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JPS5433631

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DESCRIPTION JPS5433631
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing the structure of
an electric H / T capacitor, FIG. 2 and FIG. 3 are plan views showing a conventional printed
circuit board, and FIG. FIG. 6 is a plan 1 view showing FIG. 1 и и и и и и и и и и и и и и и и и и и и и back
electrode plate, 31. ииииии Metal case, 4 и и и и и и и и и и Internal insulation case, и и и и и и и и и и и и и и и и и и и и и и
и и и и и и и и и и и и и и и и print Substrate, 8 и и и и и и и и и и и и и и Conductive pattern soldered part, и и и и и и и и и и и
и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и conductive conductive pattern, 10 и и и и и и и и radial conductive
pattern.
DETAILED DESCRIPTION OF THE INVENTION The present invention is an electret condenser
microphone impedance conversion element mounting printed circuit board (1) ? meeting? It is
about / 4 ships. Since the output impedance of the microphone unit is high, electret condenser
microphones are susceptible to high-frequency attenuation and external induction 'ft' if the
output cords are drawn directly. For this reason, as shown in Fig. 1, a normal electret condenser
microphone has all impedance converters using FETs etc installed immediately after the
microphone unit, and the microphone unit and the impedance converter are combined into one
metal case 3 It is designed to take out the output of all impedance conversion from here. This
impedance converter is NET, IC. The conversion element 5 such as a resistor is attached to the
entire printed circuit board 7. This board 7 is inserted so as to close the back of the microphone
and fixed by winding the open end 6 of the case 3 . On the outer surface of the substrate 7, as
shown in FIG. 2 to FIG. 4 (2)), the signal outlet provided independently in the center of the
substrate and the conductivity for supplying power to FETs, ICs etc. The conductive pattern 9 of
the ground part connected to the pattern and the pattern provided so as to surround the entire
outer periphery is provided, and the output cord and the power supply cord are soldered to this
part to draw the cord from the microphone . Then, the metal case 30 and the crimped portion 6
are in contact with the conductive pattern 9 provided on the outer peripheral portion of the
substrate, and the case 3 is grounded. If this metal case 3 is not grounded properly, the electret
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condenser microphone is susceptible to external influences due to the low signal level handled
and the high impedance of the microphone unit itself, which causes hum to occur. . In the
prototype example of the conventional substrate 7 shown in FIG. 2, the conductive pattern 9 is
not provided on the outer peripheral edge, but is provided along a place slightly inside, and such
a shape is obtained at the time of substrate preparation , When punching out individual
substrates from large substrates (1)-и и и punches, conductive pattern 9 on the peripheral edge, or
correction 81-! ?; It is because it is easy to get through without it. ??????? With such a
shape, the electrical connection between the substrate 7 and the metal case 3 can not be
sufficiently obtained because the winding tip 6 of the metal case 3 does not get into the
conductive pattern 9 of the substrate, and the substrate 7 and the metal case If the contact
resistance between the three points, as shown in the conventional example 1 in the table, the
resistance value may vary, and the extreme value may have an infinite resistance value.
When the contact resistance exceeds 2.00, hum is generated. There are 44 out of 100
corresponding to this, and the substrate 7 of this shape can not be used. Therefore,
conventionally, as shown in FIG. 3, a substrate 7 having a shape in which the conductive pattern
9 is provided up to the outer peripheral edge of the base 7 has been used. This is because the
conductive pattern 9 is up to the peripheral edge of the substrate when the substrate is made, so
the it pattern 9 does not pass through even if it is pulled out with a punch, and if it is removed
forcibly, the paris of the main pattern 9 is conducted to the substrate peripheral edge. Since the
conductive pattern 9 peels off from the substrate 7, there is a disadvantage that the workability
is bad. However, since the conductive pattern 7 is up to the peripheral portion, the contact
resistance with the metal case tightening portion 6 is good, and as shown in the conventional
example 2 of the table, it shows much better results as compared with the conventional example
1. The substrate of this shape has been used even at the expense of the workability of this
method. However, even with this shape, the contact resistance value of 0.10 or more is slightly
recognized. There is a need for a substrate that is easy to make and has a shape that can increase
electrical connection and cause more hum, and that can provide a more reliable electrical
connection. The present invention ameliorates these drawbacks and relates to a conductive
pattern of a 7v substrate. As shown in FIG. 4, the conductive pattern is not provided on the entire
outer periphery of the substrate, and the inner side from the outer periphery as in the
conventional example of FIG. A conductive pattern is provided around the entire circumference,
and from there the radial direction 17F?, 'N-(5) \ -2-1 \ t ? 1-? \--(и 11 ░ 1 3 + ?! The
conductive patterns lO are formed at appropriate intervals. The width and the number of the
radial conductive patterns lO are not particularly limited, but if the width of the radial conductive
patterns 10 is wide and the number is large, the shape is close to the 34th one (r, making it
difficult to punch the substrate 70) Therefore, the portion occupied by the conductive pattern at
the outer peripheral edge of the substrate is less than about 1/3 of the entire outer peripheral
portion, and the width is too narrow or the number is small, which is close to the example of FIG.
It is desirable that there be about 179 or more of the entire outer peripheral portion. A
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microphone 4 manufactured using the substrate of the present invention. The 71 army has good
electrical contact because the metal case clasp end must be tightly embedded with radial
conductive grouper. In particular, since the portion with conductive pattern lO alternates with the
portion with conductive pattern lO at the outer periphery of the substrate, a slight unevenness
can be formed in the substrate between the portion lO with the conductive portion and the
portion without lO. In order to insert the crimped tip 6 of the metal case 3 along the groove, as
shown in FIG. 3 (6) core 1. Better penetration than in the case, contact resistance is lower,
contact resistance 'ft1ll! As shown in the table!
The values determined were all less than 0.1 ?. Table, Case-to-substrate contact resistance
measurement value (э) to ~ (~ ~ +, +, + ~ 11 ? 13! ?? 10, 12.0 second figure, ..., 04N2489 +
51946 Figure 3 ? 2753000 O 000 Figure 4 Invention 81000000000 ? All measured contact
resistance between the metal case and the substrate pattern. The number of measurements is
100 each. As described above, the electret condenser microphone using the substrate of the
present invention can ensure grounding of the metal case, so that noise such as hum will not be
affected for long-term use, and a product with excellent reliability can be obtained. Can. (7) (1)
Furthermore, even in the substrate preparation, since there are only a few conductive patterns on
the peripheral portion of the substrate, it can be easily punched out with a punch, and the work
does not take time and effort.
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