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JPS54136894

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DESCRIPTION JPS54136894
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 and FIG. 2 are respectively a perspective view of
an essential part of an ultrasonic probe already developed by the present inventors, and FIGS. 3
and 4 are respectively an ultrasonic wave according to the present invention. It is a principal part
perspective view which shows the Example of a probe. 1
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иииииииии Electrode , 5 ... ... holes.
[Detailed description of the invention] Recently, medical electronic devices have been actively
developed, and among them, an ultrasound probe 1 image which can be seen with a moving
heart and abdomen, and a fault + ti l gamma time Devices are rapidly spreading. This invention
relates to this acoustic tomography unit @ O ultrasonic probe. In general, a piezoelectric element
in which the weight of the piezoelectric element is divided into m pieces or a bipolar member in
which the piezoelectric element is divided into m pieces is put to practical use as an ultrasonic
probe. The inventors of the present invention can easily perform one operation as a lead
assembly from the piezoelectric element upper electrode-, =, 5-q-73-2 to the detector, and there
is little risk of disconnection etc. 7). We are promoting the development of ultrasonic probe O
using a flexible flexible printed circuit board that can be made. Here, one problem is that an
electrical connection (for example, a conductive paste) between the bare wire (copper foil) at the
end of the m lead wires in the flexible / pull printed circuit board and the m electrodes of the
piezoelectric element , ?Soldering? is weak <, ?Attacking phenomenon such as peeling is likely
to occur during the att-setting operation, and open defects are continuously generated. The first
problem and FIG. 2 show the electrical connection between the flexible printed circuit and the
lEE element. Fig. 1 shows the case of soldering, in which the copper foil 2a on the tip of the 011lead wire 2 in the flexible printed common plate 1 is soldered and soldered together with the
electrode 3a surface of the aE @ element 3, flexible / bulpino 14 The soldering iron was pressed
from the insulating portion of the plate 1 (polyimide resin is used), and the solder was soldered r
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(both the number and the number were completely soldered). FIG. 2 shows the connection by the
conductive paste in the case of soldering and in the reverse direction of the copper foil 2a, with
the upper portion 1)), the piezoelectric element 3 to 7] X7), +1. Polar aa (Ai and superimposed
Ze-ichi 1 base 4 painted and painted 3), clothed 1 However, in the case of the former, it was
difficult to transmit the temperature because it applied a solder iron through the insulating part,
and it took a long time. In addition, the mechanical strength of the connection was weak and both
were prone to peeling during the assembly operation. In the present invention, in order to solve
this problem and to put it into practical use, hole processing is carried out on the inner edge of
copper foil on the edge of copper foil in a frequino-full-prime substrate to increase mechanical
strength in excess connection, An ultrasonic probe which prevents peeling and the like is
provided. The same parts as those described above will be described with the same reference
numerals as in FIG. 3 and FIG. In the case of connection by the conductive paste, FIG. 3 shows the
process of forming the hole 6'7 in the copper 732a of the tip of the D lead wire 2 in the flexible
thin substrate 1). The above-mentioned frequen-frit substrate 1 is put on the electrode 3alf] of
the electric wire 3 and an exclusive paste is applied from the top of the hole 6.
-PA) Fig. 4 shows a connection by soldering, flexible / 1. /. 4, the tip of the D lead wire 2a in the
pull printed circuit board 1 has a hole 5 'D processed in the copper foil 2a, and the copper foil 2a
is on the lower side. The solder layer is pressed from the top of the hole 5, and the copper foil
2aD is soldered by melting a solder paste. In this case, since the tip of the soldering iron enters
the hole, the solder plating can be directly melted, so that soldering can be performed reliably. As
described above, according to the present invention, since the lead wire end O copper foil is
processed by a hole, the connecting area is large and the connecting strength is strong, so that
the peeling phenomenon does not occur during one assembling operation. Accordingly, the
flexible frit substrate '7) can be put to practical use, and has a very high practical value.
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