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JPS63144700

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DESCRIPTION JPS63144700
[0001]
The present invention relates to a piezoelectric buzzer which applies an alternating voltage to
electrodes to cause bending distortion in a piezoelectric element plate to generate a ringing
sound. PRIOR ART This type of piezoelectric buzzer is known. By the way, the conventional
piezoelectric buzzer is configured by pressure bonding a metal type diaphragm to a piezoelectric
element plate polarized in the thickness direction. For this reason, the adhesive process causes
the element to be cracked by the applied pressure, the adhesive protrudes from between the
diaphragm and the element, and becomes dirty, or causes the piezoelectric element plate to be
lifted if the adhesive layer is excessive. There were various problems associated with In addition,
when the piezoelectric element plate was warped, adhesion became impossible. An object of the
present invention is to provide a piezoelectric buzzer free from the conventional drawbacks. In
the present invention, a piezoelectric buzzer is constructed by integrally bonding a synthetic
resin diaphragm to a piezoelectric element plate with a resin mold. Operation> By applying an
alternating voltage at an audio frequency to the piezoelectric element plate, the diaphragm is
excited to generate a noise. Also in this configuration, a diaphragm made of synthetic resin. Since
the resin mold is integrally bonded to the piezoelectric element plate, various problems caused
by the adhesive are eliminated. <Embodiment> Referring to FIG. 1.2, the structure of a
piezoelectric buzzer 1a according to an embodiment of the present invention will be described.
Reference numeral 2 denotes a piezoelectric element plate made of a material 1 1 such as
titanium 醜 zirconate polarized in the thickness direction or the length direction, and electrodes
3.4 are formed on the upper and lower surfaces thereof. Further, a disc-shaped synthetic resin
diaphragm 5 a made of epoxy resin or the like is joined to the lower surface electrode 4 of the
piezoelectric element plate 2. The outer diameter of the diaphragm 5a is larger than that of the
piezoelectric element plate 2, and the peripheral edge 6 is exposed. The vibrating plate 5 a is
molded and joined to the lower surface of the piezoelectric element plate 2. That is, as shown in
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FIG. 2, the mold 10 is assembled so as to surround the lower part of the piezoelectric element
plate 2, and resin is injected from the injection molding machine 11 into the mold 10 to form a
solid. Be done. In order to electrically draw the electrode 4 out, as shown in FIG. 1, the lead wire
12 is inserted into the mold and temporarily connected to the electrode '4 with a conductive
adhesive or the like for connection. Then, the lead wire 12 is embedded in the diaphragm 5a.
Alternatively, the conductive path 13 is formed between the electrode 4 and the diaphragm 5a by
means of conductive material I or the like, and the end is extended over the peripheral edge 6 of
the diaphragm 5a. It can also be applied by a configuration such as connecting Furthermore, the
electrical connection between the electrode 3 and the external device can be made by resiliently
contacting the crimp terminal 14 in a state where the piezoelectric buzzer 1 is incorporated in
the device.
As shown in FIG. 4, in the electrical drawing of the electrode 4 described above, the electrode 4 is
extended to the upper surface side of the piezoelectric element plate 2 by the conductive path
15, and the electrode 3 in addition to the crimp terminal 14 is formed on the upper surface of
the terminal plate. The crimp terminals 16 to be connected to each other may be prepared, and
the electrodes 3 and 4 may be electrically drawn from the upper surface of the piezoelectric
element plate 2 by the crimp terminals 14.16. FIG. 3 relates to the piezoelectric buzzer 1b of the
second embodiment. In this configuration, the entire peripheral surface of the piezoelectric
element plate 2 is covered with the diaphragm 5b. Here, in order to electrically draw out the
electrode 3.4 of the piezoelectric element plate 2 to the outside, as described above, the lead
wires 20 are inserted into the mold 10 and connected to each other, and the lead wires 20 are
vibrated. Embed in 5b. When the connecting means of the lead wire 12.20 of FIG. 1.3 is adopted,
the work of soldering the lead wire becomes unnecessary. As a result, the workability is
improved, and the connection position of the piezoelectric element plate 2 is not exposed to the
high temperature at the time of soldering, so that a stable output can be obtained without a
disadvantage such as lowering the electrostrictive performance. Produces an advantage. FIG. 4.5
shows the piezoelectric buzzers 1c and ld each having a configuration using the diaphragms 5c
and 5d as a part of the sound box 30a and 30b. Here, in FIG. 4, the acoustic box 30a has the
upper surface as the diaphragm 5C and the sound hole 31 formed on the lower surface, and the
acoustic box 30a is entirely the diaphragm 5C. And integrally with the lower surface of the
piezoelectric element plate 2. In order to facilitate this molding, the lower frame portion 32 of
the M 139 box 30a may be formed separately from the diaphragm 5C, and only the diaphragm
5C may be molded. In the above-mentioned configuration, e? The noise generated in the box 0a
is emitted from the sound hole 31 as a large sound. Further, the acoustic box 30b of FIG. 5 is
configured as a node position in so that the position of the peripheral frame 33 does not
interfere with the resonance. Its action and shaping means are the same as the acoustic box 30a.
<Effects of the Invention> The present invention has the following effects because it is molded
and joined to a piezoelectric element plate on a diaphragm as described above. B) Unlike the
pressure bonding, the ceramic components of the pressure element plate 2 are not broken due to
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the ceramic cracking, the sticking out of the bonding material, the stain, or the uneven or
excessive thickness of the bonding material layer. The bonding can be performed regardless of
the warp or the like of the piezoelectric element plate 2. There are excellent effects such as
[0002]
Brief description of the drawings
[0003]
The attached drawings show an embodiment of the present invention, FIG. 1 is a longitudinal
sectional view of the piezoelectric buzzer 1a of the first embodiment, FIG. 2 is a longitudinal
sectional view showing the molding means, and FIG. 3 is a second embodiment. A longitudinal
sectional side view of the piezoelectric buzzer 1b, FIG. 4 is a longitudinal sectional side view of
the piezoelectric buzzer 1c of the third embodiment, and FIG. 5 is a longitudinal sectional side
view of the piezoelectric buzzer 1d of the fourth embodiment.
1a-1d; piezoelectric buzzer 2; piezoelectric element plate 3.4; electrodes 5a to 5d; diaphragm 12,
20; lead wires 30a, 30b;
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