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JP2006238203

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JP2006238203
An object of the present invention is to reduce the number of parts except for the conventional
sealing parts, and to make it one step smaller. SOLUTION: Sound holes 7a and 7b to be received
as microphones are formed in a substrate 4, and external terminals 17a and 17b are formed on
the other surface of the substrate 4 by surrounding the sound holes 7a and 7b. No sound hole is
formed in the part opposite to the opening of. The mounting substrate 12 is attached to the other
surface of the substrate 4, and the external terminals 17 a and 17 b surrounding the sound hole
7 a and the terminals of the mounting substrate 12 are closely connected over the entire
circumference. A sound hole 7c communicating with the sound holes 7a and 7b is formed. The
substrate 4 is formed with a stepped portion that protrudes outward. The close connection is
performed by solder or a conductive adhesive. [Selected figure] Figure 1
マイクロホン
[0001]
The present invention relates to an electronic acoustic component represented by, for example, a
small-sized microphone incorporated in, for example, a cellular phone, and more particularly to a
microphone having a reduced number of components.
[0002]
For example, focusing on a microphone incorporated in a mobile phone, a sealing component is
disposed at the front of the front plate of the capsule where a sound hole exists and the sound
pressure reaches so as to surround the sound hole of the front plate. Between the front plate of
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1
the capsule and the case of the mobile phone, for example.
Therefore, the sound pressure from the opening of the case only reaches the sound hole of the
front plate of the capsule, and the sealing by this sealing part causes generation of echo due to
sound wrap around or generation of howling, and further mechanical It is possible to prevent
unnecessary sound such as intrusion of the operation sound.
[0003]
11 and 12 show specific examples of microphones mainly showing conventional sealing parts.
FIG. 11 shows a front plate around the sound hole 7 formed in the front plate 1 a of the capsule
1 incorporating the back electrode 2, the vibrating membrane 3, and the chip 5 such as the FET
5 and the capacitor mounted on the circuit board 4. It shows a structure in which a sealing part
10 such as a rib is disposed between the housing 1a and the housing 8 in a sealed manner. For
this reason, the sound reaching the sound hole 7 is only the sound reaching the opening 9 of the
housing 8, and the inconvenience such as the wraparound of unnecessary sound as described
above is reduced. In FIG. 11, reference numeral 11 denotes a step substrate having an external
terminal (not shown) for forming a step, and 12 denotes a mounting substrate provided with a
terminal (not shown) connected to the external terminal of the step substrate 11. It is. 12 (a) and
12 (b), a rib 10 made of rubber or resin is interposed between a housing 8 having an opening 9
and a rubber holder 13 covering the microphone, and pressure is applied to deform the rib 10
from the arrow direction. In the case of rubber, the degree of sealing between the housing 8 and
the microphone is improved. 12 (a) illustrates a structure in which the rib 10 is provided around
the side of the microphone, and FIG. 12 (b) illustrates a structure in which the rib 10 is provided
around the sound hole on the front plate side of the microphone. Do.
[0004]
Further, Patent Document 1 discloses a structure in which a microphone is enclosed by a
microphone cap and a cabinet having a sound hole and a circular rib which is a sealing
component except for the sound hole portion. Utility model registration No. 2555045 gazette
[0005]
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2
In the above-mentioned conventional microphone, the presence of a sealing part is indispensable
in order to prevent unnecessary sound from coming around. However, this sealing part needs to
be separately formed from a material different from the microphone and attached to the
microphone body, and there is a demand to reduce the number of parts except for the sealing
part if possible. Further, the presence of the sealing component is an obstacle to miniaturization,
for example, for a microphone aiming to be miniaturized, such as a built-in microphone of a
mobile phone. SUMMARY OF THE INVENTION The present invention has been made in view of
the above-mentioned problems, and aims to provide a microphone whose size has been advanced
one step while reducing the number of parts except for the conventional sealing parts.
[0006]
The present invention for achieving the above object comprises a substrate on one surface of
which an electronic circuit incorporated in the capsule is mounted so as to close the opening of
the capsule, and an external terminal is provided on the other surface opposite to the one surface
of the substrate. In the microphone, a sound hole for receiving sound as a microphone is formed
in the substrate, an external terminal is formed on the other surface of the substrate surrounding
the periphery of the sound hole, and a sound hole is formed in a portion facing the opening of
the capsule. It is characterized by not being done.
[0007]
According to the present invention, by forming the external terminal of the substrate so as to
surround the sound hole, it is possible to eliminate the wraparound of unnecessary sound by
performing close contact for sealing the sound hole in connection with the mounting substrate.
In addition, a conventional sealing member is unnecessary and contributes to downsizing.
[0008]
Here, the embodiment of the microphone of the present invention will be described with
reference to the drawings.
In the figure, the same parts as those in FIG.
Embodiment FIG. 1 is a cross-sectional view showing an example of the present embodiment. In
FIG. 1, an electret condenser microphone is shown, and in the bottomed capsule 1, the washer
15, back pole 2, spacer 16 from the bottom (corresponding to the front plate 1 a in FIG. 8) side
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3
(surface side) , The diaphragm 3, the diaphragm ring 3 a, the gate ring 17, and the chip
components 6 such as the FET 5 and the capacitor mounted on the circuit board 4 are
sequentially stored, and the opening on the back side of the capsule 1 is closed by the circuit
board 4 ing. In the present embodiment, the FET 5 and the chip component 6 are mounted on
the front surface (mounting surface) side of the circuit board 4, while the circuit board 4 in the
example of FIG. On the other hand, the step substrate 11 forming the step is closely attached.
Further, in the circuit board 4 and the step board 11, sound holes 7a and 7b which are received
as microphones and mutually communicate with each other are formed. Also, in the mounting
substrate 12 having the terminals connected to the external terminals of the stepped substrate
11, the sound holes 7c communicating with the sound holes 7b are formed. Therefore, in this
microphone, the mounting substrate 12 having the sound hole 7c on the back surface side
(outside) is located. A sound hole is not formed in a portion facing the opening of the capsule 1
and there is no hole.
[0009]
Here, the sound holes 7a formed in the circuit board 4 are the portions where the electrode
patterns (not shown) on the surface side of the circuit board 4 are attached or the portions where
the FETs 5 and the chip parts 6 of the circuit board 4 are located. It is open. That is, as an
example, as shown in FIGS. 2 (a) and 2 (b), the sound holes 7a are formed by removing the FETs
5 and the chip parts 6 as viewed from the surface side of the circuit board 4. In FIG. FIG. 2B
shows an example in which one sound hole 7a is formed at the center of the circuit board 4 and
at the corner of the circuit board 4 in FIG. 2 (a) and 2 (b), the components mounted on the circuit
board 4 include chip components 6 such as an external capacitor, resistor or varistor of the FET
5. And the number of mountings is determined depending on the size of the circuit board 4. For
example, as shown in FIG. 2A, there may be two capacitors and one resistor. For example, as
shown in FIG. 2 (b), there may be two capacitors.
[0010]
One sound hole 7 b communicating with the sound hole 7 a is formed in the stepped substrate
11 corresponding to one sound hole 7 a of the circuit board 4. That is, in FIG. 3 in which the
stepped substrate 11 is viewed from the back side, the sound hole 7 b at the center of the
stepped substrate 11 corresponding to the central sound hole 7 a in FIG. A terminal conductive
pattern 17a which is a terminal is formed. Here, the terminal conductive pattern 17a is, for
example, a signal terminal. The terminal conductive pattern 17b located on the outside thereof is,
for example, a ground terminal. Here, the circuit connection state between the FET 5 and the chip
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4
component 6 shown in FIG. 2 of the circuit board 4 and the signal terminal and the ground
terminal shown in FIG. 3 has, for example, the circuit configuration shown in FIG. That is, in FIG.
4, a circuit is configured by the chip component including the FET 5 and two capacitors and a
resistor. Reference numeral 18 in FIG. 4 denotes an electret capacitor composed of the back
electrode 2 and the vibrating film 3. Therefore, the conductive pattern formed on the front
surface side of the circuit board 4 is connected to the terminal conductive patterns 17 a and 17 b
of the stepped substrate 11 through the through holes (not shown).
[0011]
1, 2 (a) and 3 show an example in which one sound hole 7a, 7b is formed at the center of the
substrate, and FIG. 2 (b) shows one sound hole 7a at the corner of the substrate. Although the
example formed was shown, the number of sound holes is not limited to one. FIG. 5 shows an
example in which a plurality of sound holes are formed. That is, in FIG. 5 as viewed from the back
side of the circuit board 4 and the step board 11, FIG. 5 (a) shows four sound holes 7b (sound
holes 7a) so as to remove the mounting position of the mounted components on the circuit board
4. An example is shown in which the same is applied in a biased manner, and FIG. 5 (b) shows an
example in which four sound holes 7b (the sound holes 7a are also the same) are evenly
arranged. That is, in FIG. 5A, the step board 11 is closely attached to the central portion of the
circuit board 4 on which the caulking portion 1b of the capsule 1 is formed on the periphery of
the circuit board 4. For example, a terminal conductive pattern 17 b serving as a ground terminal
is formed, and a terminal conductive pattern 17 a serving as a signal terminal, for example, is
formed at the center of the stepped substrate 11. The sound hole 7b is formed between the
terminal conductive patterns 17a and 17b to be biased to the right in the figure. 5B shows only
the step substrate 11, but an example in which four sound holes 7b are equally disposed
between the terminal conductive pattern 17b at the outer edge and the terminal conductive
pattern 17a at the center is shown. Show. Even if the number of sound holes is different, a
terminal conductive pattern 17b, which is an external terminal, is formed on the back surface of
the stepped substrate 11 so as to surround the periphery of the sound hole 7b of the stepped
substrate 11.
[0012]
Thus, in FIG. 1, FIG. 2 (a), and FIG. 3, one sound hole 7a, 7b is formed in the central portion of the
circuit board 4 and the step board 11, and in FIG. 2 (b), the circuit board 4 and the step board An
example in which one sound hole 7a (including 7b) is formed at the corner of 11 and further a
plurality of sound holes 7b (including 7a) are formed is shown in FIG. 5, and these sound holes
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5
7b are external terminals The terminal conductive pattern 17a or 17b is surrounded by the
terminal conductive pattern 17a. In the example shown in FIG. 3, the terminal conductive pattern
17a is formed at the edge of the sound hole 7b formed in the stepped substrate 11. However, in
the example shown in FIGS. 6 (a), (b) and (c), Between the edge of the sound hole 7b and the
terminal conductive pattern 17a, for example, a margin (the terminal conductive pattern 17a is
not formed) in order to prevent the solder from flowing into the sound hole 7b at the time of
solder deposition (flowing in). And apply (cover) a resist 19 to prevent the deposition of solder. In
this case, examples of the resist include materials such as epoxy resin. 6 (a) shows an example in
which the resist 19 is formed around the sound hole 7b and the terminal conductive patterns
17a and 17b are formed in a ring around the sound hole 7b. FIG. 6 (b) is a terminal conductive
6C shows an example in which the sound holes 7b are formed not at the central portion of the
stepped substrate 11 but at shifted positions.
[0013]
Thus, a structure can be obtained in which the periphery of the sound hole 7b of the stepped
substrate 11 is surrounded by the terminal conductive pattern 17a or 17b. The stepped substrate
11 is next mounted on the mounting substrate 12. In the mounting substrate 12, sound holes 7c
are formed corresponding to the sound holes 7b formed in the stepped substrate 11, and
terminals (not shown) corresponding to the terminal conductive patterns 17a or 17b
surrounding the sound holes. It is formed. When the microphone is mounted on the mounting
substrate 12, the terminal conductive pattern 17a or 17b of the stepped substrate 11 and the
terminals of the mounting substrate 12 are closely connected, and the connection around the
sound hole 7b or 7c is sealed. I assume. The connection may be, for example, soldering by a
reflow bath or connection by a connecting member such as a conductive adhesive. In this case,
the connection member is applied or disposed so as to surround the sound hole 11. The terminal
conductive pattern 17a or 17b shown in FIGS. 3, 5 and 6 is also a solder application pattern
when the connection member is a solder. Then, the connecting member is in close contact with
the connecting member without any gap between the stepped substrate 11 and the mounting
substrate 12, that is, between the terminal conductive pattern 17a or 17b and the terminal.
Therefore, the space between the sound holes 7b and 7c is tightly sealed by the connection
member around the sound hole, and in the state where the step substrate 11 of the microphone
and the mounting substrate 12 are connected, the sound is The solder is positioned so that the
solder does not protrude into the hole 7 b or the sound hole 7 c. With such a structure, it is
possible to prevent unnecessary sound from being introduced into the microphone as in the
conventional sealing component.
[0014]
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6
When a conductive adhesive is used as the connecting member, the conductive adhesive is easily
deposited in the step of forming the stepped substrate 11 similar to the deposition of the
terminal conductive pattern 17a or 17b. be able to. Although the above description has been
made based on the configuration in which the step substrate 11 is attached to the circuit board
4, the step substrate 11 is not necessary by forming the circuit substrate 4 so as to protrude
outward. Regardless of the presence or absence of the step substrate 11, it is sufficient if it has a
structure in which a protrusion is present on the substrate. In the above description, the
structure in which the projecting portion is present on the substrate, and the structure in which
the step substrate 11 is attached to the circuit board 4 as a specific example is described. This
stepped substrate 11 is for obtaining a stepped portion in order to prevent the penetration of the
solder in the solder reflow bath into the caulking portion 1 b of the capsule 1. However, it is also
possible to connect the mounting substrate 12 to the circuit substrate 4 without providing the
step substrate 11, and therefore, as shown in FIG. 7, a terminal conductive pattern is formed on
the back surface side of the circuit substrate 4 The connection member 20 made of solder may
be disposed in a sealed manner between the pattern and the terminal of the mounting substrate
12. Of course, it is also possible to apply a conductive adhesive instead of solder, in which case
there is no risk of solder penetration into the crimped area due to reflow.
[0015]
8 to 10 show specific examples of the condenser microphone. FIG. 8 shows a cross section of the
electret condenser microphone mounted on the mounting substrate 12. In the example of FIG. 8,
a capacitor is formed by electrets (not shown) provided on the back electrode 2 and the vibrating
film 3, but the vibrating film 3 and the surface side of the circuit board 4 face each other, The
sound pressure from the sound hole 7 a directly vibrates the vibrating film 3. Although this point
sound pressure sensitivity is good, on the other hand, an airtight chamber is formed between the
vibrating membrane 3 having the back electrode 2 and the bottom of the capsule 1, so that for
the vibration of the vibrating membrane 3, It is necessary to provide the air circulation groove 21
in the built-in component in the space on the front surface side, for example, the washer ring 15,
and to make the opening communicate with the air circulation groove 21. In FIG. 8, the groove
21 is formed in part of the edge of the circuit board 4 to maintain communication. Moreover,
even if the air flow groove 21 is formed, when the distance between the vibrating film 3 and the
bottom of the capsule 1 is narrow, vibration of the vibrating film 3 practically does not occur,
and sound pressure sensitivity can not be obtained. Therefore, in order to obtain the vibration of
the vibrating membrane 3 capable of obtaining the sound pressure sensitivity, a certain distance
is required. That is, an interval at which the sound pressure sensitivity can be obtained by the
vibration of the vibrating membrane 3 is required. This FIG. 8 is the same structure as FIG.
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7
[0016]
FIG. 9 illustrates an electret condenser microphone having a structure in which the back
electrode 2 is also used as the bottom of the capsule 1. In FIG. 9, the same parts as in FIG. 8 are
given the same reference numerals. Further, FIG. 10 shows a microphone having a structure in
which a bias potential is applied to the back electrode 2 and a capacitor is formed with the
vibrating film 3. In FIG. 10, 22 is a bias ring, 23 is an insulating film, and 24 is a holder.
[0017]
1 is a simplified cross-sectional view of an embodiment of the present invention. It is a top view
of the circuit board which shows the example of arrangement of a sound hole. It is a rear view of
a level | step difference board | substrate. It is a connection diagram showing an example of a
circuit of a condenser microphone. It is a rear view of the level | step difference board | substrate
which shows the example of arrangement | positioning of a several sound hole. It is a back view
of the level | step difference board | substrate of resist arrangement | positioning. It is a
simplification block diagram in case there is no level | step difference board | substrate. It is
sectional drawing which shows one specific example of a microphone. It is sectional drawing
which shows the other specific example which combined the back electrode of the microphone. It
is a sectional view showing one example of a bias type microphone. It is sectional drawing of a
prior art example. It is a block diagram which shows the example of sealing by a rib.
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