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JPWO2013175662

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DESCRIPTION JPWO2013175662
Abstract: An object of the present invention is to provide a speaker capable of suppressing
variation in voltage applied to an overlapping portion. The speaker 1 is disposed on the front and
back sides of the circuit portion 5, the dielectric layer 20 or 30 having insulating property and
made of elastomer or resin, and the dielectric layer 20 or 30, and has conductivity and is
electrically connected to the circuit portion 5. A pair of electrode layers 21, 22, 31, 32 having
connecting portions 210, 220, 310, 320 to be connected, a pair of electrode layers 21, 22, 31,
32 and dielectric layers 20, 30 viewed from the front or back side And a pair of front and back
vibration parts 2 and 3 having overlapping parts A and B, and the front side vibration part 2 on
the front side and the vibration part 3 on the back side on the back side. Resistance adjustment
units 70 to 73 that suppress variations in electrical resistance between the interposing member 4
disposed between the vibration units 2 and 3 of the second embodiment, the connection units
210, 220, 310, 320, and the overlapping units A and B. And.
スピーカー
[0001]
The present invention relates to an electrostatic speaker that vibrates a vibrating portion to
reproduce sound based on a change in electrostatic attraction.
[0002]
Patent Document 1 discloses a speaker device having a plurality of speakers.
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1
Each of the plurality of speakers is an electrodynamic speaker. The multiple speakers are just
point sound sources alone. However, a plurality of speakers are arranged in a line. For this
reason, according to the speaker device of the same reference, it is possible to create a linear
sound source in a pseudo manner.
[0003]
International Publication No. 2008/142867 pamphlet JP-A-2011-77663
[0004]
However, in the case of the speaker device described in the same document, it is necessary to
arrange a plurality of speakers having the same characteristic.
In addition, the circuit configuration is complicated because a plurality of speakers are provided.
In addition, it is necessary to set the directivity for each of the plurality of speakers. In addition, if
the distance between the adjacent speakers is not strictly managed, the sound field is unlikely to
be uniform in the listening area.
[0005]
In this regard, Patent Document 2 discloses an electrostatic speaker. The electrostatic speaker
includes a pair of electrode layers, a dielectric layer, and a circuit portion. The dielectric layer is
interposed between the pair of electrode layers. An overlapping portion is formed by overlapping
the pair of electrode layers and the dielectric layer. Each of the pair of electrode layers is
electrically connected to the circuit portion through a terminal. A signal wave (voltage) based on
the sound to be reproduced is applied to the overlapping portion through the pair of electrode
layers. The present inventor attempted to create a linear sound source by forming the abovedescribed electrostatic speaker into a line as in the speaker device of Patent Document 1.
[0006]
However, in this case, the electrode layer becomes elongated. A voltage is applied to the
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2
overlapping portion through the elongated electrode layer. Therefore, in the overlapping portion,
a portion where the distance from the terminal (that is, the circuit portion) is short and a portion
where the distance from the terminal is long occur. The electrode layer has an electrical
resistance (specific resistance). In the overlapping portion, in the portion where the distance from
the terminal is short, the loss of voltage due to the specific resistance of the electrode layer is
small. On the other hand, in the overlapping portion, in the portion where the distance from the
terminal is long, the loss of voltage due to the specific resistance of the electrode layer becomes
large. Therefore, the voltage varies across the overlapping portion.
[0007]
The speaker of the present invention is completed in view of the above-mentioned subject. An
object of the present invention is to provide a speaker capable of suppressing variation in voltage
applied to an overlapping portion.
[0008]
(1) In order to solve the above problems, the speaker of the present invention has a circuit
portion, an insulating dielectric or elastomer dielectric or resin dielectric layer, and conductive
layers disposed on both sides of the dielectric layer. A pair of front and back vibration having a
pair of electrode layers having a connection portion electrically connected to the circuit portion
and an overlapping portion formed by overlapping the pair of electrode layers and the dielectric
layer when viewed from the front side or the back side. An interposed member disposed between
the pair of the vibrating portions so that the vibrating portion on the front side and the vibrating
portion on the front side protrude on the front side and the vibrating portion on the back side
protrude on the back side; And a circuit that transmits signal waves based on voice to the pair of
vibration units so as to be in opposite phases with each other, and The sound is reproduced by
driving the vibration unit.
[0009]
Here, "made of elastomer or resin" means that the substrate of the dielectric layer is made of
elastomer or resin.
That is, the dielectric layer may contain, in addition to the elastomer or resin, other components
such as additives. "Elastomer" also includes rubber and thermoplastic elastomers.
04-05-2019
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[0010]
The speaker of the present invention is an electrostatic speaker. When voice to be reproduced is
input, the voltage between a pair of electrode layers arranged on both sides of the dielectric layer
changes. For this reason, the electrostatic attraction between the pair of electrode layers changes.
Therefore, the dielectric layer expands and contracts in the front and back direction. When the
dielectric layer expands in the front and back direction, the dielectric layer contracts in the
planar direction (direction intersecting with the front and back direction). On the contrary, when
the dielectric layer contracts in the front and back direction, the dielectric layer extends in the
surface direction. The speaker according to the present invention vibrates the vibration unit to
reproduce sound by utilizing the deformation of the dielectric layer.
[0011]
A speaker according to the present invention includes a circuit unit, a pair of vibration units, an
interposed member, and a resistance adjustment unit. The interposing member is interposed
between the pair of vibrators. The circuit unit transmits signal waves based on speech to the pair
of vibration units so as to be in opposite phase to each other. For this reason, a pair of vibration
parts operate in mutually opposite directions. For example, when the vibrating portion on the
back side contracts in the surface direction, the vibrating portion on the front side extends in the
surface direction. On the other hand, when the vibrating portion on the front side contracts in the
surface direction, the vibrating portion on the back side extends in the surface direction.
[0012]
According to the speaker of the present invention, it is possible to transmit the load between the
pair of vibrating parts via the interposed member. For this reason, the vibration in the front and
back direction of the pair of vibration parts can be increased. Therefore, the amplitude of the pair
of vibration parts can be increased. Therefore, even when the applied voltage to the pair of
vibrating portions is small, the low frequency characteristics of the speaker can be improved. For
example, the sound pressure in the low frequency region can be improved. In addition, the
reproducible frequency range can be extended to the low frequency side. Moreover, the speaker
of the present invention can be miniaturized despite its high low frequency characteristics.
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[0013]
Moreover, the speaker of the present invention is provided with a resistance adjustment unit. The
resistance adjustment unit can suppress variation in electrical resistance between the connection
portion and the overlapping portion. For this reason, the variation in the voltage applied to the
overlapping portion can be suppressed.
[0014]
(1-1) Preferably, in the configuration of (1), the resistance adjusting unit is a shortest path in
which a distance between the connecting portion and the overlapping portion is shortest, the
connecting portion, and the overlapping portion. It is better to reduce the difference in electrical
resistance between the longest path where the distance between the two is the longest.
[0015]
The longest path has a large electrical resistance.
For this reason, in the overlapping portion, a portion connected to the longest path has a large
voltage loss. On the other hand, the shortest path has a small electrical resistance. For this
reason, in the overlapping portion, in the portion connected to the shortest path, the loss of
voltage decreases. According to this configuration, it is possible to suppress the variation of the
voltage applied to the overlapping portion.
[0016]
(2) Preferably, in the configuration of the above (1), the resistance adjusting portion is a
conductive portion disposed between the connection portion of the electrode layer and the
overlapping portion and having a smaller electric resistance than the electrode layer. It is better
to have a certain configuration.
[0017]
According to this configuration, the difference in the electrical resistance between the electrode
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5
layer and the conductive portion can be used to suppress the variation in the electrical resistance
between the connection portion and the overlapping portion.
For this reason, the variation in the voltage applied to the overlapping portion can be suppressed.
[0018]
(3) Preferably, in the configuration of (2), the conductive portion extends along at least a part of
the outer edge of the overlapping portion as viewed from the front side or the back side.
According to this configuration, it is possible to suppress the variation in the electrical resistance
in the extending direction of the outer edge.
[0019]
(4) Preferably, in the configuration of the above (1), the resistance adjustment portion is disposed
between the connection portion of the electrode layer and the overlapping portion, and the
thickness adjustment with uneven thickness in the front and back direction It is better to have a
configuration that is a part.
[0020]
Among the electrode layers, the cross-sectional area of the conduction path is small in the
portion where the thickness in the front and back direction is small.
Therefore, the electrical resistance is large. On the other hand, in the portion where the thickness
in the front and back direction is large, the cross sectional area of the conduction path is large.
Therefore, the electrical resistance is small. According to this configuration, it is possible to
suppress the variation in the voltage applied to the overlapping portion by using the difference in
the electrical resistance.
[0021]
(4-1) Preferably, in the configuration of the above (4), the thickness adjusting portion includes a
thin layer portion and a thick layer portion having a thickness in the front and back direction
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greater than that of the thin layer portion. The thin layer portion is disposed at a position
through which the shortest path in which the distance between the connection portion and the
overlapping portion is the shortest passes, and the thick layer portion is a distance between the
connection portion and the overlapping portion It is better to arrange in the position where the
longest route which becomes the longest passes.
[0022]
According to this configuration, the shortest path inherently having a small electric resistance
passes through the thin layer portion having a large electric resistance.
On the other hand, the longest path inherently having a large electric resistance passes through
the thick layer portion having a small electric resistance. For this reason, the variation in the
voltage applied to the overlapping portion can be suppressed.
[0023]
(5) Preferably, in the configuration of any of the above (1) to (4), the overlapping portion
preferably has a rectangular shape when viewed from the front side or the back side. According
to this configuration, it is possible to form a line sound source along the long side direction of the
overlapping portion. For this reason, it is easy to set a uniform sound field along the long side
direction.
[0024]
(6) Preferably, in any one of the configurations (1) to (5), the spring constant of the interposing
member in the front and back direction is larger than the spring constant of the interposing
member in the plane direction. It is better.
[0025]
According to this configuration, the interposing member does not easily expand and contract in
the front and back direction.
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For this reason, the transmission loss of the load between a pair of vibration parts can be made
small. Moreover, according to this configuration, the interposing member is easily deformed in
the surface direction. For this reason, the interposed member can easily expand and contract
following the expansion and contraction in the surface direction of the vibrating portion.
[0026]
(7) Preferably, in the configuration according to any one of the above (1) to (6), the vibrating
portion is disposed on a front side and a back side of the electrode layer on the front side and a
back side of the electrode layer. It is preferable that the pair of shield layers have an insulating
property and be made of an elastomer. According to this configuration, it is easy to ensure the
insulation of the vibrating portion.
[0027]
(8) Preferably, in the configuration of the above (7), the vibrating portion is directed from the
front side to the back side, the shield layer on the front side, the electrode layer on the front side,
the dielectric layer, and the electrode layer on the back side. It is better to be a film assembly in
which the above-mentioned and the above-mentioned shield layer on the back side are laminated.
According to this configuration, the front side shield layer, the front side electrode layer, the
dielectric layer, the rear side electrode layer, and the rear side shield layer are integrated. For this
reason, the assembly work of the speaker is easy.
[0028]
(9) Preferably, in the configuration of (8), a pair of front and back frame members disposed on
the front and back sides of the film assembly on the front side and the back side of the front side
film assembly is provided. Preferably, the film assembly and the film assembly on the back side
are held and fixed from the front and back direction.
[0029]
Each of the pair of film assemblies has a fixed portion (a portion fixed to the pair of frame
members) and an inner portion of the frame (a portion disposed in the frames of the pair of
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frame members).
According to this configuration, the hinge fulcrum (fulcrum when the portion in the frame
vibrates) can be disposed at the boundary between the fixed portion and the portion in the frame.
[0030]
(9-1) Preferably, in the configuration of the above (9), the pair of film assemblies are respectively
disposed in the fixing portions fixed to the pair of frame members and the frames of the pair of
frame members. A hinge fulcrum is disposed at the boundary between the fixed portion and the
portion in the frame, and the interposing member is disposed in the frame of the pair of frame
members. Preferably, an edge member having a rigidity higher than that of the interposed
member is disposed between the hinge fulcrum and the interposed member. According to this
configuration, the film assembly can be vibrated largely on the basis of the hinge fulcrum. Thus,
the amplitude of the pair of film assemblies can be increased.
[0031]
(10) Preferably, in the configuration of the above (9), the pair of frame members preferably have
a pair of opposing sides facing each other in the surface direction. According to this
configuration, the film assembly can be vibrated largely on the basis of the hinge fulcrum. Thus,
the amplitude of the pair of film assemblies can be increased.
[0032]
(11) Preferably, in the configuration according to any one of the above (1) to (10), of the pair of
electrode layers of the vibrating portion on the front side, the electrode layer on the front side is
the first electrode layer, and the electrode on the back side. The second electrode layer, the third
electrode layer on the front side of the pair of the electrode layers of the vibrating portion on the
back side, the fourth electrode layer on the back side, the first electrode layer and the first
electrode layer The circuit portion includes a pair of a fourth electrode layer as an outer
electrode pair, a pair of the second electrode layer and the third electrode layer as an inner
electrode pair, and the circuit portion includes one of the outer electrode pair and the inner
04-05-2019
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electrode pair. A bias voltage having the same polarity as each other and the signal waves having
phases opposite to each other are superimposed and applied, and the other of the outer electrode
pair and the inner electrode pair is grounded. It is better. According to this configuration, it is
possible to easily operate the pair of vibrators in the opposite direction.
[0033]
(12) Preferably, in any one of the configurations (1) to (10), in any of the vibrating portions, the
dielectric layer of N (N is an integer of 2 or more) layer and the electrode layer of N + 1 layer And
are alternately stacked in the front and back direction, and the electrode layer includes an
elastomer and a conductive material, and among the electrode layers of the N + 1 layer, the
electrode layers of odd numbered from the front side The odd-numbered electrode layer and the
even-numbered electrode layers counted from the front side are the even-numbered electrode
layers, and the connection portion of the odd-numbered electrode layer and the connection
portion of the even electrode layer are viewed from the front side or the back side The
connecting portion is divided and disposed on both sides of the overlapping portion, and the
connection portion also serves as the resistance adjusting portion, and the dielectric layer is a
pair of electrode layer insertion holes on both sides of the overlapping portion when viewed from
the front side or the back side. And the connection portions of the odd-numbered electrode layers
are a pair of the electrode layer insertion holes The connection portions of the even-numbered
electrode layers are connected to each other through the other electrode layer insertion hole of
the pair of electrode layer insertion holes. It is better to have a connected configuration.
[0034]
The electrode layers (odd electrode layers, even electrode layers) contain an elastomer.
For this reason, the electrode layer is flexible. When assembling the vibrating portion, a
compressive load is applied to the vibrating portion from the front and back direction. By the
compression load, the connection portion of the electrode layer is elastically deformed and enters
the adjacent electrode layer insertion hole. The connection parts of the odd-numbered electrode
layers are connected to each other by utilizing the elastic deformation of the connection parts.
And the connection parts of the even-numbered electrode layer are connected using the elastic
deformation of the said connection part.
[0035]
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10
According to this configuration, it is not necessary to separately arrange a member such as a wire
in order to connect the connection parts of the odd-numbered electrode layers. Similarly, in order
to connect the connection parts of the even-numbered electrode layers, it is not necessary to
arrange a member such as a wiring separately. This reduces the number of parts of the speaker.
Also, the structure of the speaker is simplified.
[0036]
According to the present invention, it is possible to provide a speaker capable of suppressing
variation in voltage applied to the overlapping portion.
[0037]
FIG. 1 is a perspective view of the speaker according to the first embodiment.
FIG. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is an exploded perspective view
of the same speaker. FIG. 4 is an enlarged view of an upper portion (a front side frame member, a
film assembly, a front side insulating member) of FIG. 3. FIG. 5 is an enlarged view of the lower
portion (back side insulating member, film assembly, back side frame member) of FIG. 3. FIG. 6 is
a perspective view of the front side frame member of the same speaker. FIG. 7 is a perspective
view of the back side insulating member of the same speaker. FIG. 8 is an exploded perspective
view of a film assembly in front of the same speaker. FIG. 9 is an exploded perspective view of a
film assembly at the rear of the speaker. FIG. 10 is a transparent front view of the front and back
electrode layers of the front film assembly of the same speaker. FIG. 11 is a transparent front
view of the front and back electrode layers of the film assembly behind the same speaker. FIG. 12
is an operation explanatory view of the same speaker. FIG. 13 is a perspective view of the
speaker according to the second embodiment. FIG. 14 is a cross-sectional view in the XIV-XIV
direction of FIG. FIG. 15 is an exploded perspective view of the same speaker. FIG. 16 is an
enlarged view of the front side frame member of FIG. 15 and the front film assembly. FIG. 17 is
an enlarged view of the intermediate insulating member and the interposed member of FIG. FIG.
18 is an enlarged view of the rear film assembly and the rear side frame member of FIG. 15; FIG.
19 is an exploded perspective view of a film assembly in front of the same speaker. FIG. 20 is an
exploded perspective view of a film assembly at the rear of the speaker. FIG. 21 is a transparent
front view of the odd-numbered electrode layer, the dielectric layer, and the even-numbered
electrode layer of the film assembly in front of the same speaker. FIG. 22 is a transparent front
view of the odd-numbered electrode layer, the dielectric layer, and the even-numbered electrode
layer of the film assembly behind the same speaker. FIG. 23 (a) is a transparent front view of the
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front and back electrode layers of the film assembly in front of the speaker of another
embodiment (part 1). FIG. 23 (b) is a transparent front view of the front and back electrode layers
of the front film assembly of the speaker according to another embodiment (part 2). FIG.23 (c) is
a permeation | transmission front view of front side electrode layer and back side electrode layer
of the film assembly front of the speaker of other embodiment (the 3). FIG. 24 (a) is a transparent
front view of the front side electrode layer and the rear side electrode layer of the film assembly
in front of the speaker according to another embodiment (part 4). FIG. 24 (b) is a cross-sectional
view in the direction of XIV (b) -XIV (b) of (a).
FIG. 25 is a front-rear direction cross-sectional view of a speaker according to another
embodiment (part 5).
[0038]
1:スピーカー。 2: Film assembly, 20: dielectric layer, 201: conductive portion insertion hole,
202 LD: terminal insertion hole, 202 LU: terminal insertion hole, 202 RD: terminal insertion hole,
202 RU: terminal insertion hole, 205 L: electrode layer insertion hole, 205 R: Electrode layer
insertion hole, 21: front side electrode layer (first electrode layer), 210: connection portion, 211:
main body portion, 22: back side electrode layer (second electrode layer), 220: connection
portion, 221: main body portion, 23 Front side shield layer (shield layer) 230: conductive portion
insertion hole 231: conductive portion insertion hole 232 LD: terminal insertion hole 232 LU:
terminal insertion hole 232 RD: terminal insertion hole 232 RU: terminal insertion hole 235 L:
pressing Part insertion hole, 235R: Press part insertion hole, 24: Back side shield layer (shield
layer), 242LD: Terminal insertion hole, 242LU: Terminal insertion hole, 242RD: Terminal
insertion hole, 2 2RU: terminal insertion hole, 25: odd electrode layer, 250: connection portion,
251: main body, 26: Even electrode layer, 260: connection portion, 261: main body portion. 3:
film assembly, 30: dielectric layer, 301: conductive portion insertion hole, 302 LD: terminal
insertion hole, 302 LU: terminal insertion hole, 302 RD: terminal insertion hole, 302 RU: terminal
insertion hole, 305 L: electrode layer insertion hole, 305 R: Electrode layer insertion hole, 31:
front side electrode layer (third electrode layer), 310: connection portion, 311: main body
portion, 32: rear side electrode layer (fourth electrode layer), 320: connection portion, 321: main
body portion, 33 Front side shield layer (shield layer) 330: conductive portion insertion hole 331:
conductive portion insertion hole 332 LD: terminal insertion hole 332 LU: terminal insertion hole
332 RD: terminal insertion hole 332 RU: terminal insertion hole 34: back side Shield layer (shield
layer), 342LD: terminal insertion hole, 342LU: terminal insertion hole, 342RD: terminal insertion
hole, 342RU: terminal insertion hole, 345L: pressing portion insertion hole, 3 5R: pressing
portion insertion hole, 35: odd electrode layer, 350: connection portion, 351: main body, 36:
Even electrode layer, 360: connection portion, 361: main body portion. 4: Interposition member,
04-05-2019
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41: Edge member. 5: Circuit part, 50a: AC power supply, 50b: AC power supply, 51: DC bias
power supply, 53: switch. 60: front side frame member (frame member), 60D: opposite side, 60L:
opposite side, 60R: opposite side, 60U: opposite side, 61: back side frame member (frame
member), 61D: opposite side, 61L: opposite side, 61R: opposing side, 61U: opposing side, 62:
front side insulating member, 63: back side insulating member, 64: intermediate insulating
member. 70: Conductive portion for front side electrode layer (conductive portion) 700:
Connection portion, 701: Connection portion, 702: Wiring portion, 71: Conductive portion for
back side electrode layer (conductive portion) 710: Connection portion, 712: Wiring portion , 72:
conductive portion for front side electrode layer (conductive portion), 720: connection portion,
722: wiring portion, 73: conductive portion for back side electrode layer (conductive portion),
730: connection portion, 732: wiring portion, 75: thickness Size adjustment part, 76: thickness
adjustment part, 760: thin layer part, 761: thick layer part, 762: middle thin layer part, 763:
middle thick layer part.
80 LD: negative electrode second terminal, 80 LU: negative electrode first terminal, 80 RD:
positive electrode second terminal, 80 RU: positive electrode first terminal, 81: terminal nut, 86:
screw, 87: nut. 90: even electrode layer pressing part 91: odd electrode layer pressing part 92:
even electrode layer pressing part 93: odd electrode layer pressing part 94: negative electrode
connecting part 900: terminal connecting part 902 Reference numeral 910: terminal connection
section 912: wiring section 920: terminal connection section 922: wiring section 930: terminal
connection section 932: wiring section 940: terminal connection section 941: terminal
connection section 942 : Wiring part. A: Overlap part, B: Overlap part, C1: shortest path, C2:
longest path, H: hinge fulcrum, P1: fixed part, P2: in-frame part, Vb: bias voltage.
[0039]
Hereinafter, embodiments of the speaker of the present invention will be described.
[0040]
<< First Embodiment >> <Overall Configuration of Speaker> First, the overall configuration of the
speaker of the present embodiment will be described.
In the drawings shown below, the front corresponds to the "front side" of the present invention,
and the rear corresponds to the "back side" of the present invention. FIG. 1 shows a perspective
view of the speaker of the present embodiment. FIG. 2 shows a cross-sectional view taken along
the line II-II in FIG. FIG. 3 shows an exploded perspective view of the same speaker. FIG. 4 shows
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an enlarged view of the upper part (front side frame member, film assembly, front side insulating
member) of FIG. FIG. 5 shows an enlarged view of the lower part (back side insulation member,
film assembly, back side frame member) of FIG. 3.
[0041]
As shown in FIGS. 1 to 5, the speaker 1 according to this embodiment includes the front film
assembly 2, the rear film assembly 3, the interposing member 4, the circuit unit 5, the front side
frame member 60, and the back side. Frame member 61, front side insulating member 62, back
side insulating member 63, front side electrode layer conductive portion 70, back side electrode
layer conductive portion 71, front side electrode layer conductive portion 72, back side electrode
layer conductive portion 73, negative electrode first terminal 80LU, negative electrode second
terminal 80LD, positive electrode first terminal 80RU, positive electrode second terminal 80RD,
four terminal nuts 81, fourteen screws 86, fourteen And a nut 87.
[0042]
The front side frame member 60 and the back side frame member 61 are respectively included
in the concept of the “frame member” in the present invention.
The front side electrode layer conductive portion 70, the back side electrode layer conductive
portion 71, the front side electrode layer conductive portion 72, and the back side electrode layer
conductive portion 73 are included in the concept of the “conductive portion” in the present
invention.
[0043]
[Front Side Frame Member 60, Front Side Electrode Layer Conductive Portion 70, Back Side
Electrode Layer Conductive Portion 71] FIG. 6 is a perspective view of the front side frame
member of the speaker according to the present embodiment. As shown in FIG. 6, the front side
frame member 60 is made of resin and has a rectangular frame shape which is long in the
vertical direction. The front side frame member 60 includes opposing sides 60L, 60R, 60U, and
60D. The opposite sides 60L, 60R, 60U, and 60D each have a linear shape. The opposite side 60L
and the opposite side 60R are opposite in the left-right direction. The opposing side 60U and the
opposing side 60D oppose each other in the vertical direction.
04-05-2019
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[0044]
As shown by hatching in FIG. 6, the front side electrode layer conductive portion 70 and the back
side electrode layer conductive portion 71 are each made of copper, and are disposed on the rear
surface (rear surface) of the front side frame member 60. The front-side electrode layer
conductive unit 70 includes connection portions 700 and 701 and a wiring portion 702. The
connection portion 700 is disposed at the upper left corner of the front side frame member 60.
The connection part 700 is electrically connected to the negative electrode 1st terminal 80LU
mentioned later. The connection portion 701 is disposed at the lower left corner of the front side
frame member 60. The connection portion 701 is electrically connected to a negative electrode
second terminal 80LD described later. The wiring portion 702 connects the connection portion
700 and the connection portion 701. That is, the wiring portion 702 extends in the vertical
direction along the left side of the front side frame member 60.
[0045]
The back electrode layer conductive portion 71 includes a connection portion 710 and a wiring
portion 712. The connection portion 710 is disposed at the upper right corner of the front side
frame member 60. Connection portion 710 is electrically connected to positive electrode first
terminal 80 RU described later. The wiring portion 712 extends downward along the right side of
the front side frame member 60 starting from the connection portion 710. The back side
electrode layer conductive portion 71 is thicker than the front side electrode layer conductive
portion 70 in the front-rear direction thickness (front and back direction thickness).
[0046]
[Film Assembly 2, Front Side Insulating Member 62] As shown in FIGS. 1 to 4, the front film
assembly 2 is in the form of a rectangular film elongated in the vertical direction. The film
assembly 2 is disposed rearward of the front side frame member 60. The interposition member 4
causes the film assembly 2 to project forward. That is, as shown emphatically in FIG. 2, the film
assembly 2 has a convex shape that bulges forward.
[0047]
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The front side insulating member 62 is made of PET (polyethylene terephthalate), and has a
rectangular frame shape long in the vertical direction. The front insulating member 62 is
disposed at the rear of the film assembly 2.
[0048]
[Back Side Insulating Member 63, Conducting Portion 72 for Front Side Electrode Layer, and
Conducting Portion 73 for Back Side Electrode Layer] FIG. 7 is a perspective view of the back
side insulating member of the speaker of this embodiment. As shown in FIG. 7, the back side
insulating member 63 is made of PET, and has a rectangular frame shape long in the vertical
direction. The back side insulating member 63 is disposed behind the front side insulating
member 62.
[0049]
As shown by hatching in FIG. 7, the front side electrode layer conductive portion 72 and the back
side electrode layer conductive portion 73 are each made of copper, and are disposed on the
back surface (back surface) of the back side insulating member 63. The front electrode layer
conductive portion 72 includes a connection portion 720 and a wiring portion 722. The
connection portion 720 is disposed at the lower right corner of the back side insulating member
63. The connection part 720 is electrically connected to the positive electrode second terminal
80RD described later. The wiring portion 722 extends upward along the right side of the back
side insulating member 63 from the connection portion 720 as a starting point. The back
electrode layer conductive portion 73 includes a connection portion 730 and a wiring portion
732. The connection portion 730 is disposed at the lower left corner of the back side insulating
member 63. The connection part 730 is electrically connected to the negative electrode second
terminal 80LD described later. The wiring portion 732 extends upward along the left side of the
back side insulating member 63 starting from the connection portion 730. The back side
electrode layer conductive portion 73 is thicker than the front side electrode layer conductive
portion 72 in the front-rear direction thickness (front and back direction thickness).
[0050]
[Intermediate Member 4, Film Assembly 3, Back Frame Member 61] The intermediate member 4
04-05-2019
16
is made of urethane foam and has a rectangular plate shape. Interposition member 4 is disposed
at the rear of film assembly 2. Further, the interposing member 4 is disposed in the frame of the
front side insulating member 62 and the back side insulating member 63. The interposing
member 4 is disposed in a state of being compressed from the front-rear direction. Therefore, the
interposing member 4 elastically presses the film assembly 2 forward and the film assembly 3
backward.
[0051]
As shown in FIGS. 1 to 3 and 5, the rear film assembly 3 has a rectangular film shape that is long
in the vertical direction. The film assembly 3 is disposed behind the back side insulating member
63 and the interposing member 4. The interposition member 4 causes the film assembly 3 to
project rearward. That is, as shown emphatically in FIG. 2, the film assembly 3 has a convex
shape that bulges backward.
[0052]
The configuration of the back side frame member 61 is similar to the configuration of the front
side frame member 60. That is, the back side frame member 61 includes the opposite sides 61L,
61R, 61U, and 61D. The rear side frame member 61 is disposed at the rear of the film assembly
3.
[0053]
Thus, in the speaker 1, as shown in FIG. 3, the front side frame member 60, the film assembly 2,
the front side insulating member 62, the back side insulating member 63, the film assembly 3,
the back side frame member 61 Are arranged in this order. Further, as shown in FIG. 2, the
interposing member 4 is disposed in the frame of the front side insulating member 62 and the
back side insulating member 63. Further, the front side electrode layer conductive portion 70
and the back side electrode layer conductive portion 71 are embedded in the film assembly 2.
The front-side electrode layer conductive portion 72 and the back-side electrode layer conductive
portion 73 are embedded in the film assembly 3. Hereinafter, these members are collectively
referred to as "laminate".
04-05-2019
17
[0054]
[Screw 86, Nut 87, Negative Electrode First Terminal 80LU, Negative Electrode Second Terminal
80 LD, Positive Electrode First Terminal 80 RU, Positive Electrode Second Terminal 80 RD,
Terminal Nut 81] As shown in FIGS. The screws 86 are disposed along the four sides of the
laminate. Fourteen screws 86 penetrate the laminate in the front-rear direction. Nuts 87 are fixed
to the rear ends of the fourteen screws 86, respectively. The laminated body is integrated by
fourteen screws 86 and fourteen nuts 87.
[0055]
As shown in FIGS. 1 to 5, the negative electrode first terminal 80LU is made of metal and has a
screw shape. Negative electrode first terminal 80LU is disposed at the upper left corner of the
stack. Negative electrode first terminal 80LU penetrates the laminate in the front-rear direction.
A terminal nut 81 is fixed to the rear end of the negative electrode first terminal 80LU.
[0056]
The configuration and arrangement method of the negative electrode second terminal 80LD, the
positive electrode first terminal 80RU, and the positive electrode second terminal 80RD are the
same as those of the negative electrode first terminal 80LU. The negative electrode second
terminal 80LD is disposed at the lower left corner of the laminate. Positive electrode first
terminal 80 RU is disposed in the upper right corner of the laminate. The positive electrode
second terminal 80RD is disposed at the lower right corner of the laminate.
[0057]
When viewed from the front or the rear, the four sides of the film assemblies 2 and 3 are held
and fixed from the front and rear direction by the front side frame member 60 and the rear side
frame member 61. Further, when viewed from the front or the rear, the interposing member 4 is
accommodated in the frames of the front side frame member 60 and the rear side frame member
61.
04-05-2019
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[0058]
<Detailed Configuration of Film Assembly 2> Next, the detailed configuration of the front film
assembly 2 of the speaker 1 of the present embodiment will be described. FIG. 8 shows an
exploded perspective view of the front film assembly of the speaker of this embodiment. As
shown in FIG. 8, the film assembly 2 includes a dielectric layer 20, a front side electrode layer 21,
a back side electrode layer 22, a front side shield layer 23, and a back side shield layer 24.
[0059]
The front side electrode layer 21 is included in the concept of the "first electrode layer" in the
present invention. The back side electrode layer 22 is included in the concept of the "second
electrode layer" of the present invention. The front side shield layer 23 and the back side shield
layer 24 are each included in the concept of the "shield layer" of the present invention.
[0060]
Each of these layers is in the form of a rectangular film elongated in the vertical direction. These
layers are laminated in order of front side shield layer 23, front side electrode layer 21, dielectric
layer 20, back side electrode layer 22, and back side shield layer 24 from the front to the back.
[0061]
Front Side Shield Layer 23 The front side shield layer 23 is made of H-NBR (hydrogenated nitrile
rubber). In the front side shield layer 23, conductive portion insertion holes 230, 231 and
terminal insertion holes 232LD, 232RD are bored. The conductive portion insertion hole 230
extends in the vertical direction along the left side of the front shield layer 23. The conductive
portion 70 for the front side electrode layer shown in FIG. 6 is inserted into the conductive
portion insertion hole 230. The conductive portion insertion holes 231 extend in the vertical
direction along the right side of the front shield layer 23. The conductive portion 71 for the back
electrode layer shown in FIG. 6 is inserted into the conductive portion insertion hole 231. The
terminal insertion hole 232LD is disposed at the lower left corner of the front shield layer 23.
The negative electrode second terminal 80LD is inserted into the terminal insertion hole 232LD.
The terminal insertion hole 232RD is disposed at the lower right corner of the front shield layer
04-05-2019
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23. The positive electrode second terminal 80RD is inserted into the terminal insertion hole
232RD.
[0062]
[Front Side Electrode Layer 21] The front side electrode layer 21 is made of an electrode material
in which carbon powder is filled in acrylic rubber. The front side electrode layer 21 is formed by
applying a paint containing an electrode material to the dielectric layer 20 (for example, screen
printing). The front side electrode layer 21 has a larger electric resistance than the front side
electrode layer conductive portion 70 shown in FIG. In FIG. 8, the sizes of the front side shield
layer 23, the dielectric layer 20, and the rear side shield layer 24 are indicated by alternate long
and short dashed lines. As shown in FIG. 8, the front side electrode layer 21 is smaller than the
front side shield layer 23, the dielectric layer 20, and the rear side shield layer 24.
[0063]
The front electrode layer 21 includes a connection portion 210 and a main body portion 211.
The main body portion 211 has a rectangular shape. The connection unit 210 is connected to the
upper left corner of the main body unit 211. The connection part 210 is electrically connected to
the negative electrode first terminal 80LU. The upper side, the lower side, and the right side of
the front side electrode layer 21 are not held and fixed in the front-rear direction by the front
side frame member 60 and the rear side frame member 61 shown in FIG. The left side of the
front side electrode layer 21 (the left side of the connection portion 210 and the main body
portion 211) is held and fixed in the front-rear direction by the front side frame member 60 and
the rear side frame member 61 shown in FIG.
[0064]
The front-side electrode layer conductive portion 70 shown in FIG. 6 penetrates the conductive
portion insertion hole 230 of the front-side shield layer 23 shown in FIG. 8 and abuts on the
front surface of the left side of the front-side electrode layer 21. The back side electrode layer
conductive portion 71 shown in FIG. 6 penetrates the conductive portion insertion hole 231 of
the front side shield layer 23 shown in FIG. 8 and passes through the right side of the right side
of the front side electrode layer 21. That is, the back side electrode layer conductive portion 71 is
not in contact with the front side electrode layer 21. Further, the negative electrode second
04-05-2019
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terminal 80 LD, the positive electrode first terminal 80 RU, and the positive electrode second
terminal 80 RD are not in contact with the front side electrode layer 21.
[0065]
[Dielectric Layer 20] The dielectric layer 20 is made of H-NBR. In the dielectric layer 20, a
conductive portion insertion hole 201 and terminal insertion holes 202LU, 202LD, 202RD are
bored. The conductive portion insertion hole 201 extends in the vertical direction along the right
side of the dielectric layer 20. The conductive part 71 for back side electrode layer shown in FIG.
6 is inserted into the conductive part insertion hole 201. The terminal insertion hole 202LU is
disposed at the upper left corner of the dielectric layer 20. The negative electrode first terminal
80LU is inserted into the terminal insertion hole 202LU. The terminal insertion hole 202LD is
disposed at the lower left corner of the dielectric layer 20. The negative electrode second
terminal 80LD is inserted into the terminal insertion hole 202LD. The terminal insertion hole
202RD is disposed at the lower right corner of the dielectric layer 20. The positive electrode
second terminal 80RD is inserted into the terminal insertion hole 202RD.
[0066]
[Back Side Electrode Layer 22] The back side electrode layer 22 is made of an electrode material
in which carbon powder is filled in acrylic rubber. The back side electrode layer 22 is formed by
applying a paint containing an electrode material to the dielectric layer 20 (for example, screen
printing). The back side electrode layer 22 has larger electrical resistance than the back side
electrode layer conductive portion 71 shown in FIG. As shown in FIG. 8, the back side electrode
layer 22 is smaller than the front side shield layer 23, the dielectric layer 20, and the back side
shield layer 24.
[0067]
The back side electrode layer 22 includes a connection portion 220 and a main body portion
221. The main body portion 221 has a rectangular shape. The connection portion 220 is
connected to the upper right corner of the main body portion 221. Connection portion 220 is
electrically connected to positive electrode first terminal 80 RU. The upper side, the lower side,
and the left side of the back side electrode layer 22 are not held and fixed in the front-rear
direction by the front side frame member 60 and the back side frame member 61 shown in FIG.
04-05-2019
21
The right side of the back side electrode layer 22 (the right side of the connection portion 220
and the right side of the main body portion 221) is held and fixed from the front and rear
direction by the front side frame member 60 and the back side frame member 61 shown in FIG.
[0068]
The conductive part 71 for the back side electrode layer shown in FIG. 6 penetrates the
conductive part insertion hole 231 of the front side shield layer 23 and the conductive part
insertion hole 201 of the dielectric layer 20 shown in FIG. In contact with The negative electrode
first terminal 80LU, the negative electrode second terminal 80LD, and the positive electrode
second terminal 80RD are not in contact with the back side electrode layer 22.
[0069]
[Back Side Shield Layer 24] The back shield layer 24 is made of H-NBR. In the back side shield
layer 24, terminal insertion holes 242LU, 242LD, 242RU, 242RD are bored. The terminal
insertion hole 242LU is disposed at the upper left corner of the back side shield layer 24. The
negative electrode first terminal 80LU is inserted into the terminal insertion hole 242LU. The
terminal insertion hole 242LD is disposed at the lower left corner of the back side shield layer
24. The negative electrode second terminal 80LD is inserted into the terminal insertion hole
242LD. The terminal insertion hole 242 RU is disposed at the upper right corner of the back side
shield layer 24. The positive electrode first terminal 80 RU is inserted into the terminal insertion
hole 242 RU. The terminal insertion hole 242RD is disposed at the lower right corner of the back
side shield layer 24. The positive electrode second terminal 80RD is inserted into the terminal
insertion hole 242RD.
[0070]
As described above, in the film assembly 2, the negative electrode first terminal 80LU and the
front electrode layer 21 are in contact with each other. Moreover, negative electrode 1st terminal
80LU and the electroconductive part 70 for front side electrode layers are contacting. Moreover,
the front side electrode layer 21 and the electroconductive part 70 for front side electrode layers
are contacting.
04-05-2019
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[0071]
In addition, in the film assembly 2, the positive electrode first terminal 80RU and the back
electrode layer 22 are in contact with each other. Further, the positive electrode first terminal 80
RU and the back electrode layer conductive portion 71 are in contact with each other. Moreover,
the back side electrode layer 22 and the electroconductive part 71 for back side electrode layers
are contacting.
[0072]
Moreover, the front side electrode layer 21, the dielectric layer 20, and the back side electrode
layer 22 overlap, seeing from the front or back. That is, the film assembly 2 includes the
overlapping portion. The overlapping part will be described later.
[0073]
<Detailed Configuration of Film Assembly 3> Next, the detailed configuration of the film
assembly 3 at the rear of the speaker 1 of the present embodiment will be described. FIG. 9
shows an exploded perspective view of the rear film assembly of the speaker of this embodiment.
As shown in FIG. 9, the film assembly 3 includes a dielectric layer 30, a front electrode layer 31,
a back electrode layer 32, a front shield layer 33, and a back shield layer 34.
[0074]
The front side electrode layer 31 is included in the concept of the "third electrode layer" of the
present invention. The back side electrode layer 32 is included in the concept of the "fourth
electrode layer" of the present invention. The front side shield layer 33 and the back side shield
layer 34 are respectively included in the concept of the "shield layer" of the present invention.
[0075]
Also, a pair of the front side electrode layer 21 of the front film assembly 2 and the back side
04-05-2019
23
electrode layer 32 of the rear film assembly 3 is included in the concept of the “outer electrode
pair” of the present invention. Also, a pair of the back side electrode layer 22 of the front film
assembly 2 and the front side electrode layer 31 of the rear film assembly 3 is included in the
concept of the “inner electrode pair” of the present invention.
[0076]
Each of these layers is in the form of a rectangular film elongated in the vertical direction. These
layers are laminated in order of front side shield layer 33, front side electrode layer 31, dielectric
layer 30, back side electrode layer 32, and back side shield layer 34 from the front to the back.
[0077]
Front Side Shield Layer 33 The front side shield layer 33 is made of H-NBR. In the front shield
layer 33, conductive portion insertion holes 330 and 331, and terminal insertion holes 332LU
and 332RU are bored. The conductive portion insertion holes 330 extend in the vertical direction
along the left side of the front shield layer 33. The conductive portion 73 for the back side
electrode layer shown in FIG. 7 is inserted into the conductive portion insertion hole 330. The
conductive portion insertion holes 331 extend in the vertical direction along the right side of the
front shield layer 33. The conductive portion 72 for the front side electrode layer shown in FIG. 7
is inserted into the conductive portion insertion hole 331. The terminal insertion hole 332LU is
disposed at the upper left corner of the front shield layer 33. The negative electrode first
terminal 80LU is inserted into the terminal insertion hole 332LU. The terminal insertion hole
332 RU is disposed at the upper right corner of the front shield layer 33. The positive electrode
first terminal 80 RU is inserted into the terminal insertion hole 332 RU.
[0078]
[Front Side Electrode Layer 31] The front side electrode layer 31 is made of an electrode material
in which carbon powder is filled in acrylic rubber. The front side electrode layer 31 is formed by
applying a paint containing an electrode material to the dielectric layer 30 (for example, screen
printing). The front side electrode layer 31 has larger electric resistance than the front side
electrode layer conductive portion 72 shown in FIG. 7. In FIG. 9, the sizes of the front side shield
layer 33, the dielectric layer 30, and the rear side shield layer 34 are indicated by alternate long
and short dashed lines. As shown in FIG. 9, the front side electrode layer 31 is smaller than the
04-05-2019
24
front side shield layer 33, the dielectric layer 30, and the rear side shield layer 34.
[0079]
The front side electrode layer 31 includes a connection portion 310 and a main body portion
311. The main body 311 has a rectangular shape. The connection portion 310 is connected to
the lower right corner of the main body portion 311. The connection portion 310 is electrically
connected to the positive electrode second terminal 80RD. The upper side, the lower side, and
the left side of the front side electrode layer 31 are not held and fixed from the front and rear
direction by the front side frame member 60 and the rear side frame member 61 shown in FIG.
The right side of the front side electrode layer 31 (right side of the connection portion 310 and
the main body portion 311) is held and fixed in the front-rear direction by the front side frame
member 60 and the rear side frame member 61 shown in FIG.
[0080]
The front side electrode layer conductive portion 72 shown in FIG. 7 penetrates the conductive
portion insertion hole 331 of the front side shield layer 33 shown in FIG. 9 and abuts on the
front side of the right side of the front side electrode layer 31. The back side electrode layer
conductive portion 73 shown in FIG. 7 penetrates the conductive portion insertion hole 330 of
the front side shield layer 33 shown in FIG. 9 and passes through the left side of the left side of
the front side electrode layer 31. That is, the back electrode layer conductive portion 73 is not in
contact with the front electrode layer 31. Further, the negative electrode first terminal 80 LU, the
negative electrode second terminal 80 LD, and the positive electrode first terminal 80 RU are not
in contact with the front side electrode layer 31.
[0081]
[Dielectric Layer 30] The dielectric layer 30 is made of H-NBR. In the dielectric layer 30, a
conductive portion insertion hole 301 and terminal insertion holes 302LU, 302RU, and 302RD
are bored. The conductive portion insertion hole 301 extends in the vertical direction along the
left side of the dielectric layer 30. The conductive portion 73 for the back electrode layer shown
in FIG. 7 is inserted into the conductive portion insertion hole 301. The terminal insertion hole
302LU is disposed at the upper left corner of the dielectric layer 30. The negative electrode first
terminal 80LU is inserted into the terminal insertion hole 302LU. The terminal insertion hole
04-05-2019
25
302 RU is disposed at the upper right corner of the dielectric layer 30. The positive electrode
first terminal 80 RU is inserted into the terminal insertion hole 302 RU. The terminal insertion
hole 302RD is disposed at the lower right corner of the dielectric layer 30. The positive electrode
second terminal 80RD is inserted into the terminal insertion hole 302RD.
[0082]
[Back Side Electrode Layer 32] The back side electrode layer 32 is made of an electrode material
in which carbon powder is filled in acrylic rubber. The back side electrode layer 32 is formed by
applying (for example, screen printing etc.) a paint containing an electrode material to the
dielectric layer 30. The back side electrode layer 32 has larger electrical resistance than the back
side electrode layer conductive portion 73 shown in FIG. 7. As shown in FIG. 9, the back side
electrode layer 32 is smaller than the front side shield layer 33, the dielectric layer 30, and the
back side shield layer 34.
[0083]
The back side electrode layer 32 includes a connection portion 320 and a main body portion
321. The main body portion 321 has a rectangular shape. The connection part 320 is connected
to the lower left corner of the main body part 321. The connection part 320 is electrically
connected to the negative electrode second terminal 80LD. The upper side, the lower side, and
the right side of the back side electrode layer 32 are not held and fixed in the front-rear direction
by the front side frame member 60 and the back side frame member 61 shown in FIG. The left
side of the back side electrode layer 32 (the left side of the connection portion 320 and the main
body portion 321) is held and fixed in the front-rear direction by the front side frame member 60
and the back side frame member 61 shown in FIG.
[0084]
The conductive part 73 for the back side electrode layer shown in FIG. 7 penetrates the
conductive part insertion hole 330 of the front side shield layer 33 and the conductive part
insertion hole 301 of the dielectric layer 30 shown in FIG. In contact with The negative electrode
first terminal 80LU, the positive electrode first terminal 80RU, and the positive electrode second
terminal 80RD are not in contact with the back side electrode layer 32.
04-05-2019
26
[0085]
[Back Side Shield Layer 34] The back side shield layer 34 is made of H-NBR. In the back side
shield layer 34, terminal insertion holes 342LU, 342LD, 342RU, 342RD are bored. The terminal
insertion hole 342LU is disposed at the upper left corner of the back side shield layer 34. The
negative electrode first terminal 80LU is inserted into the terminal insertion hole 342LU. The
terminal insertion hole 342LD is disposed at the lower left corner of the back side shield layer
34. The negative electrode second terminal 80LD is inserted into the terminal insertion hole
342LD. The terminal insertion hole 342 RU is disposed at the upper right corner of the back side
shield layer 34. The positive electrode first terminal 80 RU is inserted into the terminal insertion
hole 342 RD. The terminal insertion hole 342RD is disposed at the lower right corner of the back
side shield layer 34. The positive electrode second terminal 80RD is inserted into the terminal
insertion hole 342RD.
[0086]
As described above, in the film assembly 3, the positive electrode second terminal 80 RD is in
contact with the front side electrode layer 31. Moreover, positive electrode 2nd terminal 80RD
and the electroconductive part 72 for front side electrode layers are contacting. Moreover, the
front side electrode layer 31 and the electroconductive part 72 for front side electrode layers are
contacting.
[0087]
Moreover, in the film assembly 3, the negative electrode second terminal 80LD and the back
electrode layer 32 are in contact with each other. Further, the negative electrode second terminal
80LD is in contact with the back electrode layer conductive portion 73. Moreover, the back side
electrode layer 32 and the electroconductive part 73 for back side electrode layers are
contacting.
[0088]
Moreover, the front side electrode layer 31, the dielectric layer 30, and the back side electrode
04-05-2019
27
layer 32 overlap, seeing from the front or back. That is, the film assembly 3 includes the
overlapping portion. The overlapping part will be described later.
[0089]
<Configuration of Circuit Unit 5> Next, the configuration of the circuit unit of the speaker 1 of
the present embodiment will be described. As shown in FIG. 2, the circuit unit 5 includes two AC
power supplies 50a and 50b, a DC bias power supply 51, and a switch 53.
[0090]
The two AC power supplies 50a and 50b apply an AC voltage based on the sound to be
reproduced, that is, a signal wave, to the pair of film assemblies 2 and 3. Specifically, the AC
power supply 50a is electrically connected to the back electrode layer conductive portion 71 and
the back electrode layer 22 via the positive electrode first terminal 80RU (see FIG. 8). Further,
the AC power supply 50b is electrically connected to the front-side electrode layer conductive
portion 72 and the front-side electrode layer 31 via the positive electrode second terminal 80RD
(see FIG. 9). The phase of the signal wave of the AC power supply 50a and the phase of the signal
wave of the AC power supply 50b are in reverse phase to each other.
[0091]
The front side electrode layer conductive portion 70 and the front side electrode layer 21 are
grounded via the negative electrode first terminal 80LU (see FIG. 8). The back electrode layer
conductive portion 73 and the back electrode layer 32 are grounded via the negative electrode
second terminal 80 LD (see FIG. 9).
[0092]
The DC bias power supply 51 is disposed between the switch 53 and the two AC power supplies
50a and 50b. The DC bias power supply 51 applies a bias voltage in the direction in which the
voltage rises in the direction from the AC power supply 50a toward the positive electrode first
terminal 80RU (= the direction from the AC power supply 50b toward the positive electrode
04-05-2019
28
second terminal 80RD). That is, a positive bias voltage is applied.
[0093]
As described above, the DC bias power supply 51 and the AC power supply 50 a superimpose the
positive bias voltage and the signal wave on each other and apply them to the film assembly 2.
Also, the direct current bias power supply 51 and the alternating current power supply 50 b
superimpose the positive bias voltage and the signal wave, and apply them to the film assembly
3.
[0094]
Next, the configuration of the overlapping portions of the film assemblies 2 and 3 of the speaker
1 of the present embodiment will be described. FIG. 10 shows a transmission front view of the
front and back electrode layers of the front film assembly of the speaker of the present
embodiment. As shown in FIG. 10, the connection portion 700 of the front-side electrode layer
conductive portion 70 is stacked on the connection portion 210 of the front-side electrode layer
21. In addition, the wiring portion 702 of the front-side electrode layer conductive portion 70 is
stacked on the left side of the main portion 211 of the front-side electrode layer 21. The wiring
portion 702 extends in the vertical direction along the entire length of the left side of the main
body portion 211.
[0095]
On the other hand, the connection portion 710 of the back electrode layer conductive portion 71
is stacked on the connection portion 220 of the back electrode layer 22. The wiring portion 712
of the back electrode layer conductive portion 71 is stacked on the right side of the main body
portion 221 of the back electrode layer 22. The wiring portion 712 extends in the vertical
direction along the entire length of the right side of the main body portion 221.
[0096]
As shown by hatching in FIG. 10, the front side electrode layer 21 and the back side electrode
04-05-2019
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layer 22 overlap when viewed from the front or the rear. That is, the overlapping part A is
formed between the front side electrode layer 21 and the back side electrode layer 22. A voltage
is applied to the overlapping portion A from the circuit unit 5 through the front side electrode
layer 21, the front side electrode layer conductive portion 70, the back side electrode layer 22,
and the back side electrode layer conductive portion 71.
[0097]
FIG. 11 shows a transmission front view of the front side electrode layer and the rear side
electrode layer of the film assembly at the rear of the speaker of the present embodiment. As
shown in FIG. 11, the connection portion 720 of the front-side electrode layer conductive portion
72 is stacked on the connection portion 310 of the front-side electrode layer 31. The wiring
portion 722 of the front-side electrode layer conductive portion 72 is stacked on the right side of
the main portion 311 of the front-side electrode layer 31. The wiring portion 722 extends in the
vertical direction along the entire length of the right side of the main body portion 311.
[0098]
On the other hand, the connection portion 730 of the back electrode layer conductive portion 73
is stacked on the connection portion 320 of the back electrode layer 32. The wiring portion 732
of the back electrode layer conductive portion 73 is stacked on the left side of the main portion
321 of the back electrode layer 32. The wiring portion 732 extends in the vertical direction
along the entire length of the left side of the main body portion 321.
[0099]
As shown by hatching in FIG. 11, the front side electrode layer 31 and the back side electrode
layer 32 overlap when viewed from the front or the rear. That is, the overlapping portion B is
formed between the front side electrode layer 31 and the back side electrode layer 32. A voltage
is applied to the overlapping portion B from the circuit unit 5 through the front side electrode
layer 31 and the front side electrode layer conductive portion 72, the back side electrode layer
32, and the back side electrode layer conductive portion 73.
[0100]
04-05-2019
30
Hereinafter, a method of suppressing variation in voltage applied to the overlapping portion will
be described. The method of suppressing the voltage variation in the back electrode layer 22 of
the film assembly 2 will be described on behalf of the front electrode layer 21 of the film
assembly 2, the back electrode layer 22, the front electrode layer 31 of the film assembly 3, and
the back electrode layer 32. .
[0101]
As shown in FIG. 10, a voltage is applied to the back side electrode layer 22 from the positive
electrode first terminal 80 RU. Here, the back side electrode layer 22 has a specific resistance. As
indicated by a dotted line in FIG. 10, in the shortest path (path in which the distance between the
connection portion 220 and the overlapping portion A is the shortest) C1, the loss of voltage due
to the specific resistance of the back electrode layer 22 is reduced. On the other hand, in the
longest path (path in which the distance between the connection portion 220 and the
overlapping portion A is the longest) C2, the loss of voltage due to the specific resistance of the
back electrode layer 22 becomes large. Therefore, a direction in which the voltage applied from
the positive electrode first terminal 80 RU to the overlapping portion A is orthogonal to the
surface direction (front-rear direction) of the overlapping portion A. Vertical and horizontal
directions. ) It is easy to vary throughout.
[0102]
In this respect, on the front surface of the back side electrode layer 22, the back side electrode
layer conductive portion 71 is disposed. The back side electrode layer conductive portion 71 has
a smaller electric resistance than the back side electrode layer 22. For this reason, the current
tends to flow through the back electrode layer conductive portion 71 preferentially. That is, after
the current flows downward from the positive electrode first terminal 80 RU along the wiring
portion 712 as shown by the arrow Y 1, it easily flows from the wiring portion 712 toward the
overlapping portion A as shown by the arrow Y 2. Therefore, the difference in electrical
resistance between the shortest path C1 and the longest path C2 is reduced. In other words, the
difference in voltage loss between the shortest path C1 and the longest path C2 is reduced.
Therefore, the voltage applied from the positive electrode first terminal 80 RU to the overlapping
portion A does not easily vary over the entire surface of the overlapping portion A. Therefore, a
uniform electric field can be formed over the entire overlapping portion A.
04-05-2019
31
[0103]
Next, the movement of the speaker 1 of the present embodiment will be described. FIG. 12 is an
operation explanatory view of the speaker of the present embodiment. In addition, in FIG. 12, a
laminated body is shown typically. As shown in FIG. 12, in the stop state, the switch 53 is opened.
Therefore, no voltage is applied to the pair of film assemblies 2 and 3.
[0104]
In the bias voltage application state, the switch 53 is closed. Therefore, the bias voltage Vb is
applied to the pair of film assemblies 2 and 3 respectively. When a bias voltage Vb is applied,
electrostatic attraction is generated between the front electrode layer 21 and the back electrode
layer 22 of the film assembly 2. Therefore, the dielectric layer 20 contracts in the front-rear
direction. Also, the dielectric layer 20 extends in the surface direction. Similarly, the dielectric
layer 30 of the film assembly 3 shrinks in the front-rear direction. Also, the dielectric layer 30
extends in the surface direction.
[0105]
In the sound reproduction state α, signal waves in reverse phase to each other are transmitted to
the film assembly 2 and the film assembly 3. The electrostatic attraction between the front
electrode layer 31 and the back electrode layer 32 of the film assembly 3 is reduced. Thus, the
dielectric layer 30 stretches in the front-rear direction. In addition, the dielectric layer 30
contracts in the surface direction. That is, the tension of the dielectric layer 30 and thus the film
assembly 3 is increased. Therefore, the amount of backward projection of the film assembly 3 is
reduced. Therefore, a load is applied to the interposing member 4 in the direction from the rear
to the front. On the contrary, the electrostatic attraction between the front electrode layer 21 and
the back electrode layer 22 of the film assembly 2 is increased. Therefore, the dielectric layer 20
contracts in the front-rear direction. Also, the dielectric layer 20 extends in the surface direction.
That is, the tension in the dielectric layer 20 and thus in the film assembly 2 is reduced. In other
words, the film assembly 2 sags. Here, a load is applied to the interposing member 4 from the
film assembly 3 in the direction from the rear to the front. Due to the load, the film assembly 2
projects further forward while consuming slack. That is, the amount of forward projection of the
film assembly 2 is increased. As described above, in the sound reproduction state α, the pair of
film assemblies 2 and 3 largely vibrate from the rear to the front.
04-05-2019
32
[0106]
In the sound reproduction state β, signal waves in reverse phase to each other are transmitted to
the film assembly 2 and the film assembly 3. However, as compared with the sound reproduction
state α, the waveform of the signal wave is reversed. The movement of the film assembly 2 in
the sound reproduction state β is similar to the movement of the film assembly 3 in the sound
reproduction state α. And, the movement of the film assembly 3 in the sound reproduction state
β is similar to the movement of the film assembly 2 in the sound reproduction state α. In the
sound reproduction state β, the pair of film assemblies 2 and 3 largely vibrate from the front to
the rear.
[0107]
<Operation and Effect> Next, the operation and effect of the speaker 1 of the present
embodiment will be described. As shown in FIG. 12, the speaker 1 according to the present
embodiment includes a pair of film assemblies 2 and 3, an interposed member 4, and a circuit
unit 5. Interposition member 4 is interposed between the pair of film assemblies 2 and 3. The
circuit unit 5 transmits voice-based signal waves to the pair of film assemblies 2 and 3 so as to be
in opposite phase to each other. For this reason, the pair of film assemblies 2 and 3 operate in
opposite directions to each other. For example, when the rear film assembly 3 shrinks in the
surface direction, the front film assembly 2 stretches in the surface direction. Conversely, when
the front film assembly 2 shrinks in the surface direction, the rear film assembly 3 stretches in
the surface direction.
[0108]
According to the speaker 1 of the present embodiment, the load can be transmitted between the
pair of film assemblies 2 and 3 through the interposing member 4. Therefore, the vibration in the
front-rear direction of the pair of film assemblies 2 and 3 can be increased. Therefore, the
amplitude of the pair of film assemblies 2 and 3 can be increased. Therefore, even when the
voltage applied to the pair of film assemblies 2 and 3 is small, the low frequency characteristics
of the speaker 1 can be improved. For example, the sound pressure in the low frequency region
can be improved. In addition, the reproducible frequency range can be extended to the low
frequency side. In addition, the speaker 1 of the present embodiment can be miniaturized despite
04-05-2019
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the fact that the low frequency characteristics are high. Moreover, the speaker 1 of this
embodiment has a short length in the front-rear direction. Moreover, the speaker 1 of this
embodiment is flexible. For this reason, the speaker 1 of this embodiment has a high degree of
freedom of installation.
[0109]
Further, according to the speaker 1 of the present embodiment, the front side electrode layers 21
and 31 and the back side electrode layers 22 and 32 are formed by applying a paint containing
an electrode material to the dielectric layers 20 and 30. For this reason, formation of front side
electrode layers 21 and 31 and back side electrode layers 22 and 32 and arrangement of front
side electrode layers 21 and 31 and back side electrode layers 22 and 32 can be performed
simultaneously.
[0110]
Further, as shown in FIG. 2, the interposing member 4 is disposed between the pair of film
assemblies 2 and 3 in a state of being compressed from the front-rear direction. For this reason,
the spring constant of the interposing member 4 in the front-rear direction is larger than the
spring constant of the interposing member 4 in the surface direction. Therefore, the interposing
member 4 does not easily expand and contract in the front-rear direction. Therefore, the transfer
loss of the load between the pair of film assemblies 2 and 3 can be reduced. Moreover, according
to the speaker 1 of this embodiment, the interposing member 4 is easily deformed in the surface
direction. Therefore, the interposing member 4 easily follows the expansion and contraction of
the film assemblies 2 and 3 in the planar direction.
[0111]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 2, the film
assemblies 2 and 3 have the front shield layers 23 and 33 and the rear shield layers 24 and 34.
The front side shield layers 23 and 33 and the back side shield layers 24 and 34 each have
insulation. For this reason, according to the speaker 1 of the present embodiment, the insulation
of the film assemblies 2 and 3 can be easily secured.
04-05-2019
34
[0112]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 2, the film
assemblies 2 and 3 are directed from the front side to the back side, the front side shield layers
23 and 33, the front side electrode layers 21 and 31, and a dielectric layer 20, 30, the back
electrode layer 22, 32, and the back shield layer 24, 34 have a laminated and integrated
structure. For this reason, the assembly work of the speaker 1 is easy.
[0113]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 2, the film
assembly 2 and the film assembly 3 are held and fixed from the front-rear direction by the front
side frame member 60 and the back side frame member 61. Here, the interposing member 4 is
disposed in the frame of the front side frame member 60 and the back side frame member 61.
That is, the interposing member 4 is indirectly held by the front side frame member 60 and the
rear side frame member 61 via the pair of film assemblies 2 and 3. For this reason, the operation
of the interposition member 4 is unlikely to be restrained by the front side frame member 60 and
the rear side frame member 61. Therefore, the amplitude of the pair of film assemblies 2 and 3
can be increased.
[0114]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 2, the pair of
film assemblies 2 and 3 each have the fixing portion P 1 (the portion fixed to the front side frame
member 60 and the rear side frame member 61) And a frame inner portion P2 (a portion
disposed in the frames of the front side frame member 60 and the rear side frame member 61).
For this reason, a hinge fulcrum (fulcrum when the in-frame portion P2 vibrates) can be disposed
at the boundary between the fixed portion P1 and the in-frame portion P2.
[0115]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 3, the front side
frame member 60 and the rear side frame member 61 respectively have a pair of opposing sides
60L, 60R, 60U, 60D, 61L facing each other in the surface direction. , 61R, 61U, 61D. Therefore,
04-05-2019
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the film assemblies 2 and 3 can be largely vibrated based on the hinge fulcrum. Therefore, the
amplitude of the pair of film assemblies 2 and 3 can be increased.
[0116]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 2, the circuit
unit 5 applies the signal wave and the positive bias voltage to the back electrode layer 22 of the
front film assembly 2 in a superimposed manner. . In addition, the circuit unit 5 applies a signal
wave and a positive bias voltage to the front side electrode layer 31 of the rear film assembly 3
in a superimposed manner. That is, the circuit unit 5 applies a bias voltage having the same
polarity to each other and signal waves having opposite phases to each other in a superimposed
manner on the inner electrode pair. Also, the front side electrode layer 21 of the front film
assembly 2 and the back side electrode layer 32 of the rear film assembly 3 are grounded. That
is, the outer electrode pair is grounded. Therefore, the pair of film assemblies 2 and 3 can be
easily operated in the reverse direction.
[0117]
Also, in general, the speaker installation space often has a rectangular shape. If the speakers have
a perfect circular shape, dead space is likely to occur at the four corners if the speakers are
placed in the square speaker installation space. In this respect, the speaker 1 of the present
embodiment has a rectangular shape. For this reason, even if the speaker 1 is disposed in the
rectangular speaker installation space, a dead space hardly occurs in the speaker installation
space.
[0118]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 2, the film
assembly 2 protrudes forward and the film assembly 3 protrudes backward. That is, the pair of
film assemblies 2 and 3 have a double-sided convex lens shape. For this reason, as compared
with the case where the film assembly 2 is inserted backward and the film assembly 3 is inserted
forward (that is, when the pair of film assemblies 2 and 3 have a double-sided concave lens
shape), In the stopped state shown at 12, the film assemblies 2, 3 are not stretched in the
direction from the radially outer side toward the radial center. Also, even in the sound
reproduction state, the film assemblies 2 and 3 are unlikely to be stretched excessively in the
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36
direction from the radially outer side toward the radial center. For this reason, the durability of
the film assemblies 2 and 3 and thus the speaker 1 can be improved. Moreover, according to the
speaker 1 of this embodiment, a diaphragm is unnecessary. For this reason, weight reduction is
possible. Therefore, conversion of the audio signal can be performed efficiently.
[0119]
Further, as shown in FIG. 6 and FIG. 7, the speaker 1 of the present embodiment includes the
front side electrode layer conductive portions 70 and 72 and the back side electrode layer
conductive portions 71 and 73. Therefore, as shown in FIG. 10, the difference in electrical
resistance between the front side electrode layer 21 and the front side electrode layer conductive
portion 70, and the electric resistance between the back side electrode layer 22 and the back
side electrode layer conductive portion 71. Variation of the electrical resistance between the
connection portions 210 and 220 and the overlapping portion A can be suppressed by using the
difference of Therefore, the variation of the voltage applied to the overlapping portion A can be
suppressed.
[0120]
Similarly, as shown in FIG. 11, the difference in electrical resistance between the front electrode
layer 31 and the front electrode layer conductive portion 72, and the electric resistance between
the back electrode layer 32 and the back electrode layer conductive portion 73. The variation in
the electrical resistance between the connection portions 310 and 320 and the overlapping
portion B can be suppressed by using the difference of Therefore, the variation in the voltage
applied to the overlapping portion B can be suppressed.
[0121]
Further, as shown in FIGS. 10 and 11, the wiring portions 702, 712, 722, and 732 extend in the
vertical direction along the left side or the right side of the overlapping portions A and B. For this
reason, the variation in the electrical resistance in the vertical direction can be suppressed.
[0122]
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37
Moreover, according to the speaker 1 of this embodiment, as shown to FIG. 10, FIG. 11, the
overlap parts A and B are exhibiting the rectangular shape long to an up-down direction. For this
reason, a long linear sound source can be formed in the vertical direction. Therefore, it is easy to
set a uniform sound field in the vertical direction. Moreover, compared with the speaker
apparatus of patent document 1, it is not necessary to arrange two or more speakers which have
the same characteristic. Also, the circuit configuration is simple.
[0123]
<< Second Embodiment >> <Overall Configuration of Speaker> First, the overall configuration of
the speaker of the present embodiment will be described. In the drawings shown below, the front
corresponds to the "front side" of the present invention, and the rear corresponds to the "back
side" of the present invention. Moreover, in the figures shown below, the members corresponding
to those in FIGS. 1 to 12 are indicated by the same reference numerals.
[0124]
FIG. 13 shows a perspective view of the speaker of this embodiment. In FIG. 14, the XIV-XIV
direction sectional drawing of FIG. 13 is shown. FIG. 15 shows an exploded perspective view of
the same speaker. FIG. 16 shows an enlarged view of the front side frame member of FIG. 15 and
the front film assembly. FIG. 17 shows an enlarged view of the intermediate insulating member
and the interposed member of FIG. FIG. 18 shows an enlarged view of the rear film assembly and
the rear side frame member of FIG.
[0125]
As shown in FIG. 13 to FIG. 18, the speaker 1 of the present embodiment includes the front film
assembly 2, the rear film assembly 3, the interposing member 4, the circuit portion 5, the front
side frame member 60, and the back side. Frame member 61, intermediate insulating member
64, even electrode layer pressing part 90, odd electrode layer pressing part 91, even electrode
layer pressing part 92, odd electrode layer pressing part 93, connection between negative
electrodes A portion 94, an anode first terminal 80LU, an anode second terminal 80LD, an anode
first terminal 80RU, an anode second terminal 80RD, and four terminal nuts 81 are provided.
[0126]
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38
[Front side frame member 60, even electrode layer pressing part 90, odd electrode layer pressing
part 91] As shown by hatching in FIG. 16, the even electrode layer pressing part 90 and the odd
electrode layer pressing part 91 are each made of copper. They are disposed on the rear surface
(rear surface) of the front side frame member 60.
The even electrode layer pressing portion 90 includes a terminal connection portion 900 and a
wiring portion 902. The terminal connection portion 900 is disposed at the lower left corner of
the front side frame member 60. The terminal connection portion 900 is electrically connected to
a negative electrode second terminal 80LD described later. The wiring portion 902 extends
upward along the left side of the front side frame member 60 starting from the terminal
connection portion 900.
[0127]
The odd electrode layer pressing portion 91 includes a terminal connection portion 910 and a
wiring portion 912. The terminal connection portion 910 is disposed at the upper right corner of
the front side frame member 60. The terminal connection portion 910 is electrically connected to
a positive electrode first terminal 80 RU described later. The wiring portion 912 extends
downward along the right side of the front side frame member 60 starting from the terminal
connection portion 910. The odd-numbered electrode layer pressing portion 91 is thinner than
the even-numbered electrode layer pressing portion 90 in the front-rear direction (the thickness
in the front-rear direction).
[0128]
[Film Assembly 2] As shown in FIG. 15, the front film assembly 2 is in the form of a rectangular
film elongated in the vertical direction. The film assembly 2 is disposed between the front side
frame member 60 and the intermediate insulating member 64. The interposition member 4
causes the film assembly 2 to project forward. That is, as shown emphatically in FIG. 14, the film
assembly 2 has a convex shape that bulges forward.
[0129]
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39
[Intermediate Insulating Member 64, Connecting Part Between Negative Electrodes 94,
Interposing Member 4] As shown in FIG. 17, the intermediate insulating member 64 is made of
PET, and has a rectangular frame shape elongated in the vertical direction. As shown by hatching
in FIG. 17, the inter-negative electrode connecting portion 94 is made of copper and is disposed
on the front surface (surface) of the intermediate insulating member 64. The inter-negative
electrode connection portion 94 includes terminal connection portions 940 and 941 and a
wiring portion 942. The terminal connection portion 940 is disposed at the upper left corner of
the intermediate insulating member 64. The terminal connection portion 940 is electrically
connected to a first negative terminal 80LU described later. The terminal connection portion 941
is disposed at the lower left corner of the intermediate insulating member 64. The terminal
connection portion 941 is electrically connected to a negative electrode second terminal 80LD
described later. The wiring portion 942 extends along the left side of the intermediate insulating
member 64. The wiring portion 942 connects the terminal connection portion 940 and the
terminal connection portion 941 in the vertical direction.
[0130]
The interposing member 4 is made of urethane foam and has a rectangular plate shape.
Interposition member 4 is disposed between film assembly 2 and film assembly 3. In addition,
the interposing member 4 is disposed in the frame of the intermediate insulating member 64.
The interposing member 4 is disposed in a state of being compressed from the front-rear
direction. Therefore, the interposing member 4 elastically presses the film assembly 2 forward
and the film assembly 3 backward.
[0131]
[Film Assembly 3] As shown in FIG. 15, the rear film assembly 3 has a rectangular film shape
which is long in the vertical direction. The film assembly 3 is disposed between the intermediate
insulating member 64 and the back frame member 61. The interposition member 4 causes the
film assembly 3 to project rearward. That is, as shown emphatically in FIG. 14, the film assembly
3 has a convex shape that bulges backward.
[0132]
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40
[Backside frame member 61, Even electrode layer pressing portion 92, Odd electrode layer
pressing portion 93] As shown by hatching in FIG. 18, the even electrode layer pressing portion
92 and the odd electrode layer pressing portion 93 are each made of copper. It is disposed on
the front surface (front surface) of the back side frame member 61. The even electrode layer
pressing portion 92 includes a terminal connection portion 920 and a wiring portion 922. The
terminal connection portion 920 is disposed at the lower right corner of the back side frame
member 61. The terminal connection portion 920 is electrically connected to a positive electrode
second terminal 80RD described later. The wiring portion 922 extends upward along the right
side of the back side frame member 61 starting from the terminal connection portion 920.
[0133]
The odd electrode layer pressing portion 93 includes a terminal connection portion 930 and a
wiring portion 932. The terminal connection portion 930 is disposed at the upper left corner of
the back side frame member 61. The terminal connection portion 930 is electrically connected to
a first negative terminal 80LU described later. The wiring portion 932 extends downward along
the left side of the back side frame member 61 starting from the terminal connection portion
930. The odd-numbered electrode layer pressing portion 93 is thicker than the even-numbered
electrode layer pressing portion 92 in the front-rear direction (the thickness in the front-rear
direction).
[0134]
Thus, in the speaker 1, as shown in FIG. 15, the front frame member 60, the film assembly 2, the
intermediate insulating member 64, the film assembly 3, and the back frame member 61 are
disposed in this order from the front to the rear It is done. Further, as shown in FIG. 14, the
interposing member 4 is disposed in the frame of the intermediate insulating member 64.
Hereinafter, these members are collectively referred to as "laminate".
[0135]
[Negative electrode first terminal 80LU, Negative electrode second terminal 80LD, Positive
electrode first terminal 80RU, Positive electrode second terminal 80RD, terminal nut 81] As
shown in FIGS. 13 to 15, the negative electrode first terminal 80LU is made of metal. It has a
screw-like shape. Negative electrode first terminal 80LU is disposed at the upper left corner of
04-05-2019
41
the stack. Negative electrode first terminal 80LU penetrates the laminate in the front-rear
direction. A terminal nut 81 is fixed to the rear end of the negative electrode first terminal 80LU.
[0136]
The configuration and arrangement method of the negative electrode second terminal 80LD, the
positive electrode first terminal 80RU, and the positive electrode second terminal 80RD are the
same as those of the negative electrode first terminal 80LU. The negative electrode second
terminal 80LD is disposed at the lower left corner of the laminate. Positive electrode first
terminal 80 RU is disposed in the upper right corner of the laminate. The positive electrode
second terminal 80RD is disposed at the lower right corner of the laminate.
[0137]
When viewed from the front or the rear, the four sides of the film assemblies 2 and 3 are held
and fixed from the front and rear direction by the front side frame member 60 and the rear side
frame member 61. Further, when viewed from the front or the rear, the interposing member 4 is
accommodated in the frames of the front side frame member 60 and the rear side frame member
61.
[0138]
<Detailed Configuration of Film Assembly 2> Next, the detailed configuration of the front film
assembly 2 of the speaker 1 of the present embodiment will be described. FIG. 19 shows an
exploded perspective view of the front film assembly of the speaker of this embodiment. As
shown in FIG. 19, the film assembly 2 includes a dielectric layer 20, a front shield layer 23, a
back shield layer 24, an odd electrode layer 25, and an even electrode layer 26.
[0139]
Each of these layers (13 layers in total) is in the form of a rectangular film elongated in the
vertical direction. These layers are, from front to back, front side shield layer 23, odd electrode
layer 25, dielectric layer 20, even electrode layer 26, dielectric layer 20, odd electrode layer 25,
04-05-2019
42
dielectric layer 20, even electrode layer 26, dielectric A layer 20, an odd electrode layer 25, a
dielectric layer 20, an even electrode layer 26, and a back shield layer 24 are laminated in this
order.
[0140]
The material and shape of the total of six electrode layers are the same. Among the total six
electrode layers, the first, third, and fifth electrode layers counted from the front side are the
odd-numbered electrode layers 25. The second, fourth, and sixth electrode layers counted from
the front side are the even-numbered electrode layers 26.
[0141]
Front Side Shield Layer 23 The front side shield layer 23 is made of H-NBR. In the front side
shield layer 23, terminal insertion holes 232LU, 232LD, 232RU, 232RD, and pressing portion
insertion holes 235L, 235R are bored. The pressing portion insertion hole 235L extends in the
vertical direction along the left side of the front shield layer 23. The wiring portion 902 of the
pressing portion 90 for an even numbered electrode layer shown in FIG. 16 is inserted into the
pressing portion insertion hole 235L. The pressing portion insertion hole 235R extends in the
vertical direction along the right side of the front shield layer 23. The wiring portion 912 of the
odd electrode layer pressing portion 91 shown in FIG. 16 is inserted into the pressing portion
insertion hole 235R.
[0142]
The terminal insertion holes 232LU, 232LD, 232RU, and 232RD are disposed at the four corners
of the front shield layer 23. The negative electrode first terminal 80LU is inserted into the
terminal insertion hole 232LU. The negative electrode second terminal 80LD is inserted into the
terminal insertion hole 232LD. The positive electrode first terminal 80 RU is inserted into the
terminal insertion hole 232 RU. The positive electrode second terminal 80RD is inserted into the
terminal insertion hole 232RD.
[0143]
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43
[Back Side Shield Layer 24] The back shield layer 24 is made of H-NBR. In the back side shield
layer 24, terminal insertion holes 242LU, 242LD, 242RU, 242RD are bored. The terminal
insertion holes 242LU, 242LD, 242RU, 242RD are disposed at the four corners of the back side
shield layer 24. The negative electrode first terminal 80LU is inserted into the terminal insertion
hole 242LU. The negative electrode second terminal 80LD is inserted into the terminal insertion
hole 242LD. The positive electrode first terminal 80 RU is inserted into the terminal insertion
hole 242 RU. The positive electrode second terminal 80RD is inserted into the terminal insertion
hole 242RD.
[0144]
[Dielectric Layer 20] The dielectric layer 20 is made of H-NBR. Terminal insertion holes 202LU,
202LD, 202RD and electrode layer insertion holes 205L, 205R are bored in the dielectric layer
20. The electrode layer insertion holes 205L extend in the vertical direction along the left side of
the dielectric layer 20. The electrode layer insertion hole 205R extends vertically along the right
side of the dielectric layer 20. As shown by hatching in FIG. 19, an overlapping portion A is
disposed between the pair of left and right electrode layer insertion holes 205L and 205R.
[0145]
When viewed from the front or the rear, the electrode layer insertion holes 205L of the five
dielectric layers 20 in total and the pressing portion insertion holes 235L of the front shield layer
23 overlap. Similarly, when viewed from the front or the rear, the electrode layer insertion holes
205R of the total of five dielectric layers 20 overlap the pressing portion insertion holes 235R of
the front side shield layer 23.
[0146]
The terminal insertion holes 202LU, 202LD, 202RU, 202RD are disposed at the four corners of
the dielectric layer 20. The negative electrode first terminal 80LU is inserted into the terminal
insertion hole 202LU. The negative electrode second terminal 80LD is inserted into the terminal
insertion hole 202LD. The positive electrode first terminal 80 RU is inserted into the terminal
insertion hole 202 RU. The positive electrode second terminal 80RD is inserted into the terminal
insertion hole 202RD.
04-05-2019
44
[0147]
[Odd-numbered electrode layer 25] The odd-numbered electrode layer 25 is made of an
electrode material in which carbon powder is filled in acrylic rubber. The odd electrode layer 25
has a larger electrical resistance than the odd electrode layer pressing portion 91 shown in FIG.
The odd numbered electrode layer 25 has a Young's modulus smaller than that of the odd
numbered electrode layer pressing portion 91. The odd electrode layer 25 is smaller than the
front shield layer 23, the dielectric layer 20, and the rear shield layer 24. The odd electrode layer
25 is disposed to the right of the dielectric layer 20.
[0148]
As shown by hatching in FIG. 19, the odd-numbered electrode layer 25 includes a connection
portion 250 and a main body portion 251. The main body portion 251 has a rectangular shape.
The connection portion 250 is disposed on the right side of the main body portion 251. The
connection portion 250 extends in the vertical direction along the right side of the main body
portion 251.
[0149]
Seeing from the front or rear, the electrode layer insertion holes 205R of the dielectric layer 20
of five layers in total, the pressing part insertion holes 235R of the front side shield layer 23, and
the connection portions 250 of the odd electrode layers 25 of three layers in total overlap doing.
[0150]
[Even-Electrode Layer 26] The even-electrode layer 26 has a larger electrical resistance than the
even-electrode-layer pressing portion 90 shown in FIG.
The even electrode layer 26 has a Young's modulus smaller than that of the even electrode layer
pressing part 90. The even electrode layer 26 is smaller than the front shield layer 23, the
dielectric layer 20, and the rear shield layer 24. The even electrode layer 26 is disposed to the
left with respect to the dielectric layer 20.
04-05-2019
45
[0151]
As shown by hatching in FIG. 19, the even-numbered electrode layer 26 includes a connection
portion 260 and a main portion 261. The main body portion 261 has a rectangular shape. The
connection portion 260 is disposed on the left side of the main body portion 261. The
connection portion 260 extends in the vertical direction along the left side of the main body
portion 261.
[0152]
When viewed from the front or the rear, the electrode layer insertion holes 205L of the dielectric
layer 20 of five layers in total, the pressing part insertion holes 235L of the front side shield
layer 23, and the connection portions 260 of the even electrode layers 26 of three layers in total
overlap doing.
[0153]
Next, the electrical connection structure of the film assembly 2 in front of the speaker 1 of the
present embodiment will be described.
As shown in FIGS. 13 and 14, the film assembly 2 is sandwiched by the front frame member 60
and the intermediate insulating member 64 from the front-rear direction. Also, the film assembly
2 is pushed forward by the interposing member 4. For this reason, a compressive force is applied
to the odd-numbered electrode layer 25 and the even-numbered electrode layer 26 of the film
assembly 2 from the front-rear direction.
[0154]
Here, each of the dielectric layer 20, the front shield layer 23, the back shield layer 24, the odd
electrode layer 25, and the even electrode layer 26 has a small layer thickness (thickness in the
front-rear direction) (for example, 10 μm or less). Further, each of the odd electrode layer 25
and the even electrode layer 26 is made of a flexible elastomer.
04-05-2019
46
[0155]
For this reason, when compressed from the front-rear direction, the odd-numbered electrode
layer 25 elastically deforms accordingly. Therefore, as shown in FIG. 19, the connection portion
250 of the odd-numbered electrode layer 25 enters the electrode layer insertion hole 205R and
the pressing portion insertion hole 235R adjacent in the front-rear direction. Due to such elastic
deformation of the connecting portion 250, as shown in FIG. 14, the connecting portion 250
abuts on another connecting portion 250 adjacent in the front-rear direction or the odd electrode
layer pressing portion 91. Therefore, the odd-numbered electrode layer pressing portion 91 and
three odd-numbered electrode layers 25 in total are electrically connected.
[0156]
Similarly, when compressed from the front-rear direction, the even electrode layer 26 elastically
deforms accordingly. Therefore, as shown in FIG. 19, the connection portion 260 of the evennumbered electrode layer 26 enters the electrode layer insertion hole 205L and the pressing
portion insertion hole 235L which are adjacent in the front-rear direction. Due to such elastic
deformation of the connection portion 260, as shown in FIG. 14, the connection portion 260
abuts on another connection portion 260 adjacent in the front-rear direction and the pressing
portion 90 for an even electrode layer. Therefore, the even-electrode-layer pressing portion 90
and the even-numbered electrode layer 26 in total of three layers are electrically connected.
[0157]
As described above, the film assembly 2 secures the electrical connection between the oddnumbered electrode layer pressing portion 91 and the total of three odd-numbered electrode
layers 25 by using the flexibility of the elastomer. Also, the electrical connection between the
even electrode layer pressing portion 90 and the total of three even electrode layers 26 is
secured.
[0158]
<Detailed Configuration of Film Assembly 3> Next, the detailed configuration of the film
04-05-2019
47
assembly 3 at the rear of the speaker 1 of the present embodiment will be described. FIG. 20
shows an exploded perspective view of the rear film assembly of the speaker of this embodiment.
As shown in FIG. 20, the film assembly 3 includes a dielectric layer 30, a front shield layer 33, a
back shield layer 34, an odd electrode layer 35, and an even electrode layer 36.
[0159]
Each of these layers (13 layers in total) is in the form of a rectangular film elongated in the
vertical direction. These layers are, from front to back, front side shield layer 33, odd electrode
layer 35, dielectric layer 30, even electrode layer 36, dielectric layer 30, odd electrode layer 35,
dielectric layer 30, even electrode layer 36, dielectric A layer 30, an odd electrode layer 35, a
dielectric layer 30, an even electrode layer 36, and a back shield layer 34 are stacked in this
order.
[0160]
The material and shape of the total of six electrode layers are the same. Among the total six
electrode layers, the first, third, and fifth electrode layers counted from the front side are the
odd-numbered electrode layers 35. The second, fourth, and sixth electrode layers counted from
the front side are the even-numbered electrode layers 36.
[0161]
Here, the rear film assembly 3 has a structure in which the front film assembly 2 is vertically
inverted with respect to an axis extending in the left-right direction. Therefore, the front side
shield layer 33 and the rear side shield layer 24 correspond to each other. Moreover, the back
side shield layer 34 and the front side shield layer 23 correspond. The odd electrode layer 35
and the even electrode layer 26 correspond to each other. The even electrode layer 36 and the
odd electrode layer 25 correspond to each other. The dielectric layer 30 and the dielectric layer
20 correspond to each other.
[0162]
04-05-2019
48
[Front Side Shield Layer 33] Similar to the rear side shield layer 24, the front side shield layer 33
is provided with terminal insertion holes 332LU, 332LD, 332RU, and 332RD. The negative
electrode first terminal 80LU is inserted into the terminal insertion hole 332LU. The negative
electrode second terminal 80LD is inserted into the terminal insertion hole 332LD. The positive
electrode first terminal 80 RU is inserted into the terminal insertion hole 332 RU. The positive
electrode second terminal 80RD is inserted into the terminal insertion hole 332RD.
[0163]
[Back Side Shield Layer 34] Similar to the front side shield layer 23, the back side shield layer 34
is provided with terminal insertion holes 342LU, 342LD, 342RU, 342RD, and pressing portion
insertion holes 345L, 345R. The wiring portion 932 of the odd electrode layer pressing portion
93 shown in FIG. 18 is inserted through the pressing portion insertion hole 345L. The wiring
portion 922 of the pressing portion 92 for an even numbered electrode layer shown in FIG. 18 is
inserted into the pressing portion insertion hole 345R.
[0164]
The negative electrode first terminal 80LU is inserted into the terminal insertion hole 342LU.
The negative electrode second terminal 80LD is inserted into the terminal insertion hole 342LD.
The positive electrode first terminal 80 RU is inserted into the terminal insertion hole 342 RU.
The positive electrode second terminal 80RD is inserted into the terminal insertion hole 342RD.
[0165]
[Dielectric Layer 30] Similar to the dielectric layer 20, the dielectric layer 30 is provided with
terminal insertion holes 302LU, 302LD, 302RD, and electrode layer insertion holes 305L, 305R.
As shown by hatching in FIG. 20, an overlapping portion B is disposed between the pair of left
and right electrode layer insertion holes 305L and 305R.
[0166]
The negative electrode first terminal 80LU is inserted into the terminal insertion hole 302LU.
04-05-2019
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The negative electrode second terminal 80LD is inserted into the terminal insertion hole 302LD.
The positive electrode first terminal 80 RU is inserted into the terminal insertion hole 302 RU.
The positive electrode second terminal 80RD is inserted into the terminal insertion hole 302RD.
[0167]
[Odd-numbered electrode layer 35] The odd-numbered electrode layer 35 is disposed to the left
with respect to the dielectric layer 30, similarly to the even-numbered electrode layer 26. As
shown by hatching in FIG. 20, the odd-numbered electrode layer 35 includes a connection
portion 350 and a main portion 351. The main body portion 351 has a rectangular shape. The
connection portion 350 is disposed on the left side of the main body portion 351. The
connection portion 350 extends in the vertical direction along the left side of the main portion
351.
[0168]
[Even even electrode layer 36] The even electrode layer 36 is disposed to the right with respect
to the dielectric layer 30, similarly to the odd electrode layer 25. As shown by hatching in FIG.
20, the even-numbered electrode layer 36 includes a connection portion 360 and a main portion
361. The main body portion 361 has a rectangular shape. The connection portion 360 is
disposed on the right side of the main body portion 351. The connection portion 360 extends in
the vertical direction along the right side of the main portion 361.
[0169]
<Electrical Connection Structure of Film Assembly 3> Next, the electrical connection structure of
the film assembly 3 in front of the speaker 1 of this embodiment will be described. As shown in
FIGS. 13 and 14, the film assembly 3 is nipped by the intermediate insulating member 64 and the
back side frame member 61 from the front-rear direction. Also, the film assembly 3 is pushed
backward by the interposing member 4. For this reason, a compressive force is applied to the
odd-numbered electrode layer 35 and the even-numbered electrode layer 36 of the film assembly
3 from the front-rear direction.
[0170]
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50
When compressed from the front-rear direction, the odd electrode layer 35 elastically deforms
accordingly. Therefore, as shown in FIG. 20, the connection portion 350 of the odd-numbered
electrode layer 35 enters the electrode layer insertion hole 305L and the pressing portion
insertion hole 345L adjacent in the front-rear direction. Due to such elastic deformation of the
connection portion 350, as shown in FIG. 14, the connection portion 350 abuts on another
connection portion 350 adjacent in the front-rear direction or the odd electrode layer pressing
portion 93. Therefore, the odd-numbered electrode layer pressing portion 93 and three oddnumbered electrode layers 35 in total are electrically connected.
[0171]
Similarly, when compressed from the front-rear direction, the even electrode layer 36 elastically
deforms accordingly. Therefore, as shown in FIG. 20, the connection portion 360 of the evennumbered electrode layer 36 enters the electrode layer insertion hole 305R and the pressing
portion insertion hole 345R adjacent in the front-rear direction. Due to such elastic deformation
of the connection portion 360, as shown in FIG. 14, the connection portion 360 abuts on another
connection portion 360 adjacent in the front-rear direction or the pressing portion 92 for an
even electrode layer. Therefore, the even-electrode-layer pressing portion 92 and the total of
three even-electrode layers 36 are electrically connected.
[0172]
Thus, the film assembly 3 secures the electrical connection between the odd-numbered electrode
layer pressing portion 93 and the total of three odd-numbered electrode layers 35 by using the
flexibility of the elastomer. Also, the electrical connection between the even electrode layer
pressing part 92 and the total of three even electrode layers 36 is secured.
[0173]
<Configuration of Circuit Unit 5> Next, the configuration of the circuit unit of the speaker 1 of
the present embodiment will be described. As shown in FIG. 14, the circuit unit 5 includes two AC
power supplies 50a and 50b, a DC bias power supply 51, and a switch 53.
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[0174]
The two AC power supplies 50a and 50b apply an AC voltage based on the sound to be
reproduced, that is, a signal wave, to the pair of film assemblies 2 and 3. Specifically, AC power
supply 50a is electrically connected to odd electrode layer pressing portion 91 and odd electrode
layer 25 via positive electrode first terminal 80RU (see FIG. 16). The AC power supply 50b is
electrically connected to the even electrode layer pressing part 92 and the even electrode layer
36 via the positive electrode second terminal 80RD (see FIG. 18). The phase of the signal wave of
the AC power supply 50a and the phase of the signal wave of the AC power supply 50b are in
reverse phase to each other.
[0175]
The even electrode layer pressing portion 90 and the even electrode layer 26 are grounded via
the negative electrode second terminal 80 LD (see FIG. 16). The odd-numbered electrode layer
pressing portion 93 and the odd-numbered electrode layer 35 are grounded via the negative
electrode first terminal 80LU (see FIG. 18). In addition, the negative electrode first terminal 80LU
and the negative electrode second terminal 80LD are connected via the inter-negative electrode
connecting portion 94 (see FIG. 17).
[0176]
The DC bias power supply 51 is disposed between the switch 53 and the two AC power supplies
50a and 50b. The DC bias power supply 51 applies a bias voltage in the direction in which the
voltage rises in the direction from the AC power supply 50a toward the positive electrode first
terminal 80RU (= the direction from the AC power supply 50b toward the positive electrode
second terminal 80RD). That is, a positive bias voltage is applied.
[0177]
As described above, the DC bias power supply 51 and the AC power supply 50 a superimpose the
positive bias voltage and the signal wave on each other and apply them to the film assembly 2.
Also, the direct current bias power supply 51 and the alternating current power supply 50 b
04-05-2019
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superimpose the positive bias voltage and the signal wave, and apply them to the film assembly
3.
[0178]
Next, the configuration of the overlapping portions of the film assemblies 2 and 3 of the speaker
1 of the present embodiment will be described. FIG. 21 is a transmission front view of the oddnumbered electrode layer, the dielectric layer, and the even-numbered electrode layer of the film
assembly in front of the speaker of this embodiment. The even electrode layer pressing part 90
and the odd electrode layer pressing part 91 are indicated by alternate long and short dashed
lines.
[0179]
As shown in FIG. 21, the connection portion 250 of the odd-numbered electrode layer 25
overlaps the wiring portion 912 of the odd-numbered electrode layer pressing portion 91 in the
front-rear direction over the entire length in the vertical direction. The connection portion 260 of
the even-numbered electrode layer 26 overlaps the wiring portion 902 of the pressing portion
90 for the even-numbered electrode layer in the front-rear direction over the entire length in the
vertical direction.
[0180]
As shown by hatching in FIG. 21, the odd-numbered electrode layer 25 and the even-numbered
electrode layer 26 overlap as viewed from the front or the back. That is, the overlapping portion
A is formed between the odd-numbered electrode layer 25 and the even-numbered electrode
layer 26. A voltage is applied to the overlapping portion A from the circuit unit 5 through the
odd electrode layer pressing portion 91 and the connection portion 250, the even electrode layer
pressing portion 90, and the connection portion 260.
[0181]
FIG. 22 is a transmission front view of the odd-numbered electrode layer, the dielectric layer, and
04-05-2019
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the even-numbered electrode layer of the film assembly at the rear of the speaker according to
this embodiment. The even-electrode-layer pressing part 92 and the odd-electrode-layer pressing
part 93 are indicated by alternate long and short dashed lines.
[0182]
As shown in FIG. 22, the connection portion 350 of the odd-numbered electrode layer 35
overlaps the wiring portion 932 of the odd-numbered electrode layer pressing portion 93 in the
front-rear direction over the entire length in the vertical direction. The connection portion 360 of
the even-numbered electrode layer 36 overlaps the wiring portion 922 of the even-electrodelayer pressing portion 92 in the front-rear direction over the entire length in the vertical
direction.
[0183]
As shown by hatching in FIG. 22, the odd electrode layer 35 and the even electrode layer 36
overlap as viewed from the front or the back. That is, an overlapping portion B is formed between
the odd electrode layer 35 and the even electrode layer 36. A voltage is applied to the
overlapping portion B from the circuit unit 5 through the odd-numbered electrode layer pressing
portion 93 and the connecting portion 350, the even-numbered electrode layer pressing portion
92, and the connecting portion 360.
[0184]
Hereinafter, a method of suppressing variation in voltage applied to the overlapping portion will
be described. The method of suppressing the voltage variation in the odd electrode layer 25 of
the film assembly 2 will be described on behalf of the odd electrode layer 25 of the film assembly
2, the even electrode layer 26, the odd electrode layer 35 of the film assembly 3, and the even
electrode layer 36. .
[0185]
As shown in FIG. 21, a voltage is applied to the odd-numbered electrode layer 25 from the
04-05-2019
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positive electrode first terminal 80 RU. Here, the odd electrode layer 25 has a specific resistance.
As shown by a dotted line in FIG. 21, in the shortest path (path in which the distance between the
terminal connection portion 910 and the overlapping portion A is the shortest) C1, the loss of
voltage due to the specific resistance of the odd electrode layer 25 decreases. On the other hand,
in the longest path (path in which the distance between the terminal connection portion 910 and
the overlapping portion A is the longest) C2, the loss of voltage due to the specific resistance of
the odd-numbered electrode layer 25 is large. Therefore, a direction in which the voltage applied
from the positive electrode first terminal 80 RU to the overlapping portion A is orthogonal to the
surface direction (front-rear direction) of the overlapping portion A. Vertical and horizontal
directions. ) It is easy to vary throughout.
[0186]
In this regard, the odd electrode layer 25 includes the connection portion 250. The connection
portion 250 extends in the vertical direction. The connection portion 250 overlaps the wiring
portion 912 in the front-rear direction. Further, the wiring portion 912 has a smaller electric
resistance than the connection portion 250. Therefore, current tends to flow through the wiring
portion 912 preferentially. That is, after the current flows downward from the positive electrode
first terminal 80 RU along the wiring portion 912 as shown by the arrow Y 1, as shown by the
arrow Y 2, the current is overlapped from the wiring portion 912 through the connection portion
250. It is easy to flow toward Part A. Therefore, the difference in electrical resistance between
the shortest path C1 and the longest path C2 is reduced. In other words, the difference in voltage
loss between the shortest path C1 and the longest path C2 is reduced. Therefore, the voltage
applied from the positive electrode first terminal 80 RU to the overlapping portion A does not
easily vary over the entire surface of the overlapping portion A. Therefore, a uniform electric
field can be formed over the entire overlapping portion A.
[0187]
In addition, the motion of the speaker 1 of this embodiment is the same as the motion of the
speaker of 1st embodiment.
[0188]
<Operation and Effect> Next, the operation and effect of the speaker 1 of the present
embodiment will be described.
04-05-2019
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The speaker 1 according to the present embodiment has the same function and effect as the
speaker according to the first embodiment with respect to parts having a common configuration.
[0189]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 14, electrical
connection is made between the odd-numbered electrode layer pressing portion 91 and the total
of three odd-numbered electrode layers 25 by using the flexibility of the elastomer. Can be
secured. Further, the electrical connection between the even-electrode-layer pressing portion 90
and the total of three even-electrode layers 26 can be secured. Similarly, the electrical connection
between the odd electrode layer pressing portion 93 and the total of three odd electrode layers
35 can be secured. Further, the electrical connection between the even-electrode-layer pressing
portion 92 and the total of three even-electrode layers 36 can be secured.
[0190]
That is, the electrode layers (odd electrode layers 25 and 35, even electrode layers 26 and 36)
contain an elastomer. For this reason, the electrode layer is flexible. When the film assemblies 2
and 3 are assembled, a compressive load is applied to the film assemblies 2 and 3 from the front
and back direction (front and back direction). Due to the compressive load, the connection
portions 250, 260, 350, 360 of the electrode layers are elastically deformed and enter the
adjacent electrode layer insertion holes 205L, 205R, 305L, 305R. The connection parts 250 and
350 of the odd-numbered electrode layers 25 and 35 are connected using elastic deformation of
the connection parts 250 and 350. In addition, the connection portions 260 and 360 of the evennumbered electrode layers 26 and 36 are connected to each other by using elastic deformation
of the connection portions 260 and 360.
[0191]
According to the speaker 1 of the present embodiment, it is not necessary to separately arrange a
member such as a wire in order to connect the connection portions 250 and 350 of the odd
electrode layers 25 and 35 to each other. Similarly, in order to connect the connection portions
260 and 360 of the even-numbered electrode layers 26 and 36, it is not necessary to separately
arrange a member such as a wire. Therefore, the number of parts of the speaker 1 is reduced.
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Also, the structure of the speaker 1 is simplified.
[0192]
Further, according to the speaker 1 of the present embodiment, as shown in FIG. 14, the odd
numbered electrode layers 25 in total of three layers can be brought into close contact by
utilizing the pressing force of the odd numbered electrode layer pressing portion 91. Moreover,
the even number electrode layer 26 of a total of three layers can be stuck by using the pressing
force of the pressing portion 90 for the even numbered electrode layer. Similarly, using the
pressing force of the odd electrode layer pressing portion 93, the total of three odd electrode
layers 35 can be adhered. Moreover, the even number electrode layer 36 of a total of three layers
can be stuck by utilizing the pressing force of the pressing portion 92 for the even numbered
electrode layer. For this reason, the application of the voltage to the overlapping parts A and B is
unlikely to be interrupted.
[0193]
Further, according to the speaker 1 of the present embodiment, the rear film assembly 3 has a
structure in which the front film assembly 2 is vertically inverted with respect to an axis
extending in the left-right direction. Therefore, the same film assembly can be shared for front
and back use.
[0194]
Moreover, the front side shield layer 33 and the back side shield layer 24 are the same members.
Moreover, the back side shield layer 34 and the front side shield layer 23 are the same members.
The odd electrode layer 35, the even electrode layer 26, the even electrode layer 36, and the odd
electrode layer 25 are the same members although their positions in the left-right direction are
different. The dielectric layer 30 and the dielectric layer 20 are the same member. Therefore, the
number of parts constituting the film assemblies 2 and 3 is reduced.
[0195]
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57
Further, as shown in FIGS. 21 and 22, the odd electrode layer 35, the even electrode layer 26, the
even electrode layer 36, and the odd electrode layer 25 have a simple rectangular film shape.
Therefore, the odd electrode layer 35, the even electrode layer 26, the even electrode layer 36,
and the odd electrode layer 25 can be easily manufactured.
[0196]
<< Others >> The embodiments of the speaker of the present invention have been described
above. However, the embodiment is not particularly limited to the above embodiment. It is also
possible to carry out in various variants and modifications which can be carried out by those
skilled in the art.
[0197]
FIG. 23 (a) shows a transmission front view of the front and back electrode layers of the film
assembly in front of the speaker of another embodiment (part 1). FIG. 23 (b) shows a
transmission front view of the front and back electrode layers of the front film assembly of the
speaker according to another embodiment (part 2). FIG. 23 (c) shows a transmission front view of
the front and back electrode layers of the front film assembly of the speaker of another
embodiment (Part 3). In addition, about the site | part corresponding to FIG. 10, it shows with the
same code | symbol.
[0198]
As shown in FIG. 23A to FIG. 23C, the relative positional relationship between the connection
portions 700 and 710 and the wiring portions 702 and 712 is not particularly limited. The
connection parts 700 and 710 may be disposed at the longitudinal center of the wiring parts 702
and 712.
[0199]
Further, as shown in FIGS. 23A to 23C, the wiring portions 702 and 712 may extend in a broken
line shape or an arc shape. That is, the wiring portions 702 and 712 may extend along the outer
04-05-2019
58
edge of the overlapping portion A.
[0200]
Further, the extending sections of the wiring portions 702 and 712 are not particularly limited.
As shown to Fig.23 (a), you may extend along a part of outer edge of the overlap part A. As
shown in FIG. Moreover, as shown to FIG.23 (b), (c), you may extend along substantially all of the
outer edge of the duplication part A. As shown in FIG. In addition, the wiring portions 702 and
712 may extend in a dotted line shape or a dashed dotted line shape. The wiring portions 702
and 712 may be linear, belt-like, or planar.
[0201]
Further, as shown in FIG. 23A to FIG. 23C, the shape of the overlapping portion A is not
particularly limited. It may be a polygon (a triangle, a quadrangle, a pentagon, a hexagon, etc.), a
circle (a true circle, an ellipse, an oval), or the like.
[0202]
FIG. 24 (a) shows a transmission front view of the front side electrode layer and the rear side
electrode layer of the front film assembly of the speaker according to another embodiment (part
4). FIG. 24 (b) shows a cross-sectional view in the direction of XIV (b) -XIV (b) of FIG. 24 (a). Parts
corresponding to those in FIG. 10 are denoted by the same reference numerals.
[0203]
As shown in FIGS. 24A and 24B, a thickness adjusting portion 76 is disposed between the
connection portion 220 of the back electrode layer 22 and the overlapping portion A. The
thickness adjusting unit 76 includes a thin layer portion 760, a thick layer portion 761, an
intermediate thin layer portion 762, and an intermediate thick layer portion 763. When the
thickness in the front and back direction is compared, thin layer portion 760 → middle thin layer
portion 762 → middle thick layer portion 763 → thick layer portion 761 in ascending order.
That is, as the distance from the connection portion 220 increases, the thickness in the front and
04-05-2019
59
back direction decreases stepwise.
[0204]
The shortest path C1 having an inherently low electric resistance passes through the thin layer
portion 760 having a high electric resistance. On the other hand, the longest path C2 having an
inherently large electric resistance passes through the thick layer portion 761 having a small
electric resistance. For this reason, the variation in the voltage applied to the overlapping part A
can be suppressed. A thickness adjustment portion 75 similar to the thickness adjustment
portion 76 is disposed also between the connection portion 210 of the front side electrode layer
21 and the overlapping portion A. Further, as shown by dotted lines in FIG. 24B, the thickness of
the thickness adjusting portions 75 and 76 in the front and back direction may be changed in a
slope shape instead of a step shape.
[0205]
The front-back direction sectional view of the speaker of other embodiment (the 5) is shown in
FIG. In addition, about the site | part corresponding to FIG. 2, it shows with the same code |
symbol. As shown in FIG. 25, the front side insulating member and the back side insulating
member may not be disposed. Further, an edge member 41 may be interposed between the
interposing member 4 and the fixed portion P1. The edge member 41 is made of resin, and has a
triangular prism shape with an apex facing outward. The edge member 41 is more rigid than the
insert member 4 and the film assemblies 2 and 3.
[0206]
As shown in FIG. 25, a hinge fulcrum H is set at the boundary between the fixed portion P1 and
the in-frame portion P2. The hinge fulcrum H is a fulcrum when the frame inner portion P2
vibrates. The apex of the edge member 41 is disposed at the hinge fulcrum H. For this reason, the
hinge fulcrum H does not easily shift. That is, when the in-frame portion P2 vibrates, the fulcrum
does not easily shift. Therefore, the film assemblies 2 and 3 can be vibrated largely. Thus, the
amplitude of the pair of film assemblies 2 and 3 can be increased.
[0207]
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60
Further, in the first embodiment, as shown in FIG. 2, the circuit unit 5 has bias voltages of the
same polarity and reverse to each other for the inner electrode pair (pair of the back electrode
layer 22 and the front electrode layer 31). The signal wave of a phase was superimposed and
applied, respectively. The outer electrode pair (a pair of the front electrode layer 21 and the rear
electrode layer 32) was grounded. However, the circuit unit 5 may apply a bias voltage of the
same polarity and a signal wave of the opposite phase to each other in a superimposed manner
on the outer electrode pair. Also, the inner electrode pair may be grounded.
[0208]
In the first and second embodiments, the speaker 1 is disposed such that the front and back
direction of the speaker 1 is the front and back direction. However, the arrangement direction of
the speakers 1 is not particularly limited. For example, the speaker 1 may be disposed such that
the front and back direction of the speaker 1 is in the left-right direction or the up-down
direction. In addition, the speaker 1 may be disposed such that the longitudinal direction of the
speaker 1 is the left-right direction or the front-rear direction.
[0209]
The structure, material, and the like of the interposing member 4 are not particularly limited. For
example, a solid body, a porous body (honeycomb structure, cardboard etc.), a foam (foamed
polystyrene etc), a hollow body etc. may be used. In the case of a hollow body, the inside may be
filled with gas, liquid or the like. When the interposing member 4 restrains the movement of the
film assemblies 2 and 3, a lubricant (a release agent, oil, etc.) may be applied to the surface of the
interposing member 4.
[0210]
The shape of the speaker 1 viewed from the front or the rear is not particularly limited. It may be
polygonal, circular or the like. In addition, convex shapes may be provided on both the front and
rear surfaces of the interposing member 4. This makes it easier to project the film assembly 2
forward and the film assembly 3 backward.
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[0211]
Repeated number of laminated layers of “front side electrode layers 21, 31, dielectric layers 20,
30, back side electrode layers 22, 32” in film assemblies 2, 3, “odd electrode layers 25, 35,
dielectric layers 20, 30, even electrode layers The number of repeated laminations of “26, 36”
is not particularly limited. The amplitude of the pair of film assemblies 2 and 3 can be increased
by increasing the number of repeated laminations.
[0212]
The arrangement method of the front side electrode layers 21 and 31, the back side electrode
layers 22 and 32, the odd electrode layers 25 and 35, and the even electrode layers 26 and 36
with respect to the dielectric layers 20 and 30 is not particularly limited. For example, the front
side electrode layers 21 and 31, the back side electrode layers 22 and 32, the odd electrode
layers 25 and 35, and the even electrode layers 26 and 36 manufactured separately from the
dielectric layers 20 and 30 (e.g. ) May be adhered to the dielectric layers 20,30. Thus, the front
side electrode layers 21 and 31, the back side electrode layers 22 and 32, the odd electrode
layers 25 and 35, and the even electrode layers 26 and 36 can be firmly fixed to the dielectric
layers 20 and 30, respectively. Further, the front side electrode layers 21 and 31 and the oddnumbered electrode layers 25 and 35 may be applied or adhered to the back side of the front
side shield layers 23 and 33. Similarly, the back electrode layers 22, 32 and the even electrode
layers 26, 36 may be applied or adhered to the surface of the back shield layers 24, 34.
[0213]
Further, the arrangement method of the front side electrode layer conductive portion 70, the
back side electrode layer conductive portion 71, the even electrode layer pressing portion 90,
and the odd electrode layer pressing portion 91 with respect to the front side frame member 60
is not particularly limited. It may be arranged by means of application (including printing),
adhesion (including sputtering), and the like. Similarly, the arrangement method of the front side
electrode layer conductive portion 72, the back side electrode layer conductive portion 73, the
even electrode layer pressing portion 92, and the odd electrode layer pressing portion 93 with
respect to the back side insulating member 63 is not particularly limited. It may be arranged by
means of application (including printing), adhesion (including sputtering), and the like. Similarly,
the method of arranging the inter-negative electrode connection portion 94 with respect to the
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intermediate insulating member 64 is not particularly limited. It may be arranged by means of
application (including printing), adhesion (including sputtering), and the like.
[0214]
Also, even if the insulating base layer is disposed on the back side of the front side frame
member 60 shown in FIG. 6 and the conductive part 70 for the front side electrode layer and the
conductive part 71 for the back side electrode layer are disposed on the base layer (application,
adhesion, etc.) Good. Also, even if the insulating base layer is disposed on the back side of the
back side insulating member 63 shown in FIG. 7 and the conductive portion 72 for the front side
electrode layer and the conductive portion 73 for the back side electrode layer are disposed on
the base layer (application, adhesion, etc.) Good.
[0215]
In addition, the conductive portion 70 for the front electrode layer and the conductive portion 71
for the back electrode layer may be disposed (coated, adhered, etc.) on the surface of the front
insulating member 62 shown in FIG. In addition, the conductive portion 72 for the front side
electrode layer and the conductive portion 73 for the back side electrode layer may be disposed
on the surface of the back side frame member 61 shown in FIG.
[0216]
Also, even if an insulating base layer is disposed on the back side of the front side frame member
60 shown in FIG. 16 and the even electrode layer pressing part 90 and the odd electrode layer
pressing part 91 are disposed (application, adhesion, etc.) in the base layer. Good. Alternatively,
an insulating base layer may be disposed on the front side of the intermediate insulating member
64 shown in FIG. Further, even if an insulating base layer is disposed on the front side of the
back side frame member 61 shown in FIG. 18 and the even electrode layer pressing part 92 and
the odd electrode layer pressing part 93 are disposed (application, adhesion, etc.) in the base
layer. Good.
[0217]
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63
Further, in the odd-numbered electrode layer 35, the even-numbered electrode layer 26, the
even-numbered electrode layer 36, and the odd-numbered electrode layer 25 shown in FIGS. And
may be arranged in series. That is, the overlapping portions A and B may be disposed in the
immediate vicinity of the connection portions 350, 260, 360, and 250. In this case, the loss of
voltage due to the specific resistance of the odd electrode layer 35, the even electrode layer 26,
the even electrode layer 36, and the odd electrode layer 25 is reduced.
[0218]
The configuration of the circuit unit 5 shown in FIGS. 2 and 14 is not particularly limited. The DC
bias power supply 51 dedicated to the AC power supply 50a and the DC bias power supply 51
dedicated to the AC power supply 50b may be separately disposed. Alternatively, the DC bias
power supply 51 may be disposed between the AC power supply 50 a and the back electrode
layer conductive portion 71. Also, the DC bias power supply 51 may be disposed between the AC
power supply 50 b and the front-side electrode layer conductive portion 72.
[0219]
The method for applying alternating-current voltages (signal waves) having opposite phases to
each other from the two alternating-current power supplies 50a and 50b to the pair of film
assemblies 2 and 3 is not particularly limited. The AC power supply 50b may be omitted by
arranging one AC power supply 50a and a phase inversion circuit. Alternatively, a signal wave
based on the phase of the raw voice may be applied to the film assembly 2 from the AC power
supply 50a, and a signal wave in which the phase of the signal wave is reversed may be applied
to the film assembly 3 from the AC power supply 50b. Conversely, a signal wave based on the
phase of raw speech may be applied from the AC power supply 50b to the film assembly 3, and a
signal wave in which the phase of the signal wave is reversed may be applied to the film
assembly 2 from the AC power supply 50a.
[0220]
The material of the dielectric layers 20 and 30 is not particularly limited. It may be made of an
elastomer or a resin. For example, it is preferable to use an elastomer having a high dielectric
constant. Specifically, an elastomer having a relative dielectric constant (100 Hz) of 2 or more,
04-05-2019
64
and more preferably 5 or more at normal temperature is preferable. For example, an elastomer
having a polar functional group such as an ester group, a carboxyl group, a hydroxyl group, a
halogen group, an amido group, a sulfone group, a urethane group or a nitrile group, or an
elastomer to which a polar low molecular weight compound having these polar functional groups
is added It is good to adopt As suitable elastomers other than H-NBR, silicone rubber,
acrylonitrile-butadiene rubber (NBR), ethylene-propylene-diene rubber (EPDM), acrylic rubber,
urethane rubber, epichlorohydrin rubber, chlorosulfonated polyethylene, chlorinated
polyethylene , Etc. In addition, suitable resins include polyethylene, polypropylene, polyurethane,
polystyrene (including cross-linked expanded polystyrene), polyvinyl chloride, vinylidene
chloride copolymer, ethylene-vinyl acetate copolymer and the like. The materials of the front side
shield layers 23 and 33 and the rear side shield layers 24 and 34 are not particularly limited.
The same material as the dielectric layers 20 and 30 may be used.
[0221]
The material of the front side electrode layers 21 and 31, the back side electrode layers 22 and
32, the odd-numbered electrode layers 25 and 35, and the even-numbered electrode layers 26
and 36 is not particularly limited. For example, silicone rubber, acrylic rubber, silver powder in
H-NBR, and a flexible conductive material filled with carbon may be used. The front side
electrode layers 21 and 31 and the back side electrode layers 22 and 32 may be formed of a
metal or a carbon material. From the viewpoint of imparting stretchability, for example, the front
side electrode layers 21 and 31 and the back side electrode layers 22 and 32 can be formed by
knitting metal or the like into a mesh shape. In addition, the front side electrode layers 21 and 31
and the back side electrode layers 22 and 32 may be formed of a conductive polymer such as
polyethylene dioxythiophene (PEDOT). When a flexible conductive material containing a binder
and a conductive material is employed, it is preferable to use an elastomer as the binder. As the
elastomer, for example, silicone rubber, NBR, EPDM, natural rubber, styrene-butadiene rubber
(SBR), acrylic rubber, urethane rubber, epichlorohydrin rubber, chlorosulfonated polyethylene,
chlorinated polyethylene and the like are preferable. In addition, as the conductive material,
carbon materials such as carbon black, carbon nanotubes and graphite, silver, gold, copper,
nickel, rhodium, palladium, chromium, titanium, platinum, iron and metal materials such as alloys
thereof, indium oxide It may be appropriately selected from conductive oxides such as tin (ITO),
titanium oxide, and zinc oxide doped with other metals such as aluminum and antimony. A
conductive material may be used individually by 1 type, and may mix and use 2 or more types.
Similarly, the conductive parts 70 and 72 for the front side electrode layer, the conductive parts
71 and 73 for the back side electrode layer, the pressing part 90 for the even electrode layer, the
pressing part 91 for the odd electrode layer, the pressing part 92 for the even electrode layer,
the odd electrode layer The material of the pressing portion 93 and the intermediate insulating
member 64 is not particularly limited. For example, the same material as the conductive material
04-05-2019
65
may be used.
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66
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