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JPH07201386

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JPH07201386
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
structure in which a round pin terminal is passed through a pedestal of an insulating base plate
made of plastic or the like in electronic parts and the like and this round pin terminal is fixed by
soldering. .
[0002]
2. Description of the Related Art FIG. 5 is a cross sectional view showing a conventional
ultrasonic sensor. Referring to FIG. 5, this ultrasonic sensor has a case body 1 having an opening
at the lower side, and a base plate 2 made of plastic or the like attached so as to close the
opening. A plurality of through holes 1 a are formed on the upper surface of the case body 1, and
ultrasonic waves are guided into the case body 1 through the through holes 1 a.
[0003]
A cylindrical support portion 2 b is integrally formed at the central portion of the base plate 2,
and the piezoelectric diaphragm 3 is fixed to the upper end of the support portion 2 b. The
piezoelectric vibration plate 3 has a structure in which the piezoelectric ceramic plate 5 is
attached to the lower surface of the metal plate 4 and is configured as a unimorph piezoelectric
vibration plate. An electrode 6 is formed on the lower surface of the piezoelectric ceramic plate 5.
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1
At the center of the piezoelectric diaphragm 3, an equalizer 20 as another vibrator is joined to
the side receiving the ultrasonic waves. The equalizer 20 is made of a rigid material having a
cone shape open toward the ultrasonic wave receiving side.
[0004]
Base portions 2a and 2c protruding toward the case main body 1 are formed in the base plate 2,
and round pin terminals 8 and 9 are inserted into holes formed in the base portions 2a and 2c.
The round pin terminal 8 is connected by the solder portion 10 to the other end of the lead wire
2 whose one end is electrically connected to the electrode 6. The solder portion 10 is formed on
the surface of the pedestal portion 2a. The round pin terminal 9 is electrically connected by the
solder portion 11 to the other end of the lead wire 13 whose one end is electrically connected to
the metal plate 4. The solder portion 11 is formed on the surface of the pedestal portion 2c.
[0005]
FIG. 6 is a perspective view showing a pedestal portion 2a on which such a solder portion is
formed. As shown in FIG. 6, the round pin terminal 8 is inserted into the hole formed in the
pedestal portion 2a, a solder portion is formed on the surface of the pedestal portion 2a, and the
lead wire is electrically connected to the round pin terminal 8. Connected
[0006]
As described above, the round pin terminal is inserted into the hole of the base plate made of
plastic or the like, but the hole formed in the base plate is adjusted to the size of the round pin
terminal. Usually, round pin terminals are press-fit into the holes. Therefore, although the round
pin terminal is fixed to the hole of the base plate, the round pin terminal is heated when the
soldered portion 5 is formed, and the heat causes the round pin terminal to be fitted to the hole
of the base plate. The fit may be loose. When a force is applied to the round pin terminal, the
round pin terminal is rotated, and the lead wire may be pulled along with this, and the lead wire
may be broken.
[0007]
An object of the present invention is to solve such a conventional problem and to provide a
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2
round pin terminal fixing structure capable of preventing such a lead wire breakage with a
simple structure.
[0008]
The fixing structure of the round pin terminal according to the present invention is characterized
in that the base portion surface to be soldered for fixing the round pin terminal is formed with
unevenness.
[0009]
The electronic component of the present invention is characterized by having a fixing structure
of the round pin terminal.
The ultrasonic sensor according to the present invention includes a piezoelectric diaphragm, a
case for housing the piezoelectric diaphragm, and a hole formed in a base of the case, one end of
the case electrically connected to the piezoelectric diaphragm in the case and the other And an
uneven portion is formed on a surface of a base portion of the case, and the round pin terminal is
fixed by soldering on the surface of the base portion. It is characterized by
[0010]
According to the present invention, asperities are formed on the surface of the pedestal to be
soldered to fix the round pin terminal.
At the time of soldering, the solder enters the unevenness formed on the surface of the pedestal,
and the solder portion is formed in such a shape as to engage with the unevenness of the surface
of the pedestal. Therefore, even if the hole formed in the base plate is loosely fitted to the round
pin terminal and the round pin terminal becomes rotatable, such engagement between the solder
portion and the pedestal portion rotates the round pin terminal. Is suppressed, and problems
such as wire breakage do not occur in the lead wires.
[0011]
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3
DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 1 is a cross-sectional view showing an
embodiment according to the present invention. FIG. 1 shows an ultrasonic sensor as in FIG. 5. In
the base plate 12 of this embodiment, pedestals 12a and 12c are formed at two places outside
the support 12b. The structure other than the base plate 12 is the same as that of the ultrasonic
sensor shown in FIG. As shown in FIG. 2, a stepped portion 12 d is formed on the pedestal
portion 12 a. Similar to the pedestal 12 a shown in FIG. 2, the pedestal 12 c also has a stepped
portion. The solder portion 10 is formed on the surface of the pedestal portion 12a on which the
stepped portion 12d is formed. As shown in FIG. 1, the solder portion 10 has a shape along the
surface of the pedestal 12a and engages with the surface of the pedestal 12a. Similarly, the
solder portion 11 formed in the pedestal portion 12c is also formed in a shape to be engaged
with the pedestal portion 12c surface. Therefore, even if the round pin terminals 8 and 9 become
rotatable due to heating or the like at the time of soldering, and the round pin terminals 8 and 9
become rotatable, the pedestal portions 12a and 12c. Since the upper solder portions 10 and 11
are respectively engaged with the pedestal portion surfaces, the rotation of the round pin
terminals 8 and 9 is suppressed. Therefore, disconnection of the lead wires 12 and 13 does not
occur.
[0012]
In the present invention, the concavo-convex shape formed on the pedestal surface is not limited
to the shape as shown in FIG. 2, and may be a concavo-convex shape that can be engaged with
the solder portion formed on the pedestal surface. Just do it.
[0013]
FIG. 3 is a perspective view showing the concavo-convex shape of the pedestal surface in another
embodiment according to the present invention.
In the pedestal portion 22a shown in FIG. 3, a groove 22b is formed at the center thereof. When
soldered on the pedestal portion 22a, the solder enters into the groove 22b, and a solder portion
is formed to engage with the surface of the pedestal portion 22a.
[0014]
FIG. 4 is a perspective view showing the concavo-convex shape of the pedestal surface in still
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another embodiment according to the present invention. In the embodiment shown in FIG. 4, the
pole portions 32b and 32c are formed on the surface of the pedestal portion 32a. When
soldering is performed on such a pedestal portion 32a, holes that can be fitted to the pole
portions 32b and 32c are formed in the solder portion, and the solder portion and the pedestal
portion 32a are engaged.
[0015]
In the above embodiment, the fixing structure of the round pin terminal of the present invention
has been described by taking the ultrasonic sensor as an example, but the present invention is
not limited to the fixing structure of the round pin terminal of the ultrasonic sensor. As long as it
is a component having a structure in which a round pin terminal is inserted into a hole formed in
a portion and soldered on the base portion surface to fix the round pin terminal, it can be widely
applied to any part.
[0016]
According to the present invention, the round pin terminal is fixed by soldering to the surface of
the pedestal on which the asperities are formed.
The solder portion formed on the pedestal surface is formed along the concavo-convex shape of
the pedestal surface, so that the solder portion is formed in a shape to be engaged with the
pedestal surface. For this reason, rotation of the round pin terminal can be prevented. Therefore,
when the lead wire is connected to the round pin terminal by the solder portion on the pedestal
portion, disconnection or the like of the lead wire can be prevented.
[0017]
The fixing structure of the present invention can be implemented only by forming irregularities
on the pedestal surface in the conventional fixing structure, and since it is a simple structure, it
can be implemented at economical cost.
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