вход по аккаунту



код для вставкиСкачать
Patent Translate
Powered by EPO and Google
This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
謬 specification 1, title of the invention
Method of manufacturing diaphragm for condenser microphone
3. Detailed Description of the Invention The present invention relates to a method of
manufacturing a diaphragm for a condenser type microphone. FIG. 1 shows the entire structure
of a conventional microphone. In the figure, the vibrating membrane 3 is fixed to the membrane
ring 1 with an adhesive and pulled. An appropriate gap is held between the vibrating membrane
3 and the fixed electrode 9 smoothed by the spacer 5. The fixed electrode 9 is made of an
insulating material, and the terminal 6 of the electrode − □ is pierced to the outside through the
center of the electrode support case 7. The membrane tensioning syringe 1, the fixed electrode 9,
the electrode support case 7 and the like are still covered with the outer case 8 and fixed at the
lower end portion 81 by caulking. In the condenser microphone configured as described above,
the conventional diaphragm is configured as shown in FIG. That is, 10 is a ring for film coating
made of an insulator such as plastic, ceramic or glass, 11 is a vibrating film made of a film such
as plastic, 12 is a metal-deposited foil deposited on the vibrating film, 13.14 is a film It is a
portion of a metallized foil deposited on the side and top of the tension ring. In producing such a
vibrating film, the film-coating ring 1o is fixed on the plastic film 11 with an adhesive or by heat
fusion or the like at a stage where metal deposition is not performed, and thereafter, the upper
surface Metal deposition is performed on the entire surface including the sealing film, the JII J
film 10 and the vibrating film 11. Thereafter, cutting and cutting are performed for each
membrane tensioner. FIG. 3 shows EndPage: 1 [1: outline of the apparatus in the case of actually
performing metal deposition □. 3-1 is a vapor deposition apparatus main body, 3-2 is a per jar,
3-3 is a chamber and is evacuated to a vacuum by a pump or the like. 3-4 is a deposition jig, 3-6
is a heater, 3-6 is a metal such as nickel, 3-7 is a flying direction of metal molecules, 3-10 is a
ring for film coating, 3-11 is a vibrating film . The flying direction 3-7 of the metal molecule is
the direction toward the top right in the vicinity of the object to be deposited, and it is not
parallel to the inner surface of the link for membrane tension shown in FIG. << in the case of
deposition <<, the conductivity of the deposition surfaces 12 and 14 can not be obtained, and the
sensitivity of the microphone may be greatly reduced. The vapor deposition surface 14 and the
outer casing 8 are electrically connected. As shown in FIG. 4, it is conceivable to taper the inner
surface of the membrane coating ring as a method for solving the above-mentioned drawbacks.
The point of difference from the structure of FIG. 2 is that the taper angle of 15 is smaller than, But this angle is preferably 600 to In order to maintain the strength of the
acute angle part.
However, this taper angle is made smaller in cutting of plus 5 \ ') material, and if it is pressed, it
must have the same structure as in FIG. The present invention is intended to remedy such
manufacturing defects around the vibrating membrane. An embodiment of the present invention
will be described below with reference to FIG. FIG. 6 shows an outline of the apparatus in the
case where metal deposition is actually carried out. 5-1 is a vapor deposition apparatus main
body, 5-2 is a perger, 5-3 is a chamber and vacuum exhaust is carried out by a pump or the like.
5-4 is a vapor deposition jig, 5-5 is a heater, 5-6 is a metal such as nickel, 5-7 is a flying direction
of metal molecules, 5-10 is a ring for film tension, 5-11 is a vibrating film is there. The angle of
inclination 5-8 of the material to be deposited is somewhat different depending on the size of the
chamber 3 in order to deposit with a uniform thickness, but preferably 15 ° to 30 °. Thus,
metal can be reliably deposited on the deposition surfaces 12 and 14 shown in FIG. 2, and
electrical conduction can be reliably achieved in one direction. Similarly, in the case of a
condenser microphone, since the capacitance between the diaphragm and the electrode is at
most 100 PF, the sensitivity loss of the microphone can be ignored even if the conduction
resistance is 10 Ω at 1 × Hz and 7 :: i1MΩ. 2) Even if the deposition surfaces 12 and 14 in FIG.
2 conduct electricity only in one direction and only a part, the conduction resistance is several Ω
or less, so there is no sensitivity loss of the microphone. As described above, according to the
present invention, the material of the ring for membrane coating, the degree of freedom in
selection of the processing method are large, and the sensitivity loss of the microphone can be
sufficiently prevented.
4. Brief description of the drawings. FIG. 1 is a cross-sectional view showing the entire structure
of a conventional microphone, FIG. 2 is a side cross-sectional view of the main part of a
conventional diaphragm, and FIG. FIG. 4 is a schematic view of the apparatus, FIG. 4 is a side
sectional view of an essential part showing a modified example of a conventional diaphragm, and
FIG. 5 is a schematic diagram of a metal deposition apparatus in the method of manufacturing a
diaphragm for a condenser microphone according to one embodiment of the present invention. It
is. 10.3-10.5-10 · · · · · · · · Ring for film coating, 11, 3-11, 5-11 · · · · · · · · · · · · · · · · · · · · · · · · vapor
deposition surface. "-: Name of S attorney Attorney Nakao, Toshio and others 1 person Fig. 1 Fig.
2 EndPage: 2 Fig. 3 Fig. 4 EndPage: 3
Без категории
Размер файла
10 Кб
Пожаловаться на содержимое документа