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JPS583398

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DESCRIPTION JPS583398
[0001]
The present invention relates to a method of manufacturing a piezoelectric vibrator, and more
particularly, to a method of bonding a piezoelectric element substrate and an adhesive to an
oscillating plate which integrally generates the acoustic wave and generates a sound wave. The
adhesion method between the glass and the diaphragm will be described in Fig. 1. First, the
ceramic, piezoelectric element substrate 1 is coated with the electrode 1melb on both sides by
the screen printing method, and 800 After electrode baking at a temperature of about ░ C.,
polarization treatment is performed in a high electric field. Then, the diaphragm 3 of thin metal
plate held by the vacuum suction jig 2 is loaded with the adhesive 4 by a dispenser method or
the like, and the above-mentioned ceramic, piezoelectric element substrate is placed at the upper
position thereof. 1 is held and disposed by the vacuum suction jig 5, and is pressed in the arrow
direction by the vacuum suction jig 5 itself. In this case, the ceramic piezoelectric element
substrate 1 and the diaphragm S are held in the same manner as described above, and are
pressed while being relatively rotated, thereby bonding the ceramic, piezoelectric element
substrate 1 and the diaphragm 3. % Has been proposed (Japanese Utility Model Sho 52-33277).
However, in such a conventional method, the piezoelectric element is not so thin as 0, 05 to 0.15,
which is manufactured by the doctor blade method or the like, and the piezoelectric element is
heated by the heat or electric field at the time of electrode printing or polarization treatment. In a
state where a shear is generated, since the sheared, ceramic, or piezoelectric element is adhered
by pressure contact or rotation by a large mechanical force of movement, the ceramic, the
peripheral portion of the piezoelectric element is stuck at the time of bonding. ) In extreme cases
it reduces the yield. In the case of ceramic Z, a ceramic element substrate in which a piezoelectric
element substrate is formed, an air layer is formed between the piezoelectric element substrate
and the vibration plate to deteriorate the adhesion. Furthermore, in the case of pressure contact
or rotation due to a large mechanical force, the ceramic, the piezoelectric element substrate, the
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ceramic that the vacuum suction jig hits, or the main surface of the piezoelectric element even if
no breakage occurs. The adhesion between the ceramic, the piezoelectric element and the
adhesive, and the adhesive and the diaphragm increase on the electrode surface and the
diaphragm surface, and the adhesion of the ceramic, the piezoelectric element and the diaphragm
due to K increases. Due to the balance, a scuff mark is generated, and the piezoelectric properties
of blue sheet and gi axis are reduced. These drawbacks are also due to the fact that the vacuum
suction force is strong in the direction of suction but weak to the force from the 90 ░ direction
(rotation enters this) and that the viscosity coefficient of the adhesive used is large . The present
invention is considered in view of the above points, and provides an external pressure contact
force, a rotational force, etc., to ensure adhesion between the piezoelectric element substrate and
the diaphragm, thereby improving the reliability of the piezoelectric vibrator. Provide a way to
That is, according to the present invention, the diaphragm is, for example, deviated so that the
central portion thereof protrudes outward when vacuum suction is held, and the diaphragm is
adhered to the piezoelectric element substrate using its resilience. The adhesion can be enhanced
by preventing the formation of an air layer between the piezoelectric element substrate and the
diaphragm, and since no pressure contact force is externally applied at the time of bonding, the
quality characteristics and yield can be improved. Can. The present invention will be described in
detail with reference to the drawings. FIG. 2 shows a state immediately before bonding according
to one embodiment, wherein a pair of piezoelectric element substrate 11 having electrodes 11a
and 11b on both main surfaces is shown. The adhesive 12 is applied to one side by a screen
printing method or the like, and the opposite side is held by the vacuum suction jig 14 by
suction. In order to make the vacuum suction force uniform, the vacuum suction unit A14 is
made of a resin having a large number of holes 24aO'I concentrically, for example, a screw 2con,
and is tightly inserted into the vacuum communication tool 13. The vibrating plate 15 made of a
metal thin plate is held by another vacuum suction jig 16 so as to face the piezoelectric element
substrate 11. Here, the tip end of the vacuum suction jig 16 is made to protrude by a size of a
person from the peripheral portion, and when the suction diaphragm 15 is held by suction, the
center portion is deviated to the outward projecting state. . In this way, the tip of the diaphragm
15 is lowered to a position where it touches the surface of the adhesive 12, and the vacuum
adsorption force on the vacuum adsorption jig 16 side is gradually weakened and stopped,
thereby restoring the diaphragm 15 itself. The piezoelectric element substrate 11 is bonded to
the peripheral portion sequentially from the center portion of the support. Then, remove the
vacuum adsorption force of the ceramic substrate 11 side of the ceramic, remove the pressure,
put in a constant temperature bath around 100 ░ C and cure the adhesive 12. Ultrathin ceramic
manufactured by doctor blade method etc., The amount of warping of the piezoelectric element
occurs during the manufacturing process, but the amount (difference between the highest point
of the peripheral portion of the ceramic piezoelectric element and the lowest point of the central
portion along the concave shape) In view of the above, the ceramic piezoelectric element having
a thickness of 0.05 to 0.15 and a ceramic piezoelectric element having an outer diameter of 22-
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and less than or equal to @ 0.5 * is the majority. In the case of this amount, the ceramic
piezoelectric confectionery substrate is not deformed even if it is vacuum-sucked by the
adsorption holder because it can not be deformed in layers to flatten it. In general, a diaphragm
using a brass plate or a stainless steel plate is deflected to project its central part using vacuum
suction force, but when the thickness of the diaphragm becomes 0.05 w or less, the diaphragm is
restored When the force is reduced and the adhesion to the adhesive is insufficient, and when it
becomes 9Q, 15 or more, the restoring force becomes too large conversely, a large adsorptive
force is also required, and further, it is impossible to use an extremely thin ceramic piezoelectric
element substrate Will be able to
In this sense, the diaphragm thickness of 0.05 to 0.15 is optimum. Further, in consideration of
the elastic constant of the diaphragm, the dimension A of the height of the projecting portion at
the center of the suction jig 16 is preferably 1.5 or less. Further, it is preferable to apply the resin
in a range slightly smaller than the outer diameter of the ceramic substrate of the ceramic
substrate to move so as to be extruded to the outside p by the restoring force of the diaphragm
of the developer. According to this embodiment, between the ceramic piezoelectric element
substrate 11 and the diaphragm 15 by deflecting the diaphragm 15 in a convex shape at the time
of vacuum adsorption and bonding using its restoring force which is not a mechanical force
applied from the outside. Adhesion can be enhanced. That is, the adhesive 12 is moved as the
restoring force of the diaphragm 15 is sequentially transmitted as pressure contact from the
central portion of the piezoelectric element substrate 11 to the peripheral portion of the sevenrun piezoelectric element substrate 11 as a result. There is no air layer left between the 15 and
the surface, the familiarity of both provinces is well, and the adhesion is improved. The ceramic
force by mechanical force that has conventionally occurred, no damage to the piezoelectric
element, no damage to the electrode surface of the piezoelectric element, no damage to the
electrode surface of the piezoelectric element, and the quality characteristics are improved. can
get. FIG. 3 shows the case where the adhesive 12 is applied to the side of the diaphragm 15
contrary to FIG. Also in this case, the same effect as in the case of FIG. 2 can be obtained. In the
wc4 figure, the tip of the vacuum suction jig 16 of the diaphragm 15 @ does not draw a curved
surface matching that of the diaphragm 15 as shown in FIG. In some cases it may be desirable to
leak some true 9 so that no undue force is applied. As described above, according to the present
invention, it is possible to adhere the diaphragm and the piezoelectric element substrate with
good adhesion by utilizing the elasticity of the diaphragm, and to obtain a piezoelectric vibrator
having excellent sound * characteristics as the reliability. You can get well.
[0002]
Brief description of the drawings
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[0003]
FIG. 1 is an explanatory view of a conventional bonding method of a piezoelectric element
substrate and a diaphragm, and FIG. 2 is an explanatory view of a bonding method of a
piezoelectric element substrate and a diaphragm according to one embodiment of the present
invention. These are explanatory drawings of the bonding method by other Example.
11 ... ceramic piezoelectric element substrate, lla. J J b-и и Electrode, 11-и и Adhesive, 14.16 иии
Vacuum suction jig, 15 и и и Vibration plate. Applicant agent Patent attorney Suzue Takehiko
Figure 1 Figure 2 Figure 3 Figure 4
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