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JPS59153400

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DESCRIPTION JPS59153400
[0001]
The present invention relates to, for example, a method of taking out an electrode of an acoustic
diaphragm applied to a diaphragm of a ribbon speaker. As a diaphragm of a ribbon type speaker,
a thin plate of an alloy containing beryllium or helium as a main component is used. This
beryllium has excellent properties as a diaphragm due to its small specific gravity (about 2/3 of
aluminum) and high strength compared to aluminum, but it can not be soldered, and it is also a
plate. Since the thickness is as thin as 10 to 20 μm and welding is difficult, there is a problem
that it is difficult to take out the electrode. However, in the conventional electrode extraction
method, since it is difficult to take out the electrode, a sufficient adhesion can not be obtained
and the contact resistance increases, or even if the adhesion is obtained, the productivity is
inferior, etc. There was a problem with FIGS. 1a, b and 2 show a conventional electrode removal
method. In the case shown in FIGS. 6A and 6B, first, an electrode layer 2 made of a metal that can
be soldered such as copper is formed on the feeding portion 1a of the beryllium thin plate 1 by
vacuum evaporation or electrolytic plating. The electrode material 3 was connected to the top by
the solder 4. Further, in the case shown in FIG. 2, a thin plate 3 such as copper is crimped to the
feeding portion 1a of the beryllium thin plate 1 using a pressure bonding jig 5, and this is heated
700 to 1000 ° in a vacuum or inert gas atmosphere by the heater 6. It was heated to C and
bonded (thermal diffusion). However, in the case of vacuum deposition, electrolytic plating or the
like (FIGS. 1a and 1b), sufficient adhesion can not be achieved, and the contact resistance may
increase or the electrode layer 3 may be peeled off. In the case of heat diffusion (FIG. 2), although
the adhesion is large, the device becomes dog-friendly and takes time and effort for pressure
bonding, resulting in a problem of poor productivity. As a result of intensive studies to solve the
problem of the present invention, the present inventors formed an electrode layer by spraying a
metal or alloy having a low specific resistance such as copper in an alkali metal and / or alkaline
earth metal gas atmosphere. As a result, beryllium, t + i1, etc. are reduced by alkali metals and
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alkaline earth metals, and the oxide film is removed or its formation is overdue, and adhesion is
large, and the intrinsic conductivity of Helium is not impaired. It has been found that the
electrode lead-out portion can be formed without a large scale of the device. An embodiment of
the present invention will be described below with reference to the drawings. FIG. 3 shows an
outline of an apparatus for carrying out the electrode extraction method of the present invention.
In the figure, reference numeral 7 denotes a closed container, which sprays a metal such as
copper (Cu) toward the mounting jig 8 for fixing the beryllium thin plate 1 and the beryllium thin
plate 1 fixed to the mounting jig 8. A thermal spray gun 10 and a heater 12 for heating an alkali
metal or alkaline earth metal lff 113 are provided.
In order to form an electrode lead-out portion using the above-described apparatus, the power
supply portion at both ends thereof is covered with the mask material 9 except for the power
supply portion at both ends thereof. Next, the beryllium thin plate 1 is fixed in the closed
container 7 by the mounting jig 8. Then, after evacuating the inside of the closed container 7 to
about 10 @ -1 to 10 -g Torr, the alkali metal and / or the alkaline earth metal 13 is heated and
evaporated by the heater 12, and the gas atmosphere of the gold j bo 13 is obtained. create.
Thereafter, a specific resistance small metal such as copper or an alloy thereof is thermally
sprayed by a thermal spray gun 1o. As the above-mentioned alkali metal, lithium (!, I), sodium
(Na), potassium (K), rubidium (Rb) are used, and as the alkaline earth metal, magnesium (Mg),
calcium (Ca), Strontium (Sr) and barium (Ba) are used. The vapor pressures of lithium (1-i),
sodium (Na), potassium (K) and rubidium (Rb) are in the order of Rb> Na> Li. When Rb and K are
used, they are evaporated quickly to create a gas atmosphere, but in order to maintain the 9JJ
fruit, without using Rb and K alone, Rb and Li, K and Li, etc. Combine high and low. In the case of
an alkaline earth metal or in the case of mixing an alkali metal and an alkaline earth metal, high
and low vapor pressures are similarly silked. The thermal spraying method includes gas, arc,
plasma, explosion, discharge explosion thermal spraying, etc., and it is used properly depending
on the type of metal to be sprayed, the thermal spraying conditions and the like. The thermal
spraying may be performed at normal temperature, but good results can be obtained by heating
the beryllium thin plate 1 to 100 ° C. to 500′′C. After the thermal spraying, when the mask
material 9 is removed, an electrode layer 11 is formed on the feeding portion 1a of the beryllium
thin plate 1, as shown in FIG. An electrode material 3 such as copper is soldered to the electrode
layer 11 with solder 4 in the same manner as in the prior art (see FIG. 5). When the metal
forming the electrode layer 11 is sprayed in a gas atmosphere of an alkali metal and / or an
alkaline earth metal as in duplicate, oxidation of the sprayed metal such as copper or helium by
alkali metal, alkaline earth metal, etc. Is prevented. That is, beryllium, copper, etc. are reduced by
alkali metals, alkaline earth metals, etc., and the oxide film is removed or prevented from being
formed. For this reason, an electrode Ltll having a large adhesion, a small content of oxide, and a
good handicap property without damaging the intrinsic conductivity of IJ IJ-um is formed.
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When thermal spraying is performed in the atmosphere or in an inert gas, a large amount of
oxide is contained, and the resistance value becomes M, <. In the above embodiment, the case
where the electrode layer 11 is a small layer has been described, but the electrode layer 11 has a
two-layer structure, and the adhesion (heavy aluminum (Aff), indium (In), zinc ( A low melting
point metal such as Zn) may be sprayed, and a metal such as copper having good solderability
may be sprayed thereon. FIG. 6 shows an outline of an apparatus for forming the electrode layer
11 into a multilayer structure. In this apparatus, the closed vessel 7 is equipped with a thermal
spray gun 10.10 '. As shown in FIG. 7, when first spraying aluminum or the like from one of the
thermal spray guns 10 and then spraying copper or the like from the other thermal spray gun 10
'in an alkali metal and / or alkaline earth metal gas atmosphere, as shown in FIG. An electrode
layer 11 having a two-layer structure including an electrode layer 11a of aluminum or the like
and an electrode layer 11b of copper or the like is formed. After that, the electrode material 3 is
soldered to the electrode IW 1.1 b by the solder 4. Thus, when the electrode Nll has a doublelayer structure of an @ electrode layer 11a of aluminum or the like and an electrode layer 11b of
copper or the like, the adhesion is larger than in the case of a single layer of copper or the like.
can get. In this case, as shown in FIG. When the alloy layer 14 is formed by alloying a and Ib with
each other, the adhesion between the electrode layers 11a and 11b is thickened. It is important
to be careful in alloying that metal is selected so that the resistance value of alloy 1ri 14 does not
increase. In the two embodiments, although the electrode layer 11 is formed on one side of the
helirium thin plate 1, the electrodes rfi 11 may be formed on both sides depending on the
application. In addition, by devising the mounting jig 8, it is possible to process many Helium thin
plates 1 at one time. The present invention can be applied to titanium, titanium alloys, carbon,
carbon alloys and the like in addition to alloys containing helium and helium as main
components. That is, it can be widely applied to a diaphragm which is difficult to solder. As
described above, according to the present invention, in the gas atmosphere of alkali metal and /
or alkaline earth metal, the electrode layer is formed by thermal spraying a metal or alloy having
a small specific resistance to the feeding portion of the conductive thin plate serving as the
diaphragm. Since the electrode is formed, it is possible to take out the electrode with high
adhesion and low resistance. Moreover, the productivity is good without requiring a large-scale
apparatus such as vacuum deposition. Next, the present invention will be described in detail. The
Helium thin plate 1 having a thickness of 20 μm is fixed to the apparatus as shown in FIG. 3
through the mounting jig 8.
Next, after evacuating the inside of the container 7 to 5 × 10 − ′ Torr, copper was sprayed in
a Na 1 -rium gas atmosphere. Thereafter, the electrode material 3 of 20 μ thick was soldered on
the copper electrode layer 11 with a solder 4 and the adhesion was measured by a tensile test.
The results shown in the following table were obtained. For comparison, copper was sprayed in
the atmosphere, and the electrode material 3 was similarly brazed on the copper electrode layer
to measure adhesion, and the results are also shown in the table. As is clear from Table 1--1
table, according to the present invention, the adhesion is sufficiently strong compared to the
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conventional one. 4られた。
[0002]
Brief description of the drawings
[0003]
1a, 1b and 2 are explanatory views of the conventional electrode extraction method, FIG. 3 is a
schematic view of a device for practicing the present invention 111, and FIGS. 4 and 5 are the
production of the present invention] FIG. 6 is a schematic view of another device embodying the
present invention, and FIGS. 7 and 8 are cross-sectional views of a diaphragm manufactured by
the device.
■ · · · · · · · · · conductive thin film I and (Hilliam V, 4 anti), II, 11a, 11b · · · · · · · · · · · · · · · · · · · · · · · · ·
· · · · · · · · alkali metal and / or alkaline earth metal . Patent applicant Pioneer Corporation Figure 1
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