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JP2004356900

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DESCRIPTION JP2004356900
An object of the present invention is to reduce manufacturing costs by improving assembling
workability and to prevent an adverse effect on ultrasonic tomographic images. SOLUTION: An
ultrasonic vibrator 1 has an insulating member 3 made of epoxy resin or the like adhered to the
inner peripheral surface of a conductive housing 2, and a backing for absorbing the vibration of
ultrasonic waves in the inner peripheral surface of the insulating member 3. The material 4 is
adhered. The piezoelectric element 5 provided with electrodes on both sides is fixed to the upper
end portion of the backing material 4. The piezoelectric element 5 is provided with protruding
portions 42 at two positions on the outer periphery of a circular portion 41 formed to have the
same diameter as the backing material 4 or a smaller diameter than the backing material 4. One
end of the GND wire 9 is soldered to the surface electrode 7 of the protrusion 42 by the GND
solder 10. [Selected figure] Figure 1
Ultrasonic transducer
[0001] The present invention relates to an ultrasonic transducer for transmitting and receiving
ultrasonic waves by focusing an ultrasonic beam generated from a piezoelectric element. [0002]
In recent years, ultrasonic waves are irradiated to a living body, and ultrasonic waves reflected by
a change part of acoustic impedance in the living body are received, converted into electric
signals, and imaged to form an ultrasonic tomographic image. Ultrasonic diagnostic apparatuses
for obtaining an image are widely used. Further, for example, an ultrasonic transducer is
provided at the tip of an endoscope insertion portion which can be inserted into a body cavity
such as a digestive tract, and ultrasonic endoscope imaging in which an ultrasonic tomographic
image is obtained by this ultrasonic transducer A mirror is also put into practical use (see, for
example, Patent Document 1). FIG. 13 is a plan view of an ultrasonic transducer used in such a
conventional ultrasonic endoscope, and FIG. 14 is a cross-sectional view taken along the line C-C
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in FIG. As shown in FIGS. 13 and 14, the ultrasonic transducer 101 first bonds the insulating
member 103 made of epoxy resin or the like to the inner peripheral surface of the conductive
housing 102, and further, the inside of the insulating member 103. A backing material 104 that
absorbs ultrasonic vibration is adhered to the circumferential surface. The piezoelectric element
105 is fixed to the upper end portion of the backing material 104. The piezoelectric element 105
has a front electrode 107 and a back electrode 108 attached to the front and back surfaces of the
piezoelectric body 106, respectively. One end of the GND wire 109 is soldered to the surface
electrode 107 by the GND solder 110. The other end of the GND wire 109 is soldered to the
housing 102 by a solder 111. The transmission line 120 is for applying an electrical signal to the
piezoelectric element 105, and includes cables 121 and 122. The transmission line 120 is
inserted into a notch 112 formed in the housing 102. The cable 121 is soldered to the housing
102 by the solder 113. With such a structure, the surface electrode 107 is conducted to the
cable 121 through the housing 102 and dropped to the GND. The cable 122 is electrically
connected to the back electrode 108 using a conductive adhesive 115 through a through hole
114 formed in the backing material 104. Transmission and reception of ultrasonic waves are
transmitted to the back electrode 108 by conduction of the cable 122. In addition, an acoustic
lens 131 for focusing an ultrasonic beam is provided on the surface electrode 107 side of the
piezoelectric element 105.
In the manufacturing process of the ultrasonic transducer 101, after the GND wire 109 is
soldered to the housing 102 and the surface electrode 107, the center of the piezoelectric
element 105 is aligned with the center of the lens type and filled with a lens agent. The acoustic
lens 131 is molded. Since the acoustic lens 131 is a concave lens, efforts are made to prevent
interference between the lens type and the GND solder 110 by minimizing the size of the GND
solder 110 or the like. Here, in the diagnosis by the ultrasonic endoscope, there is a need to
observe a lesion site in more detail and improve the diagnostic ability. In order to meet this need,
it is necessary to squeeze the ultrasonic beam to improve the resolution of the ultrasonic
transducer. FIGS. 15 and 16 are explanatory views showing the relationship between the
diameter of the piezoelectric element 105 and the ultrasonic beam. FIG. 15 shows the case where
the diameter of the piezoelectric element 105 is large, and FIG. Is shown. In general, by reducing
the diameter of the piezoelectric element 105, the thickness of the ultrasonic beam 133 output
from the piezoelectric element 105 via the acoustic lens can be reduced. Therefore, as shown in
FIGS. 15 and 16, since the diameter D2 of the piezoelectric element 105 is smaller than D1, the
thickness D12 of the ultrasonic beam 133 outputted from the piezoelectric element 105 through
the acoustic lens is thinner than D11. That is, in order to narrow the ultrasonic beam 133, the
diameter reduction of the piezoelectric element 105 is an effective means. FIG. 17 is a plan view
of the ultrasonic transducer with a reduced diameter, and FIG. 18 is a cross-sectional view taken
along the line DD of FIG. [Patent Document 1] Japanese Patent Application Laid-Open No. 2002345817 (pages 2-5, FIG. 1-15) SUMMARY OF THE INVENTION However, such conventional
ultrasonic vibration When the diameter of the piezoelectric element 105 is reduced as shown in
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FIG. 17, since the GND solder 110 approaches the center of the piezoelectric element 105 as
shown in FIG. 17, the lens mold 132 and the GND solder 110 interfere with each other as shown
in FIG. There is also a limit to making the GND solder 110 smaller. Therefore, in order to avoid
this interference, the lens mold 132 has to be provided with a “relief” that avoids the GND
solder 110. When this "relief" is provided, the process of assembling the "relief" of the lens mold
132 to the position of the GND solder 110 occurs by soldering the GND solder 110 to the correct
position, so the assembly operation becomes complicated, Manufacturing cost is high.
In addition, when the diameter of the piezoelectric element 105 is reduced, the ratio of the area
of the solder to the area of the entire piezoelectric element 105 is increased. Originally, it is
preferable that the piezoelectric element 105 vibrate in a circular shape, but since the solder
portion of the piezoelectric element 105 is hard, it does not vibrate substantially and the
vibrating portion of the piezoelectric element 105 moves away from a circular shape to
deteriorate the ultrasonic tomographic image I will. The present invention has been made in view
of the above-mentioned circumstances, and by improving the assembling workability, the
manufacturing cost is reduced, and an adverse effect on the ultrasonic tomographic image is
prevented, and the ultrasonic vibration with high resolution is achieved. Intended to provide
children. In order to achieve the above object, an ultrasonic transducer according to claim 1
comprises a piezoelectric element for transmitting and receiving ultrasonic waves, and electrodes
provided on both sides of the piezoelectric element. A signal transmission unit connected to the
electrodes, a damping unit provided on a back surface of the piezoelectric element to give an
acoustic damping action to the back surface of the piezoelectric element, and focusing an
ultrasonic beam generated from the piezoelectric element It is characterized in that it comprises
focusing means and at least one or more protrusions provided on the piezoelectric element. An
ultrasonic transducer according to claim 2 is the ultrasonic transducer according to claim 1,
characterized in that the signal transmission means is connected to the projection. The ultrasonic
vibrator according to claim 3 is connected to a piezoelectric element for transmitting and
receiving an ultrasonic wave, one and the other electrodes respectively provided on one and the
other surfaces of the piezoelectric element, and these electrodes Signal transmission means,
damping means provided on the back of the piezoelectric element to give an acoustic damping
action to the back of the piezoelectric element, and focusing means for focusing the ultrasonic
beam generated from the piezoelectric element The outer dimensions of one or both of the one
and the other electrodes are different from the outer dimensions of the piezoelectric element. An
ultrasonic transducer according to claim 4 is the ultrasonic transducer according to claim 3,
wherein the one electrode is larger than the other electrode. An ultrasonic transducer according
to a fifth aspect is the ultrasonic transducer according to the third aspect, wherein the signal
transmission means is connected to the part of the difference in area of the one and the other
electrodes. It is characterized by An ultrasonic transducer according to claim 6 is the ultrasonic
transducer according to claim 3, characterized in that a projection is provided on at least one of
the one and the other electrodes. I assume.
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An ultrasonic transducer according to a seventh aspect is the ultrasonic transducer according to
the sixth aspect, wherein the signal transmission means is connected to the projection of the
electrode. Embodiments of the present invention will be described below with reference to the
drawings. First Embodiment FIGS. 1 to 8 relate to a first embodiment of the present invention,
FIG. 1 is a front view of an ultrasonic transducer, and FIG. 2 is a sectional view taken along line AA of FIG. FIG. 3 is an explanatory view showing a method of manufacturing the piezoelectric
element, and FIGS. 4 to 8 are explanatory views showing first to fifth manufacturing steps of the
entire ultrasonic transducer. (Configuration) As shown in FIGS. 1 and 2, in the ultrasonic vibrator
1, first, the insulating member 3 made of epoxy resin or the like is bonded to the inner peripheral
surface of the conductive housing 2, and further insulation is provided. A backing material 4 that
absorbs ultrasonic vibration is adhered to the inner peripheral surface of the member 3. A
piezoelectric element 5 having electrodes provided on both sides is fixed to the upper end
portion of the backing material 4. The piezoelectric element 5 has a front surface electrode 7
attached to the front surface of the piezoelectric body 6 and a back surface electrode 8 attached
to the back surface of the piezoelectric body 6. The piezoelectric element 5 has a circular portion
41 formed to have a diameter smaller than that of the backing material 4, and two protruding
portions 42 are provided on the outer periphery of the circular portion 41. The planar shapes of
the piezoelectric body 6, the surface electrode 7, and the back surface electrode 8 are all the
same. One end of the GND wire 9 is soldered to the surface electrode 7 of the projection-shaped
portion 42 by the GND solder 10. The other end of the GND wire 9 is soldered to the housing 2
by a solder 11. The transmission line 20 is for applying an electrical signal to the piezoelectric
element 5 and includes cables 21 and 22. The transmission line 20 is inserted into the notch 12
formed in the housing 2. The cable 21 is soldered to the housing 2 by the solder 13. Through
holes 14 are formed in the backing material 4. Thereby, the surface electrode 7 is conducted to
the cable 21 through the housing 2 and dropped to GND. The cable 22 is electrically connected
to the back electrode 8 using the conductive adhesive 15 through the through hole 14 of the
backing material 4. Transmission and reception of ultrasonic waves are transmitted to the back
electrode 8 by the conduction of the cable 22. In addition, an acoustic lens 31 for focusing an
ultrasonic beam is provided on the surface electrode 7 side of the piezoelectric element 5 and the
periphery thereof.
With such a structure, the piezoelectric element 5 transmits and receives ultrasonic waves. The
front surface electrode 7 and the back surface electrode 8 are one and the other electrodes
provided on the one and the other surfaces of the piezoelectric element 5 respectively. The
housing 2, the GND wire 9, the GND solder 10, the solder 13, the conductive adhesive 15 and the
cables 21 and 22 are signal transmission means connected to the electrodes 7 and 8. The
backing material 4 is provided on the back surface of the piezoelectric element 5 to give an
acoustic damping action to the back surface of the piezoelectric element 5. The acoustic lens 31
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serves as focusing means for focusing the ultrasonic beam generated from the piezoelectric
element 5. The protrusion shaped portion 42 is at least one protrusion portion provided on the
piezoelectric element 5. (Operation) Hereinafter, a method of manufacturing the ultrasonic
transducer 1 according to the first embodiment will be described. First, as shown in FIG. 3, a
plate-shaped piezoelectric element material 55 is prepared. The piezoelectric element material
55 is obtained by attaching a front surface electrode material 57 and a back surface electrode
material 58 to the front surface and the back surface of the piezoelectric material 56,
respectively. Next, the punch 50 is prepared. The punch 50 is provided with protruding portions
52 at two positions on the outer periphery of the cylindrical portion 51. In the present
embodiment, the projection shaped portion 42 is provided on the piezoelectric element 5 by
cutting out the electric element material 55 with the punch 50 provided with the projection
shaped portion 52. However, as a method of cutting out the electric element material 55, a laser
processing machine or a water jet processing machine may be used. The steps up to the molding
process of the acoustic lens 31 in the ultrasonic transducer 1 will be described below with
reference to FIGS. 4 to 8. First, the conductive housing 2 shown in FIG. 4 is prepared, the
insulating member 3 is adhered to the inner peripheral surface of the housing 2 as shown in FIG.
5, and the inner peripheral surface of the insulating member 3 is further backed Glue the
material 4 Next, as shown in FIG. 6, the piezoelectric element 5 is adhered to the upper end
portion of the backing material 4, and the GND wire 9 is soldered to the housing 2 and the
surface electrode 7 side of the projecting portion 42 of the piezoelectric element 5. Do. Then, the
cable 21 is soldered to the housing 2, the cable 22 is passed through the through hole 14 of the
backing material 4, and the cable 22 is adhered to the back electrode 8 side of the piezoelectric
element 5 by the conductive adhesive 15. Then, as shown in FIG. 7, a lens agent 30 is applied to
the surface electrode 7 side of the piezoelectric element 5, and as shown in FIG. 8, the center of
the piezoelectric element 5 and the center of the lens mold 32 are aligned and in proximity The
lens agent 30 is cured in the state where it is made to mold the acoustic lens 31.
In the above-described manufacturing process, the protrusion shaped portion 42 is provided on
the piezoelectric element 5, and the GND solder 10 is applied to the protrusion portion.
Therefore, even when the diameter of the piezoelectric element 5 is reduced, the GND solder 10
does not interfere with the lens mold 32 when the acoustic lens 31 is molded as shown in FIG.
Further, since the GND solder 10 for limiting the vibration of the piezoelectric element 5 is
applied to the projection shaped portion 42, the vibrating portion of the piezoelectric element 5
can be made closer to a circle. Incidentally, since the back surface electrode 8 side uses the
conductive adhesive 15 instead of the solder, even if the cable 22 is adhered in a circle, it does
not adversely affect the ultrasonic tomographic image. (Effects) According to the first
embodiment, the lens mold 32 and the GND solder 10 do not interfere with each other when the
acoustic lens 31 is formed. As the process of aligning the “relief” of the lens mold 32 with the
GND solder 10 can be omitted, the assembly workability is improved. Therefore, the
manufacturing cost of the ultrasonic transducer 1 can be reduced. Further, since the diameter of
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the piezoelectric element 5 is reduced, the resolution is improved. Furthermore, since the
vibration part of the piezoelectric element 5 is nearly circular, an adverse effect on the ultrasonic
tomographic image can be prevented, and an ultrasonic transducer with high resolution can be
provided. Second Embodiment FIG. 9 to FIG. 11 relate to a second embodiment of the present
invention, FIG. 9 is a front view of an ultrasonic transducer, and FIG. 10 is a BB line of FIG. FIG.
11 is an explanatory view showing a method of manufacturing a piezoelectric element. In the
description of the second embodiment using FIGS. 9 to 11, the same components as those in the
first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals. It is
omitted. (Configuration) As shown in FIGS. 9 and 10, a piezoelectric element 65 is fixed to the
upper end portion of the backing material 4 of the ultrasonic transducer 61. The piezoelectric
element 65 has a surface electrode 67 and a back surface electrode 68 attached to the front and
back surfaces of the piezoelectric body 66. The piezoelectric body 66 and the back surface
electrode 68 are formed in a circular shape slightly smaller in diameter than the backing material
4. The front surface electrode 67 is provided with the projection shaped portion 72 at two
positions on the outer periphery of the circular portion 71 whose diameter is smaller than that of
the piezoelectric body 66. One end of the GND wire 9 is soldered to the projection-shaped
portion 72 of the surface electrode 67 by the GND solder 70. Further, an acoustic lens 81 for
focusing the ultrasonic beam is provided on the surface electrode 67 side of the piezoelectric
element 65.
The configuration other than these is the same as that of the first embodiment shown in FIGS. 1
to 8. (Operation) Hereinafter, a method of manufacturing the ultrasonic transducer 61 according
to the second embodiment will be described. First, as shown in FIG. 11, a plate-shaped
piezoelectric element material 55 is prepared. The piezoelectric element material 55 is the same
as that shown in FIG. Next, the piezoelectric element material 55 is cut out with a punch 90 to
form a circular piezoelectric element material 95. The circular piezoelectric element material 95
has the circular surface electrode material 97 and the circular back electrode 68 attached to the
front and back surfaces of the circular piezoelectric body 66, respectively. As a method of cutting
out the piezoelectric element material 55, a laser processing machine or a water jet processing
machine may be used. Next, a mask 91 is formed on the surface electrode material 97 of the
circular piezoelectric element material 95. The mask 91 is provided with protruding portions 93
at two positions on the outer periphery of a circular portion 92 having a smaller diameter than
the circular piezoelectric element material 95. Thus, for the circular piezoelectric element
material 95 on which the mask 91 is formed, only the exposed portion of the surface electrode
material 97 is abraded, for example, with alumina blast, and the projection shaped portion 72 is
provided on the surface electrode 67 . In this case, only the area of the surface electrode 67
vibrates because the piezoelectric element 65 vibrates only in the portion where the electrodes
overlap on both surfaces. Hereinafter, the molding process of the ultrasonic transducer 61 is the
same as that of the first embodiment shown in FIGS. 4 to 8 except for the shape of the
piezoelectric element 65. In the above-described manufacturing process, the projection-shaped
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portion 72 is provided on the surface electrode 67 side, and the GND solder 70 is applied to the
projection portion. Therefore, even when the vibration portion of the piezoelectric element 65 is
reduced in diameter, the GND solder 70 does not interfere with the lens mold 32 (see FIG. 8)
when the acoustic lens 81 is molded. Further, since the GND solder 70 for limiting the vibration
of the piezoelectric element 65 is applied to the protrusion-shaped portion 72, the vibrating
portion of the piezoelectric element 65 approaches a circle. (Effects) According to the second
embodiment, the lens mold 32 (see FIG. 8) and the GND solder 70 do not interfere with each
other when the acoustic lens 81 is formed. There is no need to process “relief” to avoid the
GND solder 70, and the process of aligning the “relief” of the lens mold 32 (see FIG. 8) with
the GND solder 70 can be omitted. improves.
Therefore, the same effect as that of the first embodiment can be obtained. FIG. 12 is an
explanatory view showing an example of an electrode pattern of the piezoelectric element 65
applicable to the processing method shown in FIG. The first pattern shown in FIG. 12 is the same
as that shown in FIGS. In the second pattern shown in FIG. 12, the surface electrode 67 is formed
to have the same diameter as the piezoelectric body 66, and the back surface electrode 68 is
formed to have a smaller diameter than the piezoelectric body 66. In the third pattern shown in
FIG. 12, the surface electrode 67 is the same as that shown in FIGS. 9 to 11, and the back
electrode 68 is the same as the planar shape of the surface electrode 67. That is, the back surface
electrode 68 of the third pattern is provided with the protrusion shaped portions 75 at two
places on the outer periphery of the circular portion 74 which has a smaller diameter than the
piezoelectric body 66. These electrode patterns have different outer dimensions of one or both of
the electrodes with respect to the outer dimensions of the piezoelectric element 65, and all the
same effects can be obtained. Moreover, it is also possible to vapor-deposit an electrode pattern
as a method of forming an electrode. [Appendix] According to the embodiment of the present
invention as described above, the following configuration can be obtained. (Appendix 1) A
piezoelectric element for transmitting and receiving an ultrasonic wave, an electrode provided on
both sides of the piezoelectric element, a signal transmission unit connected to the electrodes,
and a piezoelectric element provided on the back surface of the piezoelectric element The
piezoelectric device has damping means for giving an acoustic damping action to the back
surface of the piezoelectric element, focusing means for focusing an ultrasonic beam generated
from the piezoelectric element, and at least one projection provided on the piezoelectric element.
An ultrasonic transducer, wherein the piezoelectric element is provided with at least one
projection. (Additional Item 2) The ultrasonic transducer according to Additional Item 1,
characterized in that the signal transmission means is connected to the protrusion of the
piezoelectric element. (Additional Item 3) A piezoelectric element that transmits and receives an
ultrasonic wave, one and the other electrodes respectively provided on one and the other
surfaces of the piezoelectric element, a signal transfer unit connected to the electrodes, and An
ultrasonic transducer comprising: damping means provided on a back surface of a piezoelectric
element for giving an acoustic damping action to the back surface of the piezoelectric element;
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and focusing means for focusing an ultrasonic beam generated from the piezoelectric element An
ultrasonic transducer characterized in that the outer dimensions of one or both of the one and
the other electrodes are different with respect to the outer dimensions of the piezoelectric
element.
(Additional Item 4) The ultrasonic transducer according to Additional Item 3, wherein the one
electrode is larger than the other electrode. (Additional Item 5) The ultrasonic transducer
according to Additional Item 3, characterized in that the signal transmission means is connected
to the part of the difference in area of the one and the other electrodes. (Additional Item 6) The
ultrasonic transducer according to Additional Item 3, characterized in that a protrusion is
provided on at least one of the one and the other electrodes. (Additional Item 7) The ultrasonic
transducer according to Additional Item 6, characterized in that the signal transmission means is
connected to the protrusion of the electrode. (Additional Item 8) The ultrasonic transducer
according to any one of Additional Items 2, 6, 7 characterized in that soldering is used as a
method of connecting the signal transmission means to the electrodes. As described above,
according to the present invention, it is possible to reduce the manufacturing cost by improving
the assembly workability, and to prevent the adverse effect on the ultrasonic tomographic image
and to provide an ultrasonic wave with a high resolution. An oscillator can be provided. BRIEF
DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of an ultrasonic transducer according to
a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line
AA of FIG. 1 according to the first embodiment of the present invention. FIG. 3 is an explanatory
view showing a method of manufacturing a piezoelectric element according to the first
embodiment of the present invention; FIG. 4 is an explanatory view showing a first
manufacturing process of the entire ultrasonic transducer according to the first embodiment of
the present invention; FIG. 5 is an explanatory view showing a second manufacturing process of
the entire ultrasonic transducer according to the first embodiment of the present invention; FIG.
6 is an explanatory view showing a third manufacturing process of the entire ultrasonic
transducer according to the first embodiment of the present invention; FIG. 7 is an explanatory
view showing a fourth manufacturing process of the entire ultrasonic transducer according to the
first embodiment of the present invention; FIG. 8 is an explanatory view showing a fifth
manufacturing process of the entire ultrasonic transducer according to the first embodiment of
the present invention; FIG. 9 is a front view of an ultrasonic transducer according to a second
embodiment of the present invention. FIG. 10 is a cross-sectional view taken along the line BB in
FIG. 9 according to the second embodiment of the present invention. FIG. 11 is an explanatory
view showing a method of manufacturing a piezoelectric element according to a second
embodiment of the present invention; FIG. 12 is an explanatory view showing an example of an
electrode pattern of a piezoelectric element according to a second embodiment of the present
invention; FIG. 13 is a plan view of an ultrasonic transducer used in a conventional ultrasonic
endoscope. 14 is a cross-sectional view of the conventional ultrasonic transducer shown in FIG.
13 taken along the line C-C. FIG. 15 is an explanatory view showing a relationship between a
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conventional piezoelectric element having a large diameter and an ultrasonic beam. FIG. 16 is an
explanatory view showing a relationship between a conventional small diameter piezoelectric
element and an ultrasonic beam.
FIG. 17 is a plan view of a conventional ultrasonic transducer with a reduced diameter. FIG. 18 is
a cross-sectional view of the ultrasonic transducer of FIG. Explanation of symbols 1 ... ultrasonic
transducer 2 ... housing 3 ... insulating member 4 ... backing material 5 ... piezoelectric element 6
... piezoelectric body 7 ... surface electrode 8 ... back surface electrode 9 ... GND line 10 ... GND
solder 11, 13 ... Solder 15 ... Conductive adhesive 20 ... Transmission line 21, 22 ... Cable 31 ...
Acoustic lens
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