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JP2006203695

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JP2006203695
An object of the present invention is to provide a speaker diaphragm molding apparatus capable
of shortening the heating time of a mold, thereby shortening the cycle time and improving the
productivity. A speaker diaphragm molding apparatus main body 50 has a pair of molding dies
5L, which sandwich a film-like material 20 between opposing molding surfaces 5Ua, 5La,
pressurize and mold them into a predetermined speaker diaphragm shape. It comprises 5 U and
induction coils 30 L, 30 U which are supplied with high frequency current and which inductively
heat the forming molds 5 L, 5 U through this high frequency current. In addition, cooling units
16L and 16U are provided which can be brought into contact with the molding dies 5L and 5U
and which circulate cooling water therein to cool the molding dies 5L and 5U. [Selected figure]
Figure 1
Speaker diaphragm molding apparatus, speaker diaphragm molding method and speaker
diaphragm
[0001]
The present invention relates to a loudspeaker diaphragm, a molding apparatus for molding the
loudspeaker diaphragm, and a molding method of the loudspeaker diaphragm.
[0002]
With regard to a method of molding a diaphragm of a small speaker, conventionally, there has
been proposed a mold heating and pressure molding method in which a film-like material is
sandwiched between a pair of heated molding molds and pressurized.
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In this mold heating and pressure molding method, for example, the heater block is heated by
pressing a high temperature heater block against the back of the upper and lower molds, and
when the mold reaches the set temperature, the film material is sandwiched by the molds.
Pressurize. Thereafter, a cooling air is blown to the mold in a state in which the film-like material
is sandwiched to be cooled, and when the temperature is lowered to a predetermined
temperature, the mold is separated from the film-like material (see, for example, Patent
Document 1).
[0003]
Japanese Patent Application Laid-Open No. 6-293064
[0004]
In recent years, the demand for small-sized speakers has been extended to not only speakers in
the receiver section of mobile phones but also external speakers.
The external speaker is required to have higher durability than the speaker of the receiver
section. Therefore, even in the speaker using polyetherimide, polyimide having higher rigidity
and higher heat resistance has come to be used. However, when polyimide or the like is used as
the film-like material, for example, the moldability is worse than conventional polyetherimide or
the like, and the film-like material and the molding die must be heated to a high temperature. On
the other hand, the heater block described above has a small heating capacity for heating the
molding die in a short time, and has a limit. And, it takes a lot of time to raise the mold to the set
temperature. Therefore, there is an unsolved problem that the cycle time is extended and the
productivity is deteriorated.
[0005]
The present invention has been made in view of the above, and it is possible to shorten the
heating time of the mold, thereby shortening the cycle time and improving the productivity. An
object is to obtain a molding method and a speaker diaphragm.
[0006]
In order to solve the problems described above and to achieve the object, according to the
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speaker diaphragm molding device of claim 1 of the present invention, a film-like material is
sandwiched between molding surfaces facing each other and pressurized to form a
predetermined speaker diaphragm It has a pair of shaping | molding dies made into a shape, and
an induction coil which supplies a high frequency current and induction-heats a shaping |
molding die through this high frequency current.
[0007]
A speaker diaphragm molding method according to claim 8 of the present invention comprises a
heating step of supplying a high frequency current to an induction coil disposed in the vicinity of
a molding die to inductively heat the molding die, and a heated molding die And forming a
predetermined film shape of the speaker diaphragm by sandwiching the film-like material on the
opposite molding surface and pressing the film-like material.
[0008]
In the loudspeaker diaphragm according to the twelfth aspect of the present invention, the filmlike material is sandwiched between the opposing molding surfaces of a pair of molding dies
inductively heated by the induction coil supplied with a high frequency current, and then molded.
It is characterized by
[0009]
Hereinafter, embodiments of a speaker diaphragm molding device, a speaker diaphragm molding
method, and a speaker diaphragm according to the present invention will be described in detail.
The present invention is not limited by the embodiment.
In the following, the outline and features of the speaker diaphragm molding device of the present
invention will be described as an embodiment, and then an embodiment relating to a speaker
diaphragm molding device, a speaker diaphragm molding method and a speaker diaphragm will
be described.
[0010]
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First Embodiment A speaker diaphragm molding apparatus according to a first embodiment is a
mold heating and pressure molding type molding apparatus in which a film-like material is
sandwiched and pressed by a pair of heated molding molds. A pair of molding dies which
sandwich and pressurize the film-like material on the opposing molding surfaces to form a
predetermined speaker diaphragm shape, an induction coil for supplying a high frequency
current and induction heating the molding die through the high frequency current And.
The induction coil is supplied with a high frequency current to form a magnetic field around the
molding die.
This magnetic field causes eddy currents to flow through the mold. Then, the molding die
generates heat by itself due to the current loss of the eddy current. According to this high
frequency current induction heating method, the temperature can be raised in a shorter time
than the conventional method of bringing the heater block into contact and heating. Therefore,
the heating time of the molding die can be shortened, whereby the cycle time can be shortened
and the productivity can be improved.
[0011]
Further, the speaker diaphragm molding device of the present embodiment is further provided
with a cooling unit which is provided so as to be in contact with the molding die, circulates the
cooling water inside, and cools the molding die. Since the cooling unit for circulating the cooling
water inside is brought into contact with the molding die to cool the molding die, the
temperature can be lowered to a predetermined temperature in a significantly short time by the
conventional method using only cooling air. Thereby, the cycle time can be further shortened,
and the productivity can be further improved.
[0012]
The cooling unit is provided movably between a cooling position in contact with the molding die
and a standby position separated from the molding die, and the cooling unit is further arranged
between the cooling position and the standby position. It has the air cylinder which is a drive
means to make it move. Therefore, it is possible to ensure that the molding die can be brought
into contact with the molding die for cooling only when it is desired to be cooled, and to leave the
molding die when it is not necessary to cool, without giving a load to the operation of the
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molding die Because the operation is not slowed down, the cycle time is not extended.
[0013]
Moreover, the speaker diaphragm shaping | molding apparatus of this Embodiment has a cooling
water pipe which is a cooling water circulation means which circulates a cooling water to an
induction coil and a cooling unit. The cooling water pipe interconnects the induction coil, the
cooling unit, and the cooling device, and supplies the cooling water discharged from the cooling
device to the induction coil and the cooling unit. That is, the cooling water supplied to the cooling
unit and the cooling water supplied to the induction coil are shared by the same water. With this
configuration, it is not necessary to provide a plurality of cooling devices and cooling water
circulating means, and cooling can be performed efficiently, and cost reduction can be achieved.
[0014]
In addition, the speaker diaphragm molding device of the present embodiment further includes
cooling air blowing means for blowing a cooling air to the molding die. With this configuration,
the molding die can be lowered to a predetermined temperature in a shorter time by the synergy
effect with the cooling unit, the cycle time can be further shortened, and the productivity can be
further improved.
[0015]
Also, the molding die is movably provided between the molding position for molding the film-like
material and the standby position apart from the film-like material, and the induction coil can be
advanced near the standby position of the molding die And induction heating the mold at the
standby position. With this configuration, since the induction coil advances to the position
retracted to the standby position with respect to the molding die that reciprocates between the
molding position and the standby position, unnecessary operation is eliminated, the mechanism
is simplified, and the operation is reliable. While improving the quality, cost can be reduced.
[0016]
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Furthermore, the molding die is made of magnetic stainless steel. By using magnetic stainless
steel having a high thermal resistance (reciprocal of thermal conductivity) as the material of the
molding die, the temperature of the molding die can be rapidly increased even when using an
induction coil with the same heating capacity As it can, the cycle time can be further shortened,
and the productivity can be further improved.
[0017]
Example. FIG. 1 is a side view of a main body of a speaker diaphragm molding apparatus
according to an embodiment of the present invention. In FIG. 1, the main body 50 which
constitutes the main part of the speaker diaphragm molding device is first of all a flat lower
fixing plate 2L, a flat upper fixing plate 2U, and four other fixing members. It has a frame 1
configured with a column-like support 3. The lower fixed plate 2L and the upper fixed plate 2U
are disposed at positions approximately equally apart in the vertical direction with respect to a
film-like material (hereinafter simply referred to as a film) 20 as a speaker diaphragm material
disposed in the central portion It is done. The main body portion 50 including the upper and
lower fixed plates 2U and 2L has a substantially symmetrical structure in the vertical direction
with respect to the film 20 (in this embodiment, the film 20 is disposed substantially
horizontally). A pair of molds will be described as being vertically disposed so as to sandwich
this. However, the orientation of the main body 50 is not limited to this). The film 20 has a band
shape, and the length of one diaphragm is sent for each cycle in which one diaphragm is formed.
[0018]
The main body 50 has a pair of molds consisting of an upper mold 5U and a lower mold 5L made
of a magnetic stainless steel material. The pair of upper and lower molds 5U and 5L are disposed
to face each other so as to sandwich the film 20, and molding surfaces 5Ua and 5La are formed
on the surface facing the film 20, respectively. The upper mold 5U is fixedly supported by the flat
upper movable plate 7U via four columnar upper mold columns 6U made of an electrical
insulator such as ceramic. On the other hand, the lower mold 5L is fixedly supported by the
lower movable plate 7L via four columnar lower mold supports 6L which are also made of an
electrical insulator such as ceramic.
[0019]
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The upper mold 5U, the upper mold support 6U, and the upper movable plate 7U disposed above
the film 20 are integrally fixed to each other to form an upper movable unit 10U. The upper
movable unit 10U is connected to an air cylinder 12U, which is a driving means, via a rod 11U
disposed slidably in the vertical direction. On the other hand, the lower mold 5L, the lower mold
support 6L, and the lower movable plate 7L disposed below the film 20 are similarly integrally
fixed to constitute a lower movable unit 10L. The lower movable unit 10L is connected to an air
cylinder 12L, which is a driving means, via a rod 11L disposed slidably in the vertical direction in
the same manner as the upper movable unit 10U. With this configuration, the upper movable
unit 10U and the lower movable unit 10L move forward and backward by the operation of the
air cylinders 12U and 12L. In the forward and backward movement, the upper mold 5U and the
lower mold 5L reciprocate between a molding position where the upper mold 5U and the lower
mold 5L abut against the film 20 and a retracted position separated from the film 20 by a
predetermined distance. Then, when the upper mold 5U and the lower mold 5L both advance to
the molding position, the molding surfaces 5Ua and 5La provided on each of the both molds 5U
and 5L sandwich the film 20 and are molded into a desired diaphragm shape Do. Incidentally, on
the surface between both molding surfaces 5Ua and 5La or on both molding surfaces 5Ua and
5La, the distance between both molding surfaces 5Ua and 5La is determined in a predetermined
manner to make the thickness of the diaphragm constant. A department is provided.
[0020]
An upper cooling unit 16U is disposed on the back surface side (the side opposite to the molding
surface 5Ua) of the upper mold 5U of the upper movable unit 10U. The upper cooling unit 16U is
made of a material having high thermal conductivity and has a block shape, and a passage for
circulating cooling water is formed inside. The upper cooling unit 16U is fixed to the tip of a rod
17U which extends parallel to the rod 11U and is provided retractably with respect to the upper
movable plate 7U. The rear end portion of the rod 17U is connected to an air cylinder 18U which
is a driving means provided side by side with the air cylinder 12U. A lower cooling unit 16L
having the same structure as that of the upper movable unit 10U is disposed on the back surface
side of the lower mold 5L of the lower movable unit 10L. The lower cooling unit 16L is fixed to
the tip of a rod 17L which extends parallel to the rod 11L and is retractably provided to the
lower movable plate 7L. The rear end portion of the rod 17L is connected to an air cylinder 18L
which is a driving means provided in parallel to the air cylinder 12L.
[0021]
The upper cooling unit 16U and the lower cooling unit 16L are cooled from the upper mold 5U
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and the lower mold 5L by the operation of the air cylinders 18U and 18L, respectively, to abut
the back surface of the upper mold 5U and the back surface of the lower mold 5L. The robot
moves back and forth between retraction positions separated by a predetermined distance. In the
upper cooling unit 16U and the lower cooling unit 16L, cooling water is circulated inside, and in
the above-described cooling position, both the molds 5U and 5L are brought into contact with
the upper mold 5U and the lower mold 5L. Cooling.
[0022]
Two lower clamps 22L are disposed in both side spaces of the lower movable unit 10L. The
lower clamp 22L has its base fixedly supported by the lower fixing plate 2L and is erected, and a
support surface 22La supporting the film 20 placed thereon from below is formed at the upper
end. On the other hand, two upper clamps 22U are disposed slidably in the vertical direction in
the space on both sides of the upper movable unit 10U. The upper clamp 22U is connected at its
base to the upper air cylinder 23U, and advances and retracts toward the film 20 by the
operation of the upper air cylinder 23U. The upper clamp 22U has a support surface 22Ua at its
tip. Then, the upper clamp 22U cooperates with the lower clamp 22L to move between a holding
position for holding the film 20 and a withdrawal position separated from the film 20 by a
predetermined distance. In this pinching position, the upper clamp 22U and the lower clamp 22L
sandwich the film 20 on both support surfaces 22Ua and 22La, and prepare for the molding
operation of the molds 5U and 5L.
[0023]
A lower high frequency induction coil (induction coil) 30L is disposed on the back surface side of
the lower mold 5L (opposite to the molding surface 5La). A high frequency current (alternate
current) is supplied from the high frequency induction heating device 32 to the lower high
frequency induction coil 30L. The lower high frequency induction coil 30L is supplied with a
high frequency current to form a magnetic field around the lower mold 5L. An eddy current
flows to the lower mold 5L by this magnetic field. Then, the lower mold 5L generates heat by the
current loss of the eddy current. また。 The lower high frequency induction coil 30L is moved
forward and backward in the direction perpendicular to the sheet of FIG. 1 by a drive mechanism
(not shown). Then, when the lower mold 5L is returned to the standby position, the lower mold
5L is advanced to approach the back surface of the lower mold 5L at this position, and a high
frequency current is supplied at that position to heat the lower mold 5L. On the other hand,
when the lower mold 5L moves to the molding position, the lower mold 5L escapes from the
back surface of the lower mold 5L in the side direction (direction perpendicular to the drawing)
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so as not to impede the progress of the lower movable unit 10L. Although not shown in FIG. 1, an
upper high frequency induction coil similar to the lower high frequency induction coil 30L is also
provided on the back surface side space of the upper mold 5U, and the upper mold 5U returns to
the standby position. At the same time, the upper mold 5U is heated so as to approach the back
surface of the upper mold 5U.
[0024]
A cooling water pipe 35, which is a cooling water circulation means, extends from the cooling
device 33 and is connected to the lower high frequency induction coil 30L and the lower cooling
unit 16L in order to supply the cooling water. The cooling water cooled by the cooling device 33
is circulated by the cooling water pipe 35 in the order of the high frequency induction heating
device 32, the lower cooling unit 16L, the lower high frequency induction coil 30L, the high
frequency induction heating device 32 and the cooling device 33. . Although not shown in the
drawing, an upper high frequency induction coil is similarly provided on the back surface side of
the upper mold 5U. The cooling water pipe 35 is also connected to the upper high frequency
induction coil and the upper cooling unit 16U (not shown), and the cooling water is supplied
from the cooling device 33. Here, although the lower high frequency induction coil and the upper
high frequency induction coil do not directly generate heat, they are cooled because they are
heated by heating from the upper mold 5U and the lower mold 5L, so that the heat is protected.
It is cooled by water.
[0025]
On the side of the upper movable unit 10U, an upper cooling air nozzle 37U, which is a cooling
air blowing means, is provided so as to be capable of advancing and retracting in the direction of
the upper movable unit 10U. The upper cooling air nozzle 37U advances to a position where the
nozzle tip approaches the upper mold 5U when the upper mold 5U is at the molding position,
and blows the cooling air to the upper mold 5U. At other times, it escapes in the side direction so
as not to disturb the operation of the lower mold 5L. Although not shown in the figure, the lower
cooling air nozzle for cooling the lower mold 5L is similarly provided on the side of the lower
movable unit 10L, and when the lower mold 5L is in the molding position Blow the cooling air.
[0026]
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FIG. 2 is a graph showing the temperature change of one cycle of the mold of the speaker
diaphragm molding apparatus. Curves shown by solid lines A to F in the graph show temperature
changes of a mold made of magnetic stainless steel. Moreover, the curves shown by alternate
long and short dash lines A to R in the graph show the temperature change of the mold made of
beryllium copper. The operation diagram shown in the lower part of the graph in FIG. 2 shows
the operation of the speaker diaphragm molding apparatus main body 50 at each position A to F
of one cycle of magnetic stainless steel shown in the graph. The operation will be described with
reference to FIG.
[0027]
(1) Heating process At the molding cycle start position of A in the graph (end position of previous
cycle), as shown in the operation diagram A, both the upper mold 5U and lower mold 5L are in
the standby position and the temperature is It is 220 ° C. In this state, the upper high frequency
induction coil 30U and the lower high frequency induction coil 30L are respectively advanced
near the back surface of the upper mold 5U and the lower mold 5L to be supplied with high
frequency current to inductively heat both molds 5U and 5L. . As a result, the temperatures of
both the molds 5U and 5L rapidly increase as shown by the straight line from the A position to
the B position. The heating process of heating the molds 5U and 5L is performed for about 5
seconds, and the temperature of both the molds 5U and 5L reaches 320 ° C. and ends (position
B in the figure).
[0028]
(2) Clamping process When the temperature of the upper mold 5U and the lower mold 5L
reaches 320 ° C. (position B in the figure), the upper clamp 22U moves to the pinching position.
Then, the upper clamp 22U and the lower clamp 22L cooperate to hold the film 20 by the
support surfaces 22Ua and 22La.
[0029]
(3) Molding Step After the completion of clamping, first, the lower die 5L is moved and raised to
the molding position as shown by the thick arrow in the operation diagram B. Thereafter, when
the position C in the graph is reached, the upper mold 5U is moved and lowered to the molding
position, as shown by the thick arrow in the operation diagram C. Thereby, the film 20 is molded
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into a desired shape. Here, the reason why the lower mold 5L is moved first to the molding
position and then the upper mold 5U is moved later to the molding position is that the central
part of the upper mold 5U has a large projecting shape It is because At first, the lower mold 5L of
roughly concave shape is brought into contact with the film 20 from the lower side, and then
pressing with the upper mold 5U so as to extend the central portion, it can be finished in a good
shape.
[0030]
(4) Cooling process When the molding process is finished by reaching the position D in the
graph, the upper and lower cooling units 16U and 16L advance to the cooling positions of the
back surfaces of both molds 5U and 5L, and contact both molds 5U and 5L. Cool them. At the
same time, the upper and lower cooling air nozzles 37U and 37L approach both molds 5U and 5L
and blow the cooling air.
[0031]
(5) Mold Detachment Process When the cooling process is finished by reaching the position E in
the graph, the upper and lower cooling units 16U and 16L are separated from the upper mold
5U and the lower mold 5L and retreated to the standby position. Subsequently, as shown in the
operation diagram E, the upper mold 5U returns to the standby position as indicated by the bold
arrow, and thereafter, as shown in the operation diagram F, the lower mold 5L reaches the
standby position as indicated by the bold arrow. Return. Thus, the process of one cycle of
molding one speaker diaphragm is completed, and the molding apparatus main body 50 returns
to the state shown in the operation diagram A for the next cycle. Then, the film 20 is advanced by
the length of one diaphragm to move to the operation of the next cycle.
[0032]
Although the operation of the molding apparatus using a mold made of magnetic stainless steel
has been described above, the molding apparatus using a mold made of beryllium copper can be
molded only by prolonging the cycle time. The device body 50 operates in the same manner. The
operation of each point of B, C, D, E, F of magnetic stainless steel corresponds to the operation of
each point of G, H, I, J, K of beryllium copper. The cycle time of the magnetic stainless steel
molding machine is about 23 seconds, while that of the beryllium copper molding machine is
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about 43 seconds. Further, the material of the molds 5U and 5L is not limited to magnetic
stainless steel and beryllium copper, and any metal that is magnetic and has conductivity can be
used.
[0033]
Here, comparing the conventional speaker diaphragm molding apparatus and the speaker
diaphragm molding apparatus of the present embodiment, the conventional molding apparatus
(the material of the mold is beryllium copper without cooling by air without using high frequency
induction heating) The molding apparatus of this example uses magnetic stainless steel as the
material of the mold, while the heating time of 49 seconds, the cooling time of 25 seconds, and
the total of 1 cycle of 83 seconds are required. The heating time was 5 seconds, the cooling time
was 7 seconds, and the cycle was 23 seconds in total. Here, it is considered that the cause of
shortening of the heating time largely depends on adoption of high-frequency induction heating,
and the factor of shortening the cooling time is largely equivalent to addition of a cooling means
by air blowing.
[0034]
As described above, the speaker diaphragm molding device, the speaker diaphragm molding
method, and the speaker diaphragm according to the present invention are useful for the
diaphragm of a small-sized speaker device, and particularly in the production process, the cycle
time Is suitable for the diaphragm of the speaker device which must be extremely small.
[0035]
It is a side view of the main-body part of the speaker diaphragm shaping | molding apparatus of
the Example of this invention.
It is a graph which shows the temperature change of 1 cycle of the molding die of the speaker
diaphragm molding device of the Example of this invention.
Explanation of sign
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[0036]
1 frame 2L lower fixing plate 2U upper fixing plate 3 post 5L lower mold (molding mold) 5U
upper mold (molding mold) 5Ua molding surface 5La molding surface 6L lower mold column 6U
upper mold column 6U upper gold column 7L lower movable plate 7U upper movable plate 10L
lower movable unit 10U upper movable unit 11U rod 11L rod 11U rod 11L rod 12U air cylinder
(drive means) 12L air cylinder (drive means) 16L lower cooling unit (cooling unit) 16U upper
cooling unit (Cooling unit) 17U rod 17L rod 18U air cylinder (drive means) 18L air cylinder
(drive means) 20 film (film-like material) 22U upper clamp 22L lower clamp 22La support
surface 22Ua support surface 23U upper air cylinder (drive means) 0L Lower high frequency
induction coil (Induction coil) 30U Upper high frequency induction coil (Induction coil) 32 High
frequency induction heating device 33 Cooling device 35 Cooling water pipe (cooling water
circulating means) 37U Upper cooling air nozzle 37L Lower cooling air nozzle 50 Speaker
diaphragm molding Device body
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