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■ Japanese Patent Office 0 JP-A-52-7530i0 published Japanese Patent Application 52. (1977)
6.24 Internal Serial Number in the 7th, 7th, No. 1 specification, title of the invention
Pickup element
3. Detailed Description of the Invention The present invention relates to the structure of a pickup
device using a piezoelectric material, and the purpose is to improve the% frequency
characteristics and significantly reduce the piezoelectric output and increase the noise due to
aging. There are less to do. Heretofore, as a pickup device utilizing a piezoelectric body, a pickup
device for a video disc record reproducing apparatus is well known. ° This is used to attach a
pair of metal electrodes 2M and 2bi- to the piezoelectric body 1 on an input rectangular
parallelepiped or flat plate as shown in FIGS. 1 and 2, and draw out the output lead wires 6a and
5b from each of them. The piezoelectric material 1 is attached to the metal electrode 2a using
Evokin + 11e which adhesive 6 to attach the warp-shaped record needle 3 made of diamond or
the like, and the other metal electrode 2b using the adhesive agent 6 purple such as epoxy resin.
It is attached to the cantilever 41 which should be a holder. In this pickup element, the pressure
applied to the warp-shaped record needle 3 is coupled to the 33 vibration mode in the
piezoelectric body 1, and the lead wire 5a. Give piezoelectric output to 6b. However, in the pickup element as described above, the adhesion of the metal electrodes 2a and 2b to the
piezoelectric body 1 is deteriorated due to the temporal change, and the metal electrodes 2a and
2b form a handle at the bonding interface with the piezoelectric body 1 It has been found that it
is separated, piezoelectric output decreases and noise increases, and it can not withstand longterm use. Also, the above metal electric 'II2a. The adhesion of 2b to the piezoelectric body 1 is
the metal electrode 2m. It is a large change due to a slight change of the formation condition of
2b or a slight gate formation of the adhesion condition of the above lead @ 6a 15 b. Therefore, it
is necessary to strictly control the conditions of EndPage: 1K [, electrode attachment and lead
attachment to mass-produce the pickup element having the above-mentioned structure, and
there is a drawback that mass-production is difficult. The all-monthly book 44 is directed to the
improvement of the pickup element described above, and is intended to provide a pickup element
which is particularly easy to be mass-produced with excellent high leg lipability and less
problems of electrode peeling. Hereinafter, embodiments of the present invention will be
described in detail with reference to the drawings. FIGS. 3 and 4 and FIGS. 5 and 6 respectively
show the structure of the embodiment of the pickup element according to the present invention.
In FIGS. 3 and 4, 11 is a thin film piezoelectric material, and 12a and 12b are a pair of metal thin
film electrodes attached to two opposite surfaces of the piezoelectric material 11, while 1241 is a
lower base electrode. , The other 12b is an upper counter electrode.
The lower surface of the lower base electrode 12a is made of diamond, boron nitride corundum
(main component is α-AIO) 4 is a hard material made of silicon carbide, and is attached to one
end face of the 1-d needle 13 doing. A cantilever board 14 is provided on the upper surface of
the upper counter electrode 12b. 1sa and 1ab are output lead wires, and 16 is an adhesive made
of epoxy resin or the like. In the pickup element, the lower base electrode 12 & and the upper
counter electrode 12b are, for example, AI. It is composed of a thin conductive layer with high
adhesion strength such as Ti, Ni, Cr, Cr / Au, Cr / Ti / Au. These thin layers are formed to a
thickness of, for example, 0.1 .mu.m by vacuum evaporation, film deposition, ion plating, or the
like. The thin film piezoelectric is, for example, ZnO having a thickness of 1 to 10 μm. ZnS,
ZnSga, CdO, CdS, CdSe, AIN, LiNbO3 L1τao3. These piezoelectric thin layers composed of high
electromechanical bonding materials such as Bi, 2 Goo 2o, Bt 12 'rto 2 °, B 1, 2 Pb O 19 0 These
piezoelectric thin layers must have both excellent crystallinity and orientation, and have
necessarily a single crystal structure The thin piezoelectric layer of this type may be formed by a
method such as, for example, a silicon 7 vapor deposition method or a vapor phase growth
method. The inventors have found that the use of the above-described thin-layer electrode and
thin-layer piezoelectric tube eliminates the disadvantages of this conventional chicken pink-up
element. That is, in the pickup element of the present invention, the pressure applied to the
record needle 13 is combined with the vibration mode 33 "31 or 16" of the piezoelectric body 11
to give a piezoelectric output to the leads 1116a, 1sb. In this case, the lower ground potential 1 #
1A12a, the piezoelectric body 11, and the upper counter electrode 12bl '! It adheres closely to
the record needle 13 and these are integrated, causing problems in the conventional pickup
element shown in FIG. 1 and FIG. The change has decreased. In addition, since the electrodes 12a
and 12b and the piezoelectric body 11 can be processed by two processes by vapor deposition,
the manufacture of the pickup element becomes easy, and the thickness of the piezoelectric body
reduces the weight of the element, and high frequency The characteristics have been improved. 6
and 6 show other examples of the embodiment of the pickup device of the present invention. In
FIG. 6 and the other drawings, the record needle 13 is attached to the metal 177t, for example,
T1 wide. And 9 diamond, boron nitride, corundum or silicon carbide, which is used to polish the
surface of the metal 17, the action of the base electrode 12 & t!
Is also a combination of In this case, for example, the record needle can be formed by a very
small amount of diamond. If semiconductorized diamond or carbonized carbon + + element is
used for the above record needle, the action of the upper ground I pole 12m is provided 9 / L of
the above record needle, so in this case, the output lead 15a Is drawn directly from the record
needle, so the lower base electrode 12a made of the metal thin layer is not particularly required.
Alternatively, only one end face of diamond or silicon carbide may be made semiconductive to
form a conductive layer, which may be used as the entire lower base electrode 12m. If the
conductive thin layer is present on one side of the record needle, the action metal of the lower
base electrode 12a is indicated, so that the conductive thin layer only needs to be firmly attached
to one end face of the reflex needle. Not limited to this embodiment in its structure and type.
Furthermore, in the above embodiment, although the electrode thin layer and the piezoelectric
thin layer gold record needle upper surface 18 are provided, EndPage: 2 etc. are formed on the
side 19 or back 2 o other than the upper surface of the record needle. The same effect can be
obtained. As described above, the pickup element according to the present invention is made
conductive by forming at least one end surface of the record] into a semiconductor, forming a
conductive bracket, and bonding metal on the end surface or the end surface. It should be noted
that the piezoelectric thin layer, the counter electrode, and the ft11 electrode are sequentially
provided on this region when the region of sex is formed. The pickup element having such a
configuration is separated from the conventional configuration in which the stylus is attached to
the piezoelectric body, and the piezoelectric body and the stylus are completely integrated by
thinning the piezoelectric body, as if from the conventional pickup element It is not only
indispensable as a pickup device for video disc reproducing equipment but also widely used for
an audio recording system or an industrial vibration detecting apparatus.
4. Brief description of the drawings. FIG. 1 shows a conventional pickup element in the positive
thI zone 1 of a conventional pickup device, FIG. 1 shows a cross-sectional view of a-a 'in FIG. 3
and FIG. 3 shows an embodiment of the present invention. FIG. 4 is a front view of the element,
FIG. Are there other embodiments of the present invention? 1 shows the pickup element, and 6
shows an a-c 'sectional view thereof. ) 'Needle, 14 · · · force / lever, 1sa, 1 esb · · · lead wire, 16 · · ·
crush agent. Name of agent Attorney Nakao Toshio Nakao # 1 or 1 person Figure 1 Figure 5
Figure 6 EndPage: 36 Inventors and agents other than the above (1) Inventor name I5 Kihiko Ise
悠 Producing place same place Mitsuyuraneo Name San-Ryu-Zensho-Kusho (2) Agent EndPage:
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