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JPWO2015045993

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DESCRIPTION JPWO2015045993
Abstract A headphone (10) includes a headband (11) and sound emitting parts (12L, 12R). The
headband (11) is a band-like body that curves in an arched manner. The sound emitting portions
(12L, 12R) are flat and disposed at both ends of the headband (11). The sound output unit (12L,
12R) includes a flat film piezoelectric actuator (20) disposed on the flat surface of the flat
housing (120). The piezoelectric actuator (20) includes a piezoelectric film (200) made of an
organic piezoelectric material such as PLLA, and first and second driving conductors (201, 202)
disposed on opposing main surfaces of the piezoelectric film (200). It consists of
ヘッドフォン
[0001]
The present invention relates to a headphone provided with a speaker unit using a piezoelectric
element.
[0002]
Conventionally, various headphones have been devised and are in practical use.
Among these, headphones using a piezoelectric body as described in Patent Document 1 have
been devised.
11-05-2019
1
[0003]
The headphone described in Patent Document 1 includes a band for attaching the headphone to
the head, and a speaker unit with ear pads attached to both ends of the band. A speaker using a
piezoelectric ceramic plate is mounted in the sound output case. The piezoelectric ceramic plate
is driven by the sound emission drive signal to emit sound toward the eardrum of the user's ear.
Furthermore, in the headphone described in Patent Document 1, the speaker unit including the
piezoelectric ceramic plate provides sound to the user even in bone conduction by causing the
speaker unit to contact bone through the skin of the user.
[0004]
JP 2007-19957
[0005]
However, in the headphone of Patent Document 1, since it is necessary to perform sound
emission to the tympanic membrane and vibration for bone conduction with one piezoelectric
ceramic plate, the size of the piezoelectric ceramic plate becomes large and the weight also
becomes heavy. I will.
[0006]
In addition, when the shape of the piezoelectric ceramic plate becomes large, it is easily broken at
the time of vibration.
[0007]
Further, in the headphone of Patent Document 1, since the ear pad of the speaker unit is filled
with the fluid, the shape of the speaker unit becomes thick.
Therefore, even if a piezoelectric ceramic plate that can form a thin speaker unit is used, the
speaker unit becomes thick and large as a result.
[0008]
An object of the present invention is to provide a thin and light headphone having good sound
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2
quality characteristics.
[0009]
The present invention relates to a headphone provided with an arch-shaped headband and sound
emitting housings mounted at both ends of the head band, wherein the sound emitting housing is
flat and the sound emitting housing is Is characterized in that a flat film-like piezoelectric
actuator provided with an organic piezoelectric film and a drive conductor is mounted.
[0010]
In this configuration, the flat sound emission housing vibrates due to the vibration of the
piezoelectric actuator, and sound is emitted so as to have strong directivity in the direction
orthogonal to the flat surface.
When the headband is worn on the user's head, the direction in which the directivity is strong is
the direction of the user's ear, so the emitted sound is effectively transmitted to the user's ear.
Moreover, since the organic piezoelectric film is used, it can be configured to be thin and
lightweight.
[0011]
Further, the headphone according to the present invention preferably comprises a spacer
member at a specific position between the center and both ends in the direction in which the
arch shape extends on the inner circumferential surface of the headband.
[0012]
In this configuration, the sound emitting housing can be separated from the ear by the spacer
member contacting the head of the user.
This makes it possible to hear the external sound while listening to the sound emitted by the
headphones.
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[0013]
Further, in the headphone of the present invention, it is preferable that a flat film-like
piezoelectric sensor provided with an organic piezoelectric film and a detection conductor be
attached to a headband.
[0014]
In this configuration, the piezoelectric sensor can receive an operation input.
[0015]
In the headphone of the present invention, preferably, at least one layer of the organic
piezoelectric film is made of polylactic acid or polyvinylidene fluoride.
[0016]
In this configuration, it is possible to realize a speaker with high piezoelectric conversion
efficiency while being thin.
[0017]
Further, in the headphone according to the present invention, the sound emission housing is
preferably made of a translucent insulating material, and the driving conductor is preferably
made of a translucent conductive material.
[0018]
In this configuration, the part of the headphone facing the user's ear can be seen through.
[0019]
Further, in the headphone according to the present invention, the headband, the sound output
housing, and the spacer member are preferably made of a translucent insulating material, and
the piezoelectric actuator is preferably composed of a translucent material.
[0020]
Further, in the headphone of the present invention, the headband and the sound output housing
are preferably made of a translucent insulating material, and the piezoelectric actuator and the
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piezoelectric sensor are preferably composed of a translucent material.
[0021]
In these configurations, the entire headphone can be seen through.
That is, it can appear as if headphones are not worn.
Or you can make it look stylish.
[0022]
Further, in the headphone of the present invention, it is preferable that the headband and the
sound emitting housing be integrally formed.
[0023]
In this configuration, since the headband and the sound output housing are not connected by the
adhesive or the connection mechanism, the overall strength of the headphone can be increased.
In addition, the appearance can be made beautiful.
[0024]
According to the present invention, it is possible to realize a thin and light headphone having
excellent sound quality characteristics.
[0025]
It is a front view of the headphones concerning a 1st embodiment of the present invention.
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It is a left side view of headphones concerning a 1st embodiment of the present invention.
It is a figure which shows the structure of the sound emission part of the headphones which
concern on the 1st Embodiment of this invention.
It is the front view and left side view of the headphones concerning a 2nd embodiment of the
present invention.
It is an external appearance perspective view which shows the other aspect of the headphones
which concern on embodiment of this invention.
[0026]
A headphone according to a first embodiment of the present invention will be described with
reference to the drawings.
FIG. 1 is a front view of a headphone according to a first embodiment of the present invention.
FIG. 2 is a left side view of the headphones according to the first embodiment of the present
invention.
[0027]
The headphone 10 includes a headband 11, sound emitting units 12L and 12R, and spacers 13L
and 13R.
The headband 11 is made of a polymer.
For example, polycarbonate (PC) resin, acrylic (PMMA) resin, polyethylene terephthalate (PET)
resin, ABS resin, polyvinyl chloride (PVC) resin or the like can be used for the headband 11.
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6
At this time, the headband 11 is preferably transparent or translucent.
[0028]
The head band 11 is formed of a band-like body having an arch shape in a front view. In other
words, the headband 11 is long and has a shape that curves along the long direction.
[0029]
The sound emitting units 12L and 12R are flat. The sound emitting portion 12L is joined to one
end of the headband 11 in the longitudinal direction, and the sound emitting portion 12R is
connected to the other end of the headband 11 in the overlapping direction. The flat plate
surfaces of the sound emitting units 12L, 12R become the vibrating surfaces of the sound
emitting units 12L, 12R.
[0030]
The sound emitting portions 12L, 12R are disposed such that the flat surfaces thereof
substantially face each other. Under the present circumstances, the space | interval of the front
side edge part of sound emission part 12L, 12R is good to be substantially the same as the back
side edge part, More preferably, the space | interval of the front side edge part of sound emission
part 12L, 12R is a back surface Narrower than the distance between the side edges. In the aspect
in which the distance between the front side end portions of the sound emitting units 12L and
12R is smaller than the distance between the back side end portions, a vibrating surface can be
formed along the shape of the human ear. Can be emitted more effectively toward the tympanic
membrane.
[0031]
The sound emitting units 12L and 12R include a sound emitting housing 120, a piezoelectric
actuator 20, and a protective film 121. FIG. 3 is a view showing the configuration of the sound
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output unit of the headphones according to the first embodiment of the present invention, FIG. 3
(A) is a view seen from the left side of the headphones, and FIG. 3 (B) is a view It is an AA 'cross
section figure in Drawing 3 (A). In FIG. 3, although the sound output unit 12L is described as an
example, the sound output unit 12R has the same structure. Here, only the sound emitting unit
12L will be described.
[0032]
The sound emission housing 120 is made of a flat insulating resin. The sound emission housing
120 may be made of a material different from or the same as that of the headband 11. When the
sound emission housing 120 and the headband 11 are made of the same material, the sound
emission housing 120 may be integrally formed with the headband 11.
[0033]
The piezoelectric actuator 20 has a flat film shape, and is mounted on a flat surface of the sound
emitting housing 12. At this time, the piezoelectric actuator 20 is mounted such that the flat film
surface of the piezoelectric actuator 20 is parallel to the flat surface of the sound output housing
120. For this attachment, for example, an adhesive may be used. The piezoelectric actuator 20
may be mounted on the surface on the inner peripheral side of the sound emitting housing 120
or may be mounted on the surface on the outer peripheral side. A protective film 121 having a
shape covering the piezoelectric actuator 20 is formed on the surface on which the piezoelectric
actuator 20 of the sound emitting housing 120 is attached. The protective film 121 is made of an
insulating material. For example, the protective film 121 is made of a PET film. By providing the
protective film 121, the piezoelectric actuator 20 can be protected from the external
environment. In addition, the piezoelectric actuator 20 can be electrically isolated from the
external environment.
[0034]
The piezoelectric actuator 20 includes a piezoelectric film 200, a first drive conductor 201, and a
second drive conductor 202. The first drive conductor 201 is formed on one main surface (flat
film surface) of the piezoelectric film 200, and the second drive conductor 202 is formed on the
other main surface (flat film surface) of the piezoelectric film 200. There is.
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[0035]
The piezoelectric film 200 is referred to as polylactic acid (hereinafter referred to as PLLA). Or
polyvinylidene fluoride (hereinafter referred to as PVDF). ) Is included as a material. The organic
piezoelectric film 200 is not limited to PLLA and PVDF, and may be a piezoelectric resin film
such as a material containing polyurea, preferably a piezoelectric resin film of a class having a
high piezoelectric constant. When PLLA is used for the organic piezoelectric film 200, the
organic piezoelectric film 200 may be formed into a rectangular shape by cutting so that each
outer periphery is approximately 45 ° in the stretching direction.
[0036]
The first and second drive conductors 201 and 202 can be made of a material containing indium
tin oxide ITO, IZO (registered trademark), zinc oxide ZnO, polythiophene, or polyaniline as a main
component. In addition, silver nanowires, carbon nanotubes, or graphene can be used for the first
and second driving conductors 201 and 202. Furthermore, when it is not necessary to have
translucency, an aluminum vapor deposition electrode can also be used. The first and second
drive conductors 201 and 202 are connected to the signal cables 14L and 14R, and a sound
emission drive signal is applied through the signal cables 14L and 14R.
[0037]
The piezoelectric actuator 20 having such a structure expands and contracts along a direction
parallel to the flat plate surface by applying the first and second driving conductors 201 and
202. The expansion and contraction of the piezoelectric actuator 20 applies a stress to the flat
sound emission housing 120, and the sound emission housing 120 vibrates in a direction
perpendicular to the flat surface. That is, the sound emission housing 120 becomes a diaphragm
and generates a sound. As a result, a sound having strong directivity is generated in the direction
perpendicular to the flat surface of the sound emitting housing 120, that is, the flat surfaces of
the sound emitting portions 12L and 12R.
[0038]
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The spacers 13L and 13R have a substantially cylindrical shape or an elliptic cylindrical shape,
and are joined to the headband 11 such that the longitudinal direction of the spacers 13L and
13R coincides with the width direction of the headband 11. The spacer 13 </ b> L is joined to an
intermediate position between the center and one end of the head band 11 in the longitudinal
direction (extending direction). The spacer 13 </ b> R is joined to an intermediate position
between the center and the other end of the head band 11 in the longitudinal direction
(extending direction). The spacers 13L and 13R are joined to the curved inner side of the
headband 11. The spacers 13L and 13R may not be bonded in advance so that the user can
change the bonding position, and the user may appropriately bond later. The spacers 13L and
13R are preferably made of a soft material such as silicon or urethane.
[0039]
With the above configuration, thin and light headphones can be realized. Furthermore, each
component can be formed of a translucent material, so that a transparent headphone can be
realized. This makes it possible to realize stylish headphones that look like they are not attached.
[0040]
The headphone 10 having such a configuration is used by being worn on the head of the user as
shown in FIGS. 1 and 2. More specifically, the headphone 10 is worn on the user's head such that
the headband 11 is disposed along the shape of the head and the sound emitting portions 12L
and 12R are disposed at a position facing the user's ear. Ru.
[0041]
In a state where the headphones 10 are not worn on the head, that is, in a state where they are
not subjected to external stress, the curvature of the headband 11 becomes tighter, so that the
sound emitting portions 12L and 12R become narrower than the user's face width. Shape.
However, since the headband 11 has elasticity by using the above-described material for the
headband 11, for example, if the user spreads both ends of the sound emitting units 12L and
12R, the headband 11 is closer to the user's head With stress, the headphones 10 can be worn
on the user's head.
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[0042]
At this time, when the spacers 13L and 13R abut on the user's head, it is possible to prevent the
sound emitting parts 12L and 12R from being in direct contact with the ears. That is, by
appropriately setting the shapes of the spacers 13L and 13R, the sound emitting portions 12L
and 12R can be brought close to each other without contacting the ears. With this configuration,
even if the headphones 10 are worn for a long time, it is possible to prevent ear aches. Further,
since the ears are not blocked by the sound emitting units 12L and 12R, it is possible to hear the
external environmental sound while listening to the sound from the headphones 10.
[0043]
Further, although the sound output units 12L and 12R using the flat film piezoelectric actuator
20 have an absolute sound pressure lower than that of the conventional sound output unit using
the electromagnetic coil, the configuration of the present embodiment Then, since the sound
emitting units 12L and 12R are in the vicinity of the ear, the volume felt by the ear can be made
to be a practically practical sound pressure level.
[0044]
Furthermore, the sound emitting units 12L and 12R using the flat film piezoelectric actuator 20
emit sound not only to the inner peripheral side of the headphone 10 but also to the outer
peripheral side, and in the bass region, the sound on the inner peripheral side and the outer
peripheral side However, since the low frequency band has a long wavelength and the sound
emitting portions 12L and 12R are in the vicinity of the ear, the sound in the low frequency band
is less likely to cause a destructive action.
Therefore, even if the headphones 10 use the sound emitting units 12L and 12R using the
piezoelectric actuator 20, a sufficiently practical sound pressure level can be obtained in the low
tone range.
[0045]
As described above, by using the configuration of the present embodiment, it is possible to
realize a thin and lightweight headphone having good sound quality characteristics.
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11
[0046]
In particular, the headphone 10 having such a configuration is more suitable for use in an indoor
environment than in an outdoor environment.
For example, it is more suitable for the aspect connected and used for a personal computer, a
tablet terminal device, and a smart phone.
[0047]
In such an environment, while listening to the sound from the headphones 10, it is possible to
hear other sounds from the room, such as a chime, a room phone, and other people's
conversations.
[0048]
In addition, the headphone 10 having such a configuration is more suitable for long-term use.
As described above, in the headphone 10 of the present embodiment, the sound emitting units
12L and 12R do not directly contact the ear. Therefore, the ear does not get hurt and the ear
canal does not get stuffy. Therefore, it does not cause discomfort even when used for a long time.
[0049]
In addition, although the example which used the piezoelectric film of 1 sheet was shown as the
piezoelectric actuator 20 of this embodiment, what laminated | stacked the piezoelectric film in
multiple layers may be used. With this configuration, the amount of expansion and contraction
with respect to the drive voltage can be increased, and the actuation characteristic can be
improved. As a result, it is possible to emit a sufficiently practical sound pressure with a noise
emission drive signal of a lower drive voltage.
[0050]
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12
Next, a headphone according to a second embodiment of the present invention will be described
with reference to the drawings. FIG. 4 (A) is a front view of a headphone according to a second
embodiment of the present invention, and FIG. 4 (B) is a left side view of the headphone
according to the second embodiment of the present invention.
[0051]
The headphone 10A of this embodiment is obtained by adding the piezoelectric sensors 15L and
15R to the headphone 10 shown in the first embodiment, and the other configuration is the same
as the headphone 10 shown in the first embodiment. It is. Therefore, only differences from the
headphone 10 shown in the first embodiment will be specifically described.
[0052]
The basic structure of the piezoelectric sensors 15L and 15R is the same as that of the
piezoelectric actuator 20. That is, the piezoelectric sensors 15L and 15R are provided with
detection conductors on both main surfaces of the piezoelectric film.
[0053]
The piezoelectric sensor 15 </ b> L is mounted between the center and one end along the
extension direction of the headband 11. More preferably, the piezoelectric sensor 15L is
mounted between the center along the extension direction of the headband 11 and the mounting
position of the spacer 13L.
[0054]
The piezoelectric sensor 15R is mounted between the center along the extension direction of the
headband 11 and the other end. More preferably, the piezoelectric sensor 15R is mounted
between the center along the extension direction of the headband 11 and the mounting position
of the spacer 13R.
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[0055]
The piezoelectric sensors 15 </ b> L and 15 </ b> R are mounted on the inner peripheral surface
of the headband 11. An insulating protective film is formed on the surface on the inner
peripheral side of the headband 11 so as to cover the piezoelectric sensors 15L and 15R.
[0056]
The piezoelectric sensors 15L and 15R are connected to a pressure detection circuit (not shown)
via detection wires (not shown). The detection wiring is formed, for example, on the headband
11, the sound emitting units 12L and 12R, and the signal cables 14L and 14R. The pressure
detection circuit is provided, for example, in a device that generates a noise emission drive signal.
[0057]
With such a configuration, when a pressure is applied to the headband 11 and the headband 11
is deformed, the piezoelectric films of the piezoelectric sensors 15L and 15R are displaced along
with the deformation of the headband 11. By detecting the charge generated by this
displacement with the detection conductor, it is possible to detect the pressing of the headband.
In the pressure detection circuit, a command corresponding to the detection signal of the
pressure is stored in advance, and the command is determined based on the detection signal, and
is given to the sound emission control unit which generates the sound emission drive signal. The
sound emission control unit changes the signal level of the sound emission drive signal or
controls the generation and stop of the sound emission drive signal according to this command.
[0058]
As described above, by using the configuration of the present embodiment, sound emission
control can be performed only by applying pressing force to the headband 11. Thereby, sound
emission control can be performed by easy operation. For example, when the left side of the
headband 11 is pressed, the signal level of the sound emission drive signal is increased. When
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the right side of the headband 11 is pressed, the signal level of the sound emission drive signal is
decreased. It can be performed.
[0059]
Here, when the left side of the headband 11 is pressed, electric charges are generated not only
from the piezoelectric sensor 15L but also from the piezoelectric sensor 15R. However, when the
left side of the headband 11 is pressed, the amount of charge generated by the piezoelectric
sensor 15L becomes larger than the amount of charge generated by the piezoelectric sensor 15R.
Therefore, the amount of charges generated by the pressure detection circuit is compared Then,
the command can be accurately detected by selecting the larger one of the generated charge
amounts.
[0060]
The actual operation may be an operation of tapping the headband 11 as well as an operation of
applying pressure. Since the signal at the time of pressing and the signal at the time of tapping
are different in waveform, the difference in this waveform may be recognized and assigned to
different operations. For example, when hitting the right side of the headband 11, the music ON /
OFF, selecting the song when hitting the left side, or increasing the volume when holding the
right side, decreasing the volume when holding the left side Etc.
[0061]
As described above, by using the configuration of the present embodiment, it is possible to
realize a thin and lightweight headphone which is excellent in sound quality characteristics and
can also perform operation input.
[0062]
Instead of the piezoelectric sensors 15L and 15R, a capacitive touch detection sensor may be
used.
In this case, signal level control of the sound emission drive signal can be received depending on
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the operation detection direction by using a capacitive position detection sensor capable of onedimensional position detection.
[0063]
Furthermore, both of the piezoelectric sensors 15L and 15R and the capacitance type position
detection sensor may be used. At this time, the piezoelectric sensors 15L and 15R and the
capacitance type position detection sensor may be disposed at different positions, or may be
disposed in a stacked manner. Thereby, various operation inputs can be received.
[0064]
For example, in the pressure detection by the piezoelectric sensors 15L and 15R, wake-up or on /
off of the operation input can be received, and the operation with respect to the signal level of
the specific sound emission drive signal can be received by the capacitance type position
detection sensor. . In this example, even if the head band 11 is carelessly touched, the signal level
control of the sound emission drive signal is not executed, and the signal level control of the
sound emission drive signal can be executed only when intended. At this time, when the
operation input can be received, the sound emitting units 12L and 12R can also emit a sound
indicating that the operation can be received.
[0065]
Although the spacers 13L and 13R are provided in the above-described embodiments, the
spacers 13L and 13R can be omitted.
[0066]
Moreover, although the case where shape (The shape which carried out the side view of the
headphones 10 and 10A) of the sound emitting parts 12L and 12R was substantially rectangular
was shown in each above-mentioned embodiment, it does not restrict to this shape.
For example, the shape shown in FIG. 5 may be used. FIG. 5 is an external perspective view
showing another aspect of the headphone according to the embodiment of the present invention.
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[0067]
In the headphone 10B, the headband 11B and the sound emitting portions 12LB and 12RB (more
precisely, the sound emitting housing 120 of the sound emitting portions 12LB and 12RB) are
integrally formed. The sound emitting units 12LB and 12RB are provided with flat film
piezoelectric actuators (not shown). The sound emitting portions 12LB and 12RB are shaped as if
a part of a sphere is cut off, and have a shape that bulges outward. Such a shape can gently cover
the ear without sealing it. At this time, the spacer may not be used.
[0068]
In addition, a disconnection detection unit may be added to the headphones of the abovedescribed embodiment. The disconnection detection unit may constitute both the sound emission
control unit and the pressure detection circuit described above. The disconnection detection unit
is connected to the piezoelectric actuator 20 via the signal cables 14L and 14R. The
disconnection detection unit applies a disconnection detection signal having a frequency higher
than that of the audible range to the piezoelectric actuator 20 through the signal cables 14L and
14R, and observes the disconnection detection signal. When disconnection occurs in the signal
cable 14L, 14R or the connection portion between the signal cable 14L, 14R and the
piezoelectric actuator 20, the disconnection detection unit closes the disconnection detection
signal including the signal cable 14L, 14R and the piezoelectric actuator 20. It can detect that it
is not flowing through the circuit. By detecting this, the disconnection detection unit can detect
the disconnection and the sound emission control unit can stop the sound emission drive signal.
At this time, since the disconnection detection signal is a signal on the higher frequency side than
the audible range, the piezoelectric actuator 20 merely acts as a capacitor with respect to the
disconnection detection signal. Therefore, almost no sound is generated by the disconnection
detection signal, and the user does not feel uncomfortable. Here, the case where only the
disconnection is detected is shown, but the impedance of the above-mentioned closed circuit is
measured by using the fact that the piezoelectric actuator acts as a capacitor to the disconnection
detection signal, and from the change of the impedance, Abnormality detection of the
piezoelectric actuator can also be performed.
[0069]
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In the above embodiment, an example is shown in which the thickness of the sound emitting
housing 120 is constant, but the thickness may be partially different, for example, the thickness
may be reduced by a range in which the piezoelectric actuator 20 is mounted. For example, the
thickness of both ends in the direction in which the piezoelectric actuator 20 extends is
increased, and the thickness of the other portion is reduced. Thereby, the sound emission
housing 120 can be vibrated more effectively.
[0070]
10, 10A, 10B: headphones 11, 11B: headbands 12L, 12R, 12LB, 12RB: sound emitting portions
13L, 13R: spacers 14L, 14R: signal cables 15L, 15R: piezoelectric sensor 20: piezoelectric
actuator 120, for sound emission Housing 121: Protective film 200: Piezoelectric film 201: First
drive conductor 202: Second drive conductor
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