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JPS58153495

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DESCRIPTION JPS58153495
[0001]
The present invention relates to a method of manufacturing a ribbon diaphragm used in a ribbon
speaker. Recently, as a method of manufacturing a hybrid substrate or a semiconductor IC, the
photo-etching method is adopted because its precision is required. By the way, although the
ribbon diaphragm used for the ribbon type speaker is formed of an extremely thin conductive
metal such as aluminum having a thickness of about 10 μ, for example, a metal foil τ such as
aluminum is formed. In addition to rolling and forming the dough itself, a method of forming a
conductive metal on a metal or nonmetal base by sputtering or the like has recently become
widespread. The aforementioned photo-etching method is also being adopted as a manufacturing
technique for ribbon diaphragms. Photo-etching method-as shown in FIGS. 1 to 6 as an example
of the negative type photo-etching method, the surface of a material to be processed A is a photo
resist as a photosensitive substance as a first step. (See FIG. 2) 0 Next, the photo resist I-B is
exposed through a photo mask C in which an image is drawn as a second step (see FIG. 3), in this
case, the photo mask C. Photoresist 1-B on the lower surface of the image portion C 'is not
exposed to light 0 Next, as a third step, the photoresist B on the unexposed portion is removed by
rubbing (see FIG. 4), as a fourth step And Etch the processing material A of the removed photo
resist portion B with acid or alkali (FIG. 5 number 1!). l) The photo resist B left as the fifth step is
dissolved in an alkaline solution and removed from the surface of the material to be processed A
(see FIG. 6). As described above, the conventional etching technique using the photo resist B has
many steps, and accordingly, the time, the manufacturing cost, the equipment cost, and the cost
increase. Also, the photo resist B, which has become unnecessary as a final step, must be
removed from the surface of the material to be processed A, but in this case, it is removed using
an acid or alkali solution. However, if the material to be processed A is made of a material
susceptible to acid and alkali, the photo resist B in the remaining image portion can not be
removed, and a defective product will be produced. The present invention has been made in view
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of the above-described points, and one of the objects of the present invention is to simplify the
whole process as compared to the photo-etching technique, and thereby to reduce the
manufacturing time and the material cost involved. An object of the present invention is to
provide a method of manufacturing a ribbon diaphragm which reduces the cost of equipment
and reduces the cost.
Hereinafter, some representative embodiments of the present invention will be described with
reference to the drawings. In this embodiment, the case of manufacturing a beryllium diaphragm
will be described. First, as a first step, a roll-shaped edge portion 2.2 is provided at an end
portion, and beryllium Be is vapor-deposited on, for example, the back surface of a ribbon-shaped
diaphragm beryllium 1 made of copper to form a vapor deposition layer 3 See Figure 8).
Deposition is performed by centering the diaphragm base 1 in a jig (not shown) in a vacuum
chamber, and then vacuuming the inside of the vacuum chamber, then depositing beryllium as a
metal to be deposited, and depositing the diaphragm base 1 Let As a second step, the mask 4, 4
is formed of chloroprene rubber having high volatility with an adhesive of rubber yarn which has
been coated with an organic solvent on both sides of a vapor deposition layer 3 formed by vapor
deposition of beryllium Be and a copper base plate 1 (See Figure 9). As a third step, the base
plate 1 made of copper other than the portion covered by the masks 4 and 4 is dissolved in a
first solvent, for example, nitric acid and etched to form the remaining deposited layer 3 on the
diaphragm ( See Figure 10). In this case, in addition to nitric acid, a strong oxidizing acid such as
concentrated sulfuric acid is used as the first solvent for etching. As the fourth step, the
evaporation layer 3 of beryllium Be is vapor-deposited on the diaphragm base by dissolving the
wax 4 * 4 made of chloroprene rubber with ethyl acetate as a second solvent to obtain a
diaphragm (See Figure 10! り。 One embodiment of the present invention includes the steps as
described above, and after etching the copper diaphragm base plate 1 using nitric acid as the
first solvent, the diaphragm using the ethyl acetate as the second solvent A mask 4.4 made of
chloroprene rubber at both ends of the base plate 1 was dissolved in ethyl acetate as a second
solvent. Therefore, the step of exposing the photo resist B through the photo mask C becomes
unnecessary, and the process can be simplified, in addition to the conventional etching technique
by the photo etching method. In addition, chloroprene mask C2C formed of chloroprene rubber
is dissolved and removed with ethyl acetate as a second solvent without using nitric acid as a first
fg agent for dissolving and removing the copper base plate 1 . Next, a second embodiment of the
present invention will be described according to FIG. In the first embodiment, chloroprene rubber
having a high volatility is used at both ends of the vapor deposition layer 3 on which beryllium
Be is vapor-deposited and the copper base plate 14. Is used. The adhesive tape 5 is made of, for
example, a base tape 5A formed of polyvinyl acetate, and an adhesive layer 5B of chloroprene
rubber or the like is coated on the lower surface of the base chip 15A. As shown in FIG. 12, this is
attached to the front and back surfaces of the diaphragm base as shown in FIG. 12, and only the
base tape 5A is peeled off. The mask is removed by the 0 adhesive layer 5B as in the first
embodiment. It can be dissolved in an organic solvent such as ethyl acetate.
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In this embodiment, the masks 4 and 4 are formed of paraffin, and after etching the base plate 3,
it is boiled using ethanol or hot alcohol as the second fg medium, and the first embodiment and
the second embodiment are used. It does not rise. In each of the first, second and third
embodiments, the base plate 3 is made of copper, but the base plate can also be made of
aluminum. As the first solvent for etching, one kind of nitric acid, sulfuric acid, hydrochloric acid,
etc. is used for aluminum. As mentioned above, the present invention can simplify the entire
powder compared to conventional photo-etching techniques. Therefore, the manufacturing time
and the associated material and equipment costs are reduced, and the cost can be reduced. In
addition, the mask can be completely removed by melting without damaging the surface of the
material to be processed by dissolving the etching solvent for the material to be processed and
the solvent for melting the mask using the respective dedicated solvents. Improve the reliability
of
[0002]
Brief description of the drawings
[0003]
FIG. 1 is a process chart showing a conventional photo-etching technique, and FIGS. 2 to 6 show
steps of a method of manufacturing a ribbon diaphragm of a key liquid, and FIG. A crosssectional view showing a first step of applying a photoresist to a material, FIG. 3 is a crosssectional view showing a second step of exposing a photoresist using a photo mask, and FIG. Fig.
5 is a cross-sectional view of a processed material etched in the same manner, Fig. 6 is a crosssectional view of a photo-resist dissolved away, and Figs. FIG. 7 is a plan view showing a first step
showing an embodiment of the diaphragm base according to the present invention, and FIG. 8 is
a cross section showing a second step in which a deposited layer is formed on a metal 6 base
plate Fig. 9 is a cross-sectional view showing the third step of covering both ends of the base
plate with a mask. Fig. 1 is a sectional view showing the fourth step in which the base plate is
etched, Fig. 11 is a sectional view showing the fifth step in which the mask is removed, and Fig.
12 is a second embodiment of the present invention. It is sectional drawing which showed the
3rd process in.
l: base plate, 3: evaporation layer, 4: mask, 5: adhesive tape. Patent applicant Pioneer Corporation
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