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JPS5310402

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DESCRIPTION JPS5310402
Description: A method of manufacturing a pad for a headphone A small diameter synthetic resin
coated fabric is placed on the recessed portion surface of a vacuum forming device having an
annular recessed portion, and a large diameter homogeneous fabric is placed thereon to make a
vacuum The machine is operated to cause both the doughs to be absorbed along the recessed
part, and a buffer material such as urethane foam having a doughnut-like shape is
accommodated in the recessed part where the two fabrics are adsorbed, and bini is placed
thereon. -Place a melt-bonded material such as glue, and cut the inner peripheral edge of the
recess by welding with an urelder, melt-bond the outer peripheral edge, then turn over the small
diameter fabric and turn over the vinyl fabric to weld the outer peripheral edge Manufacturing
method 0 of the pad for headphones characterized by cutting. 3, the detailed explanation of
Ming. It is an object of the present invention to provide a method by which a pad with a good feel
on the skin of the ear can be easily delivered. In the present invention, a small diameter synthetic
resin coated fabric is placed on the surface of the indented portion of a vacuum forming device
having an annular indented portion, a large diameter homogeneous fabric is placed thereon, and
a vacuum machine is operated to make both fabrics in the indented portion. Adsorb along the
way, the technique, cushioning material such as urethane foam that exhibits a donut shape. Is
placed in the recessed part where the two materials are adsorbed, and a molten adhesive material
such as vinyl is placed thereon, the inner peripheral edge of the recessed part is welded and cut
by a urelader, and the outer peripheral edge is melted and joined, A method of manufacturing a
headphone pad characterized by turning over small diameter cloth, laminating on a vinyl cloth,
welding and cutting the outer peripheral edge, and EndPage: 1. ある。 Next, an embodiment of a
method of manufacturing a headphone pad according to the present invention will be described
with reference to the drawings. First, the embodiment of FIGS. 7 to 6 will be discussed. In the
figure, 1 is a vacuum forming device, and an annular recess 2 is formed on the upper surface,
and by a vacuum chamber 3 and a pore 4 passing through a vacuum machine! The vacuum
chamber 3 is communicated with the vacuum machine through the pipe joint 5 in the F direction.
Insulating piece 6 around recessed part 2. The receiving plate 8 of the pressing plate 7 is
09-05-2019
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provided on the outside of the tension plate. In 9 ° 1 G, a synthetic resin-coated cloth is first
placed on a small diameter cloth 9 on the surface of the recess, and a large diameter cloth 10 is
overlaid thereon. At that time, the resin surfaces are brought into contact with each other. In this
state, the vacuum machine is operated to suck both the cloths 9.10, and the buffer material 11 is
put into the concave part 2 into the concave part, and furthermore, vinyl cloth 12 (nylon or other
fusion bonding cloth may be used). The large diameter dough 10 is pressed by the holding plate
7 and welded and cut at the inner peripheral edge of the recess by the well 13 and the outer
peripheral edge is also welded at the well 14. Next, the small diameter cloth 9 is turned over and
stacked on the vinyl cloth 12, and the outer peripheral edge of the recessed portion is cut by
welding at Wells-15 to complete.
Thus, the inner peripheral edge can produce a good pad of non-square skin. An electrode 17 is
provided adjacent to the cutting edge 16 of the elder 13.15. Next, in the modification shown in
FIG. 7 and FIG. 8, the fabric 19 is turned over under the small diameter fabric 9 and overlaid on
the headphone 18 and this is welded so as to contact the outer periphery of the large diameter
fabric 10. Pi on the form. It is the same as that of the above-described embodiment that the inner
diameter of the concave portion is melted and cut, the small diameter synthetic resin coated cloth
9 is turned over, and the plastic cloth is overlapped and melted on the vinyl cloth. The vacuum
machine may stop at an appropriate time. 又 Also, in the figure, 20 indicates a vent opened in the
fabric 9.12. 本 Since the present invention has the constitution described above, sewing machine
sewing or polyvinyl chloride film as in the prior art is carried out. It is extremely easy to
manufacture and can be made less abrasive than vacuum molding. Moreover, there is no habit of
producing defective products. In particular, it is possible to provide a robust pad which has a
good texture of the ear and a good weather resistance.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows a part of an element of an embodiment of
the method for producing and producing a headphone pad according to the present invention.
The perspective view of the material, FIGS. 2 to 5 show the production state. 6 is a crosssectional view of the welder, FIG. 7 and FIG. 7 are cross-sectional views of a part of the
manufacturing process showing different embodiments, and FIG. 9 is a pad manufactured by the
method of the present invention as a headphone. It is a cross-sectional view of a part showing a
state of cooperation. 1 · · Vacuum forming device, 2 · · Annular recessed portion, 9 · · Small
diameter synthetic resin coated fabric, 10 · · Large diameter synthetic resin coated fabric, U · ·
Donut-shaped cushioning material, 12 · · Vinyl fabric, 13.15 -Cuelder ○ Patent applicant Sun
Beam Industrial Co., Ltd. Agent, 4.11 Shioi Izawa: 2 R1 EndPage: 2 Figure 1 Figure 4 Figure 6
EndPage: 3
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