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JP2011139253

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
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DESCRIPTION JP2011139253
An object of the present invention is to provide a speaker that can be easily mounted on a smallsized audio device, a mobile phone, etc., and can realize thinning and high sound pressure. The
external shape of the speaker is formed of either a rectangle or a square, and the terminal is
joined to the first frame by insert molding, the terminal is provided outside the magnetic circuit,
and a part of the external shape of the first frame The lead wire of the voice coil is connected to
the protruding portion so as to fit within the external shape of the speaker from the side wall
portion of the lost portion, and the lead wire of the voice coil is connected to the upper surface of
the first frame. By connecting the second frame along the vicinity of the outer shape of the
speaker so as to expand the vibration area of the diaphragm and connecting the diaphragm to
the second frame, it is possible to achieve thinning and high sound pressure. [Selected figure]
Figure 2
Speaker, electronic device using the same, and mobile phone
[0001]
The present invention relates to a speaker used for various audio devices, mobile phones and the
like.
[0002]
In recent years, smaller audio devices and mobile phones have been required by the market to be
more compact, thinner and more compact in order to pursue ease of use and portability in
addition to their functions being enhanced. .
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[0003]
On the other hand, further improvements in basic performance, such as improvement of sound
pressure level and expansion of reproduction band, are being demanded by the market.
[0004]
In response to such market backgrounds, small speakers and receivers used for small-sized audio
equipment and mobile phones etc. are further miniaturized, made thinner, and more compact
than conventional ones. Performance is required from the market.
[0005]
Of these market demands for downsizing, thinning, downsizing, and high performance, it is a
good development direction to reduce the area of the diaphragm because it is necessary to
secure the sound pressure level of the speaker and the receiver. On the other hand, making the
shape other than a circle, such as a rectangle or a square, for the purpose of compactness is very
effective for mounting on a small acoustic device or a mobile phone.
[0006]
In addition, although there is difficulty in designing for reduction in thickness, there is no need to
reduce the area of the diaphragm, and the market requirements are extremely high because of its
good mountability on small-sized audio devices and mobile phones. strong.
[0007]
As mentioned above, in the future, in addition to the further reduction in size and thickness and
further improvement in sound pressure level due to the expansion of the diaphragm area, the
performance of the future small speakers and receivers will be further enhanced. Development is
urgently needed.
[0008]
Hereinafter, a conventional small speaker for a mobile phone will be described as an example.
[0009]
FIG. 5 is a plan view of a conventional small speaker for a mobile phone, and FIG. 6 is a crosssectional view thereof.
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[0010]
In addition, since the diaphragm uses a transparent thing, it does not appear in a top view, but it
is in the state which the lower part of the diaphragm is seen through.
[0011]
As shown in FIGS. 5 and 6, the magnet 1 and the upper plate 2 are connected to the yoke 3 of
the resin frame 6 in which the yoke 3 and the terminal 10 are insert-molded to form an internal
magnetic type magnetic circuit 4 The voice coil 8 is inserted into the magnetic gap 5 and the lead
wire 11 of the voice coil 8 is drawn to the terminal 10 on the back surface of the diaphragm 7
for connection, and the voice coil 8 and the peripheral portion of the resin frame 6 are
connected. The vibrating plate 7 was adhered.
[0012]
As prior art document information related to the invention of this application, for example,
Patent Document 1 and Patent Document 2 are known.
[0013]
JP, 2002-209295, A JP, 2002-354582, A
[0014]
However, in the conventional loudspeaker as shown in FIGS. 5 and 6, the overall height is
determined by the thickness of each part and the amplitude stroke of the vibrating part.
[0015]
That is, since the respective components are stacked, the thicknesses of the magnetic circuit 4
and the resin frame 6, the thickness of the terminal 10 provided on the resin frame 6, and the
leads of the voice coil 8 disposed on the terminal 10 Outer dimensions of wire 11, thickness of
solder when connecting terminal 10 and lead wire 11 of voice coil 8, thickness of reinforcing
agent for covering and reinforcing this solder portion, and reinforcing agent and diaphragm It is
determined by the amplitude stroke dimension between 7 and 7 and the material thickness
dimension of the diaphragm 7.
[0016]
Furthermore, for a speaker of a type that requires a protector for protecting the diaphragm 7, an
amplitude stroke dimension between the protector and the diaphragm 7 and a material thickness
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dimension of the protector are also required.
[0017]
As described above, in the conventional speaker, it is very difficult to realize the thinning and
high performance of market requirements because it is necessary to set the full height dimension
of the speaker in consideration of many parts and the amplitude stroke. It had a problem of being
there.
[0018]
It is an object of the present invention to solve such problems, and to propose a speaker that can
be easily mounted on a small-sized audio device, a mobile phone, etc., and can be made thinner
and higher in performance.
[0019]
In order to achieve this object, the loudspeaker according to the invention comprises a first frame
coupled to the magnetic circuit, a second frame coupled to the first frame, and a diaphragm
coupled to the second frame. And a voice coil coupled to the diaphragm, a part of which is
disposed in the magnetic gap of the magnetic circuit, and a terminal coupled to the first frame,
wherein the external shape of the speaker is rectangular or The first frame is made of resin, the
terminals are joined by insert molding, the terminals are provided outside the magnetic circuit,
and a part of the outer shape of the first frame is lost, The lead wire of the voice coil is connected
to the protruding portion which is made to project from the side wall portion of the lost portion
so as to fit within the external shape of the speaker. , The upper surface of the first frame, and
coupling the second frame along the outer shape near the speaker to allow a larger vibration
area of the diaphragm is obtained by coupling arrangement a diaphragm to the second frame.
[0020]
With this configuration, by providing the connection of the terminal and the lead wire of the
voice coil outside the magnetic circuit, the thickness of the material of the terminal and the
external dimension of the lead wire of the voice coil and soldering when connecting these
Material thickness dimension of the coupling medium and further the material thickness
dimension of the reinforcing agent applied to the connection portion of the lead wire can be
excluded from the overall height dimension of the speaker, and therefore, the dimension of the
parts disposed outside these magnetic circuits Only the thinning can be achieved.
[0021]
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In addition, the terminal is protruded from the side wall portion of the defect portion where a
part of the outer shape of the resin frame is broken so as to fit within the outer shape of the
speaker, and the protruding portion is connected to the lead wire of the voice coil. Therefore, the
external dimensions of the speaker as viewed from above do not jump out of the rectangular
shape or the square shape of the original speaker, and the mountability to an acoustic device, a
mobile phone or the like also becomes good.
[0022]
Then, the second frame is coupled along the vicinity of the outer shape of the speaker so that the
vibration area of the diaphragm can be expanded, and the diaphragm is coupled to the second
frame, so the area of the diaphragm can be maximized. As a result, the sound pressure level of
the speaker can be improved.
[0023]
According to the configuration of the speaker of the present invention, the mountability to a
small-sized acoustic device, a mobile phone, etc. is improved, and further, the thickness reduction
and the improvement of the sound pressure level can be realized.
[0024]
Further, by connecting the terminal to the resin frame by insert molding, it is possible to improve
the productivity and to improve the bonding reliability of the resin frame and the terminal.
[0025]
Furthermore, by providing the connection of the terminal and the lead wire of the voice coil
outside the outer periphery of the magnetic circuit, it is applied to foreign matter such as solder
scraps and welding scraps to the magnetic gap portion, and further to the connection portion of
the lead wire. It is possible to prevent the reinforcing agent from entering and to reduce the gap
defect rate.
[0026]
Top view of speaker in process of production in one embodiment of the present invention Top
view of speaker in one embodiment of the present invention Cross section of speaker in one
embodiment of the present invention Electronic device in one embodiment of the present
invention Top view of the main part of the top view of the conventional loudspeaker Cross
section of the conventional loudspeaker
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[0027]
Embodiment 1 Hereinafter, a configuration of a speaker in the present embodiment will be
described with reference to the drawings.
[0028]
FIG. 1 is a plan view in the process of production of a small speaker for a cellular phone
according to the present invention, FIG. 2 is a plan view of a completed state thereof, and FIG. 3
is a sectional view thereof.
[0029]
In addition, since the diaphragm uses a transparent thing, it does not appear in a top view, but it
is in the state which the lower part of the diaphragm is seen through.
[0030]
In FIG. 1 to FIG. 3, the magnet 21 and the upper plate 22 are coupled to the yoke 23 of the first
resin frame 26 in which the yoke 23 and the terminal 30 are insert-molded to form an internal
magnetic circuit 24. The voice coil 28 is inserted into the magnetic gap 25 of 24 and the lead
wire 31 of the voice coil 28 is routed to the terminal 30 provided outside the magnetic circuit 24
to connect the lead wire 31 of the voice coil 28 and the terminal 30 ing.
The above is the state shown in FIG.
[0031]
Then, as shown in FIG. 2, the second frame 29 is coupled to the upper surface of the first resin
frame 26 along the vicinity of the outer shape of the speaker so that the vibration area of the
diaphragm can be expanded. The diaphragm 27 is coupled to cover a part of the terminal 30.
[0032]
Here, the second frame 29 is set to the minimum necessary material thickness so that the
speaker can be thinned.
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[0033]
And, if necessary, the connection portion between the lead wire 31 and the terminal 30 is
protected by applying a reinforcing agent to the connection portion of the lead wire.
[0034]
Here, the terminal 30 causes two corner portions of the rectangular outer shape of the first resin
frame 26 to be lost, and the terminal 30 protrudes from the side wall portion of the lost portion
so as to fit within the outer shape of the speaker. The tip of the lead wire 31 of the voice coil 28
is connected to the protruding portion at the outer periphery of the terminal 30.
[0035]
The end of the terminal 30 connected to the end of the voice coil 28 connected to the voice coil
28 is configured as a spring terminal for feeding power to an electronic device such as a mobile
phone.
[0036]
Of course, this opposite side may be eliminated, and the end of the terminal 30 to which the lead
wire 31 of the voice coil 28 is connected may be shared as a terminal for feeding power to an
electronic device such as a mobile phone.
[0037]
Here, although the external shape of the speaker has been described as a rectangle, it may be a
square.
[0038]
With this configuration, by providing the connection between the terminal 30 and the lead wire
31 of the voice coil 28 outside the magnetic circuit 24, the material thickness dimension of the
terminal 30 and the external dimensions of the lead wire 31 of the voice coil 28 and these The
material thickness dimension of the bonding medium such as soldering when bonding, and
further, the material thickness dimension of the reinforcing agent applied to the connection
portion of the lead wire 31 can be removed from the overall height dimension of the speaker. It
is possible to reduce the thickness by the size of the parts disposed further outside.
[0039]
In addition, the terminal 30 is protruded from the side wall of the defect portion where the part
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of the outer shape of the first resin frame 26 is lost so as to fit within the outer shape of the
speaker, and the lead of the voice coil 28 Since the line 31 is connected, the external dimensions
of the speaker in plan view do not protrude from the original rectangular shape or square shape
of the speaker, and the mountability to an acoustic device, a mobile phone, etc. is also improved.
[0040]
Then, the second frame 29 is coupled along the vicinity of the outer shape of the speaker so that
the vibration area of the diaphragm can be expanded, and the diaphragm 27 is coupled to the
second frame 29 so as to cover a part of the terminal 30. Therefore, the area of the diaphragm
27 can be maximized as compared with the case where the diaphragm 27 is directly coupled to
the first resin frame 26. As a result, the sound pressure level of the speaker can be improved.
[0041]
Further, providing the terminals 30 at two corners of the rectangular or square outer shape as
shown in the figure has a great effect in promoting miniaturization and downsizing.
[0042]
Furthermore, the position where the terminal 30 is provided is at two corners of the rectangular
or square outer shape, and when the outer shape of the speaker is rectangular, the outer shape of
the diaphragm 27 is rectangular, or the outer shape of the speaker In the case where the shape
of the diaphragm 27 is square, by making the external shape of the diaphragm 27 square, the
effect of improving the sound pressure level can be further enhanced while achieving downsizing
and downsizing.
[0043]
And as for two corner parts among the corner parts which exist in four places, you may select
which corner part.
[0044]
Here, by combining the lead wire 31 and the terminal 30 of the voice coil 28 within the range of
the entire height dimension of the first resin frame 26, the speaker can be made thinner without
giving extra thickness. Effective in
[0045]
Further, the diaphragm 27 is constructed by different materials of the edge of the outer
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peripheral portion and the diaphragm of the inner peripheral portion, and the sound pressure
level is further enhanced by making the edge and the diaphragm to satisfy the required
characteristics. It is effective in the improvement of the frequency and the expansion of the
reproduction band.
[0046]
Furthermore, by integrating the second frame 29 and the edge of the outer peripheral portion of
the diaphragm 27, the productivity can be improved.
[0047]
For example, the edge of the outer peripheral portion of the diaphragm 27 is made of a flexible
elastomer resin, the diaphragm of the inner peripheral portion is made of a resin having high
rigidity, and the outer peripheral portions of the second frame 29 and the diaphragm 27 The
speaker can be improved in sound pressure level and expanded in reproduction band by
integrating the same elastic resin with the edge of the same and forming by simultaneous
molding, thereby improving productivity and obtaining it. Can.
[0048]
Further, by bonding the lead wire 31 and the terminal 30 of the voice coil 28 by soldering, it can
be manufactured with a simple facility without providing a large-scale facility.
[0049]
Then, even if the solder which is the connection medium between the lead wire 31 of the voice
coil 28 and the terminal 30 is raised to some extent, the connection portion between the lead
wire 31 and the terminal 30 of the voice coil 28 is disposed outside the magnetic circuit 24 and
resin Since it protrudes from the side wall portion of the frame 26, there is no other part, and the
raised dimension of the solder can be easily accommodated within the range of the entire height
dimension of the first resin frame 26.
[0050]
Further, when the lead wire 31 of the voice coil 28 and the terminal 30 are joined by welding,
materials such as solder can be reduced, productivity can be improved, and conduction defects
such as tunnel solder can be improved. Can also be prevented.
[0051]
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Furthermore, even when the lead wire 31 of the voice coil 28 and the terminal 30 are combined
by thermocompression bonding, materials such as solder can be reduced, productivity can also
be improved, and conduction such as tunnel solder can be improved. Defects can also be
prevented.
[0052]
And although the above-mentioned soldering, welding, and thermocompression bonding are all
accompanied by heat generation, since the terminal 30 is made to project from the side wall
portion of the first resin frame 26, the lead wire connecting portion There are no other parts
present, no adverse effect on other parts due to heat generation, and the influence on the first
resin frame 26 can be minimized.
[0053]
As described above, according to the configuration of the present application, the material
thickness dimension of the terminal 30 and the lead wire 31 of the voice coil 28 are provided by
providing the connection of the terminal 30 and the lead wire 31 of the voice coil 28 outside the
magnetic circuit 24. And the thickness of the material of the connection medium such as
soldering when these are combined, and the thickness of the reinforcing material applied to the
connection portion of the lead wire 31 can be removed from the overall height of the speaker,
The thickness reduction can be achieved by the size of the parts disposed outside the magnetic
circuit 24.
[0054]
Further, the terminal 30 is protruded from the side wall of the defect portion where the part of
the outer shape of the first resin frame 26 is lost so as to be contained in the outer shape of the
speaker, and the lead of the voice coil 28 Since the line 31 is connected, the external dimensions
of the speaker in plan view do not jump out from the original rectangular shape or square shape
of the speaker, and good mountability to an acoustic device, a mobile phone, etc. is also realized.
be able to.
[0055]
Then, the second frame 29 is coupled to the upper surface of the first resin frame 26 along the
vicinity of the outer shape of the speaker so that the vibration area of the diaphragm can be
expanded, and the diaphragm 27 is connected to the second frame 29. The configuration in
which the diaphragm 27 is coupled so as to cover a part can maximize the area of the diaphragm
27, thereby improving the sound pressure level of the speaker.
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[0056]
Further, by connecting the terminal 30 to the first resin frame 26 by insert molding, it is possible
to improve the productivity and to improve the connection reliability of the first resin frame 26
and the terminal 30.
[0057]
Furthermore, by providing the connection between the terminal 30 and the lead wire 31 of the
voice coil outside the magnetic circuit 24, it is applied to foreign matter such as solder dust and
welding dust to the magnetic gap 25 and further to the connection portion of the lead wire 31. It
is possible to prevent the reinforcing agent from entering and to reduce the gap defect rate.
[0058]
Second Embodiment Hereinafter, the present invention will be described using a second
embodiment.
[0059]
FIG. 4 is a cross-sectional view of an essential part of a mobile phone which is an electronic
apparatus according to an embodiment of the present invention.
[0060]
As shown in FIG. 4, the mobile phone 80 is configured by mounting any one of the speakers 35
of the present invention.
[0061]
Here, as the configuration of the mobile phone 80, the speaker 35, the electronic circuit 40, the
liquid crystal display 60, and other components are mounted inside the outer case 70 to
constitute the main part of the mobile phone 80.
[0062]
With this configuration, it is possible to realize thinning of the speaker and high sound pressure,
and to make thin, compact, compact and high sound pressure electronic equipment such as a
mobile phone equipped with the speaker.
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[0063]
Furthermore, great effects can also be achieved in terms of performance and quality, such as
improvement in productivity and reduction in defect rate.
[0064]
In the present embodiment, an example has been described in which the electronic device is
mounted on a mobile phone that is a mobile communication device, but the present invention is
not limited to this, and a video game device such as a portable game machine or portable
navigation or a television It may be
[0065]
That is, the present invention is applicable to all electronic devices equipped with a speaker.
[0066]
INDUSTRIAL APPLICABILITY The present invention is applicable to electronic devices such as a
mobile phone equipped with a speaker and a speaker that require thinning and high sound
pressure.
[0067]
Reference Signs List 1 magnet 2 upper plate 3 yoke 4 magnetic circuit 5 magnetic gap 6 resin
frame 7 diaphragm 8 voice coil 10 terminal 11 lead wire 21 magnet 22 upper plate 23 yoke 24
magnetic circuit 25 magnetic gap 26 first frame 27 diaphragm 28 voice coil 29 second frame 30
terminal 31 lead 35 speaker 40 electronic circuit 60 liquid crystal display 70 exterior case 80
mobile phone
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