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JP2017135496

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DESCRIPTION JP2017135496
Abstract: The present invention provides a speech processing apparatus that can be realized as a
whole as a whole and that can improve echo cancellation characteristics. SOLUTION: A voice
processing device 1 covers a region near a microphone 2, a microphone 3 disposed in proximity
to a sound emission surface 8 of the speaker 2, the speaker 2, and a front surface side of the
sound emission surface 8 of the speaker 2. And the cover 5 provided as described above. Further,
the audio processing device 1 may further include an echo cancellation circuit 12 that removes a
sound component emitted by the speaker 2 from an audio signal collected by the microphone 3
and outputs the signal. [Selected figure] Figure 1
Voice processing device
[0001]
The present invention relates to a voice processing apparatus used for hands-free communication
devices and the like, and more particularly to a technique for improving echo cancellation
characteristics.
[0002]
In Patent Document 1, a sound emitting unit that emits the sound of the speaker through the
conduction hole, a first sound collecting unit that collects sound, and a second sound collecting
unit are formed on one surface. There is disclosed a hands-free telephone call assistance device
in which the opening of the first sound collecting unit and the opening of the second sound
collecting unit are arranged equidistantly from the opening of the sound emitting unit.
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According to such a handsfree call assistance apparatus, the sound from the sound emitting unit
is input to each of the first sound collecting unit and the second sound collecting unit at
substantially the same level. By subtracting the sound signal collected by the second sound
collecting unit from the sound signal collected by the unit, the sound emitted from the sound
emitting unit can be removed, and echo cancellation can be performed. it can.
[0003]
International Publication No. 2014/203380
[0004]
By the way, when attaching the module which consists of a speaker and a microphone to the
interior surface in the interior of a car, it is necessary to make the whole module compact and
not to project from the interior surface to the interior side.
However, in the case of the above-mentioned hands-free speech assistance device, since it has a
conduction hole for guiding the sound of the speaker to the sound emission opening, it is difficult
to make it structurally compact.
[0005]
On the other hand, in order to make the entire module compact, it is necessary to place the
speaker and the microphone close to each other. However, in this case, the sound emission
surface of the microphone and the speaker are close to each other, and the sound emitted from
the speaker directly enters the microphone, so the sound collection level resulting from the
sound emission of the speaker becomes high, and the echo cancellation characteristic is There is
a problem of getting worse.
[0006]
SUMMARY OF THE INVENTION The present invention has been made in view of the above
problems, and an object of the present invention is to provide a voice processing apparatus that
can be realized as a whole in a compact size and can improve echo cancellation characteristics.
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[0007]
In order to achieve the above object, first of all, the present invention is an audio processing
device, comprising: a speaker; sound collecting means disposed close to a sound emitting surface
of the speaker; and a front side of the sound emitting surface And a cover provided so as to cover
an area in the vicinity of the sound collecting means.
[0008]
According to this configuration, since the sound collection unit is disposed close to the sound
emission surface of the speaker, the overall size of the sound processing device can be reduced.
Furthermore, according to this configuration, the cover covering the area near the sound
collection means is provided on the front side of the sound emission face of the speaker, so that
the area near the sound collection means among the sounds emitted from the sound emission
face of the speaker It is possible to prevent the sound emitted from being directly entering the
sound collecting means.
As a result, the level when the sound emitted from the speaker enters the microphone can be
reduced, and the deterioration of the echo cancellation characteristic can be suppressed.
[0009]
Second, in the voice processing apparatus according to the first aspect, the present invention
further includes an echo cancellation circuit that removes a sound component emitted by the
speaker from an audio signal collected by the sound collection unit and outputs the signal. It is
the composition characterized by having. According to this configuration, a voice processing
device having excellent echo cancellation characteristics is realized.
[0010]
Thirdly, the present invention is characterized in that in the voice processing apparatus having
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the second configuration, the echo cancellation circuit is disposed on the back side of the cover.
According to this configuration, an echo cancellation circuit can be provided between the speaker
and the cover, and the overall size of the audio processing device can be further reduced.
[0011]
Fourth, according to the present invention, in the voice processing apparatus having the second
or third configuration, the sound collection means includes a first microphone and a second
microphone, and a center of the speaker is the second microphone. The echo cancellation circuit
is located on an equidistant line between the first microphone and the second microphone, and
the echo cancel circuit picks up the second microphone from a first audio signal picked up by the
first microphone. The second audio signal is subtracted and output. According to this
configuration, the sound emitted from the speaker by the first microphone and the second
microphone can be collected at substantially the same level and substantially the same phase.
Since the echo cancellation circuit performs echo cancellation by subtracting the second audio
signal from the first audio signal, the echo cancellation characteristic can be improved.
[0012]
Fifth, according to the present invention, in the voice processing apparatus having the fourth
configuration, the cover has a sound emission opening having a center on the equidistant line.
According to this configuration, the echo cancellation characteristic is further improved.
[0013]
According to the present invention, a compact speech processing apparatus can be realized as a
whole, and furthermore, the echo cancellation characteristic can be improved.
[0014]
It is a figure showing the appearance composition of the speech processing unit in a 1st
embodiment.
It is sectional drawing which shows an example of the internal structure of the speech processing
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unit in 1st Embodiment. It is sectional drawing which shows the example of an internal structure
different from FIG. 2 of a speech processing apparatus. It is a figure which shows the external
appearance structure of the speech processing unit in 2nd Embodiment. It is sectional drawing
which shows an example of the internal structure of the speech processing unit in 2nd
Embodiment. It is a front view of the speech processing unit in a 2nd embodiment. It is a figure
which shows an example of the echo cancellation circuit in 2nd Embodiment.
[0015]
Hereinafter, preferred embodiments of the present invention will be described in detail with
reference to the drawings. In the embodiment described below, members which are common to
each other are denoted by the same reference numerals, and redundant description thereof will
be omitted.
[0016]
(First Embodiment) FIG. 1 is a view showing the appearance of a voice processing apparatus 1
according to a first embodiment of the present invention, and FIG. 1 (a) is a perspective view
showing a state in which a cover 5 is attached to a case 4. (B) is a perspective view showing a
state before the cover 5 is attached to the case 4, and (c) is a front view of the voice processing
device 1. The audio processing device 1 includes a speaker 2, a microphone 3, a case 4, and a
cover 5. The speaker 2 and the microphone 3 are attached to the front side (front side) of the
case 4, and the cover 5 is a front side of the case 4. It is configured to be attached to the side.
Such a voice processing device 1 is installed in the interior of a car or the like and used as a
hands-free calling device or the like. For example, the voice processing device 1 performs wired
or wireless communication with a mobile phone carried by a user. Input and output audio signals
between For example, the voice processing apparatus 1 receives the voice signal transmitted
from the telephone of the other party of the user via the mobile phone of the user, and drives the
speaker 2 based on the audio signal to thereby generate the voice of the other party. The speaker
2 emits noise. Further, the voice processing device 1 generates a voice signal by collecting the
voice of the user with the microphone 3 which is a sound collecting means, and outputs the voice
signal to the user's portable telephone through an echo cancellation circuit 12 described later.
Transmission to the other party's phone via the user's mobile phone.
[0017]
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As shown in FIG. 1 (b), the speaker 2 has a circular sound emitting surface 8 and emits sound
from the whole of the sound emitting surface 8 toward the front side of the case 4. The
microphone 3 is provided at a position close to the sound emitting surface 8 of the speaker 2 on
the front side of the case 4. For example, on the front side (front side) of the case 4, on the
straight line connecting the center of the sound emitting surface 8 and the microphone 3, the
point from the point where the straight line intersects the outer periphery of the sound emitting
surface 8 to the microphone 3 The microphone 3 is provided such that the spacing is smaller
than the radius of the sound emitting surface 8. Thereby, the size of case 4 can be made more
compact than before.
[0018]
The cover 5 is configured in substantially the same shape as the front surface of the case 4, and
the sound emission opening 6 is formed in a region corresponding to the sound emission surface
8 of the speaker 2, and sound is provided at a position corresponding to the installation position
of the microphone 3 Holes 7 are formed. The sound emission opening 6 is an opening for
emitting the sound emitted from the sound emission surface 8 of the speaker 2 to the front side
of the voice processing device 1. Therefore, the sound from the speaker 2 is emitted to the
outside through the sound emission opening 6. Also, the sound hole 7 is a hole for guiding an
external sound to the microphone 3. The microphone 3 picks up the sound guided through the
sound hole 7 and generates an audio signal.
[0019]
The sound emission opening 6 provided in the cover 5 is not formed in the whole area of the
sound emission surface 8 of the speaker 2 as shown in FIG. 1C, but is separated from the
microphone 3 (or the sound hole 7) by a predetermined distance or more Formed in the That is,
the cover 5 has the shielding portion 9 covering the sound emitting surface 8 of the speaker 2 in
the vicinity region R of the microphone 3 which is at least within a predetermined distance from
the position where the microphone 3 which is the sound collecting means is provided. ing. And
the cover 5 prevents the sound emission from the part in which the shielding part 9 was
provided.
[0020]
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FIG. 2 is a cross-sectional view showing an example of the internal structure of the speech
processing device 1. When the cover 5 described above is mounted on the front of the case 4, as
shown in FIG. 2, the sound emitted from the position near the microphone 3 in the sound
emitting surface 8 of the speaker 2 is blocked by the shielding portion 9. That is, it is possible to
prevent the sound emitted from the position near the microphone 3 from directly entering the
microphone 3. Moreover, by providing the shielding part 9, the distance L between the sound
emission opening 6 where the sound from the speaker 2 is emitted to the outside and the
microphone 3 (or the sound hole 7) can be lengthened. Therefore, the sound emitted from the
sound emission opening 6 is attenuated when propagating the path of the distance L. Thereby,
when the sound emitted from the sound emission opening 6 is collected by the microphone 3
through the sound hole 7, the volume level can be suppressed to a low level, and the
deterioration of the echo cancellation characteristic can be suppressed. There is. Since the
amount of attenuation can be increased as the distance L is increased, it is preferable to form the
sound emission opening 6 at a position as far as possible from the sound hole 7 of the
microphone 3.
[0021]
Further, as shown in FIG. 2, in the voice processing apparatus 1, a processing substrate 10 on
which various circuits are mounted is attached to the inside of a case 4, and an echo cancellation
circuit 12 is provided on the processing substrate 10. The echo cancellation circuit 12 is a circuit
that removes the sound component emitted by the speaker 2 from the sound signal generated by
the microphone 3 and generates it, for example, and delays the sound signal for driving the
speaker 2. A delayed signal is generated, and echo cancellation is performed by subtracting the
delayed signal from the audio signal generated by the microphone 3 to pick up the sound.
[0022]
FIG. 3 is a cross-sectional view showing an example of an internal structure different from that of
FIG. In the example of FIG. 3, the processing substrate 10 is attached to the back side of the
cover 5, and the microphone 3 and the echo cancellation circuit 12 are mounted on the
processing substrate 10. The processing substrate 10 has a through hole 11 at a position
corresponding to the sound hole 7, and the microphone 3 is mounted on the back side of the
through hole 11. The microphone 3 is mounted so that the sound collection unit 31 that collects
the sound is directed to the through hole 11 and the sound hole 7. Therefore, the microphone 3
picks up the sound guided through the sound hole 7 and the through hole 11 and generates an
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audio signal. Further, the echo cancellation circuit 12 is mounted on the back side of the
processing substrate 10 in the same manner as the microphone 3. By arranging the echo
cancellation circuit 12 on the back side of the cover 5 in this way, it is not necessary to arrange
the processing substrate 10 and the echo cancellation circuit 12 inside the case 4, so the size of
the case 4 can be made more compact. can do.
[0023]
Second Embodiment Next, a second embodiment of the present invention will be described. FIG.
4 is a view showing an appearance configuration of the voice processing device 1a according to
the second embodiment of the present invention, in which (a) is a perspective view showing a
state in which the cover 5 is attached to the case 4; It is a perspective view which shows the state
before the cover 5 is attached to case 4. As shown in FIG. 5 is a cross-sectional view showing an
example of the internal structure of the voice processing device 1a, and FIG. 6 is a front view of
the voice processing device 1a.
[0024]
The voice processing device 1a of the present embodiment includes two microphones of a first
microphone 3a and a second microphone 3b as sound collection means. These two microphones
3a and 3b are provided at positions close to the sound emitting surface 8 of the speaker 2 and at
positions where distances from the respective sound emitting surfaces 8 are equal to each other.
[0025]
As in the first embodiment, the cover 5 has a sound emission opening 6 for emitting the sound
from the speaker 2 to the outside, and has two sound holes 7 corresponding to the installation
positions of the two microphones 3a and 3b. doing. And the cover 5 has the shielding part 9
which covers the sound emission surface 8 of the speaker 2 in the near area | region of the
microphones 3a and 3b which become in the range of predetermined distance at least from the
position where two microphones 3a and 3b are provided. And prevent the sound emission from
the portion provided with the shielding portion 9.
[0026]
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The two microphones 3 a and 3 b are mounted on the processing substrate 10 attached to the
back side of the cover 5 (in particular, the back side of the shielding portion 9). The processing
substrate 10 has a through hole 11 at a position corresponding to the sound hole 7 provided in
the cover 5. The microphones 3 a and 3 b are mounted on the back side of the through hole 11.
And as shown in FIG. 5, the sound collection part 31 of microphone 3a, 3b is mounted toward
the through-hole 11 and the sound hole 7. As shown in FIG. Therefore, the microphones 3a and
3b pick up the sound guided through the sound hole 7 and the through hole 11, respectively,
and generate an audio signal. By arranging the two microphones 3a and 3b and the echo
cancellation circuit 12 between the cover 5 and the speaker 2 as shown in FIG. 5, the size of the
case 4 can be made more compact.
[0027]
And in this embodiment, two microphones 3a and 3b are provided in the position symmetrical
with respect to the speaker 2 as shown in FIG. More specifically, the center 2a of the speaker 2 is
located on the equidistant line 14 from the two microphones 3a and 3b. The center 6a of the
sound emission opening 6 is also located on the equidistant line 14 from the two microphones 3a
and 3b. The center 6a of the sound emission opening 6 is provided at a position farther from the
two microphones 3a and 3b than the center 2a of the speaker 2 on the equidistant line 14 of the
two microphones 3a and 3b. Thus, the distance from the sound release opening 6 to the two
microphones 3a and 3b (sound holes 7) can be increased, so that the sound emitted from the
sound release opening 6 passes through the sound holes 7 and the microphone 3a, The volume
when the sound is picked up by 3b can be attenuated. Further, when the sound emitted from the
sound emission opening 6 is collected by the two microphones 3a and 3b through the sound hole
7 and the through hole 11, respectively, the sound becomes approximately the same level and
approximately the same phase It is picked up. The echo cancellation circuit 12 performs echo
cancellation based on the audio signal generated by being picked up by the two microphones 3a
and 3b.
[0028]
FIG. 7 is a diagram showing an example of the echo cancellation circuit 12 in the present
embodiment. The echo cancellation circuit 12 receives a first audio signal S1 collected by the
first microphone 3a and a second audio signal S2 collected by the second microphone 3b. The
echo cancellation circuit 12 includes a subtractor 17. The subtractor 17 subtracts the second
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audio signal S2 from the first audio signal S1 to generate an echo-canceled audio signal Sout. The
echo-canceled voice signal Sout is output to the user's portable telephone in a wired or wireless
manner via a communication interface (not shown).
[0029]
When echo cancellation is performed by subtracting the second audio signal S2 from the first
audio signal S1 as described above, in order to further improve the echo cancellation
characteristic, the sound emitted from the sound emission opening 6 is It is preferable that the
sound levels and phases be as uniform as possible when picked up by each of the two
microphones 3a and 3b. And in order to equalize the level and phase of the sound collected by
each of the two microphones 3a and 3b, two microphones 3a and 3b among the sounds emitted
from the entire sound emitting surface 8 of the speaker 2 It is effective to cause the microphones
3a and 3b to pick up only the sound emitted from above the equidistant line 14. However,
strictly speaking, it is difficult to cause the microphones 3a and 3b to collect only the sound
emitted from the equal distance line 14 of the two microphones 3a and 3b. So, in this
embodiment, as shown in FIG. 6, the center 6a of the sound emission opening 6 is provided on
the equidistant line 14, and the sound emission opening 6 is formed in circular shape of a
predetermined radius from the center 6a. In other words, in the present embodiment, the sound
emission openings 6 are provided in a state (shape) in the vicinity of the equidistant line 14. As a
result, the sound picked up by each of the two microphones 3a and 3b has substantially the same
level and substantially the same phase, so that the echo cancellation characteristic is further
improved.
[0030]
(Modification) Although one embodiment of the present invention has been described above, the
present invention is not limited to the above-described one, and various modifications can be
applied. For example, in the above embodiment, although the speech processing apparatus 1, 1a
is provided with the echo cancellation circuit 12, the echo cancellation circuit 12 may be
provided separately from the speech processing apparatus 1, 1a.
[0031]
1, 1a: voice processing device, 2: speaker, 3: microphone (sound collecting means), 3a: first
microphone (sound collecting means), 3b: second microphone (sound collecting means), 4 case, 5
... cover, 6 ... sound emission opening, 8 ... sound emission surface, 9 ... shielding part, 10 ...
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processing board, 12 ... echo cancellation circuit.
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