and 6b can be formed using various metal materials.
For example, when lead wires 6a and 6b are formed using a flexible wiring in which a metal foil
such as copper or aluminum is sandwiched by resin films, the height of the piezoelectric element
5 can be reduced.
[0031]
Further, as shown in FIG. 1B or 1C, the acoustic generator 1B is disposed within the frame of the
frame 2 so as to cover the surfaces of the piezoelectric element 5 and the vibrating body 3a. It
further comprises an integrated resin layer 7.
[0032]
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The resin layer 7 is preferably formed, for example, using an acrylic resin so that the Young's
modulus is in the range of about 1 MPa to 1 GPa.
In addition, since the appropriate damper effect can be induced by embedding the piezoelectric
element 5 in the resin layer 7, it is possible to suppress the resonance phenomenon and to
suppress the peak and the dip in the frequency characteristic of the sound pressure.
[0033]
Further, FIG. 1B or FIG. 1C shows a state where the resin layer 7 is formed to have the same
height as the frame 2, but it is sufficient if the piezoelectric element 5 is embedded, for example,
the resin layer 7 may be formed to be higher than the height of the frame 2.
[0034]
As described above, the vibrating body 3a, the piezoelectric element 5 and the resin layer 7 are
integrated, and constitute a so-called composite vibrating body that vibrates integrally.
[0035]
In FIG. 1B or 1C, a bimorph-type laminated piezoelectric element is described as an example of
the piezoelectric element 5. However, the present invention is not limited to this. For example,
the expanding and contracting piezoelectric element 5 is attached to the vibrating body 3a It may
be a unimorph type.
[0036]
By the way, as shown to FIG. 1A-FIG. 1C, the vibrating body 3a is substantially flatly supported in
the state which tension was uniformly applied within the frame of the frame 2. As shown in FIG.
In such a case, since the peak dip and distortion caused by the resonance induced by the
vibration of the piezoelectric element 5 occur, the sound pressure changes rapidly at a specific
frequency, and the frequency characteristic of the sound pressure is difficult to flatten.
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[0037]
This point is illustrated in FIG.
FIG. 2 is a diagram showing an example of the frequency characteristic of sound pressure.
As already described in the description of FIG. 1A, the vibrating body 3a is substantially flatly
supported in the frame 2 with tension applied uniformly.
[0038]
However, in such a case, since the peaks are concentrated and degenerated at a specific
frequency due to the resonance of the vibrating body 3a, as shown in FIG. 2, sharp peaks and
dips are likely to be scattered throughout the frequency range.
[0039]
As an example, attention is focused on a portion enclosed by a dashed closed curve PD in FIG.
When such a peak occurs, the sound pressure varies depending on the frequency, so that it is
difficult to obtain good sound quality.
[0040]
In such a case, as shown in FIG. 2, the height of peak P is lowered (see arrow 201 in the figure)
and the peak width is broadened (see arrow 202 in the figure), and peak P or dip (not shown) is
It is effective to take measures to make it smaller.
[0041]
Here, the frame 2 is focused.
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As described above, the frame 2 is a support that applies tension to the vibrating body 3a
uniformly while supporting it, but when the vibrating body 3a vibrates, it is induced by the
resonance of the vibrating body 3a and the frame is also The body 2 itself is also vibrating.
Moreover, the frame 2 is returning the reflected wave with respect to the vibrating body 3a.
Therefore, the frame 2 can be regarded as one of the components of the integrally vibrating
composite vibrator described above.
[0042]
Therefore, in the present embodiment, by providing the substrate 2 a fixed to the frame 2 with a
pin or a screw, the vibration wave is disturbed around the substrate 2 a to return from the frame
2 to the vibrating body 3 a. It was decided to disturb the reflected wave. Then, as a result, the
resonance frequencies are partially made uneven, thereby degenerating and dispersing the
resonance mode, thereby reducing the height of the peak P and widening the peak width.
[0043]
Hereinafter, the sound generators 1 and 1A according to the embodiment will be sequentially
described in detail with reference to FIGS. 3A to 7D. First, FIG. 3A (a) is a typical top view (the 1)
which shows an example of a structure of the sound generator 1 which concerns on embodiment.
Moreover, FIG. 3C (a) is a typical top view (the 2) which shows an example of a structure of the
sound generator 1A which concerns on embodiment.
[0044]
In the following drawings including the schematic plan views of FIG. 3A and FIG. 3B, the resin
layer 7 may be omitted as in FIG. 1A for convenience of explanation. Moreover, in each drawing,
only one sheet is shown among two frame members which comprise the frame 2. As shown in
FIG. Moreover, in FIG. 3A and FIG. 3C, centerline CL1 of the frame 2 is shown.
[0045]
First, an example of a structure of the sound generator 1 which concerns on embodiment shown
to FIG. 3A is demonstrated.
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[0046]
The sound generator 1 is provided with the board | substrate 2a in the frame 2 in addition to the
sound generator 1B shown to FIG. 1A-FIG. 1C, as shown to FIG. 3A.
As shown in FIG. 3A, the substrate 2a is provided on the upper surface of the frame 2, that is, on
the main surface of the frame 2 parallel to the XY plane. Further, FIG. 3A exemplifies the case
where the lead wires 6a and 6b are provided, and the lead wires 6a and 6b are not fixed on the
substrate 2a. For example, a glass epoxy substrate can be suitably used as the substrate 2a.
[0047]
As shown in FIG. 3A, the substrate 2a has a hole 2aa, the frame 2 has a hole H1, and the
substrate 2a is a pin inserted into the hole 2aa of the substrate 2a and the hole H1 of the frame
2. 8 is fixed to the frame 2. The frame 2 is provided such that the hole H1 corresponds to the
hole 2aa of the substrate 2a.
[0048]
That is, as shown in FIG. 3A (b), the substrate 2a is fixed by inserting the parallel pin 8a into the
hole H1 of the frame 2 through the hole 2aa of the substrate 2a. The parallel pin 8a has a
circular cross-sectional shape in the direction perpendicular to the axial direction and an equal
diameter.
[0049]
Further, the hole H1 of the frame 2 may be provided halfway along the Z direction of the frame 2
or may be provided penetrating the frame 2 in the Z direction, and the substrate 2a is used as a
frame It is appropriately selected depending on the stability at the time of fixing to 2.
[0050]
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The effect by the board | substrate 2a fixed to the frame 2 by the pin 8 in the sound generator 1
of this this embodiment is demonstrated.
The substrate 2a is fixed to the frame 2 by the pins 8, and by disturbing the vibration wave
around the substrate 2a, the reflected wave returning from the frame 2 to the vibration body 3a
can be disturbed. In particular, the oscillatory waves can be disturbed around the pins 8 securing
the substrate 2a.
[0051]
Thus, the substrate 2a is provided on the main surface side of the frame 2 on which the sound
generated by the sound generator 1 propagates, so that the vibration wave induced by the sound
signal makes the substrate 2a easy to vibrate. As a result, the propagating vibration wave is likely
to be disturbed around the substrate 2a.
[0052]
Therefore, since the resonance frequencies can be partially unaligned, the sound pressure peak P
at the resonance point can be dispersed to obtain good sound pressure frequency characteristics.
[0053]
Further, when the substrate 2a uses a glass epoxy substrate as described above, since the
materials having different Young's modulus are dispersed, the vibration wave around the
substrate 2a can be violently disturbed.
Therefore, it is more effective in partially unifying the resonance frequencies.
[0054]
Moreover, although the board | substrate 2a is being fixed to the frame 2 by the parallel pin 8a
as shown to FIG. 3A (b), it does not restrict to this.
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The substrate 2a can be fixed to the frame 2 by, for example, a tapered pin 8b as shown in FIG.
3A (c). The tapered pin 8b has a circular cross-sectional shape in the direction perpendicular to
the axial direction and is tapered in the axial direction.
[0055]
The substrate 2a can be fixed to the frame 2 by, for example, a tapered pin 8c as shown in FIG.
3A (d). The tapered pin 8c has a circular cross section in a direction perpendicular to the axial
direction, is axially tapered, and has a head.
[0056]
As described above, the tapered pin 8b or 8c has a tapered portion larger than the hole 2aa of
the substrate 2a, and the substrate 2a is fixed to the frame 2 by the large tapered portion, so the
substrate 2a is detached from the frame 2 It becomes difficult.
[0057]
Further, as shown in FIG. 3B, the substrate 2a can be fixed to the frame 2 by the screws 9
inserted into the holes 2aa of the substrate 2a and the holes H1 of the frame 2.
The screw 9 comprises a bolt 9a1 and a nut 9a2 as shown in FIG. 3B. In the screw 9, the bolt 9a1
is inserted into the hole 2aa of the substrate 2a and the hole H1 of the frame 2, and the bolt 9a1
of a portion protruding from the hole H1 fixes the substrate 2a to the frame 2 by the nut 9a2.
[0058]
The substrate 2a is fixed to the frame 2 by the screws 9, and by disturbing the vibration wave
around the substrate 2a, the reflected wave returning from the frame 2 to the vibration body 3a
can be disturbed. In particular, the oscillatory waves can be disturbed around the screw 9 fixing
the substrate 2a.
[0059]
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Thus, the substrate 2a is provided on the main surface side of the frame 2 on which the sound
generated by the sound generator 1 propagates, so that the vibration wave induced by the sound
signal makes the substrate 2a easy to vibrate. As a result, the propagating vibration wave is likely
to be disturbed around the substrate 2a.
[0060]
Further, since the screw 9 includes the bolt 9a1 and the nut 9a2 and fixes the substrate 2a to the
frame 2, the substrate 2a can be stably fixed to the frame 2.
[0061]
Although at least one hole H1 of the frame 2 is provided, in order to stably fix the substrate 2a to
the frame 2, it is preferable to provide two or more holes.
The holes of the substrate 2 a are provided in accordance with the number of holes H 1 provided
in the frame 2.
[0062]
The pin 8 and the screw 9 are made of, for example, a metal material such as steel, stainless steel,
aluminum alloy or brass, and also made of, for example, a resin material or a ceramic material.
On the other hand, the frame 2 is formed using various materials, such as metal and resin. The
pin 8 and the screw 9 are preferably made of a material different from that of the frame 2.
[0063]
For example, when the frame 2 is formed of a resin material, the pin 8 and the screw 9 are made
of a metal material. When the frame 2 is formed of a resin material, the pin 8 and the screw 9
use a resin material or a ceramic material. That is, it is preferable that the frame 2 and the pin 8
or the screw 9 be a combination in which the materials are different.
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[0064]
Thus, when the material of the frame 2 and the pin 8 or the screw 9 is different, the vibration
wave propagating on the surface of the frame 2 can be violently disturbed around the frame 2
and the pin 8 or the screw 9 . Therefore, it is more effective in partially unifying the resonance
frequencies. By this, the peak P of the sound pressure at the resonance point can be dispersed to
obtain a good sound pressure frequency characteristic.
[0065]
Next, an example of the configuration of the sound generator 1A according to the embodiment
shown in FIG. 3C will be described.
[0066]
As shown in FIG. 3C, in addition to the sound generator 1 shown in FIG. 3A, the sound generator
1A is provided with a substrate 2a on the frame 2 and a terminal 2b on the substrate 2a.
As shown in FIG. 3C, the substrate 2a has a hole 2aa, and the frame 2 has a hole H2.
Furthermore, in the hole portion H2, a screw groove H2a screwed with the screw 10 is provided
inside. Then, the substrate 2a is fixed to the frame 2 by the screw 10 inserted into the hole 2aa of
the substrate 2a and the hole H2 of the frame 2.
[0067]
That is, the substrate 2 a is screwed to the frame 2 by the screw 10 through the screw groove H
2 a inside the hole H 2 of the frame 2. Further, as shown in FIG. 3C (b), the screw 10a does not
have a head, and the screw groove is cut over the entire screw (full length). The screw 10a is
provided with a cut such as a cross shape, a one-letter shape, or a hexagonal hole at one end in
order to be inserted into the hole H2 and screwed.
[0068]
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Further, the substrate 2a may or may not have a screw groove inside the hole 2aa. In the case
where the screw groove is not provided in the hole 2aa of the substrate 2a, the substrate 2a is
fixed to the frame 2 by the screw 10 with the diameter of the hole 2aa and the diameter of the
screw 10 being substantially the same. Alternatively, the substrate 2 a is fixed to the frame 2 via
an adhesive or the like and screwed with a screw 10. Thereby, the substrate 2a is fixed to the
frame 2 by the screw 10 in a state in which the movement on the XY plane is suppressed.
[0069]
The terminal 2 b is a so-called electrode terminal which is a connection point from the outside,
and at least one or more are provided on the substrate 2 a. Further, the terminal 2 b is connected
to the piezoelectric element 5 by the lead wires 6 a and 6 b. In addition, although the case where
the two terminals 2b are provided in the board | substrate 2a is illustrated in FIG. 3C, the number
of objects of the terminals 2b per board 2a is not limited.
[0070]
Here, the terminal 2b is made of, for example, a metal material, and is provided on the substrate
2a via an adhesive. In addition, for example, the terminal 2b may be configured such that a
portion to be a connection point is a metal material and a portion in contact with the substrate 2a
is an insulator and provided on the substrate 2a via an adhesive or the like.
[0071]
In the substrate 2a, as shown in FIG. 3D, the screw 10a is inserted into the hole H2 of the frame
2 through the hole 2aa of the substrate 2a. Then, the screw 10a is screwed into the screw groove
H2a to screw the substrate 2a to the frame 2. Accordingly, the substrate 2a is fixed to the frame
2 by screwing the screw 10a into the screw groove H2a. In addition, the hole H2 may be
provided halfway to the Z direction of the frame 2 or may be provided penetrating the frame 2 in
the Z direction.
[0072]
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As described above, in the sound generator 1A according to the present embodiment, the
terminal 2b serving as the connection point from the outside to the lead wires 6a and 6b is
provided on the substrate 2a together with the effect of the substrate 2a fixed to the frame 2 by
the screw 10. The vibration wave propagating in the frame 2 around the terminal 2 b can be
disturbed by being provided in And thereby, by making the resonant frequencies partially nonuniform, the height of the peak P can be lowered and the peak width can be broadened.
[0073]
Therefore, by providing the terminal 2b on such a substrate 2a, the effects of the substrate 2a
and the terminal 2b fixed to the frame 2 by the screw 10 can be synergistically obtained. That is,
the peak P of the sound pressure at the resonance point can be dispersed more effectively, and a
good sound pressure frequency characteristic can be obtained.
[0074]
When an electrical signal is input to the terminal 2b, the temperature around the terminal 2b
partially rises, so thermal expansion occurs and the vibration wave tends to be disturbed.
Thereby, it is possible to disturb the reflected wave returning from the frame 2 to the vibrating
body 3a.
[0075]
And as a result, since the resonance frequency can be partially made uneven, the peak P of the
sound pressure at the resonance point can be dispersed, and the frequency characteristic of the
sound pressure can be flattened. That is, good sound pressure frequency characteristics can be
obtained.
[0076]
Further, the terminal 2b is provided on the substrate 2a on the main surface side of the frame 2
on which the sound generated by the sound generator 1 propagates, so that the vibration wave
induced by the sound signal causes the terminal 2b to vibrate. It will be easier.
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[0077]
Therefore, in the vicinity of the terminal 2b, the propagating vibration wave is likely to be
disturbed, and along with this, the resonance frequency can be partially unaligned.
That is, the peak P of the sound pressure at the resonance point can be varied to obtain good
frequency characteristics of the sound pressure.
[0078]
Furthermore, in the sound generator 1A according to the present embodiment, the hole H2 is
internally provided with a screw groove H2a screwed with the screw 10, and thus the substrate
2a is through the screw groove H2a of the hole H2. When screwed to the frame 2, the vibration
wave propagating on the surface of the frame 2 can be violently disturbed around the screw
groove H2a of the hole H2a. Therefore, it is more effective in partially unifying the resonance
frequencies. By this, the peak P of the sound pressure at the resonance point can be dispersed to
obtain a good sound pressure frequency characteristic.
[0079]
Also, the screw 10 is not limited to the screw 10a as shown in FIGS. 3C and 3D. The screw 10
may be, for example, a screw 10b as shown in FIG. 4 (a). The screw 10b includes a head 10b1
having a diameter larger than that of the screw portion 10b2. The head 10b1 has a square crosssectional shape in the axial direction of the screw.
[0080]
The screw 10 may be, for example, a screw 10c as shown in FIG. 4 (b). The screw 10c includes a
head portion 10c1 having a diameter larger than that of the screw portion 10c2. In addition, the
cross-sectional shape of the axial direction of a screw of the head 10 c 1 is semicircular. The
head 10b1 (10c 1) is not limited to a square or a semicircular cross section in the axial direction
of the screw. The substrate 2 a is screwed to the frame 2 using, for example, a wrench that
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conforms to the shape of the head of the screw 10.
[0081]
Also, the screw 10 may be, for example, a screw 10d as shown in FIG. 4 (c). The screw 10d has a
circular cross-sectional shape in a direction perpendicular to the axial direction, is tapered in the
axial direction, and has a head 10d1 having a diameter larger than that of the screw portion
10d2.
[0082]
As described above, in the screw 10b (10c), the diameter of the head 10b1 (10c1) is different
from that of the screw portion 10b2 (10c2), so that there is a difference in size in the axial
direction of the screw. As described above, the vibration wave and its reflected wave can be
further disturbed at the portion where the size is different, that is, the portion where the
diameter changes in the axial direction of the screw, and therefore, it is more effective in partially
making the resonance frequency uneven. It is The screw 10d also has the same effect, and is
more effective in partially unifying the resonance frequencies.
[0083]
Further, the screw 10 may have a different diameter between the screw head and the screw
portion, and for example, the outer shape of the head may be square or hexagonal in plan view.
In such a case, the substrate 2a is screwed to the frame 2 using, for example, a wrench that
conforms to the shape of the head.
[0084]
The screw 10 may have a notch 11 in the head 10b1 (10c1, 10d1) to turn and tighten the head
as shown in FIG. The cut 11 is formed in a groove shape or a hole shape.
[0085]
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20
For example, as shown in FIG. 5 (a), the screw 10 has a notch 11 having a cross shape 11a, and
in the case of screwing, for example, a Phillips screwdriver is used.
[0086]
Further, as shown in FIG. 5 (b), for example, the screw 10 may have a cut 11b of a one-letter
shape 11b, and in the case of screwing, for example, a minus driver is used.
[0087]
Furthermore, for example, as shown in FIG. 5 (c), the screw 10 may have a cross-shaped cut 11c
having a shape that is elongated on one side, and in the case of screwing, for example, plus or
minus Drivers are used.
[0088]
As described above, since the screw 10 has the cut 11 in the head 10b1 (10c1, 10d1), the part
where the cut 11 is provided and the cut 11 are provided in the head 10b (10c1, 10d1) Since the
vibration wave and its reflected wave can be further disturbed in the non-portion, it is more
effective in partially unifying the resonance frequencies.
[0089]
In addition, since the screw 10a described above can be provided with the notch 11 at the upper
portion, the same effect of partially unifying the resonance frequency can be achieved thereby.
[0090]
For example, the screw 10 may have the cut 11 in the shape of a hole such as a square hole or a
hexagonal hole in the head.
[0091]
Further, in FIG. 5, the shape of the head portion of the screw is circular in plan view, but the
shape is not limited to this, and may be rectangular or hexagonal in plan view.
[0092]
In the sound generator 1 according to the embodiment, similarly to the sound generator 1A, the
terminal 2b is provided on the substrate 2a, and the terminal 2b and the piezoelectric element 5
are connected by the lead wires 6a and 6b. Good.
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[0093]
As described above, the sound generators 1 and 1A according to the embodiment include an
exciter (piezoelectric element), a vibrator, and a frame.
The exciter vibrates when an electrical signal is input.
The vibrator is attached with the exciter and vibrates with the exciter due to the vibration of the
exciter.
The frame is provided on the outer peripheral portion of the vibrator and supports the vibrator in
a substantially flat manner.
The frame has a hole, and a substrate having a hole corresponding to the hole is fixed to the
main surface by a pin or a screw inserted into the hole and the hole.
[0094]
Next, with reference to FIGS. 7A to 7D, modifications of the substrate 2a or the pins 8 and the
screws 9 and 10 will be sequentially described.
7A to 7D are schematic plan views (No. 1) to (No. 4) showing modified examples of the substrate
2a or the pin 8 and the screws 9 and 10.
In the drawings shown below, for convenience of explanation, the pin 8 or the screws 9 and 10
will be described using the screw 10 as a generic name.
Even with the pin 8 and the screw 9, the same effect as the screw 10 can be obtained as
described in the following description.
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22
[0095]
First, as shown in FIG. 7A, the screw 10 may be provided so as not to be parallel to the side of the
frame 2 in a plan view.
Specifically, the line CL4 connecting the two screws 10 and the center line CL2 of the side of the
frame 2 are not parallel in plan view.
[0096]
In such a case, even if the frame 2 vibrates due to the vibration of the vibrating body 3a, the
resonance frequency shifts further in the region of the screw 10 because the screw 10 is not
parallel to the frame 2. Therefore, since the vibration wave of the frame 2 propagating around
the screw 10 can be further disturbed, the reflected wave from the frame 2 to the vibration body
3a can also be disturbed further.
[0097]
That is, the resonance frequency is partially made nonuniform, and the peak P of the sound
pressure at the resonance point can be dispersed to obtain good frequency characteristics of the
sound pressure.
[0098]
Next, as shown in FIG. 7B, the substrate 2a may be provided so as to protrude out of the frame of
the frame 2 or in the frame.
In such a case, even if the frame 2 vibrates due to the vibration of the vibrating body 3a, the
resonance frequency of the protruding portion of the substrate 2a shifts, so that the vibration
wave of the frame 2 propagating around the terminal 2b is further disturbed. be able to. As a
result, the reflected wave from the frame 2 to the vibrating body 3a can be further disturbed.
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[0099]
That is, the resonance frequency is partially made nonuniform, and the peak P of the sound
pressure at the resonance point can be dispersed to obtain good frequency characteristics of the
sound pressure.
[0100]
Moreover, as shown to FIG. 7C, the board | substrate 2a may be provided so that it may become
non-parallel with the edge | side of the frame 2 in planar view.
Specifically, the center line CL2 of the side of the frame 2 and the center line CL3 of the
substrate 2a are not parallel in plan view.
[0101]
In such a case, even if the frame 2 vibrates due to the vibration of the vibrating body 3a, the
resonant frequency shifts further in the region of the substrate 2a because the substrate 2a is not
parallel to the frame 2. Therefore, since the vibration wave of the frame 2 propagating around
the terminal 2 b can be further disturbed, the reflected wave from the frame 2 to the vibration
body 3 a can also be further disturbed.
[0102]
That is, the resonance frequency is partially made nonuniform, and the peak P of the sound
pressure at the resonance point can be dispersed to obtain good frequency characteristics of the
sound pressure.
[0103]
In addition, as a result of being non-parallel in this way, the shape of the composite vibrator can
be made to have asymmetry.
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That is, the symmetry of the reflected wave can be reduced and the resonance frequencies can be
partially misaligned.
[0104]
Further, as shown in FIG. 7D, the screw 10 is provided so as not to be parallel to the side of the
frame 2 in plan view, and the substrate 2a is not parallel to the side of the frame 2 in plan view
May be provided. Specifically, the line CL4 connecting the two screws 10 and the center line CL2
of the side of the frame 2 are not parallel in plan view, and the center line CL3 of the substrate
2a and the center line of the side of the frame 2 This is the case where CL2 is non-parallel in plan
view.
[0105]
In this case as well, for the same reason as in FIGS. 7A and 7C, the resonance frequencies are
partially not aligned, and the sound pressure peak P at the resonance point is dispersed to obtain
good sound pressure frequency characteristics. be able to.
[0106]
Next, a sound generator and an electronic device equipped with the sound generator 1 (1A)
according to the embodiment described above will be described with reference to FIGS. 6A and
6B.
FIG. 6A is a view showing the configuration of the sound generation device 20 according to the
embodiment, and FIG. 6B is a view showing the configuration of the electronic device 50
according to the embodiment. In both figures, only the components necessary for the description
are shown, and the description of general components is omitted.
[0107]
The sound generation device 20 is a sound generation device such as a so-called speaker, and as
shown in FIG. 6A, for example, includes a sound generator 1 (1A) and a housing 30
accommodating the sound generator 1 (1A). The housing 30 internally resonates the sound
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25
emitted from the sound generator 1 (1A), and radiates the sound to the outside from an opening
(not shown) formed in the housing 30. By including such a housing 30, sound pressure in, for
example, a low frequency band can be increased.
[0108]
In addition, the sound generator 1 (1A) can be mounted on various electronic devices 50. For
example, in FIG. 6B shown below, it is assumed that the electronic device 50 is a mobile terminal
device such as a mobile phone or a tablet terminal.
[0109]
As shown in FIG. 6B, the electronic device 50 includes the electronic circuit 60. The electronic
circuit 60 includes, for example, a controller 50a, a transmitting / receiving unit 50b, a key input
unit 50c, and a microphone input unit 50d. The electronic circuit 60 is connected to the sound
generator 1 (1A) and has a function of outputting an audio signal to the sound generator 1 (1A).
The sound generator 1 (1A) generates a sound based on the sound signal input from the
electronic circuit 60.
[0110]
The electronic device 50 further includes a display unit 50e, an antenna 50f, and the sound
generator 1 (1A). In addition, the electronic device 50 includes a housing 40 that accommodates
each of these devices.
[0111]
Although FIG. 6B shows a state in which all the devices including the controller 50a are housed
in one housing 40, the housing form of each device is not limited. In the present embodiment, at
least the electronic circuit 60 and the sound generator 1 (1A) may be accommodated in one case
40.
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[0112]
The controller 50 a is a control unit of the electronic device 50. The transmitting and receiving
unit 50b transmits and receives data via the antenna 50f based on the control of the controller
50a.
[0113]
The key input unit 50c is an input device of the electronic device 50, and receives a key input
operation by the operator. The microphone input unit 50d is also an input device of the
electronic device 50, and receives a voice input operation and the like by the operator.
[0114]
The display unit 50 e is a display output device of the electronic device 50, and outputs display
information based on the control of the controller 50 a.
[0115]
The sound generator 1 (1A) then operates as a sound output device in the electronic device 50.
The sound generator 1 is connected to the controller 50a of the electronic circuit 60, and emits a
sound in response to the application of a voltage controlled by the controller 50a.
[0116]
By the way, although the electronic device 50 was described as what is a portable terminal device
in FIG. 6B, it does not ask the type of the electronic device 50, and may be applied to various
consumer devices having a function of emitting sound. . For example, flat-screen TVs and car
audio devices may be used for various products such as vacuum cleaners, washing machines,
refrigerators, microwave ovens, etc. .
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27
[0117]
As described above, the sound generator according to the embodiment includes the exciter
(piezoelectric element), the vibrator, and the frame. The exciter vibrates when an electrical signal
is input. The vibrator is attached with the exciter and vibrates with the exciter due to the
vibration of the exciter. The frame is provided on the outer peripheral portion of the vibrator and
supports the vibrator in a substantially flat manner. The frame has a hole, and a substrate having
a hole corresponding to the hole is fixed to the main surface by a pin or a screw inserted into the
hole and the hole.
[0118]
Therefore, according to the sound generator which concerns on embodiment, the frequency
characteristic of a favorable sound pressure can be obtained.
[0119]
In the embodiment described above, the case where the resin layer is formed so as to cover the
piezoelectric element and the vibrator in the frame of the frame is described as an example, but
such a resin layer may not necessarily be formed.
[0120]
Further, in the embodiment described above, the diaphragm is made of a thin film such as a resin
film. However, the present invention is not limited to this. For example, the diaphragm may be
made of a plate-like member.
[0121]
In the above-described embodiment, although the case where the exciter is a piezoelectric
element has been described as an example, the exciter is not limited to a piezoelectric element,
and a function of vibrating by receiving an electric signal is described. What is possessed is good.
[0122]
For example, an electrodynamic exciter, an electrostatic exciter, or an electromagnetic exciter
well known as an exciter for vibrating a speaker may be used.
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[0123]
It is to be noted that the electrodynamic exciter is such that a current is supplied to the coil
disposed between the magnetic poles of the permanent magnet to vibrate the coil, and the
electrostatic exciter is formed of two facing metals The bias and the electrical signal are supplied
to the plate to cause the metal plate to vibrate, and the electromagnetic exciter is to cause the
electrical signal to flow to the coil to cause the thin iron plate to vibrate.
[0124]
Further effects and modifications can be easily derived by those skilled in the art.
Thus, the broader aspects of the invention are not limited to the specific details and
representative embodiments represented and described above.
Accordingly, various modifications may be made without departing from the spirit or scope of
the general inventive concept as defined by the appended claims and their equivalents.
[0125]
DESCRIPTION OF SYMBOLS 1, 1A, 1B Sound generator 2 Frame 2a Substrate 2aa Hole 2b
Terminal 3 Diaphragm 3a Vibrator 5 Exciter (piezoelectric element) 5a, 5b, 5c, 5d Piezoelectric
layer 5e Internal electrode layer 5f, 5g Surface electrode layer 5h, 5j External electrode 6a, 6b
Lead wire 7 resin layer 8 pin 9 screw (bolt, nut) 10 screw 11 cut 20 sound generator 30, 40 case
50 electronic equipment 50a controller 50b transceiver 50c key input 50d microphone input
Part 50e Display part 50f Antenna 60 Electronic circuit P Peak H1, H2 hole H2a thread groove
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