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JPS5011783

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DESCRIPTION JPS5011783
■ Semiconductor Microphone ■ Japanese Patent Application No. 45-27575 [Phase] Application
No. 45 (1970) March 31 @ Inventor Miura Kenzo Yokohama City Kohoku Ward Kotoku Ward
880 Matsushita Communication Industrial Co., Ltd. 0 Applicant Matsushita Electric Industrial Co.,
Ltd. City Oji Kamon Shin 1006 [phase] agent patent attorney Toshio Nakao 1 other person
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a main part of a
pickup device for a record using a conventional semiconductor conversion device, FIG. 2 is a top
view of an embodiment of the present invention, and FIG. 4 is a right side view of FIG. 3, and FIG.
5 is an electric circuit diagram of an embodiment of the present invention.
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor
microphone utilizing the piezoresistive effect, and in particular to provide a compact, highly
sensitive semiconductor microphone having good frequency characteristics. Conventionally, a
microphone using a piezoresistive effect has not been considered, but there is a recording pickup
element using a semiconductor conversion element as shown in FIG. To explain this, 1 is a
semiconductor conversion element performing a direct conversion action (hereinafter simply
referred to as a semiconductor element), 2 is a support for fixedly supporting the semiconductor
element 1 and taking out the charge terminal 4 Reference numeral 3 denotes a cut portion
provided in the support base 2 opposite to the semiconductor element 1 in order to reduce the
loss of strain generated in the semiconductor element 1 by an external force. When an element
having such a configuration is coupled to a vibration system, a method of applying an external
driving force as a concentrated force to any part of the support 2 of the element is used, but such
means generally The structure of the vibration [111111] system becomes complicated, and
therefore the weight of the vibration system is increased, the resonance frequency is lowered,
and the band is narrowed. In addition, the transmission path of the external driving force is
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complicated, and the loss on the way becomes large. Therefore, even if such a structure is
adopted for the microphone, the conversion efficiency as a whole of the microphone is lowered
and the sensitivity is lowered. Furthermore, as the vibration system becomes more complicated,
the partial vibration of each part prevails, and the vibration system frequency characteristics are
degraded. In addition, as the structure becomes more complicated, the dimensions of the outer
shape tend to increase, which is disadvantageous in terms of productivity and cost. The present
invention solves such a problem, and an embodiment thereof will be described below with
reference to FIGS. First, in FIG. 2 to FIG. 4, 5 is a disk-shaped diaphragm having a reinforcing
corrugation portion 51 on its surface, and 6 and 7 are capable of vibrating the vibrator 5 to the
conductive ring-shaped fixed support 8 The semiconductor element 9 is interposed between a
part of the diaphragm 5 and a part of the fixed support 8 so as to support, the diaphragm 5 and
thus the fixed support 8 supported, and a first back air chamber The first back cylinder for
constituting the first cylinder, 91 is a braking member mounted on the lower surface of the back
cylinder 9, and the second back mounted 11 under the braking member 10 Second back
cylinders 12a, 12b and 12c for forming the air chamber are electrical terminals drawn from the
semiconductor elements 6 and 7 described above. Among them, 12c is a common electrical
terminal of the semiconductor element 6.degree. 7, which is derived from the mechanical and
electrical connection portion between the semiconductor elements 6, 7 and the diaphragm 5.
The diaphragm 5 is supported only by the semiconductor elements 6 and 7, and all the sound
pressure received by the diaphragm 5 is extended to the two semiconductor elements 6 and 7 or
converted as a compressive strain. , And utilizing the thin fluid layer between the diaphragm 5
and the [111111] EndPage: 1 damping. Furthermore, a plurality of small holes 91 are provided
in the first back cylinder 9, and the sound wave reaches the second back cylinder 11 through the
small holes 91 and the braking member 10. An example of the electric circuit at the time of using
this microphone in FIG. 5 is shown. In the figure, load resistors 13 and 14 are connected in series
to the semiconductor elements 6 and 7, respectively, and these series circuits are further
connected in parallel and connected to the DC power supply 15. That is, the circuit shown in FIG.
5 forms a bridge circuit in which the semiconductor elements 6 and 7 and the load resistors 13
and 14 are included on one side. Reference numeral 16 is an output terminal for deriving a total
output generated from both raw conductor elements 6.degree. In the embodiment of the present
invention described above, the diaphragm 5 is formed in a disk shape or made of a conductive
material, but this is not necessarily limited to such a shape or material. Needless to say. As
described above, according to the present invention, the diaphragm is supported by the
semiconductor element so as to be freely vibrated by the semiconductor element so that the
vibration of the diaphragm is directly applied to the semiconductor element. Therefore, the
conversion efficiency is extremely good. Since all of the components can be concentrated on the
part of the semiconductor device, the sensitivity as the microphone W444-1-1-IM ropon can be
remarkably enhanced. In addition, the structure is simple, so that not only miniaturization and
weight reduction can be achieved but, in particular, the weight reduction of the vibration system
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can increase the resonance frequency of the vibration system and lower the mechanical
impedance level of the vibration system. Because of this, the vibration system efficiency is very
good, and further, the simplification of the structure can improve mass productivity and can be
economically achieved. In particular, since the present invention can be made thin, it is effective
to construct a directional microphone.
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