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JPWO2015145795

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DESCRIPTION JPWO2015145795
Abstract: PROBLEM TO BE SOLVED: To provide a sound generator, a sound generator and an
electronic device which have a good sound quality and are not easily influenced by external
vibration. SOLUTION: A sound generator 1 of the present invention is provided with a
piezoelectric element 11 as an exciter and a piezoelectric element 11, and supports a diaphragm
12 that vibrates due to the vibration of the piezoelectric element 11, and the diaphragm 12. A
void 151 is included in the bonding material 15 including the frame 13 and the bonding material
15 interposed between the diaphragm 12 and the frame 13. [Selected figure] Figure 1
Acoustic generator, acoustic generator and electronic device
[0001]
The present invention relates to an acoustic generator, an acoustic generator and an electronic
device using a piezoelectric element.
[0002]
Conventionally, an acoustic generator using a piezoelectric element is known (see, for example,
Patent Document 1).
Such a sound generator vibrates the vibration plate by applying a voltage to the piezoelectric
element attached to the vibration plate to vibrate the vibration plate, and outputs the sound by
actively utilizing the resonance of the vibration. For example, such a sound generator is housed
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1
in a housing and used as a sound generator, and is incorporated into a small electronic device
such as a mobile computing device and used.
[0003]
WO 2012/001954
[0004]
The above-mentioned sound generator, sound generator and electronic device are required to
further improve the sound quality.
Further, there is also a demand for improvement to deterioration of sound quality due to the
influence of external vibration.
[0005]
The present invention has been made in view of the above circumstances, and an object of the
present invention is to provide a sound generator, a sound generator and an electronic apparatus
which have good sound quality and are not easily influenced by external vibration.
[0006]
The sound generator according to the present invention comprises an exciter, a diaphragm to
which the exciter is attached, which vibrates due to the vibration of the exciter, a frame
supporting the diaphragm, the diaphragm, and the frame And a bonding material interposed
therebetween, and a void is present in the bonding material.
[0007]
Further, according to another aspect of the present invention, there is provided a sound
generator including: the above-described sound generator; and a housing for housing the sound
generator.
[0008]
An electronic device according to the present invention includes the above-described sound
generator, an electronic circuit connected to the sound generator, and a case for housing the
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electronic circuit and the sound generator, and the sound generator generates sound from the
sound generator. Have a function of generating
[0009]
According to the sound generator of the present invention, by providing a void in the bonding
material, the strength of the bonding material can be varied, the resonance is divided and
dumped, and the sound pressure curve is flattened.
Therefore, since the peak dip is reduced, the sound quality is improved.
Furthermore, since the vibration from the outside such as the housing is absorbed, it is possible
to reduce the deterioration of the sound quality due to the external vibration.
[0010]
Further, according to the sound generating device and the electronic device of the present
invention, the sound generating device and the electronic device having high sound quality can
be realized because they are configured using the sound generator having improved sound
quality.
[0011]
(A) is a schematic plan view which shows an example of embodiment of the sound generator of
this invention, (b) is the AA line schematic sectional drawing shown to (a), (c) is an example of the
principal part X It is an expanded sectional view showing.
(A) is a schematic plan view which shows the other example of embodiment of the sound
generator of this invention, (b) is the AA line schematic sectional drawing shown to (a), (c) is the
principal part X It is an expanded sectional view showing an example of.
It is an expanded sectional view which shows the other example of the principal part X of the
sound generator of this invention.
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It is an expanded sectional view which shows the other example of the principal part X of the
sound generator of this invention. It is an expanded sectional view which shows the other
example of the principal part X of the sound generator of this invention. (A) is a schematic plan
view which shows the other example of embodiment of the sound generator of this invention, (b)
is an expanded sectional view which shows an example of the principal part X of the sound
generator shown to (a). is there. It is an expanded sectional view which shows the other example
of the principal part X of the sound generator of this invention. It is a graph which shows an
example of the frequency characteristic of the sound generator of a comparative example. It is a
graph which shows an example of the frequency characteristic of the sound generator of this
invention. It is a figure which shows the structure of embodiment of the sound generation
apparatus of this invention. It is a figure which shows the structure of one Embodiment of the
electronic device of this invention.
[0012]
Hereinafter, an example of an embodiment of a sound generator of the present invention will be
described with reference to the drawings.
[0013]
FIG. 1 (a) is a schematic plan view showing an example of the embodiment of the sound
generator of the present invention, and FIG. 1 (b) is a schematic sectional view taken along the
line AA shown in FIG. c) is an enlarged sectional view showing an example of the main part X.
Further, FIG. 2 (a) is a schematic plan view showing another example of the embodiment of the
sound generator of the present invention, and FIG. 2 (b) is a schematic sectional view taken along
the line AA shown in FIG. 2 (a). 2C is an enlarged sectional view showing an example of the main
part X. As shown in FIG.
[0014]
The acoustic generator 1 of the example shown in FIG. 1 has a piezoelectric element 11 as an
exciter and a piezoelectric element 11 attached thereto, and the diaphragm 12 vibrates together
with the piezoelectric element 11 by the vibration of the piezoelectric element 11, and the
diaphragm 12 And a bonding material 15 interposed between the outer periphery of the
diaphragm 12 and the frame 13, and the bonding material 15 has a void 151.
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[0015]
As an exciter which comprises the sound generator 1, the piezoelectric element 11 is used, for
example.
As a configuration in the case of using the piezoelectric element 11 as the exciter, a surface
electrode layer provided on the surface, an internal electrode layer including a laminate formed
by laminating a piezoelectric layer and an internal electrode layer into a plate shape. It is
preferable to use a form provided with an external electrode or the like provided on the side
surface from which.
[0016]
The piezoelectric element 11 is attached by being attached to the surface of the diaphragm 12 or
the like, and excites the diaphragm 12 by vibrating upon receiving an applied voltage. In the case
where the piezoelectric element 11 is used as an exciter, the piezoelectric element 11 includes,
for example, a piezoelectric body layer made of four layers of ceramic, a laminate in which three
layers of internal electrode layers are alternately laminated, and A surface electrode layer formed
on the upper surface and the lower surface, and an external electrode formed on the side surface
from which the internal electrode layer is drawn.
[0017]
The piezoelectric layer constituting the piezoelectric element 11 is formed of a ceramic having
piezoelectric characteristics, and as such ceramics, lead zirconate titanate, lithium niobate,
lithium tantalate, Bi layered compound Conventional piezoelectric ceramics such as lead-free
piezoelectric materials such as tungsten bronze structure compounds can be used. The thickness
of one layer of the piezoelectric layer is preferably set to, for example, 0.01 to 0.1 mm in order to
drive at a low voltage. Further, in order to obtain a large flexural vibration, it is preferable to have
a piezoelectric constant d31 of 200 pm / V or more.
[0018]
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Further, the internal electrode layer constituting the piezoelectric element 11 is formed by cofiring with the ceramic forming the piezoelectric layer, and is composed of the first internal
electrode layer and the second internal electrode layer. The piezoelectric layer is alternately
stacked with the piezoelectric layers sandwiching the piezoelectric layers from above and below,
and by arranging the first internal electrode layer and the second internal electrode layer in the
stacking order, the piezoelectric body sandwiched between them A drive voltage is applied to the
layer. Various metal materials can be used as a material for forming the internal electrode layer.
For example, a conductor containing silver or silver-palladium as a main component, which has
low reactivity with piezoelectric ceramics, or a conductor containing copper, platinum or the like
can be used, but these may contain a ceramic component or a glass component. . When the
internal electrode layer is made of a material containing a metal component of silver and
palladium and a ceramic component of the piezoelectric layer, the stress due to the thermal
expansion difference between the piezoelectric layer and the internal electrode layer is reduced.
As a result, it is possible to obtain a piezoelectric element 11 free from stacking faults.
[0019]
As the exciter, for example, a piezoelectric element 11 is preferably made of a plate-like body
whose main surface on the upper surface side and the lower surface side has a polygonal shape
such as a rectangular shape or a square shape, or a circular shape or an elliptical shape. The
sound generator 1 can be made thin by using the piezoelectric element 11 and the diaphragm 12
and frame 13 described later.
[0020]
Furthermore, it is preferable to make the piezoelectric element 11 into a bimorph structure.
That is, it is preferable that the polarization direction with respect to the direction of the electric
field applied at a certain moment be polarized so as to be reversed on one side and the other side
in the thickness direction. Since the diaphragm can be efficiently vibrated with a small amount of
energy as well as contributing to thinning, a high-volume sound generator can be obtained.
[0021]
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The diaphragm 12 which comprises the sound generator 1 can be formed using various
materials, such as resin and a metal. For example, the diaphragm 12 can be made of a resin film
of polyethylene, polyimide, acrylic resin or the like having a thickness of 0.4 mm to 1.5 mm.
[0022]
A piezoelectric element 11 as an exciter is attached to the diaphragm 12. Specifically, the main
surface of the piezoelectric element 11 is bonded to the main surface of the diaphragm 12 with
an adhesive such as epoxy resin.
[0023]
The vibration plate 12 vibrates together with the exciter (piezoelectric element 11) by the
vibration of the exciter (piezoelectric element 11). For example, when the piezoelectric element
11 is a piezoelectric element having a bimorph structure, a lead wire is connected to the external
electrode, and an electric signal is input to the piezoelectric element through the lead wire (when
a voltage is applied), At a certain moment, the piezoelectric layer on the side (lower surface side
of the piezoelectric element 11) bonded to the diaphragm 12 shrinks in the in-plane direction
perpendicular to the stacking direction, and the piezoelectric layer on the upper surface side of
the piezoelectric element 11 extends in the stacking direction It is deformed so as to extend in
the vertical in-plane direction, and is bent toward the diaphragm 12 side. Therefore, by applying
an alternating current signal to the piezoelectric element 11, the piezoelectric element 11 can be
bent and vibrated, and can be bent and vibrated to the diaphragm 12. Note that a flexible printed
circuit (FPC) can be used instead of the lead wire, which is advantageous for thinning.
[0024]
A frame 13 is provided to support the outer peripheral portion of the diaphragm 12. As the
frame 13, for example, a frame member whose inner peripheral shape and outer peripheral
shape are rectangular can be used. In the example shown in FIG. 1, the frame 13 is formed of a
single frame member, and the outer periphery of the diaphragm 12 is attached to the frame 13
to constitute the sound generation unit 10. On the other hand, in the example shown in FIG. 2,
the frame 13 is composed of two frame members 131 and 132, and supports the diaphragm 123
by sandwiching the outer peripheral portion of the diaphragm 12. An outer peripheral portion of
the diaphragm 12 is sandwiched and fixed by two frame members 131 and 132 which constitute
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the frame 13. Thus, the diaphragm 12 is supported by the frame 13 in a stretched state within
the frame of the frame 13. The portion of the diaphragm 12 in FIG. 1 located inside the frame 13
and the portion of the diaphragm 12 in FIG. 2 not sandwiched by the two frame members 131
and 132 that make up the frame 13 , Is able to vibrate freely.
[0025]
There are no particular limitations on the thickness, material, and the like of the two frame
members 131 and 132 that constitute the frame 13. The frame 13 can be formed using various
materials such as metal, resin, and glass. For example, stainless steel having a thickness of 0.1 to
5.0 mm can be suitably used as the frame 13 and the frame members 131 and 132 forming the
frame 13 because of excellent mechanical strength and corrosion resistance. . Moreover, as a
width | variety of the frame members 131 and 132 which comprise the frame 13 and the frame
13, the thing of 1.2-10.0 mm is used, for example. In addition, although the shape of the area |
region of the inner side has shown the substantially rectangular shape in FIG. 1 and FIG. 2, it may
be polygons, such as a parallelogram, a trapezoid, and a regular n square, It may be oval or oval.
[0026]
Further, even if the sound generator 1 is provided so as to cover the surfaces of the piezoelectric
element 11 and the diaphragm 12 in the frame of the frame 13, the sound generator 1 further
includes the resin layer 14 vibrating with the piezoelectric element 11 and the diaphragm 12.
Good.
[0027]
The resin layer 14 is preferably formed, for example, using an acrylic resin so that the Young's
modulus is in the range of, for example, 1 MPa to 1 GPa.
The resin layer 14 may not necessarily be provided to cover the surface of the piezoelectric
element 11, but by being provided until the surface of the piezoelectric element 11 is covered
(the piezoelectric element 11 is embedded in the resin layer 14) Since an appropriate damping
effect can be induced, it is possible to suppress the resonance phenomenon and to suppress
peaks and dips in the frequency characteristic of sound pressure. In the drawing, the resin layer
14 is formed to have the same height as the frame 13, but the resin layer 14 may be formed to
be higher than the height of the frame 13.
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[0028]
Here, the diaphragm 12, the frame 13, the bonding material 15, and the resin layer 14 can be
integrated and can be regarded as a composite vibrator that vibrates as a whole.
[0029]
In addition, although the case where one exciter (piezoelectric element 11) is illustrated in the
figure, the number of exciters (piezoelectric elements 11) is not limited.
Although the figure shows the case where the piezoelectric element 11 is provided on one main
surface of the diaphragm 12, the piezoelectric element 11 may be provided on both sides of the
diaphragm 12. Further, although a bimorph-type laminated piezoelectric element has been
described as an example of the piezoelectric element 11, it may be a unimorph-type piezoelectric
element.
[0030]
The sound generator 1 of the present embodiment includes the bonding material 15 interposed
between the outer peripheral portion of the diaphragm 12 and the frame 13, and the bonding
material 15 has a void 151.
[0031]
According to this configuration, the strength of the bonding material 15 can vary, and the
resonance of the composite vibration body in which the diaphragm 12, the frame 13, the
bonding material 15, and the resin layer 14 are integrated is divided, dumped, and sound
pressure The curve is flattened.
Therefore, since the peak dip is reduced, the sound quality is improved. Furthermore, since the
external vibration of the housing, the frame 13 and the like is absorbed, the reduction in sound
quality due to the external vibration can be reduced.
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[0032]
As shown in FIG. 2, when the frame 13 is composed of two frame members 131 and 132, it is
interposed between the outer peripheral portion of the diaphragm 12 and the frame member
131 on the side where the piezoelectric element 11 is disposed. It is preferable that the bonded
member 15 includes a void 151 and the bonded member 15 interposed between the outer
peripheral portion of the diaphragm 12 and the frame member 132 on the side on which the
piezoelectric element 11 is not disposed. However, the configuration may have a void 151 in only
one of the bonding materials 15.
[0033]
As the bonding material 15, for example, an adhesive such as a UV-curable resin, a thermosetting
resin (acrylic resin), an anaerobic UV-curable resin, or a UV thermosetting resin is used.
Specifically, acrylic resin, epoxy resin, silicone resin, polyester resin and the like are used. For
example, by using an acrylic adhesive as the bonding material 15, it is soft and can contribute to
peak dip suppression. The thickness of the bonding material 15 is, for example, 10 to 80 μm.
[0034]
As a method of bonding the diaphragm 12 to the frame 13 in the case of using an adhesive made
of a UV-curable resin as the bonding material 15, the front and back of the diaphragm 12 in a
tensioned state are subjected to excimer treatment, A UV curable resin is applied on the upper
surface of the plate 12 in the form of a frame 13 (frame member 131) using a method such as
printing or a dispenser. Then, after the primer is applied to the frame 13 (frame member 131)
and dried, the frame 13 (frame member 131) is slowly placed on the UV curable resin. After that,
it is pressed from above, and it is further irradiated with UV to cure. When bonding the frame 13
(frame member 132) under the diaphragm 12, a UV curable resin is formed on the lower surface
of the diaphragm 12 in a frame 13 (frame member 132) shape using a method such as printing
or dispenser It is good to apply | coat and to set it as the method similar to the following below.
Moreover, when using the adhesive agent which consists of thermosetting resin as the joining
material 15, when making it harden | cure, it may replace with said UV irradiation and should
just be heated. UV heat curing is also the same.
[0035]
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10
Various methods can be used as a method of forming the void 151 in the bonding material 15
for bonding the diaphragm 12 and the frame 13. For example, the void 151 can be produced in
the bonding material 15 by stirring so as to entrap air when stirring with a stirrer. Alternatively,
a method may be used in which the bonding material 15 is cured after the void 151 is formed by
applying the bonding material 15 before curing and injecting a gas into a desired place of the
bonding material 15. For example, by applying the gas through the tube while moving the tip of
the tube along the boundary, the void 151 is formed by applying the tip of the thin tube to the
boundary between the bonding material 15 and the frame 13 or the diaphragm 12 and moving
the tip of the tube along the boundary Thereafter, the bonding material 15 is cured, whereby the
void 151 can be provided at the boundary with the frame 13 or the diaphragm 12. Alternatively,
a method may be used in which the bonding material 15 before curing is applied to the surface
of the frame 13 after the hollow resin spheres are disposed in desired locations. Alternatively, the
void 151 may be moved by vacuum degassing to be positioned on the outer peripheral side of
the bonding material 15. Also, hollow resin balls may be mixed with the bonding material 15
before curing. Further, by partially applying the bonding material 15, the void 151 can penetrate
the bonding material 15 from the boundary with the diaphragm 12 to the boundary with the
frame 13.
[0036]
Here, as shown in FIG. 3, it is preferable that the void 151 face the boundary between the
diaphragm 12 and the bonding material 15 or the boundary between the frame 13 and the
bonding material 15. The existence of the void 151 facing these boundaries makes it easy for the
bonding material 15 to follow the change in vibration, and further makes it difficult for the
bonding material 15 to transmit external vibration to the diaphragm 12, so that the sound quality
is further improved. . In addition, the void 151 facing the boundary between the diaphragm 12
and the bonding material 15 or the boundary between the frame 13 and the bonding material 15
is not a perfect sphere, and the void 151 with the boundary with the diaphragm 12 or the frame
13 It is preferable that the shape is expanded in a direction (direction parallel to the boundary) in
contact with the boundary. Thus, the area of the void 151 facing the boundary with the
diaphragm 12 or the boundary with the frame 13 can be increased, so that the above-described
effect can be improved.
[0037]
The boundary between the diaphragm 12 and the bonding member 15 is a surface where the
diaphragm 12 and the bonding member 15 are in contact, and the boundary between the frame
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11
13 and the bonding member 15 is the frame 13 and the bonding member 15 It means the face
that is in contact with.
[0038]
Further, as shown in FIG. 4, it is preferable that the void 151 penetrates the bonding material 15
from the boundary between the diaphragm 12 and the bonding material 15 to the boundary
between the frame 13 and the bonding material 15.
By providing the void 151 penetrating between the frame 13 and the diaphragm 12, the
vibration passing through the void 151 is also generated without passing through the bonding
material 15, so the arrival time of the vibration is shifted and the vibration due to the external
vibration is It has the effect of making it smaller and the sound quality is even better.
[0039]
Further, as shown in FIG. 5, it is preferable that the void 151 be present at the outer peripheral
end of the bonding material 15. Here, the end on the outer peripheral side of the bonding
material 15 is the end of the bonding material 15 on the side corresponding to the outer
periphery of the diaphragm 12, and the distance from the outer wall surface of the bonding
material 15 is 20 of the entire width. It refers to the range of up to%. By thus providing the void
151 at the end of the bonding material 15 on the outer peripheral side, it is easy to follow
deformation due to external pressure, and the durability is improved.
[0040]
As shown in FIGS. 1 and 2, the void 151 does not have to be in contact with the diaphragm 12
and the frame 13. This can prevent the development of a crack in the bonding material 15 due to
vibration, and vibration The peeling of the plate 12 can be prevented, and the lowering of the
tension of the diaphragm 12 can be prevented.
[0041]
When the void 151 contained in the bonding material 15 is, for example, spherical, the diameter
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12
of one void 151 is, for example, 10 to 120 μm, for example 50 to 150% of the thickness (0.01
mm to 0.08 mm) of the bonding material 15 It is set.
When the void 151 has an irregular shape, for example, the projected area equivalent circle
diameter (diameter of a circle having the same area as the projected area of the void 151) is set
to 10 to 120 μm.
[0042]
The voids 151 included in the bonding material 15 may be dispersed in the entire
circumferential direction in a plan view, and may be biased in the circumferential direction at this
time. The voids 151 included in the bonding material 15 are unevenly present in the
circumferential direction, that is, the ratio of the voids 151 in the bonding material 15 is different
in the circumferential direction to divide the resonance, making it difficult to align the resonance
frequencies, The effect of suppressing the peak dip can be obtained. The ratio of the void 151 in
the bonding material 15 is set, for example, in the range of 0.1 to 25% of the area ratio of the
void 151 viewed in the cross section.
[0043]
Further, as shown in FIG. 6, the bonding material 15 has a protruding portion 150 which
protrudes from the inner edge of the frame 13, and the amount of protruding of the protruding
portion 150 is not good when the entire inner edge of the frame 13 is viewed. It may be uniform.
For example, the protruding portion 150 has the same thickness over the entire circumference,
and the protruding distance of the protruding portion 150 (the distance from the inner edge of
the frame 13) is different when viewed over the entire circumference. Then, in the region inside
the inner edge of the frame 13, the region vibrating with the diaphragm 12 alone and the region
vibrating with the structure in which the diaphragm 12 and the bonding material 15 are joined
are mixed, and the respective resonance conditions are different. As a result, the resonance
frequencies are difficult to be aligned, peak dip can be further suppressed, and sound quality can
be improved.
[0044]
When the entire inner edge of the frame 13 is viewed as being uneven, it is known that when the
entire inner edge of the frame 13 is viewed, at least one location has a different amount of
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overhang than other portions. It means that there is a portion 150, and the present invention is
not limited to the presence of a protruding portion 150 having a protruding amount different
from other portions on each side of the inner edge of the frame 13.
[0045]
Further, as an example in which the amount of protrusion is nonuniform, there may be
mentioned a form in which the thickness of the protrusion 150 which differs at the same
distance is different, and a configuration in which both the distance and thickness of the
protrusion 150 which are different are different.
[0046]
In addition, as a protrusion width (a protrusion distance) of the protrusion part 150, it is 0.5 mm2.0 mm, preferably 0.1 mm-1.0 mm, for example in the cross section of FIG.6 (b).
[0047]
Furthermore, as shown in FIG. 7, it is preferable that the protruding portion 150 protruding from
the inner edge of the frame 13 also be provided with a void 151, which not only differs in the
resonance condition but also how the vibration is transmitted by the void 151. As a result of the
change, the resonance frequencies become more difficult to be aligned, and peak dip can be
further suppressed.
[0048]
Here, the difference in sound quality (frequency characteristic of sound pressure) between the
case of using a bonding material not containing voids (FIG. 8) and the case of using a bonding
material containing voids (FIG. 9) will be described.
[0049]
8 and 9 are graphs showing an example of the frequency characteristic of sound pressure.
FIG. 8 shows the frequency characteristics of the sound pressure when the bonding material does
not contain voids.
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14
Further, FIG. 9 shows the frequency characteristics of the sound pressure in the case where all
the voids which are connected and penetrate the bonding material 15 in the boundary of the
bonding material 15 and in the bonding material 15 are included.
In the graphs shown in FIGS. 8 and 9, the horizontal axis indicates the frequency, and the vertical
axis indicates the sound pressure.
The sound generators whose frequency characteristics of the sound pressure shown in FIGS. 8
and 9 were measured had the same configuration except for the presence or absence of voids,
that is, the respective members, their dimensions and materials.
[0050]
The peaks and dips respectively located in the frequency band of 700 Hz to 1.4 kHz and the
frequency band of 4 kHz to 7 kHz in FIG. 8 and the frequency band of 700 Hz to 1.5 kHz and 4
kHz to 8 kHz shown in FIG. It can be seen that the peaks and dips are clearly smaller than the
peaks and dips in the graph shown in FIG.
[0051]
As described above, when the bonding material 15 contains the void 151, the peak and dip
become smaller in most of the frequency band compared with the case where the void is not
contained, and the flatness of the sound pressure is improved and the sound is generated. The
frequency characteristic of pressure is improved.
[0052]
Next, an example of the embodiment of the sound generator of the present invention will be
described.
[0053]
The sound generation device 20 is a sound generation device such as a so-called speaker, and
includes, for example, a sound generator 1 and a housing 30 for housing the sound generator 1
as shown in FIG. 10.
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15
The housing 30 resonates the sound emitted by the sound generator 1 internally, and radiates
the sound to the outside from an opening (not shown) formed in the housing 30.
The housing 30 can be formed using, for example, various materials such as metals such as
aluminum and magnesium alloy, and resins such as polycarbonate.
By including such a housing 30, sound pressure in, for example, a low frequency band can be
increased.
[0054]
The sound generation device 20 can be used alone as a speaker, and can be suitably incorporated
into a portable terminal, a flat-screen television, a tablet terminal, or the like as described later.
In addition, it can be incorporated into home appliances such as refrigerators, microwave ovens,
vacuum cleaners, washing machines, etc., for which sound quality has not been emphasized
conventionally.
[0055]
According to the sound generation device 20 of the present example, the sound generation
device with high sound quality can be obtained because it is configured using the sound
generator 1 with improved sound quality.
[0056]
Next, an electronic device equipped with a sound generator will be described with reference to
FIG.
FIG. 11 is a view showing the configuration of the electronic device 50 according to the
embodiment. In the drawings, only components necessary for the description are shown, and
description of general components is omitted.
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16
[0057]
As shown in FIG. 11, the electronic device 50 of the present example includes an acoustic
generator 1, an electronic circuit 60 connected to the acoustic generator 1, and a case 40 that
accommodates the electronic circuit 60 and the acoustic generator 1. It has a function to
generate sound from the sound generator 1. In the example illustrated in FIG. 11, the electronic
device 50 is a mobile terminal device such as a mobile phone or a tablet terminal.
[0058]
As shown in FIG. 11, the electronic device 50 includes an electronic circuit 60. The electronic
circuit 60 includes, for example, a controller 50a, a transmitting / receiving unit 50b, a key input
unit 50c, and a microphone input unit 50d. The electronic circuit 60 is connected to the sound
generator 1 and has a function of outputting an audio signal to the sound generator 1. The sound
generator 1 generates a sound based on the sound signal input from the electronic circuit 60.
[0059]
In addition, the electronic device 50 includes the display unit 50e, the antenna 50f, and the
sound generator 1, and includes the housing 40 that accommodates these devices. Although FIG.
11 shows a state in which all the devices including the controller 50a are housed in one housing
40, the housing form of the devices is not limited. In the present embodiment, at least the
electronic circuit 60 and the sound generator 1 may be accommodated in one housing 40.
[0060]
The controller 50 a is a control unit of the electronic device 50. The transmitting and receiving
unit 50b transmits and receives data via the antenna 50f based on the control of the controller
50a. The key input unit 50c is an input device of the electronic device 50, and receives a key
input operation by the operator. The microphone input unit 50d is also an input device of the
electronic device 50, and receives a voice input operation and the like by the operator. The
display unit 50 e is a display output device of the electronic device 50, and outputs display
information based on the control of the controller 50 a.
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[0061]
The sound generator 1 then operates as a sound output device in the electronic device 50. The
sound generator 1 is connected to the controller 50a of the electronic circuit 60, and emits a
sound in response to the application of a voltage controlled by the controller 50a.
[0062]
Although the electronic device 50 has been described as a portable terminal device in FIG. 11, it
does not ask the type of the electronic device 50, and may be applied to various consumer
devices having a function of emitting sound. . For example, flat-screen TVs and car audio devices
may be used for various products such as vacuum cleaners, washing machines, refrigerators,
microwave ovens and the like, as a matter of course, products having a function of emitting
sound, for example.
[0063]
According to the electronic device 50 of this example, since the electronic device 50 is
configured using the sound generator 1 with improved sound quality, it is possible to obtain an
electronic device with high sound quality.
[0064]
Next, a mobile terminal equipped with a sound generator will be described.
[0065]
As shown in FIG. 11, the portable terminal of this example includes an acoustic generator 1, an
electronic circuit 60 connected to the acoustic generator 1, a case 40 accommodating the
electronic circuit 60 and the acoustic generator 1, and a display And has a function of generating
sound from the sound generator 1.
[0066]
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That is, in the electronic device 50 described above, the portable terminal according to the
present embodiment is configured to include a display that is a display device having a function
of displaying image information as the display unit 50e shown in FIG.
For example, known displays such as liquid crystal displays and organic EL displays can be
suitably used.
The display may have an input device such as a touch panel.
[0067]
Here, the bonding member for bonding the sound generator 1 to the housing 40 is a bonding
member including a visco-elastic body at least in part.
The joining member may be a single body consisting only of a visco-elastic body or a composite
body consisting of several members including a visco-elastic body. As such a joining member, for
example, a double-sided tape or the like in which an adhesive is attached to both sides of a base
material layer made of non-woven fabric or the like can be suitably used. The thickness of the
bonding member is set to, for example, 0.1 mm to 0.6 mm.
[0068]
As the electronic circuit 60, for example, a circuit that processes image information to be
displayed on a display or audio information transmitted by a mobile terminal, a communication
circuit, and the like can be exemplified. At least one of these circuits may be included, or all of the
circuits may be included. Alternatively, a circuit having another function may be used.
Furthermore, a plurality of electronic circuits may be included. The electronic circuit and the
sound generation unit are connected by connection wiring.
[0069]
A part of the housing 40 may be a display, or a part of the housing 40 may be a cover of the
display and the display may be disposed inside the cover.
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[0070]
Note that the portable terminal has a communication unit (communication unit) that transmits
and receives data via an antenna or the like.
For example, a mobile phone represented by a smartphone, a tablet PC, a mobile device such as a
notebook PC, a game machine, etc. may be mentioned.
[0071]
Since such a portable terminal is configured using the sound generator 1 with improved sound
quality, a high-quality portable terminal can be realized.
[0072]
DESCRIPTION OF SYMBOLS 1 sound generator 11 piezoelectric element 12 diaphragm 13 frame
131, 132 frame member 14 resin layer 15 bonding material 151 bonding material 151 void 20
sound generator 30, housing 50 electronic device 50a controller 50b transmission / reception
unit 50c key input unit 50d microphone input Unit 50e Display unit 50f Antenna 60 Electronic
circuit
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