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JPS6195700

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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
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DESCRIPTION JPS6195700
[0001]
FIELD OF THE INVENTION The present invention relates to a method of forming a diaphragm for
a speaker used in various types of audio equipment, and a mold apparatus used for the
implementation thereof. 2. Description of the Related Art Recently, small and thin loudspeakers
are often required along with the miniaturization of electronic appliances. As such a small and
thin speaker, a speaker diaphragm using a thermoplastic resin film is widely used in terms of
characteristics and formability. As a conventional method of mounting the speaker diaphragm of
this type, it has been carried out as shown in FIGS. That is, as shown in FIG. 17, the thermoplastic
disease 11 ij film 3 is placed on the heating iM 2 equipped with the heater 1, and this
thermoplastic resin film 3 is heated to near the softening point, and this heated thermoplasticity
The resin film 3 is held by the mold holder 4 and the fitting portion forming portion 5 shaped
like three spherical peaks are continuous at the center of the lower surface and the corrugated
edge portion forming portion located on the outer periphery thereof The negative air suction
hole 8 is made to be adsorbed as shown in FIG. 8 and molded into a molding die 7 having 6 and
the speaker diaphragm 9 as shown in FIG. ノていた。 However, in such a conventional method,
since the thermoplastic resin film 3 having a certain thickness is simultaneously vacuumadsorbed to the molding die 7, the vibrating portion 9a is also an edge portion 9b as the molded
diaphragm 9 for a speaker. Even the thickness was almost the same. In general, a speaker
diaphragm using a thermoplastic resin film is effective for lowering the minimum resonance
frequency “0 as shown in FIG. If the tS range is also low and the thickness is 100 μm, as shown
in FIG. 5, the high region is extended but the a3 (resonance frequency fO is also increased) is d3
and thus obtained by the above conventional mold apparatus The speaker diaphragm 9 has to be
sacrificed at either one side. For this reason, there is a problem that the reproduction band is
narrow, and a speaker with a sufficiently satisfactory reproduction characteristic can not be P).
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional
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drawbacks, and can provide a speaker diaphragm which can lower the lowest resonance
frequency and extend the high frequency and widen the reproduction bandwidth. It is an object
of the present invention to provide a molding method of the present invention and a mold
apparatus used for the implementation thereof. In order to achieve the purpose of the present
invention, the method for forming a diaphragm for a speaker of the present invention comprises
heating the heat-curable resin film holding the peripheral portion to near the softening point, and
heating the heated thermoplastic resin film. After vacuum adsorption of the part to be molded of
the @ motion part of the resin film to the mold body, the peripheral part of this thermoplastic
resin film is stretched, and then the edge part of this thermoplastic resin film is molded with gold
It is configured to be attracted to the mold body.
Further, in the mold apparatus of the present invention, a vibrating portion forming portion for
forming the vibrating portion of the speaker diaphragm, and an edge portion for forming an edge
portion of the speaker diaphragm positioned on the outer peripheral side of the fitting portion
forming portion A mold main body comprising a molding portion, and a peripheral portion
stretching portion located on the outer peripheral side of the edge portion molding portion and
having a groove formed on the surface, and drilled in the respective portions of the mold main
body A vacuum suction hole passing through the shell from the surface of the mold body to the
back surface, and a space which is projected from the surface of the mold body and whose tip is
in contact with the mold holder and surrounded by the mold body and the mold holder And the
partition wall which divides into. Description of Embodiments Hereinafter, an embodiment of the
present invention will be described with reference to the drawings. FIG. 1 is a V cross-sectional
view showing a method of forming a speaker diaphragm in one embodiment of the present
invention, wherein V is a heater, 11 is a heater, 12 is a thermoplastic resin film, 13 is a mold
holder, and 14 is a mold A die 15 is an edge portion forming portion, 16 is a fitting portion
forming portion, 17.18 is a partition, 19 is a vacuum suction hole, 20 is a groove, and 21 is a
peripheral portion extending portion. In molding, first, as shown in FIG. 1, a thermoplastic resin
film 12 with a thickness of 100 μm is placed on a heater 11 combined with a heater 10. As this
thermoplastic resin film 12, a polyarylate etc. can be utilized. The thermoplastic resin film 12 is
heated to near the softening point of 180 to 200 ° C. by the heater 11. A molding die 14 held
by a die holder 13 is disposed on the thermoplastic resin film 12. This molding die 14 has a
fitting portion molding portion 16 having a cross section in the center and a lower surface and
three spherical peaks continuously formed on the lower surface, and has an edge portion
molding portion 15 having a cross section wave shape on the outer peripheral side. In the
structure having the peripheral portion extending portion 21 on the outer peripheral side of the
gutter, a large number of vacuum suction holes 19 are formed in the fitting portion forming
portion 1G, the edge portion forming portion 15 and the peripheral portion extending portion
21. The vacuum suction holes 19 of the fitting portion forming portion 16, the edge portion
forming portion 15 and the peripheral portion stretching portion 21 are separated by the
partition wall 17. 18 on the upper surface of the mold 14, and the holes 19 of the mold holder
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13 are respectively separated. It communicates with a vacuum pump etc. separately. The molding
die 14 is lowered, and as shown in FIG. 2, only the vacuum suction holes 19 formed in the
vibration closing molding portion 16 are vacuumed to shake the thermoplastic resin film 12 vJ, y
molding portion Adsorb to 16 From this state, as shown in FIG. 3, the peripheral portion of the
thermoplastic resin film 12 except the portion absorbed by the vibration closing molding portion
16 is stretched by making the vacuum suction holes 19 communicating with the full 20 vacuum.
The thickness is about 90 t 1 m.
When this stretching operation is completed, as shown in FIG. 4, the vacuum suction holes 19 of
the edge portion molding portion 15 of the molding die 14 are vacuumed to suction the
peripheral portion of the stretched thermoplastic resin film 12. In this state, cooling is performed
this time, vacuum suction is released, the mold is removed from the molding die 14, and an
unnecessary portion of the peripheral edge is cut, whereby a speaker diaphragm D as shown in
FIG. 5 is obtained. As shown in FIG. 5, the speaker diaphragm 22 obtained by such a moldmolded bag d has a configuration in which the vibrating portion 22a has a thickness and the
edge portion 22b is thin. Therefore, when a speaker is configured using this speaker imaging
plate 22 and the sound pressure / frequency characteristics thereof are measured, as shown in
FIG. 6, the lowest resonance same wave number to is low and the high region is expanded. And
the regeneration band can be broadened. In the above embodiment, although the thermoplastic
resin film 12 of 100 μm in thickness has been described as being the edge portion 22 b or 90
μIn, the present invention is not limited to this, and can be arbitrarily set. Of course it is one
work. As described in detail in the invention, according to the method for forming a speaker
vibration VJ plate of the present invention, after vibrating the vibrating portion in advance by
vacuum suction onto the mold body, the other portion is stretched so as to become thinner, and
the edge portion Is molded by vacuum suction onto the mold body, so a speaker diaphragm with
a thin edge and a thick vibrating part can be molded from a single sheet of thermoplastic resin
sheet, and the minimum resonance frequency is low when it is used as a speaker. It can be
extended in the high range, and it can be shaped with cost as well as conventional / v. Further,
according to the mold apparatus of the present invention, it is possible to easily and satisfactorily
form the speaker diaphragm having nine circular vibration parts at the edge parts using the
above method.
[0002]
Brief description of the drawings
[0003]
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1 to 40 are sectional views showing a forming process using a forming method of a speaker
diaphragm in one embodiment of the present invention, and FIG. 5 is a sectional view of the
speaker diaphragm obtained by the forming method. FIG. 6 is an explanatory view of sound
pressure and frequency characteristics of a speaker using the same speaker diaphragm, and FIGS.
7 and 8 are cross sections showing a forming process using a conventional forming method of an
imaging plate for a speaker Fig. 9 is a cross-sectional view of the speaker diaphragm obtained by
the molding method, and Figs. 10 and 11 are illustrations of sound pressure and frequency
characteristics when the speaker diaphragm is incorporated in the speaker. It is.
12: thermoplastic resin film, 13: mold holder, 14: molding mold, 15: edge part molding part, 16:
vibration closing molding part, 17, 18: partition wall , 19 ... vacuum suction hole, 20 ... full, 21 ...
peripheral edge stretching part Fig. 1 Fig. 3 C6 'N'> key bundle 枳
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