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JPS5387215

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DESCRIPTION JPS5387215
Description 1, title of the invention
Piezoelectric type, electronic phone and method for manufacturing the same
3. Detailed description of the invention The present invention relates to a piezoelectric
microphone incorporating a polymeric piezoelectric film, which provides a piezoelectric
microphone capable of applying tension to the polymeric piezoelectric film at the time of
assembly, and a method of manufacturing the same. is there. First, a conventional piezoelectric
microphone of this type and a method of manufacturing the same will be described with
reference to FIG. In FIG. 1, 1 is a polymer piezoelectric film, for example, a film obtained by
uniaxially stretching a highly crystallized polyvinylidene fluoride (PVF2) film, and electrodes are
formed on both sides of the polymer piezoelectric film by vapor deposition. It is provided. 2 is a
curved frame, and the polymer piezoelectric film 1 is adhered to one side of the frame 2 in a
tensioned state and pressure applied. It is to manufacture an electronic microphone. As described
above, it is necessary to bond the polymer piezoelectric film 1 to the frame 2 in a tensioned state
at EndPage: 1 ° of this type of piezoelectric microhole. As described above, conventionally, in
order to bond the polymeric piezoelectric film 1 to the curved frame 2 in a tensioned state, the
polymeric piezoelectric film 1 is crimped in a tensioned state until the adhesive is dried. It is
necessary to set aside for 2 hours (one hour long, which was a mass production and a shortage.
In addition, conventionally, a method has been tried in which a polymeric piezoelectric film is
adhered to a flat frame, and then the frame is bent using a jig to give tension to the polymeric
piezoelectric film. However, from f: r, this conventional method has the disadvantage of requiring
a jig for bending the frame into a curve, and the frame is deformed when the frame is housed in a
case and assembled, and the sensitivity etc. There was a changing '. It will be described with
reference to FIG. In FIG. 2, 3 is a frame consisting of a flat spring plate, and this frame 3 is
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usually flat and deforms when a force is applied (for example, it is deformed into a curve) and
returns to a flat shape when the force is removed. Phosphor bronze, plastics and the like are
used. The polymer piezoelectric film 1 is adhered to one surface of the frame 3. FIG. 3 shows an
example in which the polymeric piezoelectric film 1 is bonded to the frame 3. A plurality of
frames 3 are bonded to one polymeric piezoelectric film 1, and the frame 3 outer peripheral
portion of the polymeric piezoelectric film 1 is By cutting off, the microphone unit shown in FIG.
2 can be formed. FIG. 4 shows a completed state in which the microphone unit shown in FIG. 2 is
compressed into a case. In FIG. 4, 4 is a square cylindrical case, and the curved front plate 6 of
this case 4 has square holes. e is formed.
'7 is a frame-shaped guide plate having the same curvature as the curvature of the front panel-, 1
and 3 are respectively the above-mentioned polymer piezoelectric film and 7 frames, 8 is an
insulating plate, 9 Is a back plate on which a large number of sound holes 10 are formed, and has
the same curvature as the curved front plate 6 and the guide plate 7 of the back plate 9 Ke-eda C
case 4. 11 is a sound absorbing material attached to the rear surface of the back plate 9, 12 is a
square tube-shaped cavity box, and a 13-piece printed circuit board "Ds". The amplifying element
14 is attached to the printed circuit board 13. Next, an assembly procedure of the piezoelectric
microphone shown in FIG. 4 will be described. First, the guide plate 7 is inserted into the rear
surface of the curved front plate 5 of the case 4 and the insulating plate 8 is inserted into the
inner side surface of the case 4. Next, the flat plate microphone units 1 and 3 shown in FIG. 2 are
inserted, and the back plate e is further inserted. The name for holding the microphone unit by
the curved guide plate 7 and the back plate 9 and the frame 3 of the flat microphone unit are
curved and tension is applied to the polymeric piezoelectric film 1. Next, the cavity box 12 is
completed by bending the insertion inward. As described above, the microphone unit, which has
a flat plate shape alone, is held between the guide plate 7 and the back plate 9 serving as the
guide plate to be curved and apply tension to the polymeric piezoelectric film. In FIG. 4, the
electrode on one side of the polymeric piezoelectric film 10 is a guide plate 7. It can be taken out
through case 4 and the electrode on the other side is a frame 3 ° back plate 9. It can be taken
out through the cavity box 12. In the above embodiment, the guide plate 7. The microphone unit
is held by the back plate 9. However, even if it is a method of forcibly curving the frame from the
spring plate without using a curved guide plate or back plate, a method such as bi may be used. It
is good. . As is apparent from the above embodiments, according to the present invention BA ',
after bonding a polymer EEt film to a frame consisting of a flat plate-like spring plate, the
polymer is forcedly curved by this framework. The present invention applies tension to the
piezoelectric film λ, and according to the present invention, the following effects can be
obtained. EndPage: 2 (1) When a polymeric piezoelectric film is bonded to a frame, the bonding
operation is facilitated because it is bonded to a flat frame. (2) Since a frame consisting of a
spring plate is used, it is possible to apply tension to the polymeric piezoelectric film by curving
the frame at the time of assembly without using a jig as in the prior art.
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4. Brief description of the drawings. FIG. 1 is a perspective parent view of the main part of a
conventional piezoelectric microphone, FIG. 2 is a perspective view of a microphone unit used for
the piezoelectric microphone of the present invention, and FIG. FIG. 4 is a cross-sectional view of
a piezoelectric microphone according to an embodiment of the present invention in the bonding
step of the manufacturing method of the invention. 1 ', * = * e * Polymer pressure tr Hui, 4.3 @ @
@ @ @ * 71. z'-m, 4 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · guide plate, 8 · · · · · ·
Insulating plate, · · · printed circuit board · · · · · · fist · amplification element. Figure 1 Figure 2
EndPage: 3
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