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JPS59153399

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DESCRIPTION JPS59153399
[0001]
The present invention relates to, for example, an electrode extraction structure of a diaphragm
for sound used commonly as a diaphragm of a ribbon speaker. As a diaphragm of a ribbon type
speaker, a thin plate of helirium or an alloy mainly composed of helium is known. Although this
Helirium has a specific gravity smaller than that of aluminum and has high melting point and
high strength, it has excellent characteristics as a Bonn-type diaphragm, but it can be directly
attached with a hang, and the thickness of a thin plate is about 10 to 20 ?m. Because it is very
thin and difficult to join, there is a problem that it is difficult to take out the electrode. In the case
of the conventional diaphragm made of Helium, it is difficult to take out the electrode, and
sufficient adhesion can not be obtained, and the contact resistance increases, and even if the
adhesion is obtained, mass productivity etc. There was a problem with Fig. 1 a "-e shows a
conventional method for taking out electrodes. In the case shown in FIG. 1 ?, the power supply
portion 2 of the thin plate 1 of the helirium is removed except for a mask, and a metal 3 such as
copper is vapor-deposited on the power supply portion 2. Further, in the case shown in the same
figure, in order to prevent the oxidation of the helirium, it is heated in advance in vacuum or in a
non-oxidizing atmosphere, and the electrode thin plate 4 such as copper is closely adhered to the
feeding portion 2 to mutually diffuse the heat. It was Further, in the case shown in FIG. 6C,
electrolytic plating is performed by immersing in the electrolytic solution 5 containing copper
ions with the feeding portion 2 as a negative electrode. Further, in the case shown in FIG. 2D, the
electrode thin plate 4 made of copper or the like is stacked on the feeding portion 2 at normal
temperature and pressure bonded by the die 6. Further, in the case shown in FIG. 5E, the power
supply unit 2 is excluded except for the mass, and the power supply unit 2 is sprayed with metal
3 such as copper only for one building. However, in the case shown in FIGS. 1a and 1b, the
apparatus becomes bulky to perform evaporation, p4H diffusion, etc., and there is a problem in
mass productivity, and in the case shown in FIG. There is a problem that no force can be
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obtained, and in the case shown in FIG. D, when the crimped surface is oxidized, an insulating
film is interposed between the feeding portion 2 and the electrode layers Fj and 4, resulting in
conductivity There is a problem that the adhesive strength is also weak to decrease-and in the
case shown in Fig. E, a sufficient adhesive strength can not be obtained with lil and aluminum
adhesive strength can be obtained. There is a problem that helium is corroded by the chloride
contained in the flux of aluminum solder when soldering the lead wire using The present
invention is directed to low melting point metals such as Kl, aluminum, indium, zinc and the like,
alkali metals such as lithium, sodium and potassium, or alloys containing lithium or beryllium as
the main research to solve the problem of -h. It has been found that it has sufficient adhesion to
the present invention, and that when the electrode layer is formed by interposing these metals,
the adhesion is significantly improved as compared to the case where the electrode layer is
formed directly on helium and the like. I came to
An embodiment of the present invention will be described below. FIG. 2 is a cross-sectional view
showing an example in which the electrode extraction structure of the present invention is
applied to a diaphragm of a ribbon type speaker. In the figure, reference numeral 10 is a thin
plate of helirium, and the plate thickness is set to 10 to 20 ?m. The feeding portions 11.11 are
formed at both ends in the longitudinal direction of the beryllium thin plate 10 via the bent
portions Oa, and the intermediate metal layer 12 is formed on the surfaces of the feeding
portions 11.11. The intermediate metal 1i12 is formed by spraying a low melting point metal
such as aluminum (AC, indium (In), zinc (Zn)) or an alkali metal such as lithium (1-i), sodium 1lithium (Na), potassium (K) These low melting point metals and alkali metals have sufficient
adhesion to Helium and Li-based alloys. It also has sufficient adhesion to titanium, titanium alloys
and the like. Since alkali metals have strong activity, alkaline earth metals such as magnesium
(Mg), calcium (Ca), sodium chloride (Sr), barium (Ba) and the like are added in advance during
thermal spraying. As a thermal spraying method, there are a plasma thermal spraying method, an
arc thermal spraying method, a gas thermal spraying method and the like. During thermal
spraying, sufficient adhesion can be obtained even at room temperature, but if the temperature is
such that beryllium is difficult to oxidize, ie, 10 (approximately 1 ░ C to 500'C), adhesion can be
made even stronger. . In addition, although the surface of the feeding portion 11 can obtain
sufficient adhesion even when the mirror surface is kept, if the surface is used as a bill surface,
stronger adhesion can be obtained. An electrode # 13 is formed by thermal spraying a metal
such as copper (Ca) or silver (AU) having a low resistivity and good adhesion to the surface of the
above-mentioned intermediate metal 1ijSI image 12 A conducting wire 14 is connected to the
surface of the electrode layer 13 by a soldering iron or the like. When the electrode layer 13 is
thermally sprayed, the adhesion can be reduced by heating to about 100 ░ C. to 500 ░ C. When
forming the intermediate metal layer 12 and the electrode layer 13 in two steps, as shown in
FIGS. 3a, 3b and 3c, a large number of beryllium thin plates 10 (same a #i arrangement) are
arranged in parallel. As shown in FIG. 1], the mask material 16 may be covered in portions other
than the feeding gl eyes 1), and the electrode lead-out portion may be formed on a large number
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of helium thin plates 10 at a time (see FIG. C). . In the example described above, the case where
beryllium was used as the lhi lJJ plate was described, or it can be applied to an alloy containing
beryllium as a main component, titanium, a titanium alloy, carbon, a carbon alloy or the like.
It can be widely applied to diaphragms which are soldered and soldered. As described above,
according to the present invention, a low melting point metal or lithium such as alkali, indium,
zinc or the like having sufficient adhesion to the helirium or the like constituting the conductive
thin plate on the feeding portion of the conductive thin plate serving as the diaphragm. Since an
intermediate metal layer of an alkali metal such as sodium or potassium is formed by thermal
spraying, and an electrode layer of copper, silver or the like is formed on the intermediate metal
layer by thermal spraying, the adhesion is large and the conductive thin plate For example, the
electrode extraction structure can be obtained without losing the intrinsic conductivity of the
helirium. In addition, since the middle jH1 metal layer and the electrode layer are both formed by
thermal spraying, mass productivity is excellent. Next, the present invention will be described in
detail. An intermediate metal layer 12 of aluminum (sample-1) and lithium (sample-2) was
formed on the feeding portion 11 by gas spraying using a Helium thin plate 10 having a
thickness of 2Q trn. Then, an electrode layer 13 of copper is formed on the intermediate metal
12 of each sample by the gas 1 g injection method, and a thin copper plate 14 of 20 ? thickness
is connected to the electrode layer 12 by soldering, The results shown in the following table were
obtained. For comparison, steel is sprayed directly on the feeding portion 11 to form an electrode
layer, and a copper thin plate of 20 ? thickness is connected to the electrode layer by soldering,
and the same measurement is performed. I wrote it together. As apparent from the above table,
according to the present invention, a sufficiently strong adhesion was obtained as compared with
the conventional one.
[0002]
Brief description of the drawings
[0003]
1a to 1e are explanatory views of a conventional electrode extraction method, FIG. 2 is a
sectional view showing an embodiment of the present invention, and FIGS. 3a to 3c are
explanatory views of manufacturing steps thereof.
10 иииии Conductive thin plate (Helirium thin plate) 11 иииииии Feeding portion 12 ииииии Intermediate
metal layer, I3 ииииии Conductive layer, 14 иии Conductors. Figure 1 (-c) (d) (e) Figure 2 Figure 4
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Figure 3 (b) (c)
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