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JPS6351799

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DESCRIPTION JPS6351799
[0001]
FIELD OF THE INVENTION This invention relates to new and useful improvements to the
omniphonic microphone and speaker system disclosed in my owned U.S. Pat. No. 4,122,910.
BACKGROUND OF THE INVENTION In the U.S. Patent, a regular tetrahedron structure is used for
microphone and speaker components. However, the structure contains ambiguity in a certain
direction. The ambiguity is greatly reduced by the present invention. A superficial reading of this
specification indicates that the basis of the inventive tetrahedron of the invention shown in the
aforementioned U.S. patent has disappeared. However, as will become apparent later, the plane
passing through the cut away portion of the microphone or speaker component re-creates the
regular tetrahedron shape of the invention of said US patent. Those planes also appear during
changes made to the side speaker baffles. The present invention includes the following technical
features. (1) All transducers are shielded by a operculae, which is a cylindrical structure cut at a
half of the dihedral angle of a regular tetrahedron, ie, 35 degrees and 16 minutes. , The plane is
set at 45 degrees to the horizontal. (2) The plane of the oblong opening of the lid corresponds to
or is identical to the human auditory (1 × 1 tympanic membrane). (3) Optimal shadow
omniphonic microphone component lids and isomorphic module / lid-covered baffle lids are
indicated by reference numeral 23 in the microphone and speaker components of US Pat. No.
4,212,910 It is isomorphic. (4) The surface of the cut opening of the optimum omniphonic
microphone component corresponds to the dihedral plane of the omniphonic loudspeaker system
shown in FIG. 9 of said US patent. (5) The plane of all the baffle lids is 45 degrees and tilts
downward in the direction away from the listener. The present invention will be described in
detail below with reference to the drawings. Reference is first made to FIGS. 1 to 4 which show
the optimum shadow omniphonic microphone portion of the present invention. FIG. 1 shows a
tetrahedron 20 forming a microphone module as described in U.S. Pat. No. 4,122,910 and shown
in FIG. 8 of that U.S. patent. Reference 21 indicates the center of this tetrahedron and point
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22.23 indicates the theoretical location of the center of the microphone shown in FIG. 8 of said
US patent. The cylindrical contour 24 shown in broken lines in FIG. 1 shows the core from this
tetrahedron.
The core portion forms the microphone component 25 shown in FIGS. 2, 3 and 4. The
microphone component 25 is composed of a central portion 26, a right portion 27 and a left
portion 28. FIG. 2 is a view of the microphone component as viewed from the back, and FIG. 3 is
a view of the microphone component as viewed from the front. The theoretical center of the
tetrahedron of FIG. 1 is indicated by the reference numeral 21 in FIG. 2 as an abstraction so that
the microphone component retains the regular tetrahedral shape of the omniphonic microphone
of the US patent. It is also. The cylindrical structure is made of solid filler and the ends 26A, 26B
of the central portion are cut at a 35 degree 16 minute angle equal to half the dihedral angle of
the regular tetrahedron shown in FIG. Be Corresponding inner end 27A of end portion 27.28.
28A is also cut at a similar angle of 35 degrees 16 minutes, and the major axis of the oval formed
by the cutting is turned 45 degrees. This is illustrated in FIGS. 2, 3 and 4. Conventional
microphone components 29 open towards their cut faces of all four ends, are electronically
connected to the conventional microphone mixer 30, and then to the left and right amplifiers.
The cut ends 26 B / 27 A and 26 A / 28 A are melted together to form an adjustable gap
between them. The width of the gap is, for example, about 1 to 4 mm, and the gap is selected to
optimally receive the sound with the least ambiguity. Figures 5-12 show the same module / lid
baffle assembly that constitutes the speaker component. First, a regular tetrahedron 31 similar to
the speaker tetrahedron shown in FIG. 9 of US Pat. No. 4,122,910 is shown. In that U.S. patent, a
transducer 32 is located on the adjacent face 33 of the tetrahedron, and a cylinder 34, shown in
phantom in FIG. 5, theoretically constitutes an isomorphic module 35. Reference numeral 36
denotes the theoretical centers of tetrahedron and cylinder 35. The structure shown in FIG. 8 is
similar to the module of the microphone component shown in FIG. 3 in that it includes a central
portion 37 and an end portion 38.39. They are made of hollow cylindrical material and acoustic
insulation (not shown) is packed inside. The outer ends 37A, 37B of the central portion 37 are
also cut at an angle of 35 degrees 16 minutes (half of the dihedral angle of the tetrahedron),
similar to the inner ends 38A, 39A. The major axis of the oval formed by this cutting of all of
their ends is turned 45 degrees (FIG. 8). Intermediately spaced from the end portions 37A / 38A
and inwardly from the end portions 37B, 39A, an intermediate band transducer 40 is provided
and connected to the amplifier 41 as shown.
The cut ends of the end portions 37, 38, 39 are spaced apart and the spacing between the ends
can be adjusted as described for the microphone parts. FIG. 6 shows the alignment of all outer or
side speaker components 42.43 as well as isomorphic mogineals, with left and right channel
connections controlled by the amplitude controller 44, and to the amplifier as shown. Connected
to From this figure, the outer speakers 42A, 43A are low band speakers and connected to the
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channels on both sides, and the inner speakers 42B and 43B are high band speakers and
connected to the channels on both sides. The crossover between them is about 700 Hz. The four
center speakers 40 are mid-range tweeter-type speakers connected to their respective channels
as shown. The crossover frequency need not be fixed and can be in the range of 70-1500 Hz. The
speaker assembly 42.43 can be housed within a conventional acoustic suspension or acoustic
reflector cabinet 44A, except for the baffles shown in FIGS. 10 and 11. FIG. 10 shows the left
outer baffle plate 45 of the speaker component 42 and the left inner baffle plate 46. FIG. 11
shows the right outer baffle plate 47 of the speaker component 43 and the right inner baffle
plate 48. All panfull boards include a plurality of lidded baffles 49 near the front of each of the
speakers 42A, 42B, 43A, 43B close to the upper end thereof. The lidded baffles are in the form of
small cylindrical parts having an outer end 50 cut at 35 degrees and 16 minutes equal to half of
the tetrahedral dihedral angle. The baffles are preferably provided with a felt outer cover 51 and
a felt inner liner 52. The covers and liners are temporarily attached to the baffles in a
symmetrical array as shown. Importantly, the oval openings on the outer surface of the baffle
plate open downward and outward from the baffle plate and the oval openings on the inner
baffle plate 46.48 open downward and inward from the baffle plate, It is to place the lidded
baffles of the outer panfull [45, 47 (Figs. 10, 11, 12). Optimal shadow microphones and all
surfaces of isomorphic modules are preferably covered by felt.
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a schematic view showing the arrangement of the optimum shadow omniphonic
microphone component of the present invention, FIG. 2 is an enlarged rear view of this
microphone component with an outline of electrical connection, and FIG. 3 is a front view of FIG.
FIG. 4 is a schematic plan view of one of the inner ends of a cut cylinder supporting a
microphone, and FIG. 5 is a second view showing a conventional tetrahedral speaker whose core
is used in the speaker module of the present invention FIG. 6 is a schematic view showing the
relationship between the isomorphic module and the external speaker component, FIG. 7 is a
front view of FIG. 6 showing an outline of the electrical connection, and FIG. Fig. 9 is an enlarged
perspective view showing one of the lids, Fig. 10 is a schematic partial front view of the left and
right baffles of the left speaker part, and Fig. 11 is a left and right baffle of the right speaker part.
Figure similar to 10 FIG. 12 is a schematic cross-sectional view of one portion of the external
speaker cabinets showing the relationship between the lid and transducers.
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20: tetrahedron, 25: microphone component, 26 ° 37: central part, 27. 28, 38. 39: end part, 40:
transducer, 42.43. -Speaker parts, 44-Speaker cabinet, 45 ° 47. 48-Baffle plate, 4-Lid baffle.
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