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JPS53149315

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DESCRIPTION JPS53149315
1. An epoxy resin composition comprising an epoxy resin synthesized from epichlorohydrin and
bisphenol A, an epoxy-modified polymercaptan, and a polyamide acid resin based on a dimer
acid. Voice coil bobbins and cones of a speaker with a yoke fx epoxy resin composition having a
dynamic Young's modulus of the cured product of 20.000 roths / 'd or more at 25 ° C. and 520
or more at 80 ° C. How to glue
2, the scope of claims
3. Detailed Description of the Invention The present invention relates to a method of bonding
between a voice coil bobbin and a cone of a speaker which is a vibrating part. Conventionally,
rubber-based, hot-melt-based, and polyamide-curable epoxy-based adhesives have been used to
bond the voice coil bobbin and cone of the speaker. In addition, the temperature of the speaker
often rises up to around 80 ° C during operation. When a rubber adhesive is used, the curing
time is slow, so the bonding time is long and the cost for manufacturing the speaker is high, and
the value (here, the density ## 1) is small, and there is no distortion and the area with good
sound quality is narrow. And the characteristics of the speaker were bad. Moreover, in order to
pass the drop impact test of 4000 G (G is the acceleration of gravity) and to have an impact
bonding strength of 30 yang · cm / '-or more by the Izod tester, the curing time is too long. Also
had. When using a hot melt adhesive, the curing speed is high but the melting temperature is
high, so it is difficult to select a coating machine, and the heat creep resistance is poor, and more
importantly, it is from room temperature to high temperature side like rubber type It had the
disadvantage that the Young's modulus was extremely low and the speaker characteristics were
poor. When using a polyamide curing type epoxy adhesive, EndPage: 1 has a slow curing speed
and a long bonding time like a rubber-based adhesive, which increases the cost for
manufacturing the speaker, but in terms of characteristics, the Young's modulus at around room
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temperature is The advantage that the Young's modulus is higher than the above two types of
adhesives even at temperatures around 80 ° C at the time of extremely high operation and the
impact bond strength by the Izod impact tester under the curing conditions of 60 ° C and about
1 hour It also has the disadvantage that it is extremely bad (it can not withstand the drop impact
test of 4000 G). Therefore, an adhesive having a further property and quick curing type has been
desired. The object of the present invention is to eliminate the drawbacks of the prior art
mentioned above and to apply an adhesive to a thickness of 0.5 m to a thickness of 0.5 m, and
the gelation time at room temperature (25 ° C.) is relatively fast at 103 minutes or less Also has
a Young's modulus of 520'kII / 'crA or more even at 80 ° C, and an impact bond strength of 30
to 7 cm /' d or more by an Izod tester The object is to obtain a material having an adhesion
strength that has a value and can withstand the drop impact test of 40 [] OG. In order to achieve
the above object, as a result of intensive investigation of the adhesive by the inventor, an epoxy
resin comprising an epoxy resin synthesized from epichlorohydrin and bisphenol A, an epoxymodified polymercaptan and a polyamide resin based on a dimer acid The voice coil of the
speaker is an epoxy resin composition comprising an epoxy resin synthesized from
epichlorohydrin and bisphenol A and a polyamide resin based on epoxy modified polymercaptan
and dimer acid. The speaker obtained by this method has good sound quality and adhesion is
completed in a relatively short time, so that the manufacturing cost is also reduced.
Hereinafter, the present invention will be described in detail by way of examples. In the figure, 1
is a voice coil bobbin, 2 is a cone, 3 is an adhesive, 4 is a voice coil, 5 is an edge, 6 is a spider, 71
is a frame, 8 is a yoke plate, 9 is a magnet, and 10 is a pre.3 with center pole. The In addition, the
gelation time was measured as a standard for the curing speed of the adhesive. That is, an
adhesive was applied to a thickness of about 0.5 m on a flat plate made of brass, and this was
allowed to stand at 25 ° C. for time to touch to dry, which was taken as the gelation time.
Furthermore, Young's modulus was cured at 60 ° C. for 1 hour, and was measured by a
vibration lead method using a sample of length 45 mv × width 5 × thickness 0.3 ° C.
Furthermore, it was cured at 60 ° C for 1 hour, and the impact bond strength was determined
by an Izod impact tester, and the impact adhesion was performed at room temperature (25 ° C)
at a gravitational acceleration of 4000 G using an AVCO drop impact tester. A determination of
strength was made. Example 1 Composition A-1 Composition-1 Epicoat 82B Tomide 225-X2O3
[a mixed portion of the mold part t-1001 parts by weight, 4]. It described about the adhesion
method using the composition which consists of 2 liquid of said 4-1 liquid and B-1 liquid. Both
solutions are stable individually at 25 ° C, and the gelation time at 25 ° C when mixing the
same amount is 103 minutes, and the dynamic Young's modulus is 22.000ky 7, 1 at a
measurement temperature of 25 ° C. The temperature characteristics were good at 6 mass ° C
and at 13,000 plums / -180 ° C and 800'4 /, and i. Furthermore, the impact bonding strength is
at least 7 · 7 to 60, and the drop impact test of 4000 C; ′ ′ I / − does not break or peel off,
and a wide range of good sound quality with little distortion can be taken. , The sound quality of
the speaker was good. Example 2 Composition A-2 Composition-2 Epicoat 828 Parsamide 140
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(Japan (manufactured by Shell Chemical AA) 100 parts by weight of General Mills Chemical
Profit) 100 parts by weight and Epomee) QX-11 (Mitsubishi Yuka, manufactured by a) 20 100
parts by weight of a mixture of parts by weight The above-mentioned homogeneous solutions A2 and B-2 were both stable at room temperature EndPage: 2 temperature. The same data as in
Example 1 were determined. The gelation time was 100 minutes, and the dynamic Young's
modulus was 4 in 2000 at 25 ° C and 8,000 god / cJ at 1.60 ° C. The temperature
characteristics were as good as 54 okg /, 1 at 80 ° C. Furthermore, the impact bonding strength
is 30 呻 · “/ c ++! It is the above, and can endure a drop impact test of 4000 G, can take a wide
area of good sound quality with little distortion, and the sound quality of the speaker is good.
Comparative Example A polyamide curable epoxy adhesive classified as having the best
temperature characteristics of Young's modulus among rubber-based, hot melt-based and
polyamide-curable epoxy-based adhesives, that is, one having a so-called sound quality is shown.
For example, it showed about the adhesion method using Cemedine 1soo (made by Cemedine ff)
which made the weight blending ratio of a main ingredient and a hardening agent 1: 1. The
gelation time is much longer <300 minutes compared to the above example. The temperature
characteristic of Young's modulus is 16. at 25 ° C. oookf /, 4,000 plum / 'at 60 DEG C., 540 kg
/' crA at 80 DEG C., which was significantly worse than in the examples. In addition, impact
adhesion strength is low at 19.7 / · σ / − under curing conditions of 60 ° C for 1 hour, and
furthermore, in a drop impact test of 4000 G, the adhesive breaks and becomes defective. The
Therefore, it was found that it was not possible to widely take a good region of sound quality
with less distortion, and that the sound quality of the speaker was clearly worse than in the
example. From the above, the gelation time at 25 ° C of the epoxy resin composition comprising
an epoxy resin synthesized from epichlorohydrin and bisphenol A, an epoxy-modified
polymercaptan, and a polyamide resin of a dimer acid pace is approximately compared to
Cemedine 1500 It is as short as 1 / '3 or less, the temperature characteristic of Young's modulus
is also good, and the impact bonding strength is 60 ° C. Under the 1-hour curing condition,
Cemedine 1500 was cracked in the drop impact test at 4000 G with a value of 10 kg · cm or
more larger than Cemedine 1500 by 3 kg / cm / cd = or more, but this composition The objects
were not broken and peeled off because they had sufficient impact strength 7. Therefore, it was
possible to take a wide range of good sound quality with less distortion, and it became clear that
the production rationalization of the speaker and the remarkable improvement of the
characteristics were achieved. Moreover, these adhesives can be widely applied to electronic
parts as adhesives for vibration parts.
4, a simplified illustration of the drawing is a cross-sectional view of the speaker. 1 · · · · · · · · · · · · ·
· · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · 1 Toshiyuki 8 · lθ 1 EndPage: 3
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