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This translation is machine-generated. It cannot be guaranteed that it is intelligible, accurate,
complete, reliable or fit for specific purposes. Critical decisions, such as commercially relevant or
financial decisions, should not be based on machine-translation output.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of the main part of a
conventional electrodynamic speaker, FIG. 2 is an exploded perspective view of a part thereof,
FIG. 3 is a perspective view thereof, and FIG. FIG. 5 is an exploded perspective view of the main
part of the electrodynamic speaker according to an embodiment of the present invention, and
FIGS. 6 and 7 are partial sectional views of the electrodynamic speaker according to an
embodiment of the present invention. 15
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Portion corresponding to lead wire
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the formation of
leads in an electrodynamic loudspeaker. In the electrodynamic speaker, in the furnace shown in
FIG. 1, the moving film 3 is provided in the breathing circuit consisting of the pole piece 1 and
the yoke 2, and the printing foil provided in this moving bile or A beat // j) A sound is emitted by
passing an audio current between both ends of the voice coil 4. And, the structure of the part of
the frame 3 is, as shown in FIGS. 2 to 4, the diaphragm 3 of aluminum foil voice coil 6 printed
flatly on insulating film 5 of polyimide or the like. It is attached to the end of the tour as it is held
in the same condition. Next, the insulating plate 12 which publishes the conductor portion 10 ░
11 is brought into contact with both ends 8 and 9 of the Hois coil 6, and the both ends 8 and 9
of the voice coil 6 are ultrasonically soldered. Solder to conductors ML10 and ML11.
Furthermore, solder one node green to the conductor part 10.11 and solder it to the outside. In
other words, a total of three solderings are performed. F: Forty-one (the ultrasonic soldered part
of FIG. 1 ? 3 [(2). At this time, after soldering to the voice coil 6 first, ultrasonic soldering is
applied to the living body portion 1C 911 of the insulating plate 12, or a step between the
surface of the Heus coil 6 and the housing noise b1 o of the plate 12 or 11 is about There is 1
city, and only solder 14 can not reach to conductor part 10.11 and so on, and the vision of the
half Ef 114 is small. There is a possibility that it may be destroyed, or it may become a defect of
Ushida with a potato, a tunnel and a soldering house, and there is a problem in reliability.
Furthermore, I think the above-mentioned Ill (a work + character that you must make a stone a
half circle with 3 times. Therefore, the present invention aims to provide a speaker with a
solution to this problem. In the following, go to the 5th to 7th figure about the sea bream of the
paper sheet east. Referring to FIG. 5, first of all, a paper L film 15 such as a polyimide is provided
with a Heus coil 16 of print 76 on aluminum in a square shape, the film 15 is leveled, and seven
uneven tension is held 1 The operator treats the diaphragm ring 17 with a scissors. Then, both
ends 1o and 19v of the voice coil 16 (a red 71 board with the temple capitals 21 and 22 at the
faded place is completed). This ? i ? 2G is formed of polyimide or the like and has a thickness
of 26 ?, the conductor 21.22 is Flint's sister 4 and the bird is 35 ?. In particular, a flexible
flexible printed circuit board may be called a flexible printed circuit board.
The portion 23.24 corresponding to the lead wire of the speaker is provided on the insulating
plate 21 for this flexibility e, the first feature. In this way, as shown in FIG. 6, the height of both
ends 1B and 19 of the voice coil 16 and the temple body 21.22 of the edge plate 20 is 60 ?m (C,
06E1). And the difference in level is about 4. Therefore, it is not necessary to solder the
extraction lead @ 13 by soldering it to the dedicated part 1 ии 111 after soldering the Mi sound
live solder to the Heuss coil 6 as in the fourth prior art. As in the 6th district, the printed voice
coil 16 and the special 2C's temples 21 and 22 of board 2C are in a single soldering process, and
the number of ? i places that become irresistible decreases and the work it takes longer . In
addition, since the solder 31 solder is stable compared to the conventional method, the number
of divisions of the product, the number of divisions of the product, breakage due to adulthood,
soldering such as drying out of the tunnel, etc. I will not go away. Holes 26 and 26 (H are
provided at the original end of the hp part 23.24 that is to be hit to the REIT name of the
potential plate 20, and a private capital of 27.28 cars is provided around this hole 25 ░ 26 The
terminals 29. 30 provided in the housing of the speaker may be passed through the holes 25. 26
and the conductor portions 27. 28 and the terminals 29. 30 around the holes 25. 26 may be
soldered. At this time, the conductor portions 27.28 around the holes 24.25 may be through
holes as shown in FIG. 7 so that both sides of the edge 20 can be soldered. By doing so, the
feeling of soldering + 1iJli] 4 is also improved. It is recommended that the surface of the copper
of 23.24 which corresponds to the lead system be protected with a nor-resist or the like to
protect L + i, and to prevent seedling and corrosion. Of course, the direction and length of the
portion 23.24 corresponding to the lead wire can be adjusted to the eye by the position of the
terminal 29.30. As described above, according to the eighth proposal, it is possible to connect the
sound of the lead name to the Heuss coil and to 'make it easy to manufacture and have excellent
electrodynamic speaker with excellent reliability. .
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