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JPS58209298

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DESCRIPTION JPS58209298
[0001]
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a
transducer 1j suitable for use in a headphone microphone or the like. [Technical Background of
the Invention] A transducer, such as an electret condenser microphone, has a polymer dielectric
layer 2 electretized on one main surface of an electrode 1 as shown in FIG. The constructed fixed
electrode 3 is supported on the inside of the opening of the dish-shaped base 4, and the
membrane ring 7 on which the diaphragm 6 is stretched is sequentially stacked on the upper end
edge of the fixed electrode 3 via the spacer ring 5. The conductive case 8 is placed on the film
ring 7, the spacer ring 5 and the base 4 so that the upper surface of the base 4 is crimped so as
to be bent. In addition, the code | symbol 9 is fixed electrode 3 and '47? The symbol @ 10 is a
normal hole provided in the IJ * series 8, except for a symbol 11 (protruding through the base 4
from the back surface of the electrode 1). It is an external output terminal. And, this electret type
?5? microphone has the external output terminal 11 of the electrode 1 as one output end, and
the conductive thin film 11 formed on the vibrating film 6 (shown in FIGS. 1 and 2) The audio
signal is output to the outside through the capacitance change according to the change in the
distance between the fixed electrode 3 and the vibrating membrane 6 due to the vibration of the
vibrating membrane 6 with the conductive case 8 connected to the other) as the other output
end. It is a thing. [Problems of the Background Art] However, the conventional electret condenser
microphone configured in this way is provided via the conductive case 8 so that the output from
the conductive WIIl * of the vibrating membrane 6 contacts the membrane ring 7. In this case,
the contact failure between the ring 7 and the conductive case 8 is likely to occur, and the output
is difficult to be constant, and the operation of fitting the conductive case 8 is also troublesome.
Further, since the fusion 4, the fixed electrode 3, the spacer ring 5 and the group ring 7 which
are individually manufactured are stacked and integrated by fitting the conductive case 8, the
dimensional accuracy of each component tends to vary. Since it is difficult to maintain sufficient
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air tightness between each component, there is a drawback that the characteristics such as
sensitivity are difficult to be constant and the performance is not uniform during mass
production. Furthermore, there are many components such as the base 4, fixed electrode 3,
spacer ring 5, film ring 7 and conductive case 8 and there is a limit to miniaturization of the
shape, and the work of assembling small components is As it is extremely complicated, '11. (1)
The manufacturing cost is likely to rise and the assembling efficiency is poor, and it is not
suitable for mass production. [Object of the Invention] The present invention solves the abovementioned drawbacks. The I-Gome 1-4 ?solves this problem. Based on the purpose of providing
an inexpensive transducer suitable for
[Summary of the invention] In order to achieve this object, the present invention provides an
electrode and a support 1 and '1 layer surrounding the electrode and the electrode at a distance
on one side of an insulating substrate provided with an external output electrode And extending
the connection lead integrally from the periphery of the -1-support layer, with the vibrating
membrane facing the front surface of the electrode at a predetermined interval. And the
connecting lead is bent to the lower surface side of the insulation M & to electrically contact the
external output electrode, and the lead output is simplified. It is b which aimed at equalization
and facilitation of mass production. DESCRIPTION OF THE PREFERRED EMBODIMENTS The
present invention will be described in detail below with reference to the drawings. The same
reference numerals as in the prior art denote the same parts as in the prior art. FIG. 3 is a
longitudinal sectional view showing an embodiment of the transducer according to the present
invention, taking the 1-leftlet type condenser as an example. In the figure, a disk-shaped
electrode 1 having a diameter smaller than that of the insulating / edge substrate 12 is formed at
the center of one of the main surfaces (the in-plane in the drawing) of the cutting board 12. The
fixed electrode 3 is configured by depositing the electretized polymer dielectric layer 2. At the -F
edge of the insulating substrate 12, a conductive support ring 13 surrounding the fixed electrode
3 is formed at a slight distance from the periphery of the fixed electrode 3. The support ring 13
is formed of the same material as the electrode 1 and is thicker than the fixed electrode 8I3. The
connection lead 14 as shown in FIG. 4 extends integrally from the periphery of the support ring
13, which will be described later. It has been bent. When the conductive thin film 16 is formed
on the lower surface of the insulating film 15 by vapor deposition or the like at the tip of the
support ring 13, the conductive thin film 16 can be brought into contact with the support ring
13. It is stretched in a state of being separated by a predetermined distance in front of the. That
is, the support ring 13 functions as a support 1-'J yi and a spacer ring that stretches the spring 6
'. The other main surface (1 и ? in the figure) of the insulating substrate 12 is opposed to the
center of the electrode 1 of the fixed electrode 3 (1 ? / output electrode 17 as an external
output electrode is formed. In the state in which the output electrode 17 is surrounded in an
electrically isolated state, an earth electrode NM1B as an external output electrode is formed.
Then, the connection lead 14 of the support ring 13 is bent and passes through the side surface
of the insulating substrate 12 (a half Efl (= J is connected to the 1st surface side (.nozzle
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electrode 18)). In addition, a through hole 19 penetrating the electrode 1, the insulating
substrate 12 and the out hole 17 is drilled, and in each through hole 19, a conductive contact for
connecting the electrode 1 of the fixed electrode 3 and the output electrode 17 is provided.
Agent 20 is filled.
This electret type] sound output is performed between the output electrode 17 and the north
electrode 18 as an output end through the capacitance change between the vibrating membrane
0 and the fixed electrode 3 due to the vibration of the vibrating membrane 6 It is one. In the case
of the so-configured rectread type condenser ?microphone,? the connection lead 14 extending
from the support ring 13 formed on the upper surface of the insulating substrate 12 so as to
surround the fixed electrode -3 is on the lower surface side. It is bent and connected to the
ground electrode 18 #! Since it has a construction, it can be derived from the output of the
conductive thin film 16 of the imaging film 6 with a simple # 1 construction, and the number of
parts is extremely reduced. In addition, since this electret type] [f-cophone is formed on the
upper surface of the insulating substrate 12 by forming the fixed electrode 3 and the support
ring 13 which doubles as a spacer ring, it becomes small and thin film type. Next, an embodiment
of a method of manufacturing the electret conden V-microphone of the present invention will be
described. First, as shown in FIG. 5, the double-sided printed circuit board 23 in which the
conductive 1i 1121.22 is attached to the independent surface of the insulating substrate 12 is
prepared and reversed. The upward conductive layer 21 of the double-sided printed circuit board
23 is subjected to chemical processing such as conventional A) and L-tching or mechanical
processing such as cutting as shown in FIG. -The electrode 1 and the support ring 13
surrounding the electrode 1 at a predetermined interval are formed concentrically 4 to 7>-The
output electrode 17 and the interval between it and the conductive layer 22 on the lower surface
of the insulating substrate 12 are also formed similarly. To form an I-sumi 44i 18 (FIG. 6). The
connection lead 14 is integrally extended to the support () ring 12. Then, as shown in FIG. 7, after
the upper surface of the electrode 1 surrounded by the support IJ ring 13 is scraped by the
conventional well-known etching or the like and made lower than the support ring 13, the
polymer dielectric layer 2 is obtained. Is it electretized and fixed by C pressurization method etc.?
If pole 3 is # 11. As shown in FIG. 8, well, a through hole 19 for penetrating the fixed electrode 3,
the insulating substrate 12 and the output electrode 17 is formed to fill the conductive adhesive
20, while the vibration ring 16 is used as a support ring. The front end of the fixed electrode 3 is
covered at a predetermined interval of 4 intervals, and the insulating substrate 12 and the
ground 'I 4 i pole 18 are known so that the connection lead 14 of the support ring 13 protrudes.
The connection lead 14 is bent to the end surface side, and the tip thereof is soldered to the
ground electrode 18 and manufactured. As described above, in the electret condenser
microphone of the present invention, the electrode 1 and the support ring 13 with the
connection lead are formed from the conductive layer 21 on the upper surface using the doublesided printed board 23 and the external output from the conductive 1122 on the lower surface
(The output electrode 17 and the ground electrode 18 are formed as the electrodes-so that the
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output can be derived from the vibration 1116 simply by bending the connection lead 14.
In addition, since the support ring 13 and the electrode 1 are previously attached to the
insulating substrate 12, it becomes possible to keep the size and precision of each component
constant and keep the components airtight sufficiently. It is possible to equalize characteristics
such as sensitivity. Furthermore, since it is possible to simultaneously form a large number of
electrodes 1 and connection lead attachment support rings 13 on one double-sided printed
circuit board 23, mass productivity is extremely improved. In the double-sided printed circuit
board 23, dividing means such as perforations are formed, and (LJ can be easily divided. In
addition, since the external output electrode can be formed on the lower surface of the insulating
substrate 12 by using the double-sided printed circuit board 23, electret type (direct connection
of microphone and microphone can be realized to the circuit board of the electronic device In
order to improve the assembly efficiency of the unit, it is necessary to e. In addition, in the
transformer of the present invention, an electret type capacitor microphone having a structure in
which the polymer dielectric layer 2 is formed on the electrode 1 [, not limited to one phone, the
moving film of the polymer dielectric layer 2 is Needless to say, the present invention can be
applied to a T-leftlet-type condenser microphone having a structure of No. 6 and can be widely
applied to a transducer 4) in which an electrode and a diaphragm are combined. [Effects of the
Invention] As described above, the Trans Jico 1J of the present invention forms the electrode and
the support layer on the insulating group & L-soot provided with the external output electrode on
the lower surface, Since the connection lead integrally extended from the peripheral edge of the
support layer is bent toward the lower surface side of the insulating substrate and electrically
connected to the external output electrode, the output from the vibrating membrane is obtained.
Derivative II 4 construction is simplified, contact failure is eliminated, the output is stabilized, and
disconnection is unlikely to occur even when other electronic components abut. In addition,
unlike the conventional structure in which the separately manufactured components are
overlapped and integrated by a case, the conductive layer attached to the insulating substrate
can form a support layer for stretching the fixed electrode and the vibrating film. As a result, the
dimension 'M degree of the component can be improved, and the airtightness between the
components can be maintained, so that the performance is equalized. Since the number of parts
is small and the assembly can be performed only by removing the conductive layer formed on
the insulating substrate by a conventionally known means, cost reduction and mass production
can be achieved. Furthermore, in the case of using a double-sided printed board in which a
conductive layer is formed on the back surface of the 7 insulating board, the formation of the
external output electrode of 1 to 4) It is extremely dead inside the tube.
[0002]
Brief description of the drawings
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[0003]
1 and 2 are a rest view and an exploded perspective view showing a conventional transducer,
FIG. 3G, 1 an embodiment of the transducer according to the present invention as a small J 11 m
1 ifu figure, and FIG. Expanded the support layer shown in!
A cross-sectional view shown in Fig. 5 and Figs. 5 to 8 are process drawings showing an
embodiment of the production h 'method of the transducer according to the invention of Fig. 3. 1
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и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и Spacer ring 6 ииииииии Membrane ring 8
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и и и и и и Connection leads? Conductive? # Film 17. 18 и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и и
и и и и и и и и и и conductive adhesive 23 и и и и ...... sided printing Danban Attorney Attorney "mandatory
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