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JPS56156095

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DESCRIPTION JPS56156095
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing one
embodiment of a piezoelectric buzzer according to the present invention, and FIG. 2 is a plan
view of the metal plate shown in FIG. 1 · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · · ·
· · · · · · · · · · · · · · · · · · · · · · · ·.
The present invention relates to the construction of a piezoelectric buzzer, and more particularly
to the improvement of the bonding strength between a piezoelectric element and a metal plate,
and between a metal plate and a case. Conventionally, by sticking a piezoelectric element to a
metal plate and further bonding a metal plate to a case, in a piezoelectric buzzer that emits sound
by vibrating the case, the film of the adhesive is extremely thin. It was weak, had a drop impact,
and had a risk of peeling off due to long-term deterioration of the adhesive. In order to improve
such conventional defects, the present invention provides a large number of small holes in the
metal plate and to fill the small holes of the metal plate with an adhesive, thereby improving the
strength of the bonding portion. Figure improvement), 41! It provides a piezoelectric buzzer
having a high Il property. Hereinafter, the present invention will be described using the drawings.
FIG. 1 is a sectional view showing an embodiment of a piezoelectric buzzer according to the
present invention, wherein 1 is a piezoelectric element having electrodes on both sides, 2 is a
metal plate having a large number of small holes, and 3 is a case made of an insulating material.
is there. The piezoelectric element 1, the metal plate 2, and the case 3 are fixed by an adhesive
(shown by first flow hatching) on their respective joint surfaces, and the small holes of the metal
plate 2 are further filled. Here, although the adhesive film is actually about 1/100 to 5/100 m, it
is illustrated as thick in order to make the drawing easy to understand. 4 is a lead plate for taking
the electrode of the piezoelectric element 1 through the metal plate 2], and 5 is a coil spring
which makes electrical connection with the other electrode of the piezoelectric element. The lead
plate 4 and the coil spring 5 are connected to the electronic circuit unit 6. Now, when an
alternating drive voltage for driving the piezoelectric buzzer from the electronic circuit N6 is
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applied to the lead plate 4 and the coil panel 5, the piezoelectric element 1 starts to vibrate and
emits sound from the case 3. FIG. 2 is a plan view of the metal plate 2 shown in FIG. As described
above, according to the present invention, the metal plate 2 is provided with a large number of
small holes, a piezoelectric element is formed, and the bonding of the metal plate 2 and the case
3 is bonded not only at their respective joint surfaces but also the metal plate 2 Since the
adhesive penetrates and bonds to the small pores of the case, the strength of the bonded part is
improved compared to the conventional method, and an impact such as dropping <stronger and
a long-term reliable piezoelectric buzzer is obtained. In practice, the effect is enormous.
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