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JPS583394

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DESCRIPTION JPS583394
[0001]
The present invention relates to a method of manufacturing a piezoelectric vibrator, and more
particularly to a method of bonding a piezoelectric element substrate and a diaphragm integrated
with the same to generate a sound wave using an adhesive. The adhesion method between the
ceramic piezoelectric element substrate and the diaphragm in a conventional piezoelectric buzzer
or the like will be described with reference to FIG. 1. First, the ceramic piezoelectric substrate 1
has electrodes Ja and 1bt on both sides by screen printing method. -Apply, electrode bake at a
temperature around 800 ° C, polarize in a high electric field, and bond it to the thin metal
diaphragm 3 held by the vacuum suction jig 2 using a dispenser method or the like The ceramic
piezoelectric element substrate 1 is held and disposed by the vacuum suction jig 6 so that the
agent 4 is placed at the upper position, and the vacuum suction jig 5-4 is pressed in the arrow
direction. In this case, a method is also proposed in which the ceramic piezoelectric element
substrate 1 and the diaphragm 3 are held in the same manner as described above, and pressure
is applied while applying relative rotation to bond the ceramic piezoelectric element substrate 1
and the diaphragm 3 together. (Japanese Utility Model Sho 52-33277). However, in such a
conventional method, a ceramic piezoelectric element which is as thin as 0, 05 to 0.15
manufactured by the doctor blade method or the like is attached in a state in which warpage
occurs due to heat or electric field at the time of electrode printing or polarization treatment. The
ceramic piezoelectric element is bonded by pressure contact or rotation by mechanical force with
large movement. Therefore, the peripheral area of the ceramic piezoelectric element may be
worn during bonding, or in extreme cases, the yield may be reduced. Further, in the case of a
ceramic piezoelectric element substrate in which a warp occurs, an air layer is formed between
the ceramic piezoelectric element substrate and the diaphragm to deteriorate adhesion.
Furthermore, in the case of pressure contact or rotation by a large mechanical force of
movement, the electrode surface and diaphragm provided on the main surface of the ceramic
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piezoelectric element to which the vacuum suction jig hits, even if no ceramic piezoelectric
element substrate is applied or breakage occurs. The adhesion between the ceramic piezoelectric
element and the adhesive, and the adhesion between the adhesive and the diaphragm are
increased, so that the unbalance of the adsorption power of the ceramic piezoelectric element
and the diaphragm causes a scuffing flaw, resulting in a piezoelectric buzzer The sound
characteristics and reliability of the These drawbacks are due to the fact that the vacuum suction
force is strong in the suction direction but weak to the force from the 90 degree direction
(rotation enters this) and that the viscosity coefficient of the adhesive used is large. is there. The
present invention is considered in view of the above points, and improves adhesion of the
piezoelectric element substrate without causing wrinkling of the piezoelectric element substrate
at the time of bonding with the adhesive to the piezoelectric element substrate, thereby
improving yield and acoustic characteristics. • provide a method.
That is, according to the present invention, when bonding the piezoelectric element substrate and
the diaphragm, mechanical vibration of minute amplitude is applied to the adhesive portion to
reduce the apparent viscosity coefficient of the adhesive, and an air layer is formed between the
piezoelectric element substrate and the diaphragm In order to achieve the above purpose, An
embodiment of the present invention will be described below with reference to the drawings. FIG.
2 is a view for explaining one embodiment t. 11 is a ceramic piezoelectric element substrate
having electrodes 11h and 11bt- on its both principal surfaces, and is a vacuum suction jig 12
made of resin, for example, plastic. In g &, it is kept. The reference numeral 18 designates a
diaphragm of a thin metal plate, the surface of which is coated with an adhesive 17 by a screen
printing method, which is held by suction by a vacuum suction jig 16. The vacuum suction jig 16
is made of resin concentrically provided with a large number of holes 16a concentrically in order
to make the vacuum suction force uniform, and is tightly inserted into the vacuum
communication tool 15 having the vacuum device connection groove portion 14 16 is mounted
on the ultrasonic excitation @ 13. As described above, the piezoelectric element substrate 1 is
made to face the vibrating plate 18t, and the piezoelectric element substrate 11t? In a state
where the adhesive surface is lowered and brought into contact with the adhesive surface, the
ultrasonic vibration device IS is operated to give a mechanical vibration of minute amplitude.
Thereafter, the vacuum adsorption forces of both members are removed, and the integrated
piezoelectric element substrate 11 and the diaphragm 18 are put in a thermostatic chamber at
about 100 ° C. and adhesive 17t-cured and adhered. The ultra-thin ceramic piezoelectric
element manufactured by the doctor blade method etc. is generated during the manufacturing
process as described above, but its amount (the highest point and the lowest point at the center
of the concave ceramic piezoelectric element) The difference is that the ceramic piezoelectric
element has a thickness of 0.05 to 0.15 and an outer diameter of 22-according to the
experimental manufacturing process performed by the authors. Most of them are less than 0.5-,
and with this amount of warping, the ceramic piezoelectric element substrate is not affected even
by plastic deformation that makes it flat, so it is not a problem to make it flat using a vacuum
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suction jig. According to this embodiment, by applying a mechanical vibration of small amplitude
to the adhesive part, the adhesive 17 changes from the viscosity coefficient state to the kinetic
viscosity coefficient state and the apparent viscosity coefficient Can be made to conform to each
other without interposing an air layer between the ceramic piezoelectric element substrate 11
and the fist moving plate 18, and the adhesion can be achieved. In this case, the adhesive whose
viscosity coefficient is lowered is located between the ceramic piezoelectric element substrate 11
and the vibrating plate 18 and exhibits capillary action, and the width is 9 in the peripheral
direction of the ceramic piezoelectric element substrate, moving from the central portion of the
vibrating plate 18 to the peripheral portion As a result, the generation of the air layer in the
central part is not loosened.
According to this embodiment, it is possible to obtain the effect that the yield and the acoustic
characteristics are improved since the large mechanical force of the movement which has
conventionally occurred is also eliminated. FIG. 3 shows an embodiment in which the ultrasonic
vibration device is disposed on the piezoelectric element substrate side. The parts corresponding
to those in FIG. 2 are assigned the same reference numerals as in FIG. 2 to omit the detailed
description, but even this embodiment shows the same effect as the previous embodiment. As
described above, according to the present invention, mechanical vibration of minute amplitude
such as ultrasonic vibration is applied to bond the piezoelectric element substrate and the
diaphragm, so that both are adhered with good adhesion without occurrence of cracking. Can be
bonded to improve the step of the piezoelectric vibrator and improve the acoustic characteristics
t-Fi.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is an explanatory view showing a conventional piezoelectric vibrator during adhesion, FIG.
2 is an explanatory view of an adhesion method according to an embodiment of the present
invention, and FIG. 3 is an explanatory view of an adhesion method according to another
embodiment. is there.
11: Ceramic piezoelectric element substrate% 11 @ eJJb: electrode, lit, 16: vacuum suction jig, 13:
ultrasonic vibration device, 17: adhesive, 18: vibration Board.
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