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JP2003032784

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JP2003032784
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
speaker used in various acoustic devices.
[0002]
2. Description of the Related Art A conventional speaker will be described with reference to FIG.
[0003]
FIG. 14 shows a cross-sectional view of a conventional speaker.
According to FIG. 14, a frame 6 obtained by injection molding with a resin material is coupled to
the upper plate 2 of the magnetic circuit 4 configured by sandwiching the magnetized magnet 1
between the upper plate 2 and the lower plate 3, A diaphragm 7 is adhered to the periphery of
the frame 6, a voice coil 8 for driving the diaphragm 7 is coupled to the diaphragm 7, and the
voice coil 8 is centered by a damper 9 and fitted into the magnetic gap 5. And the dust cap 10 is
bonded to the front surface of the diaphragm 7 to complete the process.
[0004]
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1
Although the above-mentioned speaker uses the injection type resin frame 6 in order to obtain a
complicated frame shape by a simple process, the thermal conductivity compared with the metal
frame The heat dissipation and heat resistance were poor. Therefore, it was difficult to
continuously apply a large input to the speaker. That is, it has a problem that it is not possible to
achieve high input resistance of the speaker.
[0005]
Accordingly, in the future, it has been an object to improve the thermal conductivity, heat
dissipation and heat resistance of the frame 6 to realize high input resistance of the speaker.
[0006]
The present invention solves the above-mentioned problems, and provides an excellent speaker
capable of realizing high input resistance of the speaker.
[0007]
SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present
invention has the following constitution.
[0008]
According to the first aspect of the present invention, the frame is made of a resin in which
alumina powder is mixed.
As a result, the thermal conductivity, heat dissipation, heat resistance, rigidity, and shape stability
of the frame can be improved, and the effect of improving the input resistance of the speaker and
stabilizing the quality can be obtained.
[0009]
According to a second aspect of the present invention, the magnetic resin is molded with a resin
for forming a frame to a range covering a part or all of the yoke outer peripheral side surface of
the magnetic circuit.
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2
As a result, while improving the heat conductivity and the heat radiation from the yoke, the effect
of improving the productivity of the speaker can be obtained.
[0010]
According to a third aspect of the present invention, the resin is molded with a resin for forming
a frame to a range covering a part or all of the outer side surface of the top plate of the magnetic
circuit.
As a result, while improving the heat conductivity and heat dissipation from the upper plate, the
effect of improving the productivity of the speaker can be obtained.
[0011]
According to a fourth aspect of the present invention, the resin is molded with a resin for forming
a frame to a range covering a part or the whole of the outer peripheral side surface of the
magnetic circuit. As a result, while improving the heat conductivity and heat dissipation from the
magnet, the effect of improving the productivity of the speaker can be obtained.
[0012]
According to a fifth aspect of the present invention, the resin is molded with a resin for forming a
frame to a range covering a part or all of the outer peripheral side surface of the lower plate of
the magnetic circuit. As a result, while improving the heat conductivity and heat dissipation from
the lower plate, the effect of improving the productivity of the speaker can be obtained.
[0013]
The invention according to claim 6 of the present invention is one in which the resin is molded
with a resin for forming a frame to a range extending to a part of the back surface of the lower
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3
plate of the magnetic circuit. As a result, the thermal conductivity and heat dissipation from the
lower plate can be improved, and at the same time, the cancel magnet guide of the low magnetic
leakage speaker can be formed, and the productivity of the speaker can be improved.
[0014]
According to the seventh aspect of the present invention, the entire magnetic circuit is molded
with a frame forming resin. As a result, the thermal conductivity and heat dissipation from the
entire magnetic circuit can be improved, and at the same time, the holdability of the entire
magnetic circuit can also be improved, and the effect of improving the productivity of the
speaker can be obtained.
[0015]
According to an eighth aspect of the present invention, the surface of the magnetic circuit mold
portion has an uneven shape. As a result, the surface area of the magnetic circuit mold resin
portion is enlarged by the concavo-convex shape, thereby obtaining the effect of further
improving the thermal conductivity and the heat dissipation.
[0016]
According to a ninth aspect of the present invention, the frame is formed by mixing more
alumina powder than the diaphragm coupling portion in the vicinity of the magnetic circuit. As a
result, the thermal conductivity and the heat dissipation in the vicinity of the magnetic circuit of
the frame are improved, and an effect that high input resistance of the speaker can be achieved
can be obtained as a configuration not transmitting heat to the diaphragm bonding portion of the
frame.
[0017]
According to a tenth aspect of the present invention, the frame is formed by mixing more
alumina powder than the damper coupling portion in the vicinity of the magnetic circuit. As a
result, the thermal conductivity and heat dissipation in the vicinity of the magnetic circuit of the
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4
frame can be improved, and an effect that high input resistance of the speaker can be achieved
can be obtained as a configuration that does not transmit heat to the damper bonding portion of
the frame.
[0018]
According to an eleventh aspect of the present invention, the frame is formed by mixing alumina
powder more than the diaphragm coupling portion in the vicinity of the magnetic circuit and on
the outer peripheral surface. As a result, the thermal conductivity and heat dissipation in the
vicinity of the magnetic circuit of the frame and on the outer peripheral surface are improved,
and the function of transmitting heat to the diaphragm bonding portion of the frame can be
enhanced. Be
[0019]
According to the twelfth aspect of the present invention, the frame is formed by mixing alumina
powder more than the damper coupling portion in the vicinity of the magnetic circuit and the
outer peripheral surface. As a result, the thermal conductivity and heat dissipation of the vicinity
of the magnetic circuit of the frame and the outer peripheral surface are improved, and the effect
of improving the input resistance of the speaker can be obtained as a configuration not
transmitting heat to the damper bonding portion of the frame. .
[0020]
According to a thirteenth aspect of the present invention, the outer peripheral surface of the
frame is provided with an uneven shape. As a result, by enlarging the surface area of the outer
peripheral surface of the frame by the uneven shape, the effect of further improving the thermal
conductivity and the heat dissipation can be obtained.
[0021]
According to a fourteenth aspect of the present invention, the resin frame is constructed by
carrying out the mixing arrangement control of the alumina powder amount and the alumina
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5
powder by a two-color molding method of injection molding. As a result, it is possible to obtain
the effect that the amount of alumina powder in the frame and the mixing and arrangement of
the alumina powder can be freely controlled.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1 The invention according to the
first aspect of the present invention will be described with reference to Embodiment 1 below.
FIG. 1 is a cross-sectional view of a loudspeaker according to an embodiment of the present
invention.
[0023]
According to FIG. 1, the upper plate 22 of the magnetic circuit 24 constructed by sandwiching
the magnetized magnet 21 between the upper plate 22 and the lower plate 23 is injectionmolded by a resin mixed with alumina powder. The frame 26 is coupled, the diaphragm 27 is
coupled to the outer periphery of the frame 26, the voice coil 28 for driving the diaphragm 27 is
coupled to the diaphragm 27, and the voice coil 28 is centered by the damper 29. The dust cap
30 is bonded to the front of the diaphragm 27 so as to be fitted into the magnetic gap 25 and
completed.
[0024]
According to this configuration, the thermal conductivity, heat dissipation, heat resistance,
rigidity and shape stability of the magnetic circuit 24 can be improved, and high input resistance
of the speaker and stabilization of quality can be achieved.
[0025]
Second Embodiment The second embodiment of the present invention will be described in the
following.
FIG. 2 is a cross-sectional view of a loudspeaker according to an embodiment of the present
invention, which is an embodiment of a magnetic circuit of an internal magnet type using a
neodymium magnet.
13-05-2019
6
[0026]
Referring to FIG. 2, the outer peripheral side surface of the yoke 33 of the magnetic circuit 24
constructed by sandwiching the magnetized neodymium magnet 32 between the upper plate 31
and the yoke 33 is molded with a resin mixed with alumina powder. Frame 26 is configured.
A diaphragm 27 is coupled to the outer peripheral portion of the frame 26, a voice coil 28 for
driving the diaphragm 27 is coupled to the diaphragm 27, and the voice coil 28 is centered by a
damper 29 and fitted into the magnetic gap 25. Thus, the dust cap 30 is bonded to the front
surface of the diaphragm 27 and completed.
[0027]
According to this configuration, the thermal conductivity, heat dissipation, heat resistance and
productivity of the magnetic circuit 24 can be improved, and the reduction of the sound pressure
level of the speaker due to the thermal demagnetization of the neodymium magnet can be
prevented. Therefore, high input tolerance of the speaker can be achieved.
[0028]
Third Embodiment The third embodiment of the present invention will be used to explain the
third aspect of the present invention. FIG. 3 shows a cross-sectional view of a loudspeaker
according to an embodiment of the present invention. The configuration of the frame will be
described with reference to FIG. The configuration of the speaker is the same as that of the first
embodiment, and hence the description is simplified.
[0029]
Referring to FIG. 3, the frame 26 is formed by molding a resin mixed with alumina powder to the
extent of the outer peripheral side surface of the top plate 22 of the magnetic circuit 24. As a
result, the frame 26 can be formed simultaneously with the bonding with the upper plate 22 so
that the productivity can be improved, the contact area with the magnetic circuit 24 can be
13-05-2019
7
expanded, and the thermal conductivity and heat dissipation can be further enhanced.
Furthermore, the holdability of the magnetic circuit can also be improved.
[0030]
Fourth Embodiment The fourth embodiment of the present invention will be described below
with reference to the fourth aspect of the present invention. FIG. 4 shows a cross-sectional view
of a loudspeaker according to an embodiment of the present invention. The configuration of the
frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description will be simplified.
[0031]
According to FIG. 4, the frame 26 is formed by molding a resin mixed with alumina powder up to
the range extending to the outer peripheral side surface of the magnet 21 of the magnetic circuit
24. As a result, the frame 26 can be formed simultaneously with the coupling with the magnet 21
so that the productivity can be improved, and the contact area with the magnetic circuit 24 is
enlarged, and the thermal conductivity and the heat dissipation are further enhanced. The
holdability of the magnetic circuit can also be improved.
[0032]
Fifth Embodiment The fifth embodiment of the present invention will be described with reference
to the fifth embodiment of the present invention. FIG. 5 shows a cross-sectional view of a
loudspeaker according to an embodiment of the present invention. The configuration of the
frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description will be simplified.
[0033]
According to FIG. 5, the frame 26 is formed by molding a resin mixed with alumina powder up to
the range extending to the outer peripheral side surface of the lower plate 23 of the magnetic
circuit. As a result, the frame 26 can be formed simultaneously with the joint with the lower plate
13-05-2019
8
23, so that the productivity can be improved, the contact area with the magnetic circuit 24 can
be expanded, and the thermal conductivity and the heat dissipation can be further enhanced.
Furthermore, the holdability of the magnetic circuit can also be improved.
[0034]
Embodiment 6 The invention according to the sixth aspect of the present invention will be
described with reference to the sixth embodiment. FIG. 6 shows a cross-sectional view of a
loudspeaker according to an embodiment of the present invention. The configuration of the
frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description will be simplified.
[0035]
According to FIG. 6, the frame 26 is formed by molding with a resin mixed with alumina powder
to the range extending to the outer peripheral back surface of the lower plate 23 of the magnetic
circuit 24. As a result, the frame 26 can be formed simultaneously with the joint with the lower
plate 23, so that the productivity can be improved, the contact area with the magnetic circuit 24
can be expanded, and the thermal conductivity and the heat dissipation can be further enhanced.
Furthermore, the holdability of the magnetic circuit 24 can also be improved. Furthermore, since
the resin is molded to the outer peripheral back surface of the lower plate 23, this resin molded
portion can be used as an outer peripheral guide of the cancel magnet of the low magnetic
leakage speaker.
[0036]
Seventh Embodiment The seventh embodiment of the present invention will be used to explain
the seventh aspect of the present invention. FIG. 7 shows a cross-sectional view of a loudspeaker
according to an embodiment of the present invention. The configuration of the frame will be
described with reference to FIG. The configuration of the speaker is the same as that of the first
embodiment, and hence the description will be simplified.
[0037]
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9
Referring to FIG. 7, the frame 26 is constructed by molding the entire magnetic circuit 24 with a
resin mixed with alumina powder. As a result, the frame 26 can be formed simultaneously with
the coupling with the magnetic circuit 24, so that the productivity can be improved, the contact
area with the magnetic circuit 24 can be expanded, and the thermal conductivity and the heat
dissipation can be further enhanced. Furthermore, the holdability of the magnetic circuit 24 can
also be improved.
[0038]
Eighth Embodiment The eighth embodiment of the present invention will be described in the
following. FIG. 8 shows a cross-sectional view of a loudspeaker according to an embodiment of
the present invention. The configuration of the frame will be described with reference to FIG. The
configuration of the speaker is the same as that of the first embodiment, and hence the
description will be simplified.
[0039]
Referring to FIG. 8, the frame 26 is formed by molding the entire magnetic circuit 24 with a resin
mixed with alumina powder, and the unevenness 26a is provided on the surface of the magnetic
circuit mold portion. As a result, the frame 26 can be molded simultaneously with the coupling
with the magnetic circuit 24, and productivity can be improved. Besides the expansion of the
contact area with the magnetic circuit 24, the shape of the unevenness 26a on the surface of the
magnetic circuit mold resin portion As a result, the surface area is expanded, and the heat
conductivity and heat dissipation are further enhanced. Furthermore, the holdability of the
magnetic circuit can also be improved.
[0040]
Embodiment 9 The invention according to the ninth aspect of the present invention will be
described below with reference to the ninth embodiment. FIG. 9 shows a cross-sectional view of a
loudspeaker according to an embodiment of the present invention. The configuration of the
frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description will be simplified.
13-05-2019
10
[0041]
According to FIG. 9, the frame 26 is configured by mixing more alumina powder than the
diaphragm 27 coupling portion in the vicinity of the magnetic circuit 24. As a result, the thermal
conductivity and heat dissipation in the vicinity of the magnetic circuit of the frame 26 are
improved, and heat is not transmitted to the diaphragm bonding portion of the frame 26 to
prevent the detachment of the bonding of the diaphragm. The high input resistance of the
[0042]
Tenth Embodiment The tenth embodiment of the present invention will be described with
reference to the tenth embodiment. FIG. 10 shows a cross-sectional view of a loudspeaker
according to an embodiment of the present invention. The configuration of the frame will be
described with reference to FIG. The configuration of the speaker is the same as that of the first
embodiment, and hence the description will be simplified.
[0043]
According to FIG. 10, the frame 26 is configured by mixing more alumina powder than the
damper 29 coupling portion in the vicinity of the magnetic circuit 24. As a result, the thermal
conductivity and heat dissipation in the vicinity of the magnetic circuit 24 of the frame 26 are
improved, and heat is not transmitted to the damper 29 bonding portion of the frame 26 to
prevent the bonding detachment of the damper 29, It is possible to achieve high input tolerance
of the speaker.
[0044]
Eleventh Embodiment The eleventh embodiment of the present invention will be described with
reference to an eleventh embodiment of the present invention. FIG. 11 shows a cross-sectional
view of a loudspeaker according to an embodiment of the present invention. The configuration of
the frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description will be simplified.
13-05-2019
11
[0045]
Referring to FIG. 11, the frame 26 is configured by mixing more alumina powder than the
diaphragm 27 coupling portion in the vicinity of the magnetic circuit 24 and on the outer
peripheral surface. Thus, the thermal conductivity and heat dissipation in the vicinity of the
magnetic circuit 24 of the frame 26 are improved, and heat is not transmitted to the diaphragm
27 bonding portion of the frame 26 to prevent the detachment of the diaphragm 27 from
bonding. Thus, high input tolerance of the speaker can be achieved.
[0046]
(Embodiment 12) The invention according to the twelfth aspect of the present invention will be
described below with reference to Embodiment 12. FIG. 12 shows a cross-sectional view of a
loudspeaker according to an embodiment of the present invention. The configuration of the
frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description is simplified.
[0047]
According to FIG. 12, the frame 26 is configured by mixing more alumina powder than the
damper 29 coupling portion in the vicinity of the magnetic circuit 24 and on the outer peripheral
surface. As a result, the thermal conductivity and heat dissipation in the vicinity of the magnetic
circuit 24 of the frame 26 are improved, and heat is not transmitted to the damper 29 bonding
portion of the frame 26 to prevent the bonding detachment of the damper 29, It is possible to
achieve high input tolerance of the speaker.
[0048]
Thirteenth Embodiment The thirteenth embodiment of the present invention will be described in
the following with reference to the thirteenth embodiment. FIG. 13 shows a cross-sectional view
of a loudspeaker according to an embodiment of the present invention. The configuration of the
frame will be described with reference to FIG. The configuration of the speaker is the same as
that of the first embodiment, and hence the description is simplified.
13-05-2019
12
[0049]
According to FIG. 13, the unevenness 26b is formed on the outer peripheral surface of the frame
26. As a result, by expanding the surface area of the outer peripheral surface of the frame 26 by
the unevenness 26 b, the thermal conductivity and the heat dissipation can be improved, and the
input resistance of the speaker can be increased.
[0050]
Fourteenth Embodiment The fourteenth embodiment of the present invention will be described
with reference to the fourteenth embodiment. That is, the mixing control of the amount of
alumina powder and the mixing of the alumina powder is carried out by the two-color molding
method of injection molding, and the frame 26 of FIGS. 1 to 13 is configured. As a means for
obtaining the frame 26, a gate port for injection molding is provided at a position near the
magnetic circuit 24 and a position away from the magnetic circuit 24, and a resin in which a
large amount of alumina powder is mixed from the gate port near the magnetic circuit 24. It is
possible to simplify the configuration by injecting a material, and injecting a resin material not
containing or slightly mixed with alumina powder from a gate port provided at a distance from
the magnetic circuit 24 and performing two-color molding.
[0051]
Thus, the amount of alumina powder in the frame 26 and the mixing and arrangement of the
alumina powder can be freely controlled, and the productivity can be improved.
[0052]
As described above, the speaker of the present invention is made of resin in which alumina
powder is mixed in the frame, whereby the thermal conductivity, heat dissipation, heat
resistance, and rigidity of the frame are obtained. The shape stability can be improved, and high
input resistance of the speaker and stabilization of the quality can be achieved.
In the case of a neodymium magnet, it is also possible to prevent the sound pressure level of the
13-05-2019
13
speaker from lowering due to thermal demagnetization.
[0053]
Therefore, the present invention can provide an excellent speaker capable of realizing high input
resistance, and its industrial value is extremely large.
[0054]
Brief description of the drawings
[0055]
1 is a cross-sectional view of a speaker according to an embodiment of the present invention
[0056]
2 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0057]
3 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0058]
4 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0059]
5 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0060]
6 is a cross-sectional view of a speaker according to another embodiment of the present
invention
13-05-2019
14
[0061]
7 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0062]
8 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0063]
9 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0064]
10 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0065]
11 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0066]
12 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0067]
13 is a cross-sectional view of a speaker according to another embodiment of the present
invention
[0068]
Fig. 14 Cross section of the conventional speaker
[0069]
Explanation of sign
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[0070]
21 magnet 22 upper plate 23 lower plate 24 magnetic circuit 25 magnetic gap 26 frame 27
diaphragm 28 voice coil 29 damper 30 dust cap
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