close

Вход

Забыли?

вход по аккаунту

?

JP2009118455

код для вставкиСкачать
Patent Translate
Powered by EPO and Google
Notice
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
DESCRIPTION JP2009118455
A sensor is provided that is light and thin and has a desired yield. A carrier having two channels,
a capacitive sensing element disposed on the carrier, and a sensor including a cover are provided.
The capacitive sensing element has a membrane, and a first chamber is formed between the
membrane and the carrier. A cover is disposed on the carrier to cover the capacitive sensing
element. A second chamber is formed between the membrane and the cover. The first and second
chambers are disposed on opposite sides of the membrane, and the channels communicate with
the first and second chambers, respectively. [Selected figure] Figure 3A.
センサ
[0001]
The present invention relates to sensors, and more particularly to capacitive sensors.
[0002]
With advances in technology, various sensors such as pressure sensors that detect pressure,
accelerometers, or acoustic sensors that detect sound waves are widely applied to electrical
products.
Taking the acoustic sensor as an example, in response to the market requiring higher sound
quality, it is usually equipped with a capacitive microphone with excellent signal quality.
04-05-2019
1
[0003]
FIG. 1 is a schematic view showing a conventional acoustic sensor applied to a mobile phone.
Referring to FIG. 1, acoustic sensor 100 covers a micro-electro-mechanical system (MEMS)
microphone 130 on a carrier 120 using a cover 110. The rubber material 140 is filled in the
cover 110, and the acoustic channel 150 communicates with the MEMS microphone 130 held in
the cover 110. As a result, the sound wave is converted into an electrical signal by being
transmitted to the MEMS microphone 130 through the acoustic channel 150. It should be noted
that the interior space of the cover is limited, as the appliances are developed to be lighter and
thinner. The acoustic sensor 100 has an acoustic channel 150 inside. As a result, the volume of
the acoustic sensor 100 becomes large and can not fit in the limited internal space of the
electrical product.
[0004]
Further, as shown in FIG. 2, US Pat. No. 6,781, 231 discloses “MEMS package with environment
and interference shield”. The package structure 200 includes a MEMS microphone 210, a
carrier 220, and a metal cover 230. The carrier 220 carries the MEMS microphone 210. The
metal cover 230 also has at least one acoustic port 240 for sound waves to reach the MEMS
microphone 210.
[0005]
However, manufacturing of the package structure 200 is difficult and limited. In particular, since
the metal cover 230 is very thin, it is difficult to make the acoustic port 240 inside. On the other
hand, if the acoustic port 240 is formed on one side of the metal cover 230, the size of the
acoustic port 240 is limited to the height of the metal cover 230, so the height of the package
structure 200 is further reduced. It can not, this goes against the purpose of making the product
lighter and thinner.
[0006]
Furthermore, in the prior art, a machine is used that adsorbs the metal cover 230 so that the
04-05-2019
2
metal cover 230 is adhered onto the carrier 220 to cover the MEMS microphone 210 during
packaging. If the machine adsorbs the metal cover 230 when the acoustic port 240 is placed on
the top of the metal cover 230, the adsorption range of the machine extends to the acoustic port
240, so the attractive force generated by the machine is the membrane of the MEMS microphone
210. Can be easily damaged, and as a result, the yield decreases.
[0007]
The present invention is directed to a sensor that meets the trend of light and thin and has a
desirable yield.
[0008]
The present invention is directed to a sensor that provides a direction sensing effect.
[0009]
The present invention provides a sensor comprising a carrier having a first channel and a second
channel, a capacitive sensing element disposed on the carrier, and a cover.
The capacitive sensing element has a membrane, and a first chamber is formed between the
membrane and the carrier.
A cover is disposed on the carrier to cover the capacitive sensing element. A second chamber is
formed between the membrane and the cover. The first chamber and the second chamber are
respectively disposed on both sides of the membrane. The first channel is in communication with
one of the first and second chambers, and the second channel is in communication with the other
of the first and second chambers.
[0010]
The present invention provides a sensor comprising a carrier, a plurality of conductive bumps, a
capacitive sensing element, and a cover. The capacitance sensing element has a film. The
capacitance sensing element is connected to the carrier via the conductive bump. A channel is
formed between the capacitive sensing element, the conductive bump, and the carrier. The cover
04-05-2019
3
covers the capacitive sensing element, and a chamber is formed between the cover and the
capacitive sensing element. Chambers and channels are respectively disposed on both sides of
the membrane.
[0011]
In the present invention, the carrier is provided with a channel through which external waves can
be transmitted to the capacitive sensing element of the sensor. The sensor provided by the
present invention can be placed in a light and thin appliance because the channels of the carrier
do not affect the total volume of the sensor. Furthermore, the channels of the present invention
can be easily formed in the carrier as compared to the prior art in which it is difficult to process
metal covers.
[0012]
On the other hand, the capacitance sensing element is connected to the carrier via the plurality of
conductive bumps, and as a result, a channel is formed between the capacitance sensing element,
the plurality of conductive bumps, and the carrier. External waves can also be transmitted to the
capacitive sensing element of the sensor through the channel.
[0013]
In order to make the aforementioned and other objects, features and advantages of the present
invention comprehensible, a plurality of embodiments are described in detail below in
conjunction with the drawings.
[0014]
It is to be understood that both the foregoing summary and the following detailed description are
examples only, and further description of the present invention is provided as the scope of the
claims.
[0015]
The accompanying drawings provide a further understanding of the present invention and form
04-05-2019
4
part of the present specification.
The drawings illustrate several embodiments of the invention and, together with the description,
serve to explain the principles of the invention.
[0016]
FIG. 1 is a schematic view of a conventional acoustic sensor applied to a mobile phone.
[0017]
FIG. 7 is a schematic view of another conventional acoustic sensor.
[0018]
FIG. 2 is a cross-sectional view of a sensor in an embodiment of the present invention.
[0019]
FIG. 3B is a side view of the sensor of FIG. 3A.
[0020]
FIG. 5 is a schematic view of a channel opening having a porous structure.
[0021]
FIG. 2 is a cross-sectional view of a sensor in an embodiment of the present invention.
[0022]
FIG. 2 is a cross-sectional view of a sensor in an embodiment of the present invention.
[0023]
FIG. 2 is a cross-sectional view of a sensor in an embodiment of the present invention.
[0024]
FIG. 2 is a cross-sectional view of a sensor in an embodiment of the present invention.
04-05-2019
5
[0025]
FIG. 2 is a cross-sectional view of a sensor in an embodiment of the present invention.
[0026]
The present invention provides a channel in a carrier carrying a capacitive sensing element.
The capacitance detection element is, for example, a pressure sensor that detects a pressure, an
accelerometer, or an electroacoustic element that detects a sound wave.
External waves may be transmitted through the channel to the sensor and converted to electrical
signals by capacitive sensing elements in the sensor.
Furthermore, the capacitive sensing element is connected to the carrier via the plurality of
conductive bumps such that one channel is formed between the capacitive sensing element, the
plurality of conductive bumps, and the carrier.
External waves may also be transmitted through the channel to the sensor.
On the other hand, the invention can also make other channels in the carrier, or holes in the
cover covering the capacitive sensing element, so that the sensor becomes a directional sensor.
Detailed descriptions of these embodiments of the present invention are exemplified below, and
for the sake of simplicity, acoustic sensors are taken as an example.
[0027]
FIG. 3A is a cross-sectional view of a sensor in an embodiment of the present invention, and FIG.
3B is a side view of the sensor of FIG. 3A.
04-05-2019
6
With reference to FIGS. 3A and 3B together, the sensor 300 of the present embodiment includes
a carrier 310, a capacitive sensing element 320 disposed on the carrier 310, and a cover 330.
In the present embodiment, the carrier 310 has a first channel 312 and a second channel 314.
For example, the first channel 312 and the second channel 314 are laser formed in a carrier 310
such as a printed circuit board (PCB) or a conductive plastic laminate.
A capacitive sensing element 320, such as an electroacoustic element, has a membrane 322, and
a first chamber 340 is formed between the membrane 322 and the carrier 310.
Furthermore, in the present embodiment, the groove 302 is formed in the carrier 310 so that the
groove 302 and the first chamber 340 communicate with each other. Furthermore, a cover 330
is disposed on the carrier 310 to cover the capacitive sensing element 320, and a second
chamber 350 is formed between the membrane 322 and the cover 330. The first chamber 340
and the second chamber 350 are respectively disposed on both sides of the membrane 322.
[0028]
In the present embodiment, the first channel 312 and the second channel 314 are disposed on
both sides of the capacitance sensing element 320, respectively. The first channel 312
communicates with one of the first chamber 340 and the second chamber 350, and the second
channel 314 communicates with the other of the first chamber 340 and the second chamber 350
( In FIG. 3A, the first channel 312 is in communication with the second chamber 350, and the
second channel 314 is in communication with the first chamber 340. On the other hand, in other
embodiments, the first channel 312 communicates with the first chamber 340 and the second
channel 314 communicates with the second chamber 350). Thus, the surface wave may be
transmitted to the second chamber 350 via the first channel 312 or may be transmitted to the
first chamber 340 via the second channel 314, As a result, the membrane 322 of the capacitive
sensing element 320 begins to vibrate (the sensing circuit in the capacitive sensing element is
not shown in FIGS. 3A and 4 and is represented in a simple manner to avoid limitation) . The
sensing circuit in the capacitive sensing element is clearly shown in FIGS. 5, 6, 7 and 8 below).
04-05-2019
7
[0029]
The first channel 312 and the second channel 314 are respectively disposed on both sides of the
capacitive sensing element 320, and the capacitive sensing element 320 can receive a plurality of
sound waves from a plurality of different directions. In particular, in the present embodiment,
since the second channel 314 is longer than, for example, the first channel 312, the sound wave
transmitted to the capacitive sensing element via the first channel 312, and the second channel
314 There is a time difference between the sound waves being transmitted to the capacitive
sensing element 320 through which the sensor 300 determines the direction of sound wave
transmission. That is, the sensor 300 of the present embodiment is a direction sensor.
[0030]
In the present invention, in addition to creating a time difference between the sound waves
transmitted to the capacitive sensing element 320 using the first channel 312 and the second
channel 314 having different channel lengths, in another embodiment, By placing a mechanical
screen (not shown) in the first channel 312 or the second channel 314, for example, the first
channel 312 and the second channel can be made via a mechanical screen made of a porous
material. Create a time difference in the sound waves transmitted in the
[0031]
Also, in this embodiment, a porous structure 312 is formed in the opening of the first channel
312 to prevent dust in the ambient environment entering the sensor 300 through the first
channel 312 from contaminating the capacitive sensing element 320. The formation of
'effectively blocks dust in the environment.
The porous structure 312 ′ is, for example, a net structure or a fence structure (with reference
to FIG. 3C, a schematic view of the channel openings of the porous structure is shown). Of course,
in the present embodiment, dust in the environment may be effectively blocked by forming
another porous structure in the opening of the second channel 314.
[0032]
04-05-2019
8
Next, other direction sensors are shown below. Referring to FIG. 4, a cross-sectional view of a
sensor in one embodiment of the present invention is shown. In this embodiment, for example,
the carrier 410 has a first channel 412 in communication with the first chamber 440, and the
cover 430 has a hole 432 in communication with the second chamber 450. Similar to the sensor
300 in FIG. 3A, in the sensor 400 of this embodiment, the membrane 422 of the capacitive
sensing element 420 identifies the direction of the acoustic wave transmitted to the sensor 400
through the hole 432 and the first channel 412. You can also
[0033]
In one embodiment, the capacitive sensing element 520 is a complementary metal oxide
semiconductor (CMOS) device (as shown in FIG. 5). The capacitance sensing element 520
includes a sensing circuit 524 including a readout circuit, an amplification circuit, and a pressure
circuit. The sensor 500 can read the vibrational parameters of the membrane 522 via a readout
circuit. In yet another embodiment, the capacitive sensing element 620 includes a MEMS device
620a and a control chip 620b (shown in FIG. 6) electrically connected to the MEMS device 620a.
The control chip 620 b has a sensing circuit 624 via which the oscillating parameters of the
membrane 622 can be read out. In the present invention, each of the capacitance sensing
elements 320, 420, 520 of the above embodiments may be a combination of the MEMS device
620a and the control chip 620b or a CMOS device, but is not limited thereto.
[0034]
In the present invention, in addition to placing a channel in the carrier for transmitting sound
waves to the sensor, in another embodiment (for example as shown in FIG. 7) of the sensor 700,
the capacitive sensing element 720 is A channel between the capacitance sensing element 720,
the plurality of conductive bumps 760, and the carrier 710 by being connected to the carrier
710 (eg, PCB or conductive plastic laminate) through the plurality of conductive bumps 760 780
is formed. Specifically, in the sensor 700, the capacitive sensing element 720 is coupled to the
carrier 710 by flip chip technology, for example, so as to be between the capacitive sensing
element 720, the conductive bumps 760 and the carrier 710. Channel 780 is formed. Further,
the cover 730 covers the capacitive sensing element 720 and a chamber 770 is formed between
the cover 730 and the capacitive sensing element 720. Chamber 770 and channel 780 are
respectively disposed on either side of membrane 722 of capacitive sensing element 720. In this
way, sound waves can be transmitted to the capacitive sensing element 720 through the channel
780. In this embodiment, the capacitive sensing element 720 is, for example, a CMOS device
having sensing circuitry 724 that reads the vibrational parameters of the film 722.
04-05-2019
9
[0035]
Furthermore, in the present invention, the cover 730 of the sensor 700 has a hole, so that the
sensor 700 becomes a direction sensor 800 (see FIG. 8). In particular, in the present
embodiment, a hole 732 in communication with the chamber 770 is formed in the cover 730. In
this way, sound waves are transmitted to the membrane 722 through the channel 780 and the
hole 732 respectively, and the readout circuit of the sensing circuit 724 can read the vibration
parameters of the membrane 722 so that The direction of the sound wave transmitted to the
sensor 800 can be identified.
[0036]
In view of the above, in the sensor of the present invention, a capacitance sensing element is
disposed on a carrier having two channels. External waves may be transmitted to the first
chamber and the second chamber of the sensor via the two channels respectively. The time
difference in the transmission of sound waves results from setting up channels of different
lengths or by placing a mechanical screen in one of the two channels. That is, the sensor of the
present invention is a direction sensor. In addition, a capacitance detection element in the sensor
converts radio waves into electrical signals. Further, the capacitance sensing element is
connected to the carrier via the plurality of conductive bumps, thereby forming a channel
between the capacitance sensing element, the plurality of conductive bumps, and the carrier.
Through the channel, surface waves can be transmitted to the first and second chambers of the
sensor, and the capacitive sensing element converts radio waves into electrical signals.
[0037]
Compared with the prior art in which an acoustic port is formed in a metal cover or an acoustic
channel is formed in the cover, the present invention eliminates the need to process the metal
cover, and the channel transmitting the acoustic wave carries the carrier. The sensor of the
present invention has a high yield because it is formed in the carrier during the manufacturing
process. Also, the channels formed in the carrier do not affect the overall height of the sensor.
That is, since the sensor of the present invention is compact, it is suitable for being disposed in a
light and thin appliance. Furthermore, the present invention functions as a direction sensor by
forming a hole in the cover.
04-05-2019
10
[0038]
It will be apparent to those skilled in the art that various modifications and variations can be
made to the structure of the present invention without departing from the scope or spirit of the
present invention. In view of the above, it is intended that the invention cover the modifications
and variations provided that they fall within the scope of the appended claims and their
equivalents.
04-05-2019
11
Документ
Категория
Без категории
Просмотров
0
Размер файла
19 Кб
Теги
jp2009118455
1/--страниц
Пожаловаться на содержимое документа