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JPH09163496

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DESCRIPTION JPH09163496
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
piezoelectric receiver used in a handset such as a telephone or an interphone.
[0002]
2. Description of the Related Art A conventional piezoelectric receiver will be described with
reference to FIG.
[0003]
In FIG. 3, reference numeral 12 denotes a piezoelectric ceramic plate, which is bonded to a metal
substrate 11 and connected to a lead wire 18 taken out to the outside to form a piezoelectric
diaphragm.
The piezoelectric diaphragm includes an acoustic resistance member 17 which damps the
vibration of the piezoelectric diaphragm and flattens the frequency characteristic via the shock
absorbing material 19 in the front case 13 provided with the sound emission hole 14 and the
inner surface of the leak hole 16 The peripheral portion of the rear case 15 is held and
connected by the rear case 15 connected to the rear side.
08-05-2019
1
[0004]
In the above-described conventional configuration, there is a problem that secondary resonance
occurs when the piezoelectric diaphragm vibrates, thereby deteriorating the characteristics. The
frequency characteristic of such a conventional piezoelectric receiver is shown in FIG. The
present invention solves the above-mentioned conventional problems, and an object of the
present invention is to provide a piezoelectric receiver which suppresses secondary resonance
when a piezoelectric diaphragm vibrates and improves sound quality.
[0005]
SUMMARY OF THE INVENTION In order to solve this problem, the piezoelectric receiver
according to the present invention achieves an initial object by incorporating a piezoelectric
diaphragm in which a secondary resonance suppression substrate is bonded. It is.
[0006]
According to the configuration of claim 1 of the present invention, the secondary resonance
generated when the piezoelectric diaphragm vibrates is attenuated by the secondary resonance
suppression substrate, and a piezoelectric receiver having excellent frequency characteristics is
obtained. You can get it.
[0007]
Hereinafter, an embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a cross-sectional view showing a piezoelectric receiver according to the present
invention. In FIG. 1, reference numeral 12 denotes a piezoelectric ceramic plate, which is bonded
to a metal substrate 11 and connected to lead wires 18 taken out to form a piezoelectric
diaphragm. ing.
[0008]
The piezoelectric diaphragm includes an acoustic resistance member 17 which damps the
vibration of the piezoelectric diaphragm and flattens the frequency characteristic via the shock
08-05-2019
2
absorbing material 19 in the front case 13 provided with the sound emission hole 14 and the
inner surface of the leak hole 16 The peripheral portion is pinched and coupled by the rear case
15 coupled to the.
Furthermore, the piezoelectric vibration plate has a configuration in which the secondary
resonance suppression substrate 20 is bonded to the metal substrate 11.
[0009]
The second resonance suppression substrate 20 is the same material as the metal substrate 11
and is an adhesive containing a modified methacrylate as a main component (trade name ... UVcurable adhesive LID-1316, manufactured by Nippon Locktite Co., Ltd.), adhesive layer Is bonded
to the metal substrate 11 with a thickness of 1 to 3 μm, and it has a circular shape with a
diameter of 0.4 to 0.6 times that of the metal substrate 11 and a thickness of 1 to 2 times. It is
possible to suppress and attenuate the secondary resonance to a level that causes no practical
problems.
[0010]
The frequency characteristic of the piezoelectric receiver having the characteristic improved by
thus attenuating the secondary resonance is shown in FIG.
Compared with the frequency characteristics of the conventional piezoelectric receiver described
in the above-mentioned prior art and shown in FIG. 4 from the frequency characteristics of FIG.
2, unnecessary peak dips in the high range are improved and distortion is eliminated. I
understand.
[0011]
As described above, according to the present invention, by bonding the secondary resonance
suppression substrate together, it is possible to attenuate the secondary resonance generated
when the piezoelectric diaphragm vibrates, and to improve the sound quality. A handset can be
provided.
[0012]
Brief description of the drawings
08-05-2019
3
[0013]
1 is a cross-sectional view of a piezoelectric receiver according to an embodiment of the present
invention
[0014]
Fig. 2 Frequency characteristics of the piezoelectric receiver according to the same embodiment
[0015]
Fig. 3 A sectional view showing a conventional piezoelectric receiver
[0016]
Fig. 4 Frequency characteristics of the conventional piezoelectric handset
[0017]
Explanation of sign
[0018]
11 metal substrate 12 piezoelectric ceramic plate 13 front case 14 sound output hole 15 back
case 16 leak port 17 acoustic resistance material 18 lead wire 19 buffer material 20 secondary
resonance suppression substrate
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4
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