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JP2012029084

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DESCRIPTION JP2012029084
The present invention provides an electronic device capable of shielding sound waves arbitrarily
and highly. An electronic device 100 is provided opposite to a first vibration surface, an
oscillation device 10 for oscillating an ultrasonic wave 40 from a first vibration surface, a casing
20 having the oscillation device 10 inside, and A waveguide 30 having an opening end 50 on the
surface of the housing 20, and a shielding member 80 provided at the opening end 50 and
opening and closing the opening end 50 are provided. This provides an electronic device capable
of arbitrarily and highly shielding sound waves. [Selected figure] Figure 1
Electronics
[0001]
The present invention relates to an electronic device using ultrasonic waves.
[0002]
A piezoelectric electroacoustic transducer is known as an electroacoustic transducer of a portable
device or the like.
The piezoelectric-type electroacoustic transducer generates an oscillation amplitude by using an
expansion and contraction motion generated by applying an electric field to the piezoelectric
vibrator. The piezoelectric electroacoustic transducer does not require a large number of
members to generate vibration amplitude, and is advantageous for thinning. In addition, about
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the technique regarding the portable apparatus etc. which mounted the speaker, there exist some
which are described, for example in patent documents 1-4. These all relate to a mobile phone
equipped with a speaker, and aim to enhance the convenience of the mobile phone.
[0003]
The piezoelectric electroacoustic transducer may be used as a parametric speaker using
ultrasonic waves. The parametric speaker demodulates audible sound from modulated ultrasonic
waves using the air density phenomenon. Since ultrasonic waves are used, higher directivity can
be realized as compared with a normal speaker.
[0004]
JP-A-2001-285433 JP-A-2003-111194 JP-A-2004-289563 JP-A-2005-142834
[0005]
It is desirable to improve the convenience of the electronic device equipped with the speaker.
As one of them, it is required to develop an electronic device capable of shielding sound waves
arbitrarily and highly.
[0006]
An object of the present invention is to provide an electronic device capable of arbitrarily and
highly shielding sound waves.
[0007]
According to the present invention, there is provided an oscillation device for emitting an
ultrasonic wave from a first vibration surface, a case having the above-mentioned oscillation
device inside, and a case provided on the surface of the case facing the first vibration surface. An
electronic device is provided, comprising: a first waveguide having a first open end; and a first
shielding member provided at the first open end and opening and closing the first open end.
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[0008]
According to the present invention, it is possible to provide an electronic device capable of
arbitrarily and highly shielding sound waves.
[0009]
FIG. 2 is a cross-sectional view showing the electronic device according to the first embodiment.
It is sectional drawing which shows the oscillation apparatus shown in FIG.
It is sectional drawing which shows the piezoelectric vibrator shown in FIG.
It is sectional drawing which shows the electronic device which concerns on 2nd Embodiment.
[0010]
Hereinafter, embodiments of the present invention will be described with reference to the
drawings. In all the drawings, the same components are denoted by the same reference numerals,
and the description thereof will be appropriately omitted.
[0011]
FIG. 1 is a cross-sectional view showing the electronic device 100 according to the first
embodiment. The electronic device 100 includes the oscillation device 10, the housing 20, the
waveguide 30, and the shielding member 80. The electronic device 100 is, for example, a mobile
communication terminal, a laptop computer, or a small game device.
[0012]
The oscillation device 10 oscillates the ultrasonic wave 40 from the first vibration surface. The
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housing 20 has the oscillation device 10 inside. The waveguide 30 is provided to face the first
vibration surface. The waveguide 30 also has an open end 50 on the surface of the housing 20.
The shielding member 80 is provided at the open end 50 and opens and closes the open end 50.
Hereinafter, the configuration of the electronic device 100 will be described in detail with
reference to FIGS. 1 to 3.
[0013]
As shown in FIG. 1, the electronic device 100 further includes a waveguide 35 and a shielding
member 85. The oscillation device 10 oscillates the ultrasonic wave 45 from a second vibration
surface configured by a surface opposite to the first vibration surface. The waveguide 35 is
provided to face the second vibration surface. The waveguide 35 also has an open end 55 on the
surface of the housing 20. The shielding member 85 is provided at the open end 55 and opens
and closes the open end 55.
[0014]
The electronic device 100 further includes a control unit 78. The control unit 78 is connected to
the shielding member 80 and controls the movement of the shielding member 80. Thereby, the
opening and closing of the open end 50 is controlled. The control unit 78 is also connected to the
shielding member 85 and controls the movement of the shielding member 85. Thereby, the
opening and closing of the open end 55 is controlled. The control unit 78 may not be provided,
and the shielding members 80 and 85 may be moved manually. The shielding members 80 and
85 move along the unevenness serving as a guide provided on the housing 20, for example.
[0015]
As shown in FIG. 2, the oscillation device 10 includes a piezoelectric vibrator 60, a vibrating
member 72, and a support member 70. The vibrating member 72 restrains the piezoelectric
vibrator 60. The support member 70 supports the vibrating member 72. The oscillation device
10 further includes a control unit 74 and a signal generation unit 76. The signal generation unit
76 is connected to the piezoelectric vibrator 60 and generates an electrical signal to be input to
the piezoelectric vibrator 60. The control unit 74 is connected to the signal generation unit 76,
and controls the generation of the signal by the signal generation unit 76 based on the
information input from the outside. Since the oscillation device 10 is used as a speaker, the
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information input to the control unit 74 is an audio signal.
[0016]
In the present embodiment, the oscillation device 10 is used as a parametric speaker. Therefore,
the control unit 74 inputs a modulation signal as a parametric speaker via the signal generation
unit 76. When used as a parametric speaker, the piezoelectric vibrator 60 uses a sound wave of
20 kHz or more, for example, 100 kHz as a transport wave of a signal. In the oscillation device
10, for example, a plurality of piezoelectric vibrators 60 and a plurality of vibration members 72
are provided in an array. Thereby, the directivity of the ultrasonic waves 40 and 45 which the
oscillation apparatus 10 emits can be improved. The piezoelectric vibrator 60 and the vibration
member 72 may be singular.
[0017]
FIG. 3 is a cross-sectional view showing the piezoelectric vibrator 60 shown in FIG. As shown in
FIG. 3, the piezoelectric vibrator 60 includes a piezoelectric body 62, an upper electrode 64, and
a lower electrode 66. The piezoelectric vibrator 60 has, for example, a circular shape, an elliptical
shape, or a rectangular shape. The piezoelectric body 62 is sandwiched between the upper
electrode 64 and the lower electrode 66. The piezoelectric body 62 is made of a material having
a piezoelectric effect, and is made of, for example, lead zirconate titanate (PZT), barium titanate
(BaTiO3) or the like. The thickness of the piezoelectric body 62 is preferably 10 um to 1 mm. If
the thickness is less than 10 μm, the piezoelectric body 62 is made of a brittle material, and thus
breakage or the like is likely to occur. On the other hand, when the thickness exceeds 1 mm, the
electric field strength of the piezoelectric body 62 is reduced. Therefore, the energy conversion
efficiency is reduced.
[0018]
The upper electrode 64 and the lower electrode 66 are made of, for example, silver or a silver /
palladium alloy. The thickness of the upper electrode 64 and the lower electrode 66 is preferably
1 to 50 μm. If the thickness is less than 1 um, uniform molding becomes difficult. On the other
hand, when it exceeds 50 um, the upper electrode 64 or the lower electrode 66 becomes a
constraining surface with respect to the piezoelectric body 62, and the energy conversion
efficiency is lowered.
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[0019]
The vibrating member 72 is made of a material having a high elastic modulus with respect to the
ceramic material, and is made of, for example, phosphor bronze or stainless steel. The thickness
of the vibrating member 72 is preferably 5 to 500 μm. The longitudinal elastic modulus of the
vibrating member 72 is preferably 1 to 500 GPa. If the longitudinal elastic modulus of the
vibrating member 72 is excessively low or high, the characteristics and reliability as a mechanical
vibrator may be impaired.
[0020]
The waveguide 30 is formed by providing a waveguide 22 connecting the first vibration surface
and the open end 50. The waveguide 35 is formed by providing the waveguide 24 connecting the
second vibration surface and the open end 55. The waveguides 30 and 35 are provided
perpendicular to the first and second vibration planes. The area of the waveguides 30 and 35
may be, for example, 0.1 mm <2> or more.
[0021]
The shielding members 80 and 85 are made of, for example, a sound absorbing material such as
urethane. In this case, the thickness of the shielding members 80 and 85 is, for example, 1 mm
or less. When the shielding members 80, 85 are made of a sound absorbing material, the
shielding members 80, 85 shield the sound waves by absorbing the sound waves. In addition, the
shielding members 80 and 85 may be made of, for example, a metal material. When the shielding
members 80 and 85 are made of a metal material, the shielding members 80 and 85 shield the
sound waves by reflecting the sound waves. The reflected sound waves collide with each other in
the housing 20 and are canceled.
[0022]
Next, the effects of the present embodiment will be described. When an audible sound wave is
oscillated from the oscillation device, the audible sound wave which is excellent in diffusivity may
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leak through the gap between the shielding member and the casing to the outside. On the other
hand, in the electronic device 100 according to the present embodiment, the oscillation device
10 oscillates the ultrasonic waves 40 and 45. The ultrasonic waves 40 and 45 which are
excellent in rectilinearity collide with the shielding members 80 and 85 and disappear without
being diffused and leaking to the outside. Further, the shielding members 80 and 85 are provided
movably. Therefore, an electronic device capable of shielding sound waves arbitrarily and highly
can be provided.
[0023]
In addition, since the shielding members 80 and 85 are respectively provided at the open ends
50 and 55, it is possible to prevent water from invading the inside of the housing 20.
Furthermore, waveguides 30 and 35 are provided on the first vibration plane and the second
vibration plane of the oscillation device 10, respectively. Therefore, the ultrasonic waves 40 and
45 oscillated from both the first vibration surface and the second vibration surface can be used,
and sound can be reproduced with high efficiency. Furthermore, the waveguide 30 is
perpendicular to the first vibration plane, and the waveguide 35 is perpendicular to the second
vibration plane. The ultrasonic waves 40 and 45 emitted from the oscillation device 10 have
many components perpendicular to the first vibration surface and the second vibration surface,
so that sound reproduction can be performed with higher efficiency.
[0024]
FIG. 4 is a cross-sectional view showing the electronic device 102 according to the second
embodiment, and corresponds to FIG. 1 according to the first embodiment. The electronic device
102 according to the present embodiment is the same as the electronic device 100 according to
the first embodiment except that the waveguides 22 and 24 are not provided.
[0025]
The electronic device 102 further includes a component 90 provided inside the housing. No
component 90 is located on a straight line connecting at least a part of the first vibration surface
and at least a part of the open end 50. Further, no component 90 is located on a straight line
connecting at least a part of the second vibration surface and at least a part of the opening end
55. The waveguide 30 is configured by the opening end 50 and a portion where the component
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90 is not located in the overlapping portion of the oscillation device 10. Further, the waveguide
35 is configured by a portion where the component 90 is not located in a place where the
opening end 55 and the oscillation device 10 overlap.
[0026]
The electronic device 102 further includes a mounting substrate 92. The mounting substrate 92
is disposed parallel to the top and bottom surfaces of the housing 20. The mounting substrate 92
is, for example, a printed wiring board. The component 90 is mounted on the mounting substrate
92. Further, the heights of the components 90 on the mounting substrate 92 are different from
each other. The component 90 includes, for example, electronic components such as discrete
components and semiconductor packages.
[0027]
The oscillation device 10 is provided in a direction intersecting the mounting substrate 92. In
this case, the waveguides 30 and 35 are provided not to intersect the mounting substrate 92. The
open ends 50 and 55 are disposed on the side surface of the housing 20. In addition, the
oscillation device 10 may be provided in a direction not intersecting the mounting substrate 92
(not shown). In this case, a through hole is formed in a portion of the mounting substrate 92
which intersects the waveguides 30 and 35 (not shown). The open ends 50 and 55 are disposed
on the top and bottom of the housing 20 (not shown).
[0028]
Also in this embodiment, the same effect as that of the first embodiment can be obtained.
Further, in the electronic device 102 according to the present embodiment, the gaps of the
component 90 are made to be the waveguides 30 and 35 by utilizing the straightness of the
ultrasonic waves 40 and 45. Accordingly, the acoustic reproduction can be performed without
providing the waveguide, and the electronic device can be miniaturized.
[0029]
Although the embodiments of the present invention have been described above with reference to
the drawings, these are merely examples of the present invention, and various configurations
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other than the above can also be adopted.
[0030]
Reference Signs List 10 oscillator 20 housing 22 waveguide 24 waveguide 30 waveguide 35
waveguide 40 ultrasonic 45 ultrasonic 50 opening end 55 opening end 60 piezoelectric vibrator
62 piezoelectric body 64 upper electrode 66 lower electrode 70 support member 72 vibration
Member 74 Control unit 76 Signal generation unit 78 Control unit 80 Shielding member 85
Shielding member 90 Component 92 Mounting board 100 Electronic device 102 Electronic
device
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