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JP2004336506

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DESCRIPTION JP2004336506
An object of the present invention is to provide a method of manufacturing a piezoelectric
sounding component capable of automating a manufacturing line and eliminating auxiliary work
by an operator in the middle of a process. A housing is provided with a piezoelectric diaphragm,
a non-flowable silicone adhesive is applied between the piezoelectric diaphragm and the housing,
and sound pressure separation is performed before the silicone adhesive is cured. Since sound
pressure screening is performed prior to curing of the silicone adhesive, a time consuming curing
process can be performed after sound pressure screening. Therefore, the storage of the
diaphragm, the application of the silicone adhesive, the sound pressure sorting and the like can
be made into a continuous line, and the cost of the equipment can be reduced, and the auxiliary
work by the operator in the middle of the process can be eliminated. [Selected figure] Figure 3
Method of manufacturing piezoelectric sound component
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
method of manufacturing a piezoelectric sounding component such as a piezoelectric buzzer or a
piezoelectric sounder. [0002] Conventionally, in electronic devices, home electric appliances,
mobile phones, etc., piezoelectric sounding components as piezoelectric sounders or piezoelectric
buzzers that generate alarm sounds and operation sounds. Is widely used. Piezoelectric sounding
parts, as described in Patent Document 1, include a diaphragm housed in a housing and
adhesively fixed by applying a silicone adhesive and curing the periphery of the diaphragm and
the inner wall of the housing There are many. Examples of the diaphragm include one in which a
piezoelectric plate is attached to one side of a metal plate to form a unimorph diaphragm, and a
bimorph diaphragm in which a plurality of piezoelectric ceramic layers are stacked. FIG. 1 shows
an example of a piezoelectric sounding component, in which 1 is a housing, 2 is a diaphragm,
and 3 is a terminal. The peripheral portion of the diaphragm 2 is supported on a support 1 a of
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the housing 1 and fixed by a silicone adhesive 4. FIG. 2 illustrates the general manufacturing
process of a piezoelectric sounding component as described above. That is, after the diaphragm 2
is housed in the housing 1 (step S1) and the terminal 3 is assembled (step S2), the silicone
adhesive 4 is applied (step S3). Next, the silicone adhesive 4 is cured by a curing device such as
an oven (step S4). Thereafter, a predetermined frequency signal is applied to the diaphragm 2, a
ringing sound is generated, and sound pressure selection is performed (step S5). However, since
the curing process is a process which requires much time (for example, 60 minutes) as compared
to other processes, only the curing process is a batch process, and an automatic line of
equipment is provided. Was difficult. As a result, there has been a problem that the
manufacturing line is divided in the curing process, and an auxiliary operation by the operator
becomes necessary. In addition, sound pressure measurement of a sounding component that
generates a ringing sound at a single frequency, such as a piezoelectric buzzer or a piezoelectric
sounder, is a standard method performed in a room called an anechoic room where no sound is
reflected. However, the anechoic chamber is one large chamber, which can not be incorporated
into a manufacturing facility for electronic components. Therefore, it is necessary to separately
provide equipment for carrying out from storage of the diaphragm to application of the adhesive
and equipment for performing sound pressure measurement, which increases the equipment
cost. Therefore, an object of the present invention is to provide a method of manufacturing a
piezoelectric sounding component capable of achieving automation of a manufacturing line and
eliminating assistant work by an operator in the middle of a process.
Another object of the present invention is to provide a method of manufacturing a piezoelectric
sounding component capable of providing equipment for carrying out from storage of diaphragm
to application of adhesive and equipment for measuring sound pressure in one manufacturing
equipment. It is in. In order to achieve the above object, the invention according to claim 1
comprises the steps of: housing a piezoelectric diaphragm inside a housing; a periphery of the
piezoelectric diaphragm; and a housing A step of applying a non-flowable silicone adhesive
between the inner peripheral portion of the and the above-mentioned piezoelectric adhesive
before applying the curing of the above-mentioned silicone adhesive, applying a predetermined
frequency signal to the above-mentioned piezoelectric vibrating plate and measuring its sound
pressure A method of manufacturing a piezoelectric sounding component is provided, comprising
the steps of: sorting and sorting; and curing the silicone adhesive for a product determined to be
non-defective after the sorting step. In the present invention, by setting the time-consuming
curing process as the final process, it is possible to create a continuous line of processes (storage
of the diaphragm, application of silicone adhesive, sound pressure sorting, etc.), It is possible to
reduce the cost of equipment cost and eliminate the auxiliary work by the operator in the middle
of the process. In addition, since the curing process is performed after the sound pressure sorting
process, the curing process may be performed only for the products determined to be nondefective products by the sound pressure sorting, and the curing process can be efficiently
performed. That is, since the curing process can be omitted for products determined to be
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defective products, waste can be omitted. The silicone adhesive used in the present invention
needs to be non-flowable. When a fluid silicone adhesive is used, the silicone adhesive will flow
when the piezoelectric diaphragm is driven to measure and sort the sound pressure, causing the
diaphragm to move or the sound pressure to become unstable. Problems arise. In addition, as a
hardening method of a silicone adhesive agent, well-known methods, such as moisture
absorption hardening and heat-hardening, can be used, for example. According to the second
aspect of the present invention, it is preferable to use one having a viscosity of 500 Pa · s or
more before curing of the silicone adhesive. If a silicone adhesive with a viscosity before curing
of 500 Pa · s or less is used, the silicone adhesive has fluidity, so if sound pressure screening is
performed before curing, the original sound pressure can not be obtained, or the adhesive Will
flow. By using a silicone adhesive having a viscosity of 500 Pa · s or more before curing, the
adhesive does not flow at the time of sound pressure sorting, and the original sound pressure can
be obtained. According to the third aspect of the present invention, the sound pressure before
and after curing of the silicone adhesive is measured, and the manufacturing method of the
present invention is applied to a piezoelectric sounding component having a correlation between
the sound pressure values. Good.
Some piezoelectric sounding parts do not have a correlation between the sound pressure value of
the silicone adhesive before and after curing. When the present invention is applied to such a
piezoelectric sounding component, the sound pressure characteristics after curing may be
defective even if it is determined to be non-defective before curing, and the reliability of sound
pressure sorting before curing is lowered. Do. Therefore, before implementing the present
invention, the sound pressure of the silicone adhesive before and after curing is measured as a
pre-process, and the presence or absence of the correlation between the sound pressure values is
determined to have a correlation (for example, before and after curing) By applying the present
invention only to the piezoelectric sounding component in which the sound pressure of the (1)
has a substantially proportional relationship, it is possible to ensure the reliability of the sound
pressure screening before curing. According to the fourth aspect of the present invention, the
step of applying a predetermined frequency signal to the piezoelectric diaphragm to measure the
sound pressure is a simplified sound pressure having a correlation with the sound pressure
characteristic of the piezoelectric sounding component in the anechoic chamber. It should be
measured by a measuring device. If the sound pressure is measured using the simple sound
pressure measuring device that has a high correlation with the measurement in the anechoic
chamber as described above, the equipment dimensions can be reduced, and the equipment that
performs from the storage of the diaphragm to the application of the adhesive The equipment for
performing sound pressure measurement can be provided in one manufacturing equipment, and
while the manufacturing equipment can be made into a continuous line, the measurement time
can be shortened, so that the manufacturing efficiency can be improved. As a simple sound
pressure measurement device, for example, a sound pressure measurement device (Japanese
Patent Application No. 2002-112987) previously proposed by the present applicant may be
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used. This device is attached to an artificial ear for sound pressure measurement equipped with a
microphone, having one end of an adapter having directivity of measurement sound and
internally having an air chamber having a resonance frequency larger than the measurement
frequency of the piezoelectric sound component. The ringing sound is measured by the artificial
ear through the adapter by ringing the piezoelectric sounding component in a state where the
piezoelectric sounding component is pressed against the seating surface of the other end of the
adapter communicating with the air chamber. In addition, the sound pressure characteristics
when the piezoelectric sounding component is housed in a small soundproof box where the
sounding noise does not echo and when this is sounded are correlated with the sound pressure
characteristics of the sounding sound of the piezoelectric sounding component in the anechoic
chamber You may use the device which has Both devices are compact and can be integrated into
the production line. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT FIG. 3 shows a
manufacturing process of a piezoelectric sounding component according to the present
invention. The piezoelectric sound-production component used here is the same as that shown in
FIG. FIG. 3 (a) is a pre-process, in which sound pressure of a plurality of piezoelectric sounding
parts before and after curing of the silicone adhesive is measured, and the correlation of the
sound pressure value is examined.
That is, after the diaphragm 2 is housed in the housing 1 (step S1) and the terminal 3 is
assembled (step S2), the silicone adhesive 4 is applied (step S3). The application operation can be
performed automatically using an application device such as a dispenser. As the silicone adhesive
4, one having a viscosity of 500 Pa · s or more before curing, that is, a non-flowable one is used.
Then, an AC signal is applied to the diaphragm 2 before the silicone adhesive 4 is cured, and the
sound pressure-frequency characteristics are measured (step S4). Since the silicone adhesive 4 is
non-flowable when the diaphragm 2 is vibrated, there is no problem that the diaphragm 2 is
displaced or the silicone adhesive 4 flows from the application position to the outside. Next, the
silicone adhesive 4 is cured by a curing device such as an oven (step S5), an AC signal is applied
to the cured diaphragm 2 again, and its sound pressure-frequency characteristics are measured
(step S6). From the sound pressure-frequency characteristics measured as described above, the
cross correlation between before and after curing is examined (step S7). FIG. 4 is an example of
sound pressure-frequency characteristics before and after curing of the silicone adhesive. Here,
an example of a piezoelectric sounder that requires a predetermined sound pressure at 4 kHz is
shown. FIG. 4 shows an example of a piezoelectric sounding component having a correlation
between before and after curing. A peak of sound pressure occurs at a frequency of around 3.3
kHz as shown by a broken line before curing, but after curing The peak of is translated to the
high frequency side by approximately 0.2 kHz. And the sound pressure difference in 4.0 kHz
before hardening and after hardening is about 4 dB. FIG. 5A shows measurement results of sound
pressure values before and after curing at a predetermined frequency in a plurality of examples
in which the sound pressure values are correlated. As apparent from (a) of FIG. 5, in the
piezoelectric sounding component having a correlation, the sound pressure value before curing
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and the sound pressure value after curing are approximately proportional to each other, and in
this example, the correlation coefficient is It was 0.9 or more. (B) in FIG. 5 is an example in which
the correlation before and after curing is not obtained, and in the case of such a piezoelectric
sounding component in which the correlation is not obtained, the sound pressure before curing
is measured. I can not guess the sound pressure. The present process shown in FIG. 3B is
performed on the piezoelectric sounding component having the above-mentioned correlation.
That is, after the diaphragm 2 is housed in the housing 1 (step S1) and the terminal 3 is
assembled (step S2), the silicone adhesive 4 is applied (step S3).
The housing 1, diaphragm 2, terminal 3 and silicone adhesive 4 used here are the same as those
used in the previous step. Before the silicone adhesive 4 is cured, a predetermined frequency
signal is applied to the diaphragm 2, and a ringing noise is generated to perform sound pressure
sorting (step S8). The above steps S1 to S3 and S8 can be implemented as a continuous line in
one installation. The sound pressure in step S8 is used to sort the non-defective product and the
non-defective product. Next, only the non-defective product is carried to a curing device such as
an oven to cure the silicone adhesive 4 (step S5). Since this curing step takes a long time of about
60 minutes, it is carried out by batch processing. Since it is known in advance that the correlation
between the sound pressure before and after curing is obtained in the previous step, the
piezoelectric sounding component in which the silicone adhesive 4 is cured as described above
can be used until another sound pressure selection is performed. Sound pressure characteristics
as a good product. Sound pressure measurement of sounding parts that generate ringing sound
at a single frequency, such as a piezoelectric buzzer or a piezoelectric sounder, is a standard
method that is performed in a room called an anechoic room where no sound is reflected. As the
dimensions become large, it takes time for measurement, and it is difficult to carry out in one
equipment along with other processes such as assembly of a diaphragm, assembly of a terminal,
and application of an adhesive. The applicant of the present invention has developed a compact,
simple sound pressure measuring device having high correlation with measurement in an
anechoic chamber (Japanese Patent Application No. 2002-112987). FIG. 6 shows an example of
such a simple sound pressure measuring device. 10 is a well-known artificial ear for sound
pressure measurement. The artificial ear 10 incorporates the microphone 11, and a cylindrical
earpiece mounting portion 12 is provided in a protruding manner at one end of the artificial ear
10. The receiving portion of the microphone 11 faces the inside of the earpiece mounting portion
12. One end opening 27 of the adapter 20 is fitted to the earpiece mounting portion 12 and
appropriately fixed by a screw or the like. The adapter 20 is formed in a cylindrical shape from a
metal material such as copper alloy, and the other end of the adapter 20 is formed with a seating
surface 21 for pressing the piezoelectric sounder S. A communication hole 23 is formed at the
center of the seating surface 21. An air chamber 24 communicating with the communication hole
23 is formed inside the adapter 20, and an opening hole 25 opened to the outside is formed on
the side wall of the air chamber 24. The opening holes 25 in this embodiment are formed in a
long hole shape in the axial direction, and a total of 12 holes are provided. The axial length L of
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the air chamber 24 is set larger than the diameter d.
Desirably, 2 d L L> d is good. The reason is that, assuming that the ringing sound of the
piezoelectric sounder S is emitted at a radiation angle of about 90 °, the reflected wave reflected
on the inner side wall of the air chamber 24 is prevented from being directly received by the
microphone 11, To increase FIG. 7 shows sound pressure comparison data of the piezoelectric
sounder S between the conventional measurement method A using an anechoic chamber and the
measurement method B using the above-described simple sound pressure measurement device.
In the conventional method A, a piezoelectric sounder S and a microphone are disposed in an
anechoic chamber, and the sound pressure is measured. In measurement method B, the sound
pressure of the piezoelectric sounder S is measured using a sound pressure measuring device
shown in FIG. It is measured. In A, the sounder S and the microphone were measured at a
distance of 10 cm, and in B, the sounder S and the microphone were measured at a distance of 5
cm. As apparent from FIG. 7, in the measurement method B, the sound pressure is about 10 dB
larger than that in the conventional method A, but at 1 to 5 kHz including the resonance
frequency 4 kHz of the sounder S, the correlation coefficient between them is 0.95 or more The
measurement level according to the measurement method B is equal to the reference level A.
Therefore, it was confirmed that even if the adapter 20 was used, there was no significant
difference in measurement accuracy from the method using the anechoic chamber. If the sound
pressure is measured using such a simple sound pressure measuring device, the equipment size
can be reduced, and the measurement time can be shortened. Therefore, it can be carried out in
one equipment along with the other steps, and the continuous line is made can do. The present
invention is not limited to the above embodiment, and can be changed without departing from
the spirit of the present invention. For example, although the frequency of sound pressure
measurement before and after curing of the silicone adhesive is fixed, the frequency of sound
pressure measurement before and after curing may be made different in anticipation of the shift
amount. In the above embodiment, an example in which the terminal is assembled after applying
the silicone adhesive has been described, but instead of the terminal, a lead wire may be
connected to the diaphragm in advance by soldering or the like. In this case, lead wires are also
incorporated into the housing when the diaphragm is housed in the housing. Also, the simple
sound pressure measuring device is not limited to the one shown in FIG. 6, but can be
incorporated into one production line, and it has a correlation with the sound pressure
characteristics of the piezoelectric sounding component in the anechoic chamber. For example, it
can be used. As is apparent from the above description, according to the invention as set forth in
claim 1, since the sound pressure separation is performed before the curing of the silicone
adhesive, it takes a long time to bond the silicone adhesive. The curing process of the agent can
be carried out after sound pressure screening.
Therefore, storage of the diaphragm, assembly of the terminals, application of silicone adhesive,
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sound pressure sorting, etc. can be made into a continuous line, and the cost of equipment cost
can be reduced and the assistant work by the operator in the middle of the process is eliminated.
be able to. In addition, since the curing process is performed after the sound pressure sorting
process, the curing process may be performed only for the products determined to be nondefective products by the sound pressure sorting, and the curing process can be efficiently
performed. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of an
example of a general piezoelectric sound producing component. FIG. 2 is a process diagram
showing a method of manufacturing a conventional piezoelectric sound producing component.
FIG. 3 is a process diagram showing a method of manufacturing a piezoelectric sounding
component according to the present invention. FIG. 4 is a sound pressure characteristic diagram
showing the correlation between before and after curing of a silicone adhesive. FIG. 5 (a) is a
sound pressure comparison diagram before and after curing when there is a correlation, and FIG.
5 (b) is a sound pressure comparison diagram before and after curing when there is no
correlation. FIG. 6 is a cross-sectional view of an example of a simplified sound pressure
measuring device. FIG. 7 is a sound pressure comparison diagram of a piezoelectric sounder in
the case of using an anechoic chamber and in the case of using a simplified sound pressure
measuring device. <Explanation of mark> 1 case 2 piezoelectric diaphragm 3 terminal 4 silicone
adhesive
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