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FIELD OF THE INVENTION The present invention relates to a conductive paint for forming a
piezoelectric buzzer electrode. [Prior Art and Problem] As shown in FIG. 1, in the piezoelectric
buzzer, the electrodes 2 are formed on both sides of the piezoelectric vibrator 1, and the lead
wires 4 are directly connected to the electrodes 2 or through the metal elastic body 3. It is
connected. Silver paste is conventionally used as the electrode 2 in this piezoelectric buzzer, and
as shown in FIG. 9, the silver paste is applied to both surfaces of the piezoelectric vibrator 1 by
printing to form the electrodes 2, and thereafter, Drying and baking are performed according to
the flow shown in FIG. However, silver paste is expensive, has a large proportion in cost, and has
a problem that silver migration occurs when a direct current voltage is applied in a wet
atmosphere, and appropriate vibration characteristics can not be obtained. Also, the piezoelectric
vibrator 1 is desired to be as thin as possible from the viewpoint of vibration characteristics, but
if it is made thinner, there is a risk that silver megly silane may be generated in the electrode 2 at
the time (about 800 ° C.) in the baking, and piezoelectric vibration There is also a problem that
the thickness of the child 1 can not be reduced. By the way, the present inventors, in Japanese
Patent Application No. 63-167229, Japanese Patent Application No. 1-1395'72, etc., are easy to
use screen printing, intaglio printing, etc. having conductivity equivalent to that of silver paste. ■
■ Good adhesion of the coating on the insulating substrate ■ ■ Can form fine line circuits ■
Has excellent solderability and strength on the coating ■ Conductivity of the conductive circuit
of the solder coat The copper paste (conductive paint) which consists of the following structures
which can be maintained over a long term was proposed. Saturated fatty acid or unsaturated
fatty acid or metal salt thereof 0.5 with respect to a total of 100 parts by weight of 85 to 96% by
weight of the metal copper powder A, 815 to 4% by weight of resol type phenol resin, and both A
and B And 8 parts by weight and 1 to 50 parts by weight of a metal chelate-forming material, and
the resol type phenol resin B is a 2-substituted one, a 2.4-2 substituted one, 2.4.6- which it has.
Let l, m, n, aSb and c be infrared transmittances of tri-substituted compound, methylol group,
dimethylene ether and phenyl group by infrared spectroscopy, and (i) − = 0.8 between the
respective transmittances ~ 1.2 (R)-= 0.8 to 1.2 (C)-= 0.8 to 1.2 (D)-= 1.2 to 1.5 paste that holds
the relationship, 20 copper paste Is used as the electrode 2 of the piezoelectric buzzer, the
piezoelectric vibrator 1 Order to be able to Rimmer adhesion, need not be calcined as the silver
paste, no risk of migration silane, can be thinned piezoelectric vibrator 1.
However, the piezoelectric vibrator 1 of the copper paste has a capacitance (resonance
characteristic) lower than that of the silver paste, and is about 60 when the silver paste is 100.
Therefore, sufficient sound pressure can not be obtained. Then, this invention makes it a subject
to improve the capacity | capacitance with a piezoelectric vibrator in said copper paste (paint).
[Means for Solving the Problems] In order to solve the above-mentioned problems, according to
the present invention, first, the above-mentioned copper paste is mixed with a necessary weight
part of carbon black. The parts by weight and particle size of the carbon black may be
appropriately determined by experiments etc. For example, 0.5 to 20 parts by weight, preferably
1 to 10 parts by weight with respect to 100 parts by weight of the conventional copper base)
The particle diameter is, for example, 15 (10 bow n) as to 1 nm, preferably 15 to 50 nm.
Moreover, the copper powder particle of the said copper paste can be set as 0.5-20 #m, and an
electrode can be formed, Preferably it is referred to as 5 micrometers or less. Carbon black may
be further added as the copper powder particle size in this range. The shape of the metal copper
powder A may be dendritic, the density may be 1.5 to 3.51 / ce, and the ratio of the specific
surface area to the hydrogen reduction loss may be 11,000 or more. In addition, in order to
adjust viscosity to a copper paste, the normal organic solvent can be used suitably. For example,
known solvents such as butyl carpitol, butyl carpitol acetate, butyl cellosolve, methyl isobutyl
ketone, toluene, xylene and the like. [Examples] With the compounding ratio shown in Table 1,
the particle size of copper powder in Example 1 is 0.8x, 1.0tra, 1.3-13. The copper paste was
prepared by kneading seven types of On and 5.0 J11 15.15 to 120 μ with a three-wheeled roll
for 20 minutes. In Example 2, the copper powder diameter: 5. On, carbon black particle size: 40
nm, 25 nm, 16 nm, weight ratio to copper powder: 1%, 2.5%, 4%, 5%, 6%, 7.5%, 9% as
appropriate The copper paste was prepared by mixing and kneading with a three-wheeled roll for
20 minutes each as well. As the resol-type phenol resin, one having an infrared transmittance
ratio of-= 1.31 was used. As shown in FIG. 2, the copper paste of Example 1.2, which was
adjusted to be two, was applied to both sides of the false negative substrate of the piezoelectric
vibrator 1 by screen printing to form the electrodes 2, and its own cavityity Was measured.
The results of Example 1 are shown in FIG. 3, and the results of Example 2 are shown in FIG.
From the results, it is understood that the smaller the diameter of the metallic copper powder,
the larger the coverage, and the larger the carbon black content (addition amount), the larger the
capacity. l! When the paste coverage is 100, the height of the example is about 90. The
conductivity, adhesion, solderability, solderability and printability were examined in the same
manner as in Japanese Patent Application No. 63-167229 and the like. When the copper powder
diameter is 0.5 n or less, sufficient conductivity is obtained. In addition, although the solderability
deteriorated at 1.0 or less, the other points were satisfactory. As described above, when the
particle size of the metallic copper powder is reduced, the capacity is improved, but on the other
hand, problems occur in the conductivity and the solderability. This is considered to be because
the smaller the particle diameter is, the easier it is to enter the surface of the false reckoning
substrate (plate voltage vibrator 1), and the bonding degree is improved. For this reason, it is
understood that it is preferable to apply a plurality of pastes and form the electrodes 2 in a
plurality of layers, with the small diameter particles on the piezoelectric vibrator 1 side and the
large diameter particles on the lead wire 4 side. In addition, the compounding ratio (weight ratio)
of metal @ (Cu) to resol type phenol resin (Re) in the metal copper powder diameter: 5.0 μ,
carbon black diameter: 37 ns: 86: 14.88: 12.90: 10.92: 08.93: 07.94: 06 A copper paste was
prepared, whereby the electrode 2 was formed in the same manner as described above, and the
carbon black loading was changed, and the loading and coverage were changed. The relationship
is shown in FIG. Figure 6 shows the capacity of the copper paste electrode where the loading of
metal copper powder (particle size: 51) (weight ratio with resin, for example, 88 in the figure:
copper powder: resin = 88: 12) is changed The relationship with the filling amount is shown. FIG.
7 shows the degree of change in specific resistance due to the copper paste electrode in which
the blending ratio of metal copper powder (diameter 5JII11) and carbon flanks (diameter, 40 nm,
25 nm, 16 nII +) is changed. In this case, metal copper powder: resin was 92: 8 (% by weight).
Further, FIG. 8 shows the relationship of specific resistance to tan δ. From this, it can be
confirmed that an inflection point exists around 2 to 3 × 10− ′ ′ (Ω · C11). [Effects of the
Invention] The present invention is configured as described above, and therefore, it can be
considered to obtain the causability of a silver paste. For this reason, the cost can be reduced
without lowering the sound pressure, and since the baking is not required, the productivity is
improved, and there is no risk of migration due to the baking of the solder, so the piezoelectric
vibrator Can be made thin.
Brief description of the drawings
1 is a schematic view of an example of the piezoelectric buzzer according to the present
invention, FIG. 2 is a production explanatory view of the same side, FIG. 3 is a relation diagram of
metal copper powder diameter and coverage, FIG. Fig. 5 shows the relationship between carbon
black content and coverage, Fig. 6 shows the relationship between metal copper powder loading
and key capacity, Fig. 7 shows the relationship between carbon black content and specific
resistance FIG. 8 is a diagram showing the relationship between the specific resistance and tan
δ, and FIG. 9 is a diagram for explaining a conventional example.
1 · · · Piezoelectric vibrator, 2 · · · · · · · · · · · · · · · · · · · · · metal elastic body, 4 · · · · · · lead wire.
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